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TPS82740A, TPS82740B
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
TPS82740x 360-nA IQ MicroSIPTM Step Down Converter Module for Low Power
Applications
1 Features
•
•
•
•
•
•
•
•
•
•
•
•
•
1
360-nA Typical Quiescent Current
Up to 90% Efficiency at 10-µA Output Current
Pin-Selectable Output Voltages in 100-mV Steps
Integrated Slew Rate Controlled Load Switch
Up to 200-mA Output Current
Input Voltage Range VIN from 2.2 V to 5.5 V
RF Friendly DCS-Control™
Low Output Voltage Ripple
Automatic Transition to No Ripple 100% Mode
Discharge Function on VOUT and LOAD
Sub 1.1-mm Profile Solution
Total Solution Size < 6.7mm2
Small 2.3 mm × 2.9 mm MicroSIP™ Package
2 Applications
•
•
•
Bluetooth® Low Energy, RF4CE, Zigbee
Wearable Electronics
Energy Harvesting
TPS82740
DC/DC Converter
VIN
SW
VOUT
CIN
VSEL2
VSEL3
EN
VSEL1
VSEL2
VSEL3
LOAD
CTRL
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS82740A
µSIP
2.30 mm × 2.90 mm
TPS82740B
µSIP
2.30 mm × 2.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
TPS82740B
L
VOUT
up to 200mA
COUT
GND
VSEL1
The output voltage is user selectable by three voltage
select pins (VSEL), within a range from 1.8 V to 2.5 V
(TPS82740A) and 2.6 V to 3.3 V (TPS82740B) in
100-mV steps. The TPS82740 features low output
voltage ripple and low noise. Once the battery voltage
comes close to the output voltage (close to 100%
duty cycle), the device enters no ripple 100% mode
operation preventing an increase of output voltage
ripple. In this case the device stops switching and the
output is connected to the input voltage.
The TPS82740 is available in a small 9-bump 6.7
mm2 MicroSiP™ package.
The TPS82740 is the industry's first step-down
converter module featuring typically 360-nA quiescent
current consumption. It is a complete MicroSIPTM
DC/DC step-down power solution intended for ultra
low-power applications. The module includes the
switching regulator, inductor and input/output
capacitors. The integration of all required passive
components enables a tiny solution size of only 6.7
mm2.
Figure 1. Typical Application
ENABLE
The device operates from rechargeable Li-Ion
batteries, Li-primary battery chemistries such as LiSOCl2, Li-MnO2 and two or three cell alkaline
batteries. The input voltage range up to 5.5 V also
allows operation from an USB port and thin-film solar
modules.
The integrated slew rate controlled load switch with a
typical ON-resistance of 0.6Ω distributes the selected
output voltage to a temporarily used sub-system.
3 Description
VIN
2.2 V to 5.5 V
This new DCS-Control™ based device extends the
light load efficiency range below 10-µA load currents.
It supports output currents up to 200 mA.
Switched Supply
RON = 0.6Ω
Control for
Switched
Supply Rail
TPS82740 extends
light load efficiency range
down to 10mA output current
Current
TM
DCS-Control topology
VIN = 3.6V
VOUT = 3.3V
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS82740A, TPS82740B
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1 Absolute Maximum Ratings .....................................
7.2 ESD Ratings ............................................................
7.3 Recommended Operating Conditions......................
7.4 Thermal Information ..................................................
7.5 Electrical Characteristics..........................................
7.6 Typical Characteristics ..............................................
4
4
4
5
5
6
Parameter Measurement Information ................ 14
Detailed Description ............................................ 15
9.1 Overview ................................................................. 15
9.2 Functional Block Diagram ....................................... 15
9.3 Feature Description................................................. 15
9.4 Device Functional Modes........................................ 17
10 Application and Implementation........................ 20
10.1 Application Information.......................................... 20
10.2 Typical Application ............................................... 20
11 Power Supply Recommendations ..................... 23
12 Layout................................................................... 23
12.1 Layout Guidelines ................................................. 23
12.2 Layout Example .................................................... 23
12.3 Surface Mount Information.................................... 24
13 Device and Documentation Support ................. 25
13.1
13.2
13.3
13.4
Documentation Support .......................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
25
25
25
25
14 Mechanical, Packaging, and Orderable
Information ........................................................... 25
14.1 Tape and Reel Information ................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (June 2014) to Revision A
•
2
Page
Added 150 mA Typical current specification for ILIM_softstart, Low side MOSFET switch current limit...................................... 6
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Copyright © 2014, Texas Instruments Incorporated
TPS82740A, TPS82740B
www.ti.com
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
5 Device Comparison Table
PART NUMBER
OUTPUT VOLTAGE SETTINGS
(VSEL1, VSEL2, VSEL3)
PACKAGE
MARKING
TPS82740A
1.8V to 2.5V in 100mV steps
E7
TPS82740B
2.6V to 3.3V in 100mV steps
E8
6 Pin Configuration and Functions
MicroSIP™
9 Bump
(TOP VIEW)
(BOTTOM VIEW)
VSEL2
VSEL2
VSEL3
A1
LOAD
B1
VOUT
C1
VSEL1
A3
VSEL1
B2
B3
EN
EN
C2
C3
VIN
VIN
A2
GND
CTRL
A2
A1
VSEL3
B3
B2
B1
LOAD
C3
C2
C1
VOUT
A3
CTRL GND
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO
VIN
C3
IN
GND
C2
-
CTRL
B2
IN
CTRL pin controls the LOAD output pin. With CTRL = low, the LOAD output is disabled. This pin must be
terminated and not left floating.
VOUT
C1
OUT
Output voltage pin of the module. An internal load switch is connected between VOUT pin and LOAD pin.
LOAD
B1
OUT
Load switch output pin controlled by the CTRL pin. With CTRL = high, an internal load switch connects the
LOAD pin to the VOUT pin. The LOAD pin allows connect / disconnect other system components to the
output of the DC/DC converter. This pin is pulled to GND with the CTRL pin = low. The LOAD pin features
soft switching. If not used, leave the pin open.
VSEL3
A1
IN
VSEL2
A2
IN
Output voltage selection pins. See Table 1 and Table 2 for VOUT selection. These pins must be terminated
and can be changed during operation.
VSEL1
A3
IN
EN
B3
IN
Input voltage supply pin of the module.
Ground terminal.
High level enables the devices and low level turns the device into shutdown mode. This pin must be
terminated and not left floating.
Table 1. Output Voltage Setting TPS82740A
Device
TPS82740A
VOUT
VSEL3
VSEL2
VSEL1
1.8
0
0
0
1.9
0
0
1
2.0
0
1
0
2.1
0
1
1
2.2
1
0
0
2.3
1
0
1
2.4
1
1
0
2.5
1
1
1
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Table 2. Output Voltage Setting TPS82740B
Device
TPS82740B
VOUT
VSEL3
VSEL2
VSEL1
2.6
0
0
0
2.7
0
0
1
2.8
0
1
0
2.9
0
1
1
3.0
1
0
0
3.1
1
0
1
3.2
1
1
0
3.3
1
1
1
7 Specifications
Absolute Maximum Ratings (1)
7.1
Over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
MAX
VIN
–0.3
6
V
EN, CTRL, VSEL1, VSEL2, VSEL3
–0.3
VIN +0.3V
V
VOUT, LOAD
–0.3
3.7
V
-40
85
°C
Operating junction temperature TJ
-40
125
°C
Storage temperature, Tstg
–55
125
Pin voltage
(2)
Operating ambient temperature range, TA (3)
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal GND.
In applications where ambient temperature (TA) constantly stays above 70°C, the product life time might degrade. MLCC capacitor
reliability and lifetime is depending on temperature and applied voltage conditions. At higher temperatures, MLCC capacitors are subject
to stronger stress. The most critical parameter is the Insulation Resistance (IR) resulting in leakage current.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
±2000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body
model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VIN
Supply voltage VIN
IOUT + ILOAD
Device output current (sum of IOUT and ILOAD)
2.2
NOM
MAX
V
VOUTnom + 0.7V ≤ VIN ≤ 5.5V
200
mA
VOUTnom ≤ VIN ≤ VOUTnom +0.7V
100
ILOAD
Load current (current from LOAD pin)
COUT
Additional output capacitance connected to VOUT pin (not including LOAD pin)
10
CLOAD
Capacitance connected to LOAD pin
10
TJ
Operating junction temperature range
-40
90
TA
Operating ambient temperature range
-40
85
4
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UNIT
5.5
100
µF
°C
Copyright © 2014, Texas Instruments Incorporated
TPS82740A, TPS82740B
www.ti.com
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
7.4 Thermal Information
TPS82740
THERMAL METRIC (1)
µSIP
UNIT
9 PINS
RθJA
Junction-to-ambient thermal resistance
83
RθJC(top)
Junction-to-case (top) thermal resistance
53
RθJB
Junction-to-board thermal resistance
-
ψJT
Junction-to-top characterization parameter
-
ψJB
Junction-to-board characterization parameter
-
RθJC(bot)
Junction-to-case (bottom) thermal resistance
-
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5
Electrical Characteristics
VIN = 3.6V, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage range
Operating quiescent
current
IQ
ISD
Shutdown current
2.2
360
EN = VIN, IOUT = 0mA, CTRL = GND, VOUT = 1.8V device switching
460
EN = VIN, IOUT = 0mA, CTRL = GND, VOUT = 2.6V, device switching
500
EN = VIN, IOUT = 0mA., CTRL = VIN, VOUT = 1.8V, device not
switching
12.5
EN = VIN, IOUT = 0mA., CTRL = VIN, VOUT = 2.6V, device not
switching
13.5
VTH_UVLO-
Undervoltage
lockout threshold
V
2300
nA
µA
EN = GND, shutdown current into VIN
70
EN = GND, shutdown current into VIN, TA = 60°C
VTH_UVLO+
5.5
EN = VIN, CTRL = GND, IOUT = 0µA, VOUT = 1.8V / 2.6V, device not
switching
nA
150
Rising VIN
2.075
2.15
Falling VIN
1.925
2
V
INPUTS EN, CTRL, VSEL 1-3
High level input
threshold
2.2V ≤ VIN ≤ 5.5V
VIL TH
Low level input
threshold
2.2V ≤ VIN ≤ 5.5V
IIN
Input bias Current
TA = 25°C
10
TA = –40°C to 85°C
25
VIH
TH
1.1
0.4
V
V
nA
POWER SWITCHES
ILIMF
High side MOSFET
switch current limit
Low side MOSFET
switch current limit
430
mA
2.2V ≤ VIN ≤ 5.5V
mA
430
OUTPUT DISCHARGE SWITCH (VOUT)
RDSCH_VOUT
MOSFET onresistance
EN = GND, IOUT = -10mA into VOUT pin
30
IIN_VOUT
Bias current into
VOUT pin
EN = VIN, VOUT = 2V / 2.8V, CTRL = GND
RLOAD
High side MOSFET
on-resistance
ILOAD = 50mA, CTRL = VIN, VOUT = 2.0V / 2.8V, 2.2 V ≤ VIN ≤ 5.5V
RDSCH_LOAD
Low side MOSFET
on-resistance
CTRL = GND, 2.2V ≤ VIN ≤ 5.5V, ILOAD = - 10mA
TA = 25°C
40
TA = –40°C to 85°C
65
660
1570
Ω
nA
LOAD OUTPUT (LOAD)
VLOAD rise time
tRise_LOAD
Copyright © 2014, Texas Instruments Incorporated
Starting with CTRL low to high transition, time to ramp VLOAD from
0V to 95%, VOUT = 1.8V / 2.6V, 2.2V ≤ VIN ≤ 5.5V, ILOAD = 1mA, TA =
25°C
0.6
1.25
30
65
315
800
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Ω
µs
5
TPS82740A, TPS82740B
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
www.ti.com
Electrical Characteristics (continued)
VIN = 3.6V, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
170
250
340
mV
110
200
280
10
25
ms
400
1200
µs
150
200
AUTO 100% MODE TRANSITION
VTH_100+
Auto 100% Mode
exit detection
threshold (1)
Rising VIN,100% Mode is left with VIN = VOUT + VTH_100+ , max value
at TJ = 85°C
VTH_100-
Auto 100% Mode
enter detection
threshold (1)
Falling VIN, 100% Mode is entered with VIN = VOUT + VTH_100-, max
value at TJ = 85°C
OUTPUT
tStartup_delay
Regulator start up
delay time
From transition EN = low to high until device starts switching
tSoftstart
Softstart time with
reduced switch
current limit
2.2V ≤ VIN ≤ 5.5V, EN = VIN
High side MOSFET
switch current limit
ILIM_softstart
Low side MOSFET
switch current limit
VVOUT
(1)
80
Reduced switch current limit during softstart
mA
150
Output voltage
range
Output voltages are selected with pins VSEL1,
VSEL2, VSEL3
TPS82740A
1.8
2.5
TPS82740B
2.6
3.3
Output voltage
accuracy
IOUT = 10mA, VOUT = 1.8V / 2.6V
-2.5
0
2.5
IOUT = 100mA, VOUT = 1.8V / 2.6V
–2
0
2
DC output voltage
load regulation
VOUT = 1.8V / 2.6V, CTRL = VIN
DC output voltage
line regulation
VOUT = 1.8V / 2.6V, CTRL = VIN, IOUT = 10 mA, 2.5V ≤ VIN ≤ 5.5V
0.001
V
%
%/mA
0
%/V
VIN is compared to the programmed output voltage (VOUT). When VIN–VOUT falls below VTH_100- , the device enters 100% Mode by
turning the high side MOSFET on. 100% Mode is exited when VIN–VOUT exceeds VTH_100+ and the device starts switching. The
hysteresis for the 100% Mode detection threshold VTH_100+ - VTH_100- is always positive and 50 mV(typ.)
7.6 Typical Characteristics
TABLE OF GRAPHS
FIGURE
η
Efficiency
vs Output Current
Figure 4, Figure 5, Figure 6,
Figure 7
η
Efficiency
vs Input Voltage
Figure 8, Figure 9, Figure 10,
Figure 11
VOUT
Output voltage
vs Output curent
Figure 12, Figure 13, Figure 14,
Figure 15
IQ
Operating quiescent current
vs Input voltage
Figure 2
ISD
Shutdown current
vs Input voltage
Figure 3
Automatic Transition into 100% Mode
FSW
Switching frequency
Line and Load Transient Performance
AC load regulation performance
LOAD
6
Figure 19, Figure 20, Figure 21
vs Output current
Figure 16, Figure 17, Figure 18
Figure 22, Figure 23, Figure 24,
Figure 25, Figure 26, Figure 27,
Figure 28, Figure 29, Figure 30,
Figure 31
Figure 32, Figure 33
LOAD Output Behavior
Figure 34, Figure 35, Figure 36
Input Voltage Ramp up / down
Figure 37, Figure 38, Figure 39,
Figure 40
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Typical Characteristics (continued)
200
1000
TA = -40C
TA = 25C
TA = 60C
TA = 85C
800
TA = -40C
TA = 25C
TA = 60C
TA = 85C
180
Shutdown Current ISD (nA)
Quiescent Current IQ (nA)
900
700
600
500
400
300
200
160
140
120
100
80
60
40
20
100
0
2.0
2.5
EN = VIN
Device not switching
3.0
3.5
4.0
4.5
Input Voltage VIN (V)
5.0
0
2.0
5.5
2.5
D019
CTRL = GND
3.0
3.5
4.0
4.5
Input Voltage VIN (V)
5.0
5.5
D020
EN = GND
Figure 2. TPS82740 Quiescent Current IQ
95
90
90
85
85
80
80
Efficiency (%)
Efficiency (%)
Figure 3. TPS82740 Shutdown current ISD
95
75
70
65
60
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
55
50
45
40
0.001
0.01
0.1
1
Output Current (mA)
10
75
70
65
60
50
45
40
0.001
100 300
0.1
1
Output Current (mA)
10
100 300
D009
CTRL = GND
Figure 4. TPS82740A Efficiency VOUT = 1.8V
Figure 5. TPS82740A Efficiency VOUT = 2.1V
100
100
95
95
90
90
85
85
80
Efficiency (%)
Efficiency (%)
0.01
D008
CTRL = GND
75
70
65
VIN = 3.0V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
60
55
50
45
0.001
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
55
0.01
0.1
1
Output Current (mA)
10
Figure 6. TPS82740B Efficiency VOUT = 2.6V
Copyright © 2014, Texas Instruments Incorporated
75
70
65
60
55
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
50
100 300
CTRL = GND
80
45
0.001
0.01
D001
0.1
1
Output Current (mA)
10
100 300
D002
CTRL = GND
Figure 7. TPS82740B Efficiency VOUT = 3.3V
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100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
Typical Characteristics (continued)
60
50
IOUT = 1PA
IOUT = 2PA
IOUT = 5PA
IOUT = 10PA
IOUT = 100PA
IOUT = 1mA
IOUT = 10mA
IOUT = 200mA
40
30
20
10
0
2.0
2.5
3.0
3.5
4.0
4.5
Input Voltage VIN (V)
60
50
IOUT = 1PA
IOUT = 2PA
IOUT = 5PA
IOUT = 10PA
IOUT = 100PA
IOUT = 1mA
IOUT = 10mA
IOUT = 200mA
40
30
20
10
5.0
0
2.0
5.5
CTRL = GND
90
90
80
80
70
70
60
IOUT = 1PA
IOUT = 2PA
IOUT = 5PA
IOUT = 10PA
IOUT = 100PA
IOUT = 1mA
IOUT = 10mA
IOUT = 200mA
30
20
10
0
2.5
5.0
5.5
D011
3.0
3.5
4.0
4.5
Input Voltage VIN (V)
60
50
IOUT = 1PA
IOUT = 2PA
IOUT = 5PA
IOUT = 10PA
IOUT = 100PA
IOUT = 1mA
IOUT = 10mA
IOUT = 200mA
40
30
20
10
5.0
0
3.5
5.5
4.0
D004
CTRL = GND
4.5
Input Voltage VIN (V)
5.0
5.5
D003
CTRL = GND
Figure 10. TPS82740B Efficiency VOUT = 2.6V
Figure 11. TPS82740B Efficiency VOUT = 3.3V
1.85
2.16
1.84
2.15
2.14
1.83
Output Voltage VOUT (V)
Output Voltage VOUT (V)
3.5
4.0
4.5
Input Voltage VIN (V)
Figure 9. TPS82740A Efficiency VOUT = 2.1V
100
Efficiency (%)
Efficiency (%)
Figure 8. TPS82740A Efficiency VOUT = 1.8V
40
3.0
CTRL = GND
100
50
2.5
D010
1.82
1.81
1.80
1.79
1.78
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1.77
1.76
1.75
0.001
0.01
0.1
1
10
Output Current IOUT (mA)
2.13
2.12
2.11
2.10
2.09
2.08
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
2.07
2.06
2.05
100 300
D012
2.04
0.001
0.01
0.1
1
10
Output Current IOUT (mA)
100 300
D013
CTRL = GND
Figure 12. TPS82740A Output voltage VOUT = 1.8V
8
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Figure 13. TPS82740A Output voltage VOUT = 2.1V
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SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
3.40
2.67
2.66
2.65
2.64
2.63
2.62
2.61
2.60
2.59
2.58
2.57
2.56
2.55
2.54
2.53
2.52
0.001
3.38
Output Voltage VOUT (V)
Output Voltage VOUT (V)
Typical Characteristics (continued)
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.01
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.20
0.001
0.1 0.2 0.5 1 2 3 5 10 20 50 100 300
Output Current IOUT (mA)
D014
CTRL = GND
0.1
1
10
Output Current IOUT (mA)
100 300
D015
Figure 15. TPS82740B Output voltage VOUT = 3.3V
1800
1800
1600
1600
Switching Frequency (kHz)
Switching Frequency (kHz)
0.01
CTRL = GND
Figure 14. TPS82740B Output voltage VOUT = 2.6V
1400
1200
1000
800
600
VIN = 2.5V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
400
200
1400
1200
1000
800
600
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
400
200
0
0
0
20
40
60
80 100 120 140
Output Current (mA)
160
180
200
0
2.50
1600
2.45
Output Voltage VOUT (V)
1400
1200
1000
800
600
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
200
20
40
60
80 100 120 140
Output Current (mA)
160
180
200
D018
Figure 18. TPS82740B switching frequency VOUT = 3.0V
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60
80 100 120 140
Output Current (mA)
160
180
200
D017
IOUT = 10mA, rising V IN
IOUT = 10mA, falling V IN
IOUT = 50mA, rising V IN
IOUT = 50mA, falling V IN
IOUT = 100mA, rising V IN
IOUT = 100mA, falling V IN
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
0
0
40
Figure 17. TPS82740A Switching frequency VOUT = 2.1V
1800
400
20
D016
Figure 16. TPS82740A Switching frequency VOUT = 1.8V
Switching Frequency (kHz)
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
3.22
2.00
2.20
2.25
2.30
2.35
2.40
2.45
Input Voltage V IN (V)
2.50
2.55
D005
Figure 19. TPS82740A 100% Mode Transition VOUT = 2.1V
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Typical Characteristics (continued)
2.90
2.80
2.75
3.65
Output Voltage VOUT (V)
Output Voltage VOUT (V)
2.85
3.70
IOUT = 10mA, rising V IN
IOUT = 10mA, falling V IN
IOUT = 50mA, rising V IN
IOUT = 50mA, falling V IN
IOUT = 100mA, rising V IN
IOUT = 100mA, falling V IN
2.70
2.65
2.60
2.55
3.55
3.50
3.45
3.40
3.35
3.30
2.50
3.25
2.45
2.45
3.20
3.20 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 3.70
Input Voltage V IN (V)
D007
2.50
2.55
2.60 2.65 2.70 2.75
Input Voltage V IN (V)
2.80
2.85
2.90
D006
Figure 20. TPS82740A 100% Mode Transition VOUT = 2.5V
VIN = 3.6V
VOUT = 1.8V
CTRL = GND
Load step at VOUT
IOUT = 50mA to 10mA
Figure 22. TPS82740A Load Transient Response VOUT = 1.8V
VIN = 3.6V
VOUT = 2.6V
CTRL = GND
Load step at VOUT
IOUT = 50mA to 10mA
Figure 24. TPS82740B Load Transient Response VOUT = 2.6V
10
3.60
IOUT = 10mA, rising V IN
IOUT = 10mA, falling V IN
IOUT = 50mA, rising V IN
IOUT = 50mA, falling V IN
IOUT = 100mA, rising V IN
IOUT = 100mA, falling V IN
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Figure 21. TPS82740B 100% Mode Transition VOUT = 3.3V
VIN = 3.6V
VOUT = 1.8V
CTRL = VIN
Load step at VOUT
IOUT = 0.5mA to 150mA
Figure 23. TPS82740A Load Transient Response VOUT = 1.8V
VIN = 3.6V
VOUT = 2.6V
CTRL = VIN
Load step at VOUT
IOUT = 0.5mA to 150mA
Figure 25. TPS82740B Load Transient Response VOUT = 2.6V
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Typical Characteristics (continued)
VIN = 3.6V
VOUT = 1.8V
CTRL = GND
Load step at VOUT
IOUT = 0mA to 100mA
1ms rise/fall time
70ms / 10ms
Figure 26. TPS82740A Load Transient Response VOUT = 1.8V
VIN = 3.6V
VOUT = 2.6V
CTRL = GND
Load step at VOUT
0mA to 100mA
1ms rise/fall time
70ms / 10ms
Figure 28. TPS82740B Load Transient Response VOUT = 2.6V
VIN = 3.6V / 4.2V
VOUT = 2.1 V
IOUT = 10mA
CTRL = GND
Figure 30. TPS82740A Line Transient Response
IOUT = 10mA
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VIN = 3.6V
VOUT = 1.8V
CTRL = VIN
Load step at VOUT
0mA to 100mA
1ms rise/fall time
70ms / 10ms
Figure 27. TPS82740A Load Transient Response VOUT = 1.8V
VIN = 3.6V
VOUT = 2.6V
CTRL = VIN
Load step at VOUT
0mA to 100mA
1ms rise/fall time
70ms / 10ms
Figure 29. TPS82740B Load Transient response VOUT = 2.6V
VIN = 3.6V / 4.2V
VOUT = 2.1 V
IOUT = 100mA
CTRL = GND
Figure 31. TPS82740A Line Transient Response
IOUT = 100mA
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Typical Characteristics (continued)
VIN = 3.6V
VOUT = 2.6V
IOUT = 50mA to 200mA
CTRL = GND
VIN = 3.6V
VOUT = 1.8V
IOUT = 50mA to 200mA
CTRL = GND
Figure 32. TPS82740A AC Load Sweep VOUT = 1.8V
VIN = 3.6V
VOUT = VLOAD = 1.8 V
ILOAD = 0 to 50mA
IOUT = 0mA
CTRL = VIN
VIN = 3.6V
VOUT = VLOAD = 2.6V
ILOAD = 0 to 50mA
IOUT = 0mA
CTRL = VIN
Figure 34. TPS82740A Load Step at LOAD Output
VIN = 3.6V
VOUT = 2.6V
IOUT = 0mA
ILOAD = 0mA
CLOAD = 10mF
controlled
slew rate
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Figure 35. TPS82740B Load Step at LOAD Output
VIN ramp up/down
0V to 5V in 150ms
VOUT = 1.8V
ROUT = 50W
CTRL = GND
VLOAD discharged
Figure 36. TPS82740B Load Output ON / OFF
12
Figure 33. TPS82740B AC Load Sweep VOUT = 2.6V
Figure 37. TPS82740A Input Voltage Ramp Up / Down
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Typical Characteristics (continued)
VIN ramp up/down
0V to 5V in 150ms
VOUT = 2.6V
ROUT = 50W
CTRL = GND
VIN ramp up/down
0V to 5V in 150ms
VOUT = 3.3V
ROUT = 50W
CTRL = GND
100% mode operation
High side MOS-FET turned on
100% mode operation
High side MOS-FET turned on
Figure 38. TPS82740B Input Voltage Ramp Up / Down
Figure 39. TPS82740B Input Voltage Ramp Up / Down
VIN ramp up/down
2.8V to 3.7V
VOUT = 3.0V
ROUT = 50W
CTRL = GND
High side MOSFET turned on
100% Mode
Exit / Enter
Figure 40. TPS82740B Enter / Exit 100% Mode Operation
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8 Parameter Measurement Information
TPS82740
DC/DC Converter
VIN
2.2 V to 5.5 V
VIN
SW
VOUT
L
VOUT
up to 200mA
GND
ENABLE
LOAD
EN
VSEL1
VSEL1
VSEL2
VSEL2
VSEL3
VSEL3
Switched Supply Rail
CLOAD
10mF
CTRL
Control for
Switched Supply Rail
GND
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9 Detailed Description
9.1 Overview
The TPS82740 is the first fully integrated step down converter module with an ultra low quiescent current
consumption (360nA typ.) while maintaining a regulated output voltage and featuring TI's DCS-Control™
topology. The device extends high efficiency operation to output currents down to a few micro amperes.
9.2 Functional Block Diagram
CTRL
ENABLE
Ultra Low Power
Reference VREF = 1.2V
UVLO
Softstart
VOUT
VSEL1
Load Switch
Internal
UVLO
VFB feedback
Comp
divider
network
VIN
(typ. 50MW)
VTH_UVLO
VSEL2
VSEL3
UVLO
VIN
VOUT
Min. On
CTRL
Auto 100% Mode
Comp
100%
Mode
Slew Rate
Control
LOAD
EN
VIN
UVLO Discharge
VTH_100
Current
Limit Comparator
Timer
DCS
Control
VOUT
Discharge
EN
UVLO
Limit
High Side
Power Stage
VIN
PMOS
Min. OFF
VOUT
Direct Control
& Compensation
EN
Control
Logic
L
Gate Driver
Anti
Shoot-Through
VOUT
VFB
VREF
Error
amplifier
Main
Comparator
Limit
Low Side
NMOS
Current
Limit Comparator
GND
9.3 Feature Description
9.3.1 DCS-Control™
TI's DCS-Control™ (Direct Control with Seamless Transition into Power Save Mode) is an advanced regulation
topology, which combines the advantages of hysteretic and voltage mode control. Characteristics of DCSControl™ are excellent AC load regulation and transient response, low output ripple voltage and a seamless
transition between PFM and PWM mode operation. DCS-Control™ includes an AC loop which senses the output
voltage (VOUT pin) and directly feeds the information to a fast comparator stage. This comparator sets the
switching frequency, which is constant for steady state operating conditions, and provides immediate response to
dynamic load changes. In order to achieve accurate DC load regulation, a voltage feedback loop is used.
The DCS-Control™ topology supports PWM (Pulse Width Modulation) mode for medium and high load
conditions and Power Save Mode at light loads. During PWM mode, it operates in continuous conduction. The
switching frequency goes up to 1.7MHz with a controlled frequency variation depending on the input voltage. If
the load current decreases, the converter seamlessly enters Power Save Mode to maintain high efficiency down
to very light loads. In Power Save Mode, the switching frequency varies nearly linearly with the load current.
Since DCS-Control™ supports both operation modes within one single building block, the transition from PWM to
Power Save Mode is seamless without effects on the output voltage. The TPS82740 offers both excellent DC
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Feature Description (continued)
voltage and superior load transient regulation, combined with very low output voltage ripple, minimizing
interference with RF circuits. At high load currents, the converter operates in quasi fixed frequency PWM mode
operation and at light loads in PFM (Pulse Frequency Modulation) mode to maintain highest efficiency over the
full load current range. In PFM Mode, the device generates a single switching pulse to ramp up the inductor
current and recharge the output capacitor, followed by a sleep period where most of the internal circuits are
shutdown to achieve the lowest quiescent current. During this time, the load current is supported by the output
capacitor. The duration of the sleep period depends on the load current and the inductor peak current.
During the sleep periods, the quiescent current of the TPS82740 is reduced to 360nA. This low quiescent current
consumption is achieved by an ultra low power voltage reference, an integrated high impedance (typ. 50MΩ)
feedback divider network and an optimized DCS-Control™ block.
9.3.2 LOAD Switch
The LOAD pin can be used to power an additional, temporarily used sub-system. If the CTRL pin is set high, the
LOAD pin is connected to the VOUT pin via an integrated load switch. The load switch is slew rate controlled to
support soft switching and not impacting the regulated output VOUT. If the CTRL pin is set to low, the LOAD pin
is disconnected from the VOUT pin and internally connected to GND by an internal discharge switch. The CTRL
pin can be controlled by a micro controller and must be terminated. With CTRL pin high, the quiescent current is
increased to improve the transient response.
9.3.3 Output Voltage Selection (VSEL1, VSEL2, VSEL3)
The TPS82740 provides an integrated, high impedance (typ. 50MΩ) feedback resistor divider network which is
programmed by the pins VSEL1-3. The TPS82740A supports an output voltage range of 1.8V to 2.5V in 100mV
steps, while the TPS82740B supports an output voltage range from 2.6V to 3.3V in 100mV steps. The output
voltage can be changed during operation and supports a simple dynamic output voltage scaling, shown in
Figure 46. The output voltage is programmed according to Table 1 and Table 2.
9.3.4 Output Discharge Function (VOUT and LOAD)
Both the VOUT pin and the LOAD pin feature a discharge circuit to connect each rail to GND, once they are
disabled. This feature prevents residual charge voltages on capacitors connected to these pins, which may
impact proper power up of the main- and sub-system. With the CTRL pin pulled low, the discharge circuit at the
LOAD pin activates. With the EN pin pulled low, the discharge circuit at the pin VOUT activates.
9.3.5 Internal Current Limit
The TPS82740 integrates a current limit in the high side, as well as in the low side MOSFETs to protect the
device against overload or short circuit conditions. The peak current in the switches is monitored cycle by cycle.
If the high side MOSFET current limit is reached, the high side MOSFET is turned off and the low side MOSFET
is turned on until the current decreases below the low side MOSFET current limit.
Table 3. Load Pin Condition Table
Pin condition
Operating condition
Remark
LOAD
EN
CTRL
VIN
Connected
to VOUT
high
high
> VUVLO
load switch enabled
and slew rate
controlled
high
low
> VUVLO
load switch turned
off
low
high or low
> VUVLO
device and load
switch disabled
high
high
< VUVLO
device disabled due
to UVLO
Connected
to GND
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9.3.6 CTRL / DVS (Dynamic Voltage Scaling TPS62741)
In TPS62741, the CTRL pin controls beside the load switch as well Dynamic Voltage Scaling. The CTRL pin
selects between two different voltage setting banks. The voltage of each bank are set with the VSEL pins 1-4
according to .
The output LOAD is controlled with the CTRL pin. The pin is internally connected either to VOUT pin or GND and
can be used to power up/down temporarily used external circuits to reduce leakage current consumption of the
system.
9.4 Device Functional Modes
9.4.1 Enable / Shutdown
The TPS82740 is activated when the EN pin is set high. For proper operation, the pin must be terminated and
must not be left floating. With the EN pin set low, the device enters shutdown mode with less than typ. 70nA
current consumption.
9.4.2 Soft Start
When the device is enabled, the internal reference is powered up and after the startup delay time tStartup_delay has
expired, the device enters softstart, starts switching and ramps up the output voltage. During softstart, the device
operates with a reduced current limit, ILIM_softstart, of typ. 1/3 of the nominal current limit. This reduced current limit
is active during the time tSoftstart. The current limit is increased to its nominal value, ILIMF, once this time has
expired or the nominal output voltage is reached.
9.4.3 POWER GOOD OUTPUT (PG)
The Power Good comparator features an open drain output. The PG comparator is active with EN pin set to high
and VIN is above the threshold VTH_UVLO+. It is driven to high impedance once VOUT trips the threshold VTH_PG+ for
rising VOUT. The output is pulled to low level once VOUT falls below the PG hysteresis, VPG_hys. The output is also
pulled to low level in case the input voltage VIN falls below the undervoltage lockout threshold VTH_UVLO- or the
device is disabled with EN = low. The power good output (PG) can be used as an indicator for the system to
signal that the converter has started up and the output voltage is in regulation.
Table 4. PG condition table
Pin condition
Operating condition
EN
CTRL
hiz
high
high
don't care
> VUVLO
VOUT > VTH_PG+
PG comparator
active, pull up resistor
pulls PG to high
hiz
high
low
medium load (>
1mA)
> VUVLO
VOUT > VTH_PG+
PG comparator
active, pull up resistor
pulls PG to high
VOUT
light load (< 1mA)
> VUVLO
VOUT > VTH_PG+
don't care
0mA < IOUT <
100mA
> VUVLO
VOUT < VTH_PG-
startup, overload or
ramp down
don't care
output disabled
VIN > 1.2V
high
low
low
high
low
low
high
VIN
PG comparator
disabled for low Iq
operation, pull up
resistor pulls PG to
high
hiz
low
IOUT / ILOAD
Remark
PG
don't care
output disabled
< VUVLO
VOUT = 0
VOUT not present
device disabled
device disabled, due
to UVLO
Table 5. VOUT Output Discharge Condition Table
EN
VIN condition
connected to GND, output discharged
VOUT pin
low
1.5V < VIN < VUVLO
connected to GND, output discharged
high
< VUVLO
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Table 5. VOUT Output Discharge Condition Table (continued)
VOUT pin
hiz, discharge switch disabled
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EN
high
VIN condition
remark
> VUVLO
during regulator start
up, the discharge
switch is enabled and
VOUT pulled to low,
until the regulator
start up time tStart
expires. During the
softstart time and
later, the discharge
switch is disabled.
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9.4.4 Automatic Transition into 100% Mode
Once the input voltage comes close to the output voltage, the TPS82740 stops switching and enters 100% duty
cycle operation. It connects the output VOUT via the inductor and the internal high side MOSFET switch to the
input VIN, once the input voltage VIN falls below the 100% mode enter threshold, VTH_100-. In 100% mode
switching stops eliminating output voltage ripple. Because the output is connected to the input, the output voltage
tracks the input voltage minus the voltage drop across the internal high side switch and the inductor caused by
the output current. Once the input voltage increases and trips the 100% mode exit threshold, VTH_100+ , the
TPS82740 turns on and starts switching again. See Figure 41, Figure 19, Figure 20 and Figure 21.
VIN
VIN,
VOUT
100%
Mode
100%
Mode
VTH_100+
VTH_100VOUT
tracks VIN
Step Down Operation
VOUT
tracks VIN
VUVLO+
VUVLOVOUT
discharge
tsoftstart
Figure 41. Automatic Transition into 100% Mode
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10 Application and Implementation
10.1 Application Information
The device is designed to operate from an input voltage supply range between 2.2V and 5.5V with a maximum
output current of 200mA. Once the input voltage comes close to the output voltage, the DC/DC converter stops
switching and enters 100% duty cycle operation. The integrated slew rate controlled load switch can distribute
the selected output voltage to a temporarily used sub-system. The TPS82740 module operates in PWM mode for
medium and high load conditions and in power save mode at light load currents.
At high load currents, the converter operates in quasi fixed frequency PWM mode operation. The switching
frequency is up to 1.7MHz with a controlled frequency variation depending on the input voltage. If the load
current decreases, the converter seamlessly enters Power Save Mode by varying the switching frequency
linearly to maintain high efficiency over the full load current range. At very light load conditions the device
generates a single switching pulse to ramp up the inductor current and recharge the output capacitor, followed by
a sleep period where most of the internal circuits are shutdown to achieve 360nA quiescent current consumption.
10.2 Typical Application
TPS82740
DC/DC Converter
VIN
2.2 V ... 5.5 V
VIN
L
LCD
Display + Driver
Main Supply
SW
VOUT
GND
ENABLE
ADC
Control Subsystem
CTRL
EN
VSEL1
VSEL1
VSEL2
VSEL2
VSEL3
VSEL3
MCU
Switched Supply
LOAD
Radio
SOC
GND
Acceleration
Sensor
Electronic
Compass
Temperature
Sensor
Figure 42. Example of Implementation in a SOC Based System
10.2.1 Design Requirements
TPS82740 is a complete step-down converter module including all passive components (inductor, input and
output capacitor). For most applications no additional input / output capacitors are required. Use the following
typical application design procedure to select additional external components in case further performance
improvement of the module is desired.
10.2.2 Detailed Design Procedure
10.2.2.1 Input Capacitor Selection
For most applications, the integrated input capacitor at the VIN pin is sufficient.
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Typical Application (continued)
TPS82740 uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable
inductance, such as that from a wall adapter, a load step at the output can induce ringing at the VIN pin. This
ringing can couple to the output and be mistaken as loop instability or can even damage the module. In this
circumstance, additional ceramic 'bulk" capacitance, such as electrolytic or tantalum, should be placed between
the input of the module and the power source lead to reduce ringing that occurs between the inductance of the
power source leads and the module.
10.2.2.1.1 Input Buffer Capacitor Selection
In addition to the small ceramic input capacitor a larger buffer capacitor CBuf is recommended to reduce voltage
drops and ripple voltage. When using battery chemistries like Li-SOCl2, Li-SO2, Li-MnO2, the impedance of the
battery has to be considered. These battery types tend to increase their impedance depending on discharge
status and often can support output currents of only a few mA. Therefore a buffer capacitor is recommended to
stabilize the battery voltage during DC/DC operations e.g. for a RF transmission. A voltage drop on the input of
the TPS82740 during DC/DC operation impacts the advantage of the step down conversion for system power
reduction. Furthermore the voltage drops can fall below the minimum recommended operating voltage of the
device and leads to an early system cut off. Both effects reduce the battery life time. To achieve best
performance and to extract the most energy out of the battery a good procedure is to select the buffer capacitor
value for an voltage drop below 50mVpp during DC/DC operation. The capacitor value strongly depends on the
used battery type, as well the current consumption during a RF transmission as well the duration of the
transmission.
10.2.2.2 Output Capacitor Selection
For most applications, the integrated output capacitor at the VOUT pin is sufficient.
In order to further reduce the output voltage ripple and improve the load transient performance an additional
external output capacitance may be used. For most applications an additional 4.7µF or 10µF capacitor will be
sufficient. Care should be taken that the total effective capacitance present at the output does not exceed 10µF
in order to guarantee loop stability. Ceramic capacitors with low ESR values have the lowest output voltage ripple
and are recommended.
At the LOAD output pin, no additional output capacitor is required. For applications demanding external
capacitance connected to the LOAD pin, the total capacitance should not exceed 10µF.
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Typical Application (continued)
10.2.3 Application Curves
VIN = 3.6V
VOUT = 2.6V
ROUT = 100W
CTRL = GND
VIN = 3.6V
VOUT = 2.6V
ROUT = 100W
CTRL = GND
Figure 43. TPS82740B Device Enable and Start up
VIN = 3.6V, VOUT = VLOAD = 2.6V
CTRL = VIN
ROUT = 100W
ILOAD = 0mA
CLOAD = 10mF
Figure 45. TPS82740B VOUT Ramp with activated LOAD
Switch
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Figure 44. TPS82740B VOUT Ramp after Enable
VIN = 3.6V,
VOUT = 1.8V / 2.5V ramp up / down
IOUT = 5mA
VSEL 2+3 toggled, VSEL1 = GND
CTRL = GND
Figure 46. TPS82740A Dynamic Output Voltage Scaling:
VOUT = 1.8V / 2.5V
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11 Power Supply Recommendations
The TPS82740 device is a complete and optimized power supply module working within the given
specification range without additional components. Please use the information given in the Application
Information section to connect the input and output circuitry appropriately.
12 Layout
12.1 Layout Guidelines
In making the pad size for the uSiP LGA balls, it is recommended that the layout use a non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 47 shows the appropriate diameters for a MicroSiPTM
layout. Figure 48 shows a suggestion for the PCB layout.
12.2 Layout Example
Figure 47. Recommended Land Pattern Image and Dimensions
SOLDER PAD
DEFINITIONS (1) (2) (3) (4)
COPPER PAD
Non-solder-mask
defined (NSMD)
0.30mm
(1)
(2)
(3)
(4)
(5)
(6)
SOLDER MASK
OPENING
0.360mm
(5)
COPPER
THICKNESS
STENCIL (6)
OPENING
STENCIL THICKNESS
1oz max (0.032mm)
0.34mm diameter
0.1mm thick
Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
Copyright © 2014, Texas Instruments Incorporated
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TPS82740A, TPS82740B
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
www.ti.com
GND
LOAD Pin A1
VIN
VOUT
GND
Figure 48. PCB Layout Suggestion
12.3 Surface Mount Information
The TPS82740 MicroSIP™ module uses an open frame construction for a fully automated assembly process and
provides a large surface area for pick and place operations. See the "Pick Area" in the package drawing.
Package height and weight have been kept to a minimum, allowing MicroSIP™ device handling similar to a 0805
footprint component.
For reflow recommendations, see document J-STD-20 from the JEDEC/IPC standard.
24
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Copyright © 2014, Texas Instruments Incorporated
TPS82740A, TPS82740B
www.ti.com
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 6. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS82740A
Click here
Click here
Click here
Click here
Click here
TPS82740B
Click here
Click here
Click here
Click here
Click here
13.2 Trademarks
DCS-Control, MicroSIP, MicroSiP are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc..
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014, Texas Instruments Incorporated
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TPS82740A, TPS82740B
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
www.ti.com
14.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
26
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width W1
(mm)
TPS82740ASIPR
uSIP
SIP
9
3000
178
9.0
TPS82740ASIPT
uSIP
SIP
9
250
178
9.0
TPS82740BSIPR
uSIP
SIP
9
3000
178
9.0
TPS82740BSIPT
uSIP
SIP
9
250
178
9.0
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A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
2.5
3.1
1.35
4.0
8.0
Q2
2.83
3.18
1.2
4.0
8.0
Q2
2.5
3.1
1.35
4.0
8.0
Q2
2.83
3.18
1.2
4.0
8.0
Q2
Copyright © 2014, Texas Instruments Incorporated
TPS82740A, TPS82740B
www.ti.com
SLVSCE3A – JUNE 2014 – REVISED JUNE 2014
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS82740ASIPR
uSIP
SIP
9
3000
223
194
35
TPS82740ASIPT
uSIP
SIP
9
250
223
194
35
TPS82740BSIPR
uSIP
SIP
9
3000
223
194
35
TPS82740BSIPT
uSIP
SIP
9
250
223
194
35
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
27
PACKAGE OUTLINE
SIP0009F
MicroSiP TM - 1.1 mm max height
SCALE 5.500
MICRO SYSTEM IN PACKAGE
2.95
2.85
B
A
PIN A1 INDEX
AREA
2.35
2.25
PICK AREA
NOTE 3
1.1 MAX
C
SEATING PLANE
0.10
0.06
0.05 C
2 TYP
1 TYP
C
0.8
TYP
9X
0.015
C A
0.35
0.25
B
1.6
TYP
B
A
1
2
3
4221589/A 06/2014
MicroSiP is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. For pick and place nozzle recommendation, see product datasheet.
4. Location, size and quantity of each component are for reference only and may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
SIP0009F
MicroSiP TM - 1.1 mm max height
MICRO SYSTEM IN PACKAGE
SYMM
1
9X ( 0.3)
SEE DETAILS
3
2
A
SYMM
B
(0.8)
TYP
C
(1) TYP
LAND PATTERN EXAMPLE
NOT TO SCALE
0.05 MIN
( 0.3)
METAL
0.05 MAX
( 0.3)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER MASK
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221589/A 06/2014
NOTES: (continued)
5. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
www.ti.com
EXAMPLE STENCIL DESIGN
SIP0009F
MicroSiP TM - 1.1 mm max height
MICRO SYSTEM IN PACKAGE
SYMM
1
( 0.34) TYP
SEE DETAIL
3
2
A
SYMM
B
(0.8)
TYP
C
(1) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:20X
( 0.34)
METAL
UNDER PASTE
SOLDER PASTE DETAIL
TYPICAL
4221589/A 06/2014
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS82740ASIPR
ACTIVE
uSiP
SIP
9
3000
RoHS & Green
NIAU
Level-2-260C-1 YEAR
-40 to 85
E7
TPS82740ASIPT
ACTIVE
uSiP
SIP
9
250
RoHS & Green
NIAU
Level-2-260C-1 YEAR
-40 to 85
E7
TPS82740BSIPR
ACTIVE
uSiP
SIP
9
3000
RoHS & Green
NIAU
Level-2-260C-1 YEAR
-40 to 85
E8
TPS82740BSIPT
ACTIVE
uSiP
SIP
9
250
RoHS & Green
NIAU
Level-2-260C-1 YEAR
-40 to 85
E8
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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