TPS7A7002DDA

Order Now Product Folder Support & Community Tools & Software Technical Documents TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 TPS7A7002 Very Low Input, Very Low Dropout 3-A Regulator With Enable 1 Features 3 Description • • • • • • • • • The TPS7A7002 is a high-performance, positivevoltage, low-dropout (LDO) regulator designed for use in applications requiring very-low input voltage and very-low dropout voltage at up to 3 A. The device operates with a single input voltage as low as 1.425 V, and with an output voltage programmable to as low as 0.5 V. The output voltage can be set using an external divider. 1 Input Voltage as Low as 1.425 V 380-mV Maximum Dropout at 2 A 600-mV Maximum Dropout at 3 A Adjustable Output from 0.5 V Protections: Current Limit and Thermal Shutdown Enable Pin 1-µA Ground Current in Shutdown Mode Full Industrial Temperature Range Available in an SOIC-8, Fully RoHS-Compliant Package 2 Applications • • • • • • • • The TPS7A7002 features ultra-low dropout, ideal for applications where VOUT is very close to VIN. Additionally, the TPS7A7002 has an enable pin for further reduced power dissipation while in Shutdown mode. The TPS7A7002 provides excellent regulation over variations in line, load, and temperature. The TPS7A7002 is available in an 8-pin SO PowerPAD™ package. Telecom and Networking Cards Motherboards and Peripheral Cards Industrial Wireless Infrastructure Set-Top Boxes Medical Equipment Notebook Computers Battery-Powered Systems Device Information(1) PART NUMBER TPS7A7002 Dropout Voltage vs Output Current (VOUT = 3.3 V) 400 NC TPS7A7002 Input Voltage OUT R1 Enable EN FB R2 NC VOUT = 0.5 ´ 1 + GND R1 R2 COUT Dropout Voltage (mV) IN −40°C 25°C 125°C 350 Output Voltage CIN BODY SIZE (NOM) 3.90 mm × 4.89 mm (1) For all available packages, see the package option addendum at the end of the data sheet. Typical Application NC PACKAGE SO PowerPAD (8) 300 250 200 150 100 50 0 0 500m 1 Output Current (A) 1.5 2 G003 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Detailed Description .............................................. 7 7.1 7.2 7.3 7.4 8 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 7 7 7 8 Application and Implementation .......................... 9 8.1 Application Information.............................................. 9 8.2 Typical Application .................................................. 10 9 Power Supply Recommendations...................... 11 10 Layout................................................................... 11 10.1 10.2 10.3 10.4 Layout Guidelines ................................................. Layout Example .................................................... Thermal Consideration.......................................... Power Dissipation ................................................. 11 12 12 12 11 Device and Documentation Support ................. 13 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Device Support...................................................... Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 13 13 13 13 13 13 13 12 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (July 2015) to Revision D Page • Changed OUT pin description text from "TI recommends using at least a 4.7-μF ceramic capacitor, and up to 10 μF for a good transient response." to " A 4.7-μF or larger capacitor of any type is required for stability." for clarity.................. 3 • Changed "operating free-air" to "junction" in Absolute Maximum Ratings table condition line ............................................. 4 • Added rows for enable pin voltage, input capacitor, output capacitor, and feedforward capacitance to Recommended Operating Conditions table............................................................................................................................ 4 • Added min value of 0 to output current in Recommended Operating Conditions table ......................................................... 4 • Changed note (1) in Electrical Characteristics table; deleted initial reference to R1 and updated R2 resistor range............. 5 • Changed Output Capacitor (OUT) section; reworded for clarity............................................................................................. 9 Changes from Revision B (November 2013) to Revision C • Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1 Changes from Revision A (September 2013) to Revision B Page • Changed data sheet status from product preview to production data.................................................................................... 1 • Added pin 1 identifier (black bar) to pinout diagram............................................................................................................... 3 Changes from Original (May 2013) to Revision A • 2 Page Changed product preview data sheet..................................................................................................................................... 7 Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 TPS7A7002 www.ti.com SBVS209D – MAY 2013 – REVISED APRIL 2017 5 Pin Configuration and Functions DDA Package 8-Pin SO PowerPAD Top View NC 1 8 GND EN 2 7 FB PowerPAD IN 3 6 OUT NC 4 5 NC Pin Functions PIN NAME NO. I/O DESCRIPTION EN 2 I Enable input. Pulling this pin to less than 0.5 V turns the regulator off. Connect to VIN if not being used. FB 7 I This pin is the output voltage feedback input through voltage dividers. See Table 2 for more details. GND 8 — IN 3 I NC 1, 4, 5 — Not internally connected. The NC pins are not connected to any electrical node. TI recommends connecting the NC pins to large-area planes. OUT 6 O Regulated output pin. A 4.7-μF or larger capacitor of any type is required for stability. PowerPAD — — TI strongly recommends connecting the thermal pad to a large-area ground plane. If an electrically floating, dedicated thermal plane is available, the thermal pad can also be connected to it. Ground pin Input pin. Although it is not required for stability, TI recommends connecting a 1-μF to 10-μF capacitor with low equivalent series resistance (ESR) across this pin and GND. Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 3 TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over junction temperature range (unless otherwise noted) (1) Voltage Current (2) MAX –0.3 7 EN, FB, OUT –0.3 VIN + 0.3 (2) OUT Temperature (1) MIN IN UNIT Internally limited V A Operating virtual junction, TJ –55 150 Storage temperature, Tstg –55 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The absolute maximum rating is VIN + 0.3 V or 7 V, whichever is smaller. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN VIN Input voltage VEN Enable pin voltage CIN Input capacitor COUT Output capacitor (1) (2) CFB Feedforward capacitance IOUT Output current TJ Junction temperature (1) (2) NOM MAX UNIT 1.425 6.5 V 0 VIN V 1 10 µF 200 µF 0 100 nF 0 3 A –40 125 °C 4.7 10 See Figure 1 and Figure 2 for additional output capacitor ESR requirements. For output capacitors larger than 47 µF, a feedforward capacitor of at least 220 pF must be used. 6.4 Thermal Information TPS7A7002 THERMAL METRIC (1) DDA (SO PowerPAD) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 46.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.2 °C/W RθJB Junction-to-board thermal resistance 29.9 °C/W ψJT Junction-to-top characterization parameter 10.2 °C/W ψJB Junction-to-board characterization parameter 29.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.8 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 TPS7A7002 www.ti.com SBVS209D – MAY 2013 – REVISED APRIL 2017 6.5 Electrical Characteristics Over the full operating temperature range (see Recommended Operating Conditions), VEN = 1.1 V, VFB = VOUT (1), 1.425 V ≤ VIN ≤ 6.5 V, 10 µA ≤ IOUT ≤ 3 A, COUT = 10 μF (unless otherwise noted). Typical values are at TJ = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT VOLTAGE GND pin current VIN = 3.3 V, 50-Ω load resistor between OUT and GND 3 mA Shutdown GND pin current VIN = 6.5 V, VEN = 0 V 5 µA IGND OUTPUT VOLTAGE Output voltage accuracy (2) (3) VOUT VIN = VOUT + 0.5 V (4), IOUT = 10 mA –2% 2% VIN = 1.8 V, IOUT = 0.8 A, 0°C ≤ TJ = TA ≤ 85°C –2% 2% IOUT = 10 mA –3% ΔVO(ΔVI) Line regulation IOUT = 10 mA ΔVO(ΔIO) Load regulation (3) 10 mA ≤ IOUT ≤ 3 A VDO Dropout voltage ICL (5) 3% 0.2 0.4 %/V 0.25 0.75 %/A IOUT = 1 A, 0.5 V ≤ VOUT ≤ 5 V 200 IOUT = 2 A, 0.5 V ≤ VOUT ≤ 5 V 380 IOUT = 3 A, 0.5 V ≤ VOUT ≤ 4.8 V 600 Output current limit VIN = 1.425 V, VOUT = 0.9 × VOUT(NOM) 3.36 VREF Reference voltage accuracy VIN = 3.3 V, IOUT = 10 mA 0.49 IFB FB pin current VFB = 0.5 V IEN EN pin current VEN = 0 V, VIN = 3.3 V VEN(LO) EN pin input low (disable) VIN = 3.3 V 0 VEN(HI) EN pin input high (enable) VIN = 3.3 V 1.1 mV A FEEDBACK 0.5 0.51 V 1 µA 0.2 µA 0.5 V VIN V ENABLE TEMPERATURE TSD (1) (2) (3) (4) (5) Shutdown, temperature increasing 160 Reset, temperature decreasing 140 Thermal shutdown temperature °C When setting VOUT to a value other than 0.5 V, connect R2 to the FB pin using 27-kΩ ≤ R2 ≤ 33-kΩ resistors. See Figure 7 for details of R1 and R2. Accuracy does not include error on feedback resistors R1 and R2. TPS7A7002 is not tested at VOUT = 0.5 V, 2.3 V ≤ VIN ≤ 6.5 V, and 500 mA ≤ IOUT ≤ 3 A because the power dissipation is higher than the maximum rating of the package. Also, this accuracy specification does not apply to any application condition that exceeds the power dissipation limit of the package. VIN = VOUT + 0.5 V or 1.425 V, whichever is greater. VDO = VIN – VOUT with VFB = GND configuration. Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 5 TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 www.ti.com 6.6 Typical Characteristics for all fixed voltage versions and an adjustable version at TJ = 25°C, VEN = VIN, CIN = 10 μF, COUT = 10 μF, and using the component values in Table 2 (unless otherwise noted) 10 10 Region of Instability ESR of Output Capacitor (W) ESR of Output Capacitor (W) Region of Instability 1 100m Stable Region 10m 1m 1 100m Stable Region 10m 1m Region of Instability 100u 0 500m 1 Output Current (A) Region of Instability 1.5 100u 2 0 500m G000 COUT = 10 µF Figure 1. Stability Curve IOUT = 0.1 A IOUT = 1 A Dropout Voltage (mV) PSRR (dB) −40°C 25°C 125°C 350 40 30 20 10 300 250 200 150 100 50 10 100 1k 10k 100k Frequency (Hz) 1M 0 10M 0 500m G002 VIN = 5 V, VOUT = 3.3 V 1 Output Current (A) 1.5 2 G003 VOUT = 3.3 V Figure 3. Power-Supply Ripple Rejection vs Frequency Figure 4. Dropout Voltage vs Output Current 400 400 −40°C 25°C 125°C 300 −40°C 25°C 125°C 350 Dropout Voltage (mV) 350 Dropout Voltage (mV) G001 Figure 2. Stability Curve 50 250 200 150 100 50 300 250 200 150 100 50 0 500m 1 Output Current (A) 1.5 2 0 0 G004 VOUT = 1.6 V 500m 1 Output Current (A) 1.5 2 G005 VOUT = 1.4 V Figure 5. Dropout Voltage vs Output Current 6 2 400 60 0 1.5 COUT = 100 µF 70 0 1 Output Current (A) Figure 6. Dropout Voltage vs Output Current Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 TPS7A7002 www.ti.com SBVS209D – MAY 2013 – REVISED APRIL 2017 7 Detailed Description 7.1 Overview The TPS7A7002 offers a high current supply with very-low dropout voltage. The TPS7A7002 is designed to minimize the required component count for a simple, small-size, and low-cost solution. 7.2 Functional Block Diagram OUT Current Limit IN VOUT VOUT = 0.5 x (1 + UVLO Thermal Protection Charge Pump 0.5V Reference R1 ) R2 R1 FB R2 EN Hysteresis GND Figure 7. Adjustable Output Voltage Version 7.3 Feature Description 7.3.1 Internal Current Limit The TPS7A7002 internal current limit helps protect the regulator during fault conditions. During a current limit condition, the output sources a fixed amount of current largely independent of output voltage. For reliable operation, do not operate the device in a current limit state for an extended period of time. Powering on the device with the enable pin, or increasing the input voltage above the minimum operating voltage while a low-impedance short exists on the output of the device, may result in a sequence of high-current pulses from the input to the output of the device. The energy consumed by the device is minimal during these events; therefore, there is no failure risk. Additional input capacitance helps to mitigate the load transient requirement of the upstream supply during these events. 7.3.2 Enable (EN) The enable pin (EN) is an active-high logic input. When it is logic low, the device turns off, and the consumption current is less than 1 µA. When it is logic high, the device turns on. The EN pin must be connected to a logic high or logic low level. When the enable function is not required, connect EN to IN. Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 7 TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 www.ti.com 7.4 Device Functional Modes Table 1 provides a quick comparison between the normal, dropout, and disabled modes of operation. Table 1. Device Functional Mode Comparison PARAMETER OPERATING MODE VIN EN IOUT TJ Normal VIN > VOUT(nom) + VDO VEN > VEN(HI) IOUT < ICL TJ < TSD Dropout VIN < VOUT(nom) + VDO VEN > VEN(HI) IOUT < ICL TJ < TSD Disabled — VEN < VEN(LO) — TJ > TSD 7.4.1 Normal Operation The device regulates to the nominal output voltage under the following conditions: • The input voltage is greater than the nominal output voltage plus the dropout voltage (VOUT(nom) + VDO). • The enable voltage has previously exceeded the enable rising threshold voltage and not yet decreased below the enable falling threshold. • The output current is less than the current limit (IOUT < ICL). • The device junction temperature is less than the thermal shutdown temperature (TJ < TSD). 7.4.2 Dropout Operation If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other conditions are met for normal operation, the device operates in dropout mode. In this mode, the output voltage tracks the input voltage. During this mode, the transient performance of the device becomes significantly degraded because the pass device is in a triode state and no longer controls the current through the LDO. Line or load transients in dropout can result in large output-voltage deviations. 8 Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 TPS7A7002 www.ti.com SBVS209D – MAY 2013 – REVISED APRIL 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TPS7A7002 offers a high current supply with very-low dropout voltage, and it is designed to minimize the required component count for a simple, small-size, and low-cost solution. This section discusses the implementation of the TPS7A7002 LDO. 8.1.1 Input Capacitor (IN) An input capacitor is not required for stability; however, TI recommends connecting a 1-µF to 10-µF low equivalent series resistance (ESR) capacitor across IN and GND as close as possible to the device. 8.1.2 Output Capacitor (OUT) The TPS7A7002 is stable with standard ceramic capacitors with capacitance values from 4.7 μF to 47 μF without a feedforward capacitor. For output capacitors from 47 μF to 200 μF, a feedforward capacitor of at least 220 pF must be used. The TPS7A7002 is evaluated using an X5R-type, 10-μF ceramic capacitor. X5R- and X7R-type capacitors are recommended because of minimal variation in value and ESR over temperature. Maximum ESR must be less than 1 Ω. As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude, but increases duration of the transient response. 8.1.3 Feedback Resistors (FB) The voltage on the FB pin sets the output voltage and is determined by the values of R1 and R2. Use Equation 1 to calculate the values of R1 and R2 for any voltage. æ R ö VOUT = VREF ´ ç 1 + 1 ÷ R è 2ø (1) Table 2 shows the recommended resistor values for the best performance of the TPS7A7002. If the values in Table 2 are not used, keep the value of R2 from 27 kΩ to 33 kΩ. In Table 2, E96 series resistors are used. For the actual design, pay attention to any resistor error factors. Table 2. Sample Resistor Values for Common Output Voltages VOUT R1 (kΩ) R2 (kΩ) 1 30.1 30.1 1.2 42.2 30.1 1.5 60.4 30.1 1.8 78.7 30.1 2.5 121 30.1 3 150 30.1 3.3 169 30.1 5 274 30.1 Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 9 TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 www.ti.com 8.2 Typical Application This section describes the implementation of the TPS7A7002, using the feedback pin to configure the output voltage and regulate a 2-A load at 1.4 V using a 1.6-V input voltage, operating in a temperature range of 25°C to 85°C. Figure 8 shows the schematic for this typical application circuit. NC NC TPS7A7002 Input Voltage Output Voltage IN OUT CIN COUT R1 Enable EN FB NC GND R2 VOUT = 0.5 ´ 1 + R1 R2 Figure 8. Typical Application Schematic 8.2.1 Design Requirements For this design example, use the parameters listed in Table 3 as the input parameters. Table 3. Design Parameters PARAMETER DESIGN REQUIREMENT Input voltage 1.6 V ±3% Output voltage 1.4 V ±3% Maximum output current 2A Ambient temperature 25°C ≤ TA ≤ 75°C 8.2.2 Detailed Design Procedure At IOUT = 2 A, the TPS7A7002 has a maximum dropout of less than 150 mV over temperature, as seen in Figure 9; thus, a 200-mV headroom is sufficient for operation over both input and output voltage accuracy. To achieve 1.2 V on the output, choose the correct feedback resistors. The Feedback Resistors (FB) section suggests keeping the value of R2 in the range of 27 kΩ to 33 kΩ, so select R2 to be 30.1 kΩ, a standard resistor in the E96 series. Using Equation 1 to achieve a 1.4-V output, determine the size for R1 using Equation 2. R1 = ((2 × VOUT) – 1) × R2 (2) Given that R2 = 30.1 kΩ and VOUT = 1.4 V, R1 = 54.2 kΩ. The closest resistor in the E96 series is 53.6 kΩ, giving an output voltage within the output design requirements. With a headroom voltage of 200 mV and a 2-A maximum load, the internal power dissipation is 400 mW, and corresponds to a 18.56°C junction temperature rise for the DDA package. With a 75°C maximum ambient temperature as per design constraints, the junction temperature is at 93.56°C, and satisfies the recommended operating junction temperature range. 10 Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 TPS7A7002 www.ti.com SBVS209D – MAY 2013 – REVISED APRIL 2017 8.2.3 Application Curve 400 −40°C 25°C 125°C Dropout Voltage (mV) 350 300 250 200 150 100 50 0 0 500m 1 Output Current (A) 1.5 2 G005 VOUT = 1.4 V Figure 9. Dropout Voltage vs Output Current 9 Power Supply Recommendations These devices are designed to operate from an input voltage supply range from 1.425 V to 6.5 V. The input voltage range provides adequate headroom for the device to have a regulated output. This input supply is well regulated and stable. If the input supply is noisy, additional input capacitors with low ESR can help improve the output noise performance. 10 Layout 10.1 Layout Guidelines For best performance, place all circuit components on the same side of the circuit board, and place the external components as close to the device as practically possible. The use of vias and long traces is strongly discouraged because of parasitics that might affect performance; follow these guidelines to minimize parasitics. Also, embed a ground reference plane to maintain accuracy of the output voltage and shield noise. Make sure that this plane is connected to the PowerPAD in order to help spread (or sink) heat from the device; be aware that NC pins might be connected to this plane. The recommended layout is shown in Figure 10. Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 11 TPS7A7002 SBVS209D – MAY 2013 – REVISED APRIL 2017 www.ti.com 10.2 Layout Example R2 TPS7A7002 VEN NC 1 8 GND EN 2 7 FB IN 3 6 OUT NC 4 5 CIN R1 VIN VOUT NC COUT GND PLANE Figure 10. Layout Recommendation 10.3 Thermal Consideration Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is re-enabled. The internal protection circuitry of the TPS7A7002 is designed to protect against overload conditions. The protection circuitry is not intended to replace proper heat sinking. Continuously running the TPS7A7002 into thermal shutdown degrades device reliability. 10.4 Power Dissipation Power dissipation (PD) of the device depends on the input voltage and load conditions, and is calculated using Equation 3. PD VIN VOUT u IOUT (3) In order to minimize power dissipation and achieve greater efficiency, use the lowest possible input voltage necessary to achieve the required output voltage regulation On the SOIC (DDA) package, the primary conduction path for heat is through the exposed pad to the PCB. The pad can either be connected to ground or left floating; however, attach the pad to an appropriate amount of copper PCB area to prevent the device from overheating. The maximum junction-to-ambient thermal resistance depends on the maximum ambient temperature, maximum device junction temperature, and power dissipation of the device, and is calculated using Equation 4: RqJA = 12 +125°C - TA PD (4) Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 TPS7A7002 www.ti.com SBVS209D – MAY 2013 – REVISED APRIL 2017 11 Device and Documentation Support 11.1 Device Support 11.1.1 Device Nomenclature PRODUCT (1) DESCRIPTION YYY is package designator. Z is package quantity. TPS7A7002yyyz (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. 11.2 Documentation Support 11.2.1 Related Documentation For related documentation, see the following: • A Topical Index of TI LDO Application Notes • Semiconductor and IC Package Thermal Metrics 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2013–2017, Texas Instruments Incorporated Product Folder Links: TPS7A7002 13 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS7A7002DDA ACTIVE SO PowerPAD DDA 8 75 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SJA TPS7A7002DDAR ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SJA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of