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TPS80010ARSMR

TPS80010ARSMR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VQFN-32_4X4MM-EP

  • 描述:

    IC CONV BUCK/BOOST 1.8V 32VQFN

  • 数据手册
  • 价格&库存
TPS80010ARSMR 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 TPS80010 PMU for Alkaline Battery-Powered Applications 1 Features 3 Description • • The TPS80010 device provides an integrated powermanagement solution for 2-cell alkaline battery applications such as wireless mice, keyboards, and video game controllers. The VBUCK 1.8-V output is powered by a buck converter with a load capacity of 100 mA. A Power Good (PG) signal is generated when VBUCK is greater than 90% of its target output voltage. Integrated in the TPS80010 is an 80-mΩ load switch that can be connected to the VBUCK output, allowing more system design flexibility when connecting to multiple loads. The 3.1-V VBOOST output is powered by a boost converter. The VBOOST output voltage is post-regulated by the integrated 3-V LDO. This post-regulation provides a low-noise supply level through the specified battery range. 1 • • • • • • 1.8-V Buck DC-DC Converter 3.1-V Boost DC-DC Converter with 3-V PostRegulation LDO Over 91% Conversion Efficiency Current-Limited Start-Up for Both DC-DC Converters Load Switch With Current-Limited Turnon Battery-Level Monitor Switch 32-Pin, 4-mm × 4-mm × 1-mm VQFN Package ESD Performance Tested per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 500-V Charged-Device Model (C101) Device Information(1) 2 Applications • • • PART NUMBER Wireless Mice Wireless Keyboards Game Controllers TPS80010 PACKAGE VQFN (32) BODY SIZE (NOM) 4.00 mm × 4.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application 1.8 V–3.6 V AA AA 10 mF 10 mF VIN_BOOST BAT_FALSELOAD VIN_BUCK PP_BAT 10 W 10 mH SW_BOOST EN_BOOST VO_BOOST EN_LDO FB_BOOST 3.1 V 22 mF EN_BUCK TPS80010 IN_VM EN_SW1 EN_BAT_CHECK 3V OUT_VM 4.7 mF CONTROLLER EN_BAT_FLASELOAD 2.2 mH PG SW_BUCK OPTICAL SENSOR LED 1.8 V 10 mF BAT_CHECK MEMORY/ IO FB_BUCK 1.8 kW MODE_BUCK IN_VIO ADC OUT_VIO TEST1 NC 1.8 kW 1.8 V 1.8-V PERIPHERALS TEST2 GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 5 6.1 6.2 6.3 6.4 6.5 6.6 6.7 5 5 5 5 6 8 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Timing Requirements ................................................ Typical Characteristics .............................................. Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 12 7.3 Feature Description................................................. 13 7.4 Device Functional Modes........................................ 14 8 Application and Implementation ........................ 15 8.1 Application Information............................................ 15 8.2 Typical Application ................................................. 15 9 Power Supply Recommendations...................... 19 10 Layout................................................................... 20 10.1 Layout Guidelines ................................................. 20 10.2 Layout Example .................................................... 20 11 Device and Documentation Support ................. 21 11.1 11.2 11.3 11.4 11.5 Device Support...................................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 21 21 21 21 21 12 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (June 2010) to Revision B Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 • Changed values in Thermal Information table........................................................................................................................ 5 2 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 5 Pin Configuration and Functions SW_BOOST VO_BOOST MODE_BUCK GND2 EN_BUCK VIN_BUCK SW_BUCK GND_BUCK RSM Package 32-Pin VQFN Bottom View 1 32 EN_BOOST GND_BOOST EN_LDO GND VIN_BOOST EN_BAT_CHECK FB_BOOST FB_BUCK THERMAL PAD IN_VM BAT_FLASELOAD_EN OUT_VM EN_SW1 GND_FALSELOAD BAT_FALSELOAD PP_BAT GND3 PG TEST2 TEST1 IN_VIO OUT_VIO BAT_CHECK OUT_VIO IN_VIO Pin Functions PIN NAME NO. I/O DESCRIPTION BAT_CHECK 15 O Battery monitor switch output. Connect to ADC for battery-level check. BAT_FALSELOAD 18 I Battery monitor input for false-load check BAT_FALSELOAD_EN 28 I Battery false load switch enable EN_BAT_CHECK 30 I Battery-check path enable EN_BOOST 32 I Boost converter enable EN_BUCK 4 I Buck converter enable EN_LDO 31 I Boost post-regulation LDO enable EN_SW1 27 I Buck-load switch (SW1) enable FB_BOOST 12 I Boost-converter feedback input FB_BUCK 29 I Buck converter feedback input GND 10 – Ground GND2 5 – Device ground GND3 20 – Device ground GND_BOOST 9 – Boost converter ground GND_BUCK 1 – Buck converter ground Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 3 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com Pin Functions (continued) PIN NAME GND_FALSELOAD NO. I/O DESCRIPTION 17 O False load ground IN_VIO 25, 26 – Internal I/O power supply. Load switch 1 input. Connect externally to buck output IN_VM 13 I Boost post-regulation LDO input. Connect externally to VO_BOOST. MODE_BUCK 6 I Buck converter mode control. High for PWM, low for PFM. OUT_VIO 23, 24 O Load switch 1 output OUT_VM 14 O Boost post-regulation LDO output PG 21 O Buck Power Good indication output. High when VBUCK > 1.7 V. PP_BAT 19 I Battery input for level check SW_BOOST 8 I/O Boost converter switching node. Inductor connection. SW_BUCK 2 O Buck converter switching output. Inductor connection. TEST1 22 I/O Test pin1 (tie to GND) TEST2 16 O Test pin 2 (do not connect) VIN_BOOST 11 – Boost-converter power supply VIN_BUCK 3 – Buck converter power supply VO_BOOST 7 O Boost converter regulated output 4 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VI Input voltage (all pins) –0.3 3.6 V VO Output voltage (all pins) –0.3 3.6 V TJ Junction temperature –40 125 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) MAX UNIT ±2000 V ±500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TA = 0°C to 85°C; typical values are at TA = 25°C MIN VBAT Input voltage, VIN BOOST, VIN_BUCK, PP_BAT pins VIO (IN_VIO) Digital I/O operating voltage TA Ambient temperature NOM 1.95 MAX UNIT 3.6 V 1.8 VBAT V 25 85 °C 0 6.4 Thermal Information TPS80010 THERMAL METRIC (1) RSM (VQFN) UNIT 32 PINS RθJA Junction-to-ambient thermal resistance 37.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 31.8 °C/W RθJB Junction-to-board thermal resistance 8.2 °C/W ψJT Junction-to-top characterization parameter 0.4 °C/W ψJB Junction-to-board characterization parameter 8.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 5 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com 6.5 Electrical Characteristics TA = 0°C to 85°C; typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY CURRENT IQ Quiescent current VBAT = 3 V, all modules enabled IOFF Off current VBAT = 3 V RPULLDOWN Internal pulldown resistor EN_BOOST, EN_LDO, EN_SW1, EN_BAT_CHECK, EN_BAT_FALSELOAD 157 VIH Input logic-high voltage EN_BOOST, EN_LDO, EN_SW1, EN_BAT_CHECK, EN_BAT_FALSELOAD 0.7 × VIO 51 μA 1 μA DIGITAL I/O EN_BUCK, BUCK_MODE VIL Input logic-low voltage 275 V 0.3 × VIO 0.7 × VBAT EN_BUCK, BUCK_MODE Output logic-high voltage PG VOL Output logic-low voltage PG IL_DIG Logic-output load current kΩ 0.7 × VBAT EN_BOOST, EN_LDO, EN_SW1, EN_BAT_CHECK, EN_BAT_FALSELOAD VOH 383 VIO – 0.2 V V 0.2 1 V mA BUCK CONVERTER VIN Input voltage at VIN_BUCK IO Output current VFB Feedback voltage (output accuracy) VBUCK Buck output voltage ISW Switch current limit IRUSH Inrush current Line regulation Load regulation Efficiency Quiescent current 1.95 PWM, IO = 0 mA to 100 mA, VIN ≥ 1.85 V to 3.6 V, VBUCK = 1.8 V –1.5% PFM V 100 mA 1.5% 1 1.8 0.56 VIN = 2 V 0.7 V 0.84 150 PWM, IO = 100 mA A mA 0.9% PFM, IO = 100 mA 0.9% PWM, VIN = 2.4 V, IO = 0 mA to 100 mA –0.5% PFM, VIN = 2.4 V, IO = 0 mA to 100 mA 0.5% PFM , IO = 100 mA, VIN = 2.4 V, VBUCK = 1.8 V 92% PWM, IO = 100 mA, VIN = 2.4 V, VBUCK = 1.8 V 90% PFM, IO = 0 mA, no switching 21 PFM, IO = 0 mA, switching 25 PWM, IO = 0 mA IQ 3.6 μA 5 Shutdown current Leakage current into SW_BUCK mA 0.005 0.15 μA 0.01 1 μA RREC Rectifier on-resistance VGS = 3.6 V 185 380 mΩ RMAIN Main SW on-resistance VGS = 3.6 V 240 480 mΩ ΔVLN Line transient output variation PFM, IO = 50 mA, VIN = 2 V → 3.6 V, Δt = 25 µs 10 20 mV ΔVLD PFM, VIN = 2.4 V, VBUCK = 1.8 V, Load transient output variation IO = 1 mA → 100 mA, Δt = 1 µs 30 40 mV VRIP Output ripple fSW Switching frequency UVLO Undervoltage lockout threshold 1.7 V CL Load capacitance 10 μF L Inductor 2.2 μH 6 PWM, IO = 100 mA, VIN = 2.4 V PFM, IO = 10 mA, VIN = 3.6 V 2 Submit Documentation Feedback 1 10 10 20 2.25 2.5 mVpp MHz Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 Electrical Characteristics (continued) TA = 0°C to 85°C; typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 80 120 mΩ 360 mA 100 mA 1 μA 1.7 1.72 V 10 15 LOAD SWITCH RON Switch on-resistance VGS = 1.8 V Maximum load current Turnon inrush current IOFF Off-state current Switch turned off, IO = 0 mA POWER GOOD RESET VTHRESH Power good threshold voltage VHYS Power good hysteresis 1.68 mV BOOST CONVERTER Boost mode 1.8 3.1 VIN > VBOOST mode, VBOOST = VIN 3.1 3.6 VIN Input voltage at VIN_BOOST VBOOST Output voltage TA = 0°C–50°C, VIN = 1.8 V to 3.1 V, IO = 0 mA to 50 mA IO Output current VIN = 1.8 V to 3.6 V ISW Switch current limit IRUSH Inrush current VIN = 2 V RREC Rectifier on-resistance VBOOST = 3.1 V RMAIN Main SW on-resistance fSW 3 200 3.1 350 V 50 mA 475 mA mA 1 Ω 1 Ω Line regulation VIN = 2 V to 3 V, IO = 50 mA 0.5% Load regulation VIN = 2 V, IO = 0–50 mA 0.5% Boost efficiency VIN = 2.4 V, IO = 5 mA 91% Oscillator frequency 3.2 150 VIN = 2.4 V, IO = 50 mA 91 kHz 625 From VIN supply, IO = 0 mA, VIN = 1.8 V, VBOOST = 3.1 V 1 2.5 From VBOOST, IO = 0 mA, VIN = 1.8 V, VBOOST = 3.1 V 4 6.5 Shutdown current 0.1 1 Leakage current into SW_BOOST 0.1 1 VUVLO VIN decreasing 0.5 0.7 ΔVLN Line transient output variation ΔVLD V = 2.4 V, VBOOST = 3.1 V, IO = 1 mA → 50 mA, Load transient output variation IN Δt = 1 µs VRIP Output ripple IOFF Off-mode current CL Load capacitance L Inductance Quiescent current IQ IO = 10 mA, VIN = 1.8 V → VBOOST, ΔT = 25 µs 10 VIN = 1.8 V, IO = 50 mA 6 V μA V mV 5 10 4 10 mVpp 0.1 1 10 22 10 mV μA μF μH POST REGULATION LDO VIN Input voltage at IN_VM VLDO Output voltage 10 µA ≤ IO ≤ IOMAX 3.6 V 2.91 3.1 3 3.09 V IO Output current Normal mode ILIMIT Current limit VLDO > 1 V 50 mA 300 400 500 ISHORT Short circuit current Output shorted to ground mA 30 60 150 mA VREG Line regulation dVLDO/dVIN at IO = Max LREG Load regulation VLDO (IOMIN) – VLDO(IOMAX) 40 mV ΔVLN Load transient response IO = 20 mA/µs, VIN = 3.1 V 50 100 mV IQ Quiescent current IO = 0 mA 16 17.6 µA 0.2% Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 7 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com Electrical Characteristics (continued) TA = 0°C to 85°C; typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PSRR Power-supply ripple rejection f = 120 Hz to 1 kHz at IO = IOMAX/2, VIN = 3.1 V VRIP_NORM Output ripple VBAT < 3.1 V, IO = 50 mA, VIN = VBOOST 0.1 1 mVpp VRIP_HIBAT Output ripple VBAT > 3.1 V, IO = 50 mA, VIN = VBOOST 4 10 mVpp Boost plus LDO efficiency CL Load capacitance 40 VBAT = 2.4 V, IO = 5 mA, VIN = VBOOST dB 87% VBAT = 2.4 V, IO = 50 mA, VIN = VBOOST 88% Ceramic capacitor, ESR = 10 mΩ to 150 mΩ 4.7 10 22 µF 1.8 3.6 V 3.6 V VIN V BATTERY LOAD MONITOR VOP Operating voltage VIN Input voltage at PP_BAT VOUT Output voltage at BAT_CHECK ILOAD Load current RON Switch on-resistance 1.8 VIN = 1.8 V to 3.6 V 10 mA 12 15 Ω 1.8 3.6 V 3.6 V BATTERY LOAD SWITCH VOP Operating voltage VIN Input voltage at BAT_FALSELOAD IIN Input current RON Switch on-resistance 240 360 mA 500 mΩ 6.6 Timing Requirements MIN NOM MAX UNIT BUCK CONVERTER tSTART Start-up time 10 ms LOAD SWITCH 4 ms tON Output rise time; 10%–90% of final VO, CL = 100 µF Turnon time; CL = 100 µF 2 6 ms tOFF Turnoff time; CL = 100 µF 10 ms 150 200 ms 0.25 10 ms POWER GOOD RESET ΔtPG Power good time-out delay 100 BOOST CONVERTER tSTART Start-up time; from enable, VBOOST = 10% → 90% POST REGULATION LDO tON Turn-on time; IO = 0 mA, VLDO = 90%, CL = 2.9 µF 130 500 µs tOFF Turn-off time; IO = 0 mA, VLDO < 0.5 V, CL = 2.9 µF 3.9 5 ms 8 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 6.7 Typical Characteristics 1.830 95 1.825 VBUCK - Buck Output Voltage - V 100 Efficiency - % 90 85 VIN = 2.1 V VIN = 2.4 V 80 VIN = 2.8 V 75 VIN = 3.2 V 70 VIN = 3.2 V 1.820 1.815 VIN = 2.8 V 1.810 1.805 VIN = 2.4 V 1.800 VIN = 2.1 V 1.795 65 1.790 60 0.1 1 10 Load - mA 100 Figure 1. Buck Efficiency, MODE_BUCK = 0 0 10 20 30 40 50 60 Load - mA 70 80 90 100 Figure 2. Buck Output Voltage vs Load, MODE_BUCK = 0 1.805 VBUCK - Buck Output Voltage - V VIN = 2.4 V Iload = 100 mA VIN = 3.2 V 1.803 VIN = 2.8 V VIN = 2.4 V 1.801 1.799 VBUCK VIN = 2.1 V 1.797 10 mV/div 1 ms/div 1.795 0 20 40 60 Load - mA 80 100 Figure 4. Buck Output-Voltage Ripple, PWM Figure 3. Buck Output Voltage vs Load, MODE_BUCK = 1 100 VBUCK VIN = 2.4 V Iload = 20 mA VIN = 3.2 V 95 VIN = 2.8 V Efficiency - % 90 85 VIN = 2.4 V 80 75 VIN = 2.1 V 70 10 mV/div 10 ms/div 65 60 0.1 Figure 5. Buck Output-Voltage Ripple, PFM 1 Load - mA 10 100 Figure 6. Boost With LDO Efficiency Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 9 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com Typical Characteristics (continued) VIN = 2.4 V Iload = 50 mA VIN = 2.4 V Iload = 0 mA VBOOST VBOOST VLDO VLDO 10 mV/div 1 ms/div 10 mV/div 1 ms/div Figure 7. Boost Output Voltage Ripple Inductor Voltage Figure 8. Boost Output Voltage Ripple VIN = 1.8 V to 3.1 V Iload = 10 mA 1 V/div 10 mV/div 400 ns/div VBOOST Figure 9. Boost Switching Waveform, Continuous-Current Mode 10 Submit Documentation Feedback Figure 10. Boost Switching Waveform, Discontinuous-Current Mode Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 7 Detailed Description 7.1 Overview The TPS80010 provides a system level solution for 2-cell alkaline battery applications. Popular applications include handheld devices including wireless mice, keyboards, and video game controllers. The TPS80010 provides two DC-DC converters, a load switch, post-regulation LDO, and battery monitoring switch—each with their own enable pins to allow for maximum flexibility. The buck converter operates at a fixed voltage, 1.8 V, and can provide up to 150 mA load. Automatic switching is implemented to maximize power efficiency. In moderate to heavy loads the converter operates in PWM mode; as load current decreases it switches to PFM mode. PWM can be forced regardless of load size by disabling this power save mode (PFM mode). The buck allows for several loads to be connected to its output, due to the power distributing load switch connected externally to the output of the buck. The boost converter regulates at a fixed voltage of 3.1 V, and can provide up to 50 mA load current. It contains a discontinuous current mode to maintain efficiency at low load currents. The boost provides a low noise supply at low input voltages due to a post regulation LDO. The battery monitoring switch is used to check battery lifetime. Using a false load implementation and the battery voltage it can determine the battery impedance and therefore health. Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 11 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com 7.2 Functional Block Diagram BUCK VIN_BUCK EN_BUCK MODE_BUCK Switching Control SW_BUCK GND_BUCK + PFM Soft Start - GND FB_BUCK + + ErrAmp - PWM - VREF PG - PG Comp 1.7V + BUCK LOAD SW EN_SW1 IN_VIO Soft Turn ON OUT_VIO OUT_VM ErrAmp VREF + IN_VM EN_LDO BOOST REG. LDO FB_BOOST ErrAmp + VREF VO_BOOST EN_BOOST TEST1 Regulation & Switching Mode Control with Soft Start SW_BOOST + TEST2 I SENSE - GND_BOOST VIN_BOOST + VIN COMP - BOOST VTH PP_BAT EN_BAT_CHECK BATT MONITOR SWITCH BAT_CHECK VIO L/S BAT_FALSELOAD VIO EN_BAT_FALSELOAD 12 BATTERY LOAD SWITCH Submit Documentation Feedback GND_FALSELOAD Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 7.3 Feature Description 7.3.1 Enable The TPS80010 includes two DC-DC converters, a load switch, post-regulation LDO, and battery monitoring switch. Each of these circuits has a dedicated enable pin with an internal pulldown resistor, RPULLDOWN, that can be driven by standard logic or by an open-drain driver. The EN_BUCK pin not only enables the buck converter, but also serves as the master enable for the device. No other circuitry in the TPS80010 can operate without EN_BUCK set high. 7.3.2 Buck DC-DC Converter and Load Switch The synchronous step-down (buck) converter in the TPS80010 provides a fixed 1.8-V output with a load capacity of 150 mA. This converter operates with a fixed switching frequency of 2.25 MHz during pulse-width-modulation (PWM) operation at moderate to heavy loads. As the load current decreases, the converter automatically switches to a power-save mode and operates in pulse-frequency-modulation (PFM) mode to maximize power efficiency. During PFM operation, the converter positions the output at a voltage about 1% greater than the nominal output voltage. This feature minimizes the output voltage drops during sudden load transients. The power-save mode can be disabled by setting the MODE_BUCK pin high. The buck converter has internal soft-start circuitry that limits the inrush current during startup to 150 mA, allowing a slow and controlled output-voltage ramp. Once the output voltage reaches 1.7 V, the output monitoring circuitry generates a Power Good (PG) output signal. The TPS80010 also includes a load switch that is to be connected externally to the buck output voltage. This switch provides flexibility in the design and power distribution of the end application by allowing several loads (such as memory, I/O, Bluetooth, and so forth) to be connected to the same supply while being able to power down or disconnect some of these loads selectively when the end application goes to a low-power mode of operation. This switch has a controlled turnon to limit the inrush current caused by the load, and hence the load transient to the buck converter. 7.3.3 Boost DC-DC Converter and Post-Regulation LDO The TPS80010 includes a synchronous step-up (boost) converter that provides a 3.1-V fixed output at 50-mA load current. The boost converter is controlled by a hysteretic current-mode controller. This controller regulates the output voltage by keeping the inductor ripple current constant and adjusting the offset of this inductor current depending on the output load. If the required average input current is lower than the average inductor current defined by this constant ripple, the converter goes into discontinuous-current mode (DCM) to keep the efficiency high at low-load conditions. The boost also has a soft-start circuit that limits the inrush current to 150 mA. To provide a clean, low-noise supply when VBAT > 3.1 V, the output of the boost is post-regulated by a 3-V LDO. This post-regulation allows the TPS80010 to provide a solid 3-V supply rail to the end application across the full input or battery-voltage range while minimizing the number of external components. To minimize power loss through the power path, the LDO allows for 100-mV input-voltage headroom at 50-mA load. 7.3.4 Battery Monitoring Switch and False Load The TPS80010 implements a battery-voltage monitor switch to briefly check battery lifetime. The integrated falseload switch connects a specified load to the battery. When this false load is applied, the battery monitor switch is turned on, gating the sensed battery voltage to the ADC in the system. Based on this measurement, the system can determine the battery impedance and, therefore, battery health. Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 13 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com 7.4 Device Functional Modes The step-down converter has two modes of operations to maximize efficiency: Pulse frequency modulation (PFM) and pulse width modulation (PWM). PFM mode is for: • Light loads • Automatic transition from this mode to PWM mode automatically when MODE_BUCK pin is pulled low • Increasing output voltage setting by 1% • Better accuracy PWM mode is for: • Moderate to heavy loads • Small output ripple • Pulling MODE_BUCK pin high to result in PWM mode over all load range 14 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TPS80010 is ideal for dual-cell alkaline battery-powered and noise-sensitive applications. The application controller has the ability to enable resources on the power management IC to allow for maximum flexibility. The device resources are often used to power memory, IO, and optical sensors. These devices are common in wireless keyboards and video game controllers. 8.2 Typical Application 1.8 V–3.6 V AA AA 10 mF 10 mF VIN_BOOST BAT_FALSELOAD VIN_BUCK PP_BAT 10 W 10 mH SW_BOOST EN_BOOST VO_BOOST EN_LDO FB_BOOST 3.1 V 22 mF EN_BUCK TPS80010 IN_VM EN_SW1 EN_BAT_CHECK 3V OUT_VM 4.7 mF CONTROLLER EN_BAT_FLASELOAD 2.2 mH PG SW_BUCK OPTICAL SENSOR LED 1.8 V 10 mF BAT_CHECK MEMORY/ IO FB_BUCK 1.8 kW MODE_BUCK IN_VIO ADC OUT_VIO TEST1 NC 1.8 V 1.8-V PERIPHERALS TEST2 1.8 kW GND Figure 11. TPS80010 Typical Application Diagram 8.2.1 Design Requirements The design requirements for TPS80010 are located in Table 1. Table 1. TPS80010 Design Requirements RESOURCE VOLTAGE Buck 1.8 V Boost 3.1 V Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 15 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com 8.2.2 Detailed Design Procedure 8.2.2.1 Buck Output Filter Design The TPS80010 buck regulator is designed to operate with inductors in the range of 1.5 µH to 4.7 µH and with output capacitors in the range of 4.7 µF to 22 µF. The part is optimized for operation with a 2.2-µH inductor and 10-µF output capacitor. Larger or smaller inductor values can be used to optimize the performance of the device for specific operation conditions. For stable operation, the L and C values of the output filter must not be less than 1-µH effective inductance and 3.5-µF effective capacitance. 8.2.2.2 Buck Inductor Selection The inductor value has a direct effect on the ripple current. The selected inductor must be rated for its DC resistance and saturation current. The inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VIN or VBUCK. The inductor selection also has an impact on the output-voltage ripple in PFM mode. Higher inductor values lead to lower output-voltage ripple and higher PFM frequency; lower inductor values lead to a higher output-voltage ripple but lower PFM frequency. Equation 1 calculates the maximum inductor current in PWM mode under static load conditions. The saturation current of the inductor must be rated higher than the maximum inductor current, as calculated with Equation 2. This is recommended because during heavy load transients, the inductor current rises above the calculated value. V 1- BUCK VIN ΔIL = VBUCK ´ L ´ f (1) ΔIL ILmax = IOmax + 2 where • • • • f = Switching frequency (2.25 MHz typical) L = Inductor value ΔIL = Peak-to-peak inductor ripple current ILmax = Maximum inductor current (2) A more conservative approach is to select the inductor current rating just for the switch current limit, ILIMF, of the converter. Accepting larger values of ripple current allows the use of lower inductance values, but results in higher output voltage ripple, greater core losses, and lower output current capability. The total losses of the coil have a strong impact on the efficiency of the DC-DC conversion and consist of both the losses in the DC resistance (R(DC)) and the following frequency-dependent components: • The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies) • Additional losses in the conductor from the skin effect (current displacement at high frequencies) • Magnetic field losses of the neighboring windings (proximity effect) • Radiation losses 8.2.2.3 Buck Output Capacitor Selection The advanced fast-response voltage mode control scheme of the TPS80010 buck regulator allows the use of tiny ceramic capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V- and Z5U-dielectric capacitors, aside from their wide variation in capacitance over temperature, become resistive at high frequencies. At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated with Equation 3. 16 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 VBUCK VIN 1 ´ L ´ f 2 ´ 3 1 IRMSCout = VBUCK × (3) At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the output capacitor in Equation 4. V 1- BUCK æ ö VIN 1 ΔVBUCK = VBUCK × + ESR ÷ ´ ç L ´ f è 8 × COUT ´ f ø (4) At light-load currents, the converter operates in power-save mode, and the output-voltage ripple depends on the output-capacitor and inductor values. Larger output-capacitor and inductor values minimize the voltage ripple in PFM mode and tighten DC output accuracy in PFM mode. 8.2.2.4 Buck Input Capacitor Selection An input capacitor is required for best input voltage filtering and for minimizing the interference with other circuits caused by high input-voltage spikes. For most applications, a 4.7-µF to 10-µF ceramic capacitor is recommended. Because a ceramic capacitor loses up to 80% of its initial capacitance at 5 V, TI recommends that 10-µF input capacitors be used for input voltages > 4.5 V. The input capacitor can be increased without any limit for better input-voltage filtering. Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, such as from a wall adapter, a load step at the output or VIN step on the input can induce ringing at the VIN_BUCK pin. This ringing can couple to the output and be mistaken as loop instability or could even damage the part by exceeding the maximum ratings. Table 2. Recommended Component List for Buck Converter COMPONENT VALUE PART SUPPLIER SIZE LQM2HPN2R2MJ0L Murata 2.5 mm × 2 mm × 1.2 mm (1008) Inductor 2.2 μH LPS3015-222ML Coilcraft 3 mm × 3 mm × 1.5 mm Cacitor (IN) 10 μF GRM188R60J106ME47D Murata 0603 Capacitor (OUT) 10 μF GRM188R60J106ME47D Murata 0603 8.2.2.5 Boost Inductor Selection To ensure proper operation of the TPS80010 boost DC-DC converter, a suitable inductor must be connected between pins VIN_BOOST and SW_BOOST. Inductor values of 4.7 μH show good performance over the whole input and output voltage range. Choosing other inductance values affects the switching frequency f proportional to 1/L as shown in Equation 5. V ´ (VBOOST - VIN ) 1 L= ´ IN f ´ 200 mA VBOOST (5) Choosing inductor values higher than 4.7 μH can improve efficiency due to reduced switching frequency and correspondingly reduced switching losses. Using inductor values less than 2.2 μH is not recommended. Having selected an inductance value, the peak current for the inductor in steady-state operation can be calculated. Equation 6 gives the peak current estimate. ìV ü × IBOOST IL,MAX = í BOOST + 100 mA ý 0.8 × VIN î þ IL,MAX = 200 mA continuous current operation discontinuous current operation (6) IL,MAX is the required minimum inductor-current rating. The load-transient or overcurrent conditions may require an even higher current rating. Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 17 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com The condition in Equation 7 provides an easy way to determine whether the device is in continuous or discontinuous operation. As long as the condition is true, the device operates in continuous-current mode. If the condition becomes false, discontinuous-current operation is established. VBOOST × IO > 0.8 ´ 100 mA VIN (7) Due to the use of current hysteretic control in the TPS80010 boost, the series resistance of the inductor can impact the operation of the main switch. There is a simple calculation that can ensure proper operation of the TPS80010 boost converter. The relationship between the series resistance (RIN), the input voltage (VIN), and the switch current limit (ISW) is shown in Equation 8. V RIN < IN ISW (8) Examples include Equation 9 and Equation 10. ISW = 400 mA, VIN = 2.5 V (9) In Equation 9, RIN < 2.5 V / 400 mA; therefore, RIN must be less than 6.25 Ω. ISW = 400 mA, VIN = 1.8 V (10) In Equation 10, RIN < 1.8 V / 400 mA; therefore, RIN must be less than 4.5 Ω. 8.2.2.6 Boost Input Capacitor The input capacitor must be at least 10 μF to improve transient behavior of the regulator and EMI behavior of the total power-supply circuit. The input capacitor must be a ceramic capacitor and be placed as close as possible to the VIN_BOOST and GND pins of the IC. These capacitors must be X7R or X5R ceramic capacitors. 8.2.2.7 Boost Output Capacitor For the output capacitor COUT, TI recommends using small X7R or X5R ceramic capacitors placed as close as possible to the VO_BOOST and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which cannot be placed close to the IC, the use of a small ceramic capacitor with a capacitance value of around 4.7 μF in parallel with the larger one is recommended. This small capacitor must be placed as close as possible to the VO_BOOST and GND pins of the IC. A minimum effective capacitance value of 6 μF must be used; 10 μF is recommended. If the inductor value exceeds 4.7 μH, the value of the effective output capacitance value must be half the inductance value or higher for stability reasons; see Equation 11. L mF COUT ³ ´ 2 mH (11) NOTE When choosing the output capacitor, be aware of the effects of bias voltage, temperature, and tolerance on the effective capacitance of the component. A capacitor in a 0603 package size suffers more capacitance degradation than a 0805 package at a similar bias voltage. For example, either a 22-µF 0603-sized capacitor or a 10-µF 0805-sized capacitor is required to work with a nominal 10-µH inductor. The TPS80010 boost is not sensitive to ESR in terms of stability. Using low-ESR capacitors, such as ceramic capacitors, is recommended to minimize output-voltage ripple. If heavy load changes are expected, the output capacitor value must be increased to avoid output voltage drops during fast load transients. Table 3. Recommended Component List for Boost Converter COMPONENT Inductor 18 VALUE 10 μH PART SUPPLIER SIZE CBC3225T100MR Taiyo Yuden 3.2 mm × 2.5 mm × 2.5 mm (1210) DO3314-103ML Coilcraft 3.3 mm × 3.3 mm × 1.4 mm Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 Table 3. Recommended Component List for Boost Converter (continued) COMPONENT VALUE PART SUPPLIER SIZE Capacitor (IN) 10 μF GRM188R60J106ME47D Murata 0603 Capacitor (OUT) 22 μF AMK107BJ226MA-T Taiyo Yuden 0603 8.2.3 Application Curves VIN = 2 V to 3.6 V in 25 ms Iload = 50 mA VIN 1 V/div VBUCK 20 mV/div 400 ms/div Figure 12. Buck Output Load Transient Response Figure 13. Buck Output Line Transient Response VIN = 1.8 V to 3.1 V Iload = 10 mA VBOOST VIN 10 mV/div 1 V/div 2 ms/div Figure 14. Boost Line Transient Response Figure 15. Boost Load Transient Response 9 Power Supply Recommendations The TPS80010 was originally designed for dual-cell alkaline battery applications. Therefore, the device has working input voltage ranges from 1.95 V to 3.6 V. As long as the input voltage range is followed, the input supply can be from other regulated supplies. Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 19 TPS80010 SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 www.ti.com 10 Layout 10.1 Layout Guidelines The VIN_BOOST and VIN_BUCK pins must be bypassed to ground with a low-ESR ceramic bypass capacitor. Texas Instruments recommends the typical bypass capacitance is 10 μF. • The optimum placement is closest to the VIN_BUCK and VIN_BOOST pins of the device. Minimize the loop area formed by the bypass capacitor connection, the VINDCDC and VINLDO pins, and the thermal pad of the device. • The thermal pad must be tied to the PCB ground plane with multiple vias. • The FB _BOOST, FB_BUCK, SW_BOOST, SW_BCUK, and OUT_VM pins (feedback and output pins) traces must be routed away from any potential noise source to avoid coupling. • Output capacitance must be placed immediately at the output pins. Excessive distance from the capacitance to output pins may cause poor converter performance. 10.2 Layout Example PowerPAD vias to GND plane Figure 16. TPS80010 Layout 20 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 TPS80010 www.ti.com SLVSAD1B – JUNE 2010 – REVISED JANUARY 2016 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Product Folder Links: TPS80010 21 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS80010ARSMR ACTIVE VQFN RSM 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 TPS 80010A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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