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TPS7A4001DGNT

TPS7A4001DGNT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    HVSSOP8_3X3MM_EP

  • 描述:

    100-V输入电压,50mA,超高压线性稳压器 Vo=1.175~90V HVSSOP8_3X3MM_EP

  • 数据手册
  • 价格&库存
TPS7A4001DGNT 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 TPS7A4001 100-V Input Voltage, 50-mA, Very High Voltage Linear Regulator 1 Features 3 Description • • • The TPS7A4001 device is a very high voltagetolerant linear regulator that offers the benefits of a thermally-enhanced package (HVSSOP), and is able to withstand continuous DC or transient input voltages of up to 100 V. 1 • • • • • • • • • • Very High Maximum Input Voltage: 100 V Wide Input Voltage Range: 7 to 100 V Accuracy: – Nominal: 1% – Over Line, Load, and Temperature: 2.5% Low Quiescent Current: 25 µA Quiescent Current at Shutdown: 4.1 µA Maximum Output Current: 50 mA CMOS Logic-Level-Compatible Enable Pin Adjustable Output Voltage from about 1.175 to 90 V Stable With Ceramic Capacitors: – Input Capacitance: ≥1 µF – Output Capacitance: ≥4.7 µF Dropout Voltage: 290 mV Built-In Current Limit and Thermal Shutdown Protection Package: High Thermal Performance HVSSOP PowerPAD™ Operating Temperature Range: –40°C to 125°C 2 Applications • • • • • • • Microprocessors, Microcontrollers Powered by Industrial Busses With High Voltage Transients Industrial Automation Telecom Infrastructure Automotive Power over Ethernet (PoE) LED Lighting Bias Power Supplies The TPS7A4001 device is stable with any output capacitance greater than 4.7 µF and any input capacitance greater than 1 µF (over temperature and tolerance). Therefore, implementations of this device require minimal board space because of its miniaturized packaging (HVSSOP) and a potentially small output capacitor. In addition, the TPS7A4001 device offers an enable pin (EN) compatible with standard CMOS logic to enable a low-current shutdown mode. The TPS7A4001 device has an internal thermal shutdown and current limiting to protect the system during fault conditions. The HVSSOP packages has an operating temperature range of TJ = –40°C to 125°C. In addition, the TPS7A4001 device is ideal for generating a low-voltage supply from intermediate voltage rails in telecom and industrial applications; not only can it supply a well-regulated voltage rail, but it can also withstand and maintain regulation during very high and fast voltage transients. These features translate to simpler and more cost-effective electrical surge-protection circuitry for a wide range of applications, including PoE, bias supply, and LED lighting. Device Information(1) PART NUMBER TPS7A4001 PACKAGE HVSSOP (8) BODY SIZE (NOM) 3.00 mm × 5.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Schematic 100 V VIN VIN VOUT OUT IN CIN CBYP TPS7A4001 VEN R1 COUT EN GND FB R2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes.......................................... 9 8 Application and Implementation ........................ 10 8.1 Application Information............................................ 10 8.2 Typical Application ................................................. 11 9 Power Supply Recommendations...................... 12 10 Layout................................................................... 13 10.1 10.2 10.3 10.4 Layout Guidelines ................................................. Layout Example .................................................... Thermal Considerations ........................................ Power Dissipation ................................................. 13 13 13 14 11 Device and Documentation Support ................. 15 11.1 11.2 11.3 11.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 12 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (March 2011) to Revision B Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1 • Changed Package from MSOP-8 to HVSSOP. ..................................................................................................................... 1 • Changed TJ value for disabled mode operating mode from 165 to 170°C............................................................................. 9 • Changed value from 35 to 45°C ........................................................................................................................................... 14 Changes from Original (March 2011) to Revision A • 2 Page Changed all 105 V to 100 V on page 1 .................................................................................................................................. 1 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 5 Pin Configuration and Functions DGN Package 8-Pin HVSSOP Top View OUT FB NC GND 1 2 3 4 8 7 6 5 IN NC NC EN Pin Functions PIN NAME NO. I/O DESCRIPTION OUT 1 O Regulator output. A capacitor > 4.7 µF must be tied from this pin to ground to assure stability. FB 2 O This pin is the input to the control-loop error amplifier. It is used to set the output voltage of the device. — Not internally connected. This pin must either be left open or tied to GND. — Ground 3 NC 6 7 GND 4 EN 5 I This pin turns the regulator on or off. If VEN ≥ VEN_HI the regulator is enabled. If VEN ≤ VEN_LO, the regulator is disabled. If not used, the EN pin can be connected to IN. Make sure that VEN ≤ VIN at all times. IN 8 I Input supply PowerPAD — — Solder to printed-circuit-board (PCB) to enhance thermal performance. NOTE: The PowerPAD is internally connected to GND. Although it can be left floating, TI highly recommends connecting the PowerPAD to the GND plane. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 3 TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX –0.3 105 OUT pin to GND pin –0.3 105 OUT pin to IN pin –105 0.3 FB pin to GND pin –0.3 2 FB pin to IN pin –105 0.3 EN pin to IN pin –105 0.3 EN pin to GND pin –0.3 105 IN pin to GND pin Voltage Current Peak output Temperature (1) UNIT V Internally limited Operating virtual junction, TJ –40 125 Storage, Tstg –65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN MAX UNIT 7 100 V 1.161 90 V VEN 0 100 V IOUT 0 50 mA VIN VOUT NOM 6.4 Thermal Information TPS7A4001 THERMAL METRIC (1) DGN (HVVSOP) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 66.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.1 °C/W RθJB Junction-to-board thermal resistance 38.1 °C/W ψJT Junction-to-top characterization parameter 2 °C/W ψJB Junction-to-board characterization parameter 37.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 15.5 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 6.5 Electrical Characteristics At TJ = –40°C to 125°C, VIN = VOUT(NOM) + 2 V or VIN = 7 V (whichever is greater), VEN = VIN, IOUT = 100 µA, CIN = 1 μF, COUT = 4.7 μF, and FB tied to OUT, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 100 V 1.173 1.185 V VREF 90 V –1 1 %VOUT –2.5 2.5 %VOUT VIN Input voltage VREF Internal reference TJ = 25°C, VFB = VREF, VIN = 9 V, IOUT = 25 mA Output voltage range (1) VIN ≥ VOUT(NOM) + 2 V Nominal accuracy TJ = 25°C, VIN = 9 V, IOUT = 25 mA Overall accuracy VOUT(NOM) + 2 V ≤ VIN ≤ 24 V (2) 100 µA ≤ IOUT ≤ 50 mA D%VOUT DVIN Line regulation 7 V ≤ VIN ≤ 100 V 0.03 %VOUT D%VOUT DIOUT Load regulation 100 µA ≤ IOUT ≤ 50 mA 0.31 %VOUT VOUT VDO 7 Dropout voltage ILIM Current limit IGND Ground current ISHDN Shutdown supply current Feedback current IEN Enable current VEN_HI Enable high-level voltage VEN_LO Enable low- level voltage VNOISE Output noise voltage PSRR Power-supply rejection ratio TSD Thermal shutdown temperature TJ Operating junction temperature (1) (2) (3) (4) VIN = 17 V, VOUT(NOM) = 18 V, IOUT = 20 mA 290 VIN = 17 V, VOUT(NOM) = 18 V, IOUT = 50mA 0.78 1.3 mV V VOUT = 90% VOUT(NOM), VIN = 7 V, TJ ≤ 85°C 51 117 200 mA VOUT = 90% VOUT(NOM), VIN = 9 V 51 128 200 mA 7 V ≤ VIN ≤ 100 V, IOUT = 0 mA 25 65 μA IOUT = 50 mA 25 VEN = 0.4 V 4.1 20 μA 0.01 0.1 µA 0.02 1 μA 1.5 VIN V 0 0.4 V (3) IFB 1.161 –0.1 7 V ≤ VIN ≤ 100 V, VIN = VEN μA VIN = 12 V, VOUT(NOM) = VREF, COUT = 10 μF, BW = 10 Hz to 100 kHz 58 μVRMS VIN = 12 V, VOUT(NOM) = 5 V, COUT = 10 μF, CBYP (4) = 10 nF, BW = 10 Hz to 100 kHz 73 μVRMS VIN = 12 V, VOUT(NOM) = 5 V, COUT = 10 μF, CBYP (4) = 10 nF, ƒ = 100 Hz 65 dB Shutdown, temperature increasing 170 °C Reset, temperature decreasing 150 –40 °C 125 °C To ensure stability at no-load conditions, a current from the feedback resistive network greater than or equal to 10μA is required. Maximum input voltage is limited to 24 V because of the package power dissipation limitations at full load (P ≈ (VIN – VOUT) × IOUT = (24 V – VREF) × 50 mA ≈ 1.14 W). The device is capable of sourcing a maximum current of 50 mA at higher input voltages as long as the power dissipated is within the thermal limits of the package plus any external heatsinking. IFB > 0 flows out of the device. CBYP refers to a bypass capacitor connected to the FB and OUT pins. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 5 TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com 6.6 Typical Characteristics At TJ = –40°C to 125°C, VIN = VOUT(NOM) + 2 V or VIN = 9 V (whichever is greater), VEN = VIN, IOUT = 100 µA, CIN = 1 μF, COUT = 4.7 μF, and FB tied to OUT, unless otherwise noted. VIN = 12V, VOUT = 5V DIOUT = 1mA®29mA®1mA COUT = 10mF, CBYP = 10nF VOUT = 5V, IOUT = 28mA, COUT = 10mF VIN Slew Rate = 220V/ms DVIN = 12V®55V CBYP = 0nF 100mV/div VOUT VOUT CBYP = 10nF 100mV/div VOUT 50mV/div VIN IOUT 10mA/div 50V/div Time (100ms/div) Time (1ms/div) Figure 1. Line Transient Response vs CBYP Figure 2. Load Transient Response 10 1.275 − 40°C + 25°C + 85°C 7.5 + 105°C + 125°C − 40°C + 25°C + 85°C 1.225 2.5 VFB (V) VOUT(NOM) (%) 5 + 105°C + 125°C 0 1.175 −2.5 −5 1.125 −7.5 −10 5 15 25 35 45 55 65 Input Voltage (V) 75 85 95 105 1.075 5 Figure 3. Line Regulation 25 35 45 55 65 Input Voltage (V) 75 85 95 105 Figure 4. Feedback Voltage 100 100 − 40°C + 25°C + 85°C + 105°C + 125°C 80 60 90 80 70 IFB (nA) Isub (GND) 15 40 60 50 40 30 20 20 10 IOUT = 0mA 0 5 15 25 35 45 55 65 Input Voltage (V) 75 85 95 105 0 −40 −25 −10 Figure 5. Ground Current vs Input Voltage 6 Submit Documentation Feedback 5 20 35 50 65 Temperature (°C) 80 95 110 125 Figure 6. Feedback Current Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 Typical Characteristics (continued) At TJ = –40°C to 125°C, VIN = VOUT(NOM) + 2 V or VIN = 9 V (whichever is greater), VEN = VIN, IOUT = 100 µA, CIN = 1 μF, COUT = 4.7 μF, and FB tied to OUT, unless otherwise noted. 100 2 − 40°C + 25°C + 85°C + 105°C + 125°C 90 80 60 50 40 + 105°C + 125°C 1.5 1.25 VDROP (V) IGND (µA) 70 − 40°C + 25°C + 85°C 1.75 1 0.75 30 0.5 20 0.25 10 0 0 10 20 30 Output Current (mA) 40 0 50 0 10 Figure 7. Ground Current vs Output Voltage 20 30 Output Current (mA) 40 50 Figure 8. Dropout Voltage 2.5 10 2 Noise (µV/ Hz) VEN (V) 1 1.5 Vsub (EN_HI) 1 0.1 VIN = 12V VOUT = VREF COUT = 10µF CBYP = 10nF 0.01 0.5 Vsub (EN_LO) 0 −40 −25 −10 5 20 35 50 65 Temperature (°C) 80 95 110 125 0.001 10 Figure 9. Enable Threshold Voltage 100 IOUT = 100µA,VNOISE = 60µVRMS IOUT = 50mA,VNOISE = 100µVRMS 1k 10k 100k Frequency (Hz) 1M 10M Figure 10. Output Spectral Noise Density 200 100 90 160 80 PSRR (dB) ICL (mA) 70 120 80 − 40°C + 25°C + 85°C + 105°C + 125°C 40 0 6 9 12 15 18 Input Voltage (V) Figure 11. Current Limit 21 24 60 50 40 30 VIN = 12V VOUT = 5V COUT = 10µF CBYP = 10nF 20 10 0 10 100 IOUT = 50mA IOUT = 100µA 1k 10k 100k Frequency (Hz) 1M 10M Figure 12. Power-Supply Rejection Ratio Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 7 TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com 7 Detailed Description 7.1 Overview The TPS7A4001 device belongs to a new generation of linear regulators that use an innovative BiCMOS process technology to achieve very high maximum input and output voltages. This process not only allows the TPS7A4001 device to maintain regulation during very fast high-voltage transients up to 105 V, but it also allows the TPS7A4001 device to regulate from a continuous high-voltage input rail. Unlike other regulators created using bipolar technology, the ground current of the TPS7A4001 device is also constant over its output current range, resulting in increased efficiency and lower power consumption. These features, combined with a high thermal performance HVSSOP PowerPAD package, make this device ideal for industrial and telecom applications. 7.2 Functional Block Diagram IN OUT UVLO Pass Device Thermal Shutdown Current Limit Enable Error Amp EN FB 7.3 Feature Description 7.3.1 Internal Current Limit The fixed internal current limit of the TPS7A4001 device helps protect the regulator during fault conditions. The maximum amount of current the device can source is the current limit (309 mA, typical), and is largely independent of output voltage. For reliable operation, the device does not operate in current limit for extended periods of time. 7.3.2 Enable Pin Operation The TPS7A4001 device provides an enable pin (EN) feature that turns on the regulator when VEN > VEN_HI, and disables the regulator when VEN < VEN_LO. 7.3.3 Thermal Protection Thermal protection disables the output when the junction temperature rises to approximately 170°C, allowing the device to cool. When the junction temperature cools to approximately 150°C, the output circuitry is enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, limit junction temperature to a maximum of 125°C. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, trigger thermal protection at least 35°C above the maximum expected ambient condition of your particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. 8 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 Feature Description (continued) The internal protection circuitry of the TPS7A4001 device has been designed to protect against overload conditions. The protection circuitry was not intended to replace proper heatsinking. Continuously running the TPS7A4001 device into thermal shutdown degrades device reliability. 7.3.4 Undervoltage Lockout (UVLO) The TPS7A4001 contains an Undervoltage Lockout comparator that ensures the error amplifier is disabled when the input voltage is below the required minimum operational voltage. The minimum recommended operational voltage is 7 V. 7.4 Device Functional Modes 7.4.1 Normal Operation The device regulates to the nominal output voltage under the following conditions: • The input voltage is at least as high as VIN(min). • The input voltage is greater than the nominal output voltage added to the dropout voltage. • The enable voltage has previously exceeded the enable rising threshold voltage and has not decreased below the enable falling threshold. • The output current is less than the current limit. • The device junction temperature is less than the maximum specified junction temperature. 7.4.2 Dropout Operation If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other conditions are met for normal operation, the device operates in dropout mode. In this mode of operation, the output voltage is the same as the input voltage minus the dropout voltage. The transient performance of the device is significantly degraded because the pass device (as a bipolar junction transistor, or BJT) is in saturation and no longer controls the current through the LDO. Line or load transients in dropout can result in large output voltage deviations. 7.4.3 Disabled The device is disabled under the following conditions: • The enable voltage is less than the enable falling threshold voltage or has not yet exceeded the enable rising threshold. • The device junction temperature is greater than the thermal shutdown temperature. Table 1 lists the conditions that lead to the different modes of operation. Table 1. Device Functional Mode Comparison PARAMETER OPERATING MODE VIN VEN IOUT TJ Normal mode VIN > VOUT(nom) + VDO and VIN > VIN(min) VEN > VEN_HI IOUT < ILIM T J < 125°C Dropout mode VIN(min) < VIN < VOUT(nom) + VDO VEN > VEN_HI — TJ < 125°C — VEN < VEN_LO — TJ > 170°C Disabled mode (any true condition disables the device) Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 9 TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information One of the primary applications of the TPS7A4001 device is to provide transient voltage protection to sensitive circuitry that may be damaged in the presence of high-voltage spikes. This transient voltage protection can be more cost-effective and compact compared to topologies that use a transient voltage suppression (TVS) block. 8.1.1 Adjustable Operation The TPS7A4001 device has an output voltage range of about 1.175 to 90 V. The nominal output voltage of the device is set by two external resistors, as shown in Figure 13. VOUT VIN CIN 10 µF OUT IN CBYP 10 nF TPS7A4001 EN GND R1 FB COUT 10 µF R2 Figure 13. Adjustable Operation for Maximum AC Performance Calculate R1 and R2 for any output voltage range using the formula shown in Equation 1. To ensure stability under no-load conditions, this resistive network must provide a current ≥ 10 μA. VOUT VOUT ³ 10mA R1 = R2 - 1 , where R1 + R2 VREF (1) If greater voltage accuracy is required, consider the output voltage offset contributions because of the feedback pin current and use 0.1% tolerance resistors. 10 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 8.2 Typical Application VIN CIN 10 µF VEN CBYP 10 nF TPS7A4001 EN VOUT OUT IN R1 FB GND Where: COUT 10 µF VOUT ≥10 µA, and R1 + R2 R1 = R2 R2 VOUT –1 VREF Figure 14. Example Circuit to Maximize Transient Performance 8.2.1 Design Requirements For this design example, use the following parameters listed in Table 2. Table 2. Design Parameters PARAMETER VALUE VIN 12 V, with 55 V surge tolerance VOUT 5 V (ideal), 4.981 (actual) IOUT 28 mA Accuracy 5% R1, R2 162 kΩ, 49.9 kΩ 8.2.2 Detailed Design Procedure The maximum value of total feedback resistance can be calculated to be 500 kΩ. Equation 1 was used to calculate R1 and R2, and standard 1% resistors were selected to keep the accuracy within the 5% allocation. 10uF ceramic input and output capacitors were selected, along with a 10-nF bypass capacitor for optimal AC performance. 8.2.2.1 Capacitor Recommendations Low equivalent series resistance (ESR) capacitors should be used for the input, output, and bypass capacitors. Ceramic capacitors with X7R and X5R dielectrics are required. Ceramic X7R capacitors offer improved voltage and temperature coefficients, while ceramic X5R capacitors are the most cost-effective and are available in higher values. NOTE High ESR capacitors may degrade PSRR. 8.2.2.2 Input and Output Capacitor Requirements The TPS7A4001 device high voltage linear regulator achieves stability with a minimum output capacitance of 4.7 µF and input capacitance of 1 µF; however, TI highly recommends to use 10-μF output and input capacitors to maximize AC performance. 8.2.2.3 Bypass Capacitor Requirements Although a bypass capacitor (CBYP) is not needed to achieve stability, TI highly recommends using a 10-nF bypass capacitor to maximize AC performance (including line transient, noise, and PSRR). For additional information regarding the performance improvements of using a bypass capacitor, see . 8.2.2.4 Transient Response As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude but increases the duration of the transient response. The presence of the CBYP capacitor may greatly improve the line transient response of the TPS7A4001 device, as shown in Figure 1. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 11 TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com 8.2.3 Application Curves VIN = 12V, VOUT = 5V DIOUT = 1mA®29mA®1mA COUT = 10mF, CBYP = 10nF VOUT = 5V, IOUT = 28mA, COUT = 10mF VIN Slew Rate = 220V/ms DVIN = 12V®55V CBYP = 0nF 100mV/div CBYP = 10nF 100mV/div VOUT VOUT 50mV/div VOUT VIN IOUT 10mA/div 50V/div Time (100ms/div) Time (1ms/div) Figure 15. Line Transient Response vs CBYP Figure 16. Load Transient Response 9 Power Supply Recommendations The input supply for the LDO should not exceed its recommended operating conditions (7 V to 100 V). The input voltage should provide adequate headroom for the device to have a regulated output. If the input supply is noisy, additional input capacitors with low ESR can help improve the output noise performance. The input and output supplies should also be bypassed with 10-µF capacitors located near the input and output pins. There should be no other components located between these capacitors and the pins. 12 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 10 Layout 10.1 Layout Guidelines 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance To improve AC performance such as PSRR, output noise, and transient response, TI recommends designing the board with separate ground planes for IN and OUT, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor should connect directly to the GND pin of the device. Equivalent series inductance (ESL) and ESR must be minimized to maximize performance and ensure stability. Every capacitor (CIN, COUT, CBYP) must be placed as close as possible to the device and on the same side of the PCB as the regulator itself. Do not place any of the capacitors on the opposite side of the PCB from where the regulator is installed. The use of vias and long traces is strongly discouraged because they may impact system performance negatively and even cause instability. If possible, and to ensure the maximum performance denoted in this product data sheet, use the same layout pattern used for the TPS7A40 evaluation board, available at www.ti.com. 10.2 Layout Example Input GND Plane Vout Cin Sense Line OUT 1 FB 2 NC 3 GND 4 8 IN 7 NC 6 NC 5 EN R1 Cout R2 Thermal Pad Vin Output GND Plane Figure 17. Recommended Layout Example 10.3 Thermal Considerations Thermal protection disables the output when the junction temperature rises to approximately 170°C, allowing the device to cool. When the junction temperature cools to approximately 150°C, the output circuitry is enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle ON and OFF. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 13 TPS7A4001 SBVS162B – MARCH 2011 – REVISED JULY 2015 www.ti.com Thermal Considerations (continued) Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to a maximum of 125°C. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least 45°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. The internal protection circuitry of the TPS7A4001 has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TPS7A4001 device into thermal shutdown degrades device reliability. 10.4 Power Dissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat dissipating layers also improves the heatsink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current times the voltage drop across the output pass element, as shown in Equation 2: PD = (VIN - VOUT) IOUT (2) 14 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 TPS7A4001 www.ti.com SBVS162B – MARCH 2011 – REVISED JULY 2015 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.2 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS7A4001 15 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TPS7A4001DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 QVQ TPS7A4001DGNT ACTIVE HVSSOP DGN 8 250 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR -40 to 125 QVQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
TPS7A4001DGNT 价格&库存

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TPS7A4001DGNT
  •  国内价格 香港价格
  • 1+26.563371+3.19051
  • 10+19.9131810+2.39176
  • 25+18.2522425+2.19227
  • 100+16.42325100+1.97259

库存:6285

TPS7A4001DGNT
  •  国内价格 香港价格
  • 250+15.55096250+1.86782
  • 500+15.02493500+1.80464
  • 750+14.76162750+1.77301
  • 1250+14.469891250+1.73797
  • 1750+14.299331750+1.71749
  • 2500+14.135272500+1.69778

库存:6285