TPS7A4001TDA1

TPS7A4001-DIE www.ti.com SBVS223 – FEBRUARY 2013 VERY HIGH VOLTAGE LINEAR REGULATOR Check for Samples: TPS7A4001-DIE FEATURES 1 • • • • 2 Very High Maximum Input Voltage CMOS Logic-Level-Compatible Enable Pin Stable with Ceramic Capacitors Built-In Current-Limit and Thermal Shutdown Protection APPLICATIONS • • • • • • • Microprocessors, Microcontrollers Powered by Industrial Busses with High Voltage Transients Industrial Automation Telecom Infrastrucure Automotive Power over Ethernet (PoE) LED Lighting Bias Power Supplies DESCRIPTION The TPS7A4001-DIE is a very high voltage-tolerant linear regulator that is able to withstand continuous dc or transient input voltages. The TPS7A4001-DIE offers an enable pin (EN) compatible with standard CMOS logic to enable a low-current shutdown mode. The TPS7A4001-DIE has an internal thermal shutdown and current limiting to protect the system during fault conditions. In addition, the TPS7A4001-DIE is ideal for generating a low-voltage supply from intermediate voltage rails in telecom and industrial applications; not only it can supply a well-regulated voltage rail, but it can also withstand and maintain regulation during very high and fast voltage transients. These features translate to simpler and more cost-effective electrical surge-protection circuitry for a wide range of applications, including PoE, bias supply, and LED lighting. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE TPS7A4001 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY TPS7A4001TDA1 132 TPS7A4001TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated TPS7A4001-DIE SBVS223 – FEBRUARY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlTiW 760 nm Table 1. Bond Pad Coordinates in Microns 2 DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX OUT 1 356.94 46.08 432 121.14 FB 2 776.97 46.08 852.03 121.14 GND 3 1293.12 46.08 1368.18 121.14 EN 4 1210.05 1285.56 1285.11 1360.62 IN 5 403.56 1285.56 478.62 1360.62 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS7A4001-DIE PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TPS7A4001TDA1 ACTIVE 0 132 RoHS & Green Call TI N / A for Pkg Type -40 to 125 TPS7A4001TDA2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of