TPSM365R6V3EVM

www.ti.com User’s Guide TPSM365R6V3EVM User’s Guide ABSTRACT The TPSM365R6V3EVM evaluation board (EVM) allows for evaluation of TPSM365R6, a synchronous stepdown DC/DC module capable of driving up to 0.6-A of load current from a wide input voltage of up to 65-V. This EVM is configured to provide a 3.3V fixed output voltage. The switching frequency is set to 1MHz, and can also be synced to an external signal. The EVM can also serve as an example for circuit layout and design for a user's end application. See the TPSM365R6, 3-V to 65-V Input, 600-mA, 4-μA No-Load IQ Synchronous Buck Converter Power Module in a HotRod™ QFN Package data sheet for additional features, detailed descriptions, and available options. Table 1-1. Device and Package Configurations EVM U1 FREQUENCY SPREAD SPECTRUM CURRENT PIN 11 TRIM TPSM365R6V3EVM TPSM365R6V3RDNR Fixed (1MHz) Disabled 0.6 A MODE/SYNC TPSM365R6V3EVM Board SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 1 Table of Contents www.ti.com Table of Contents 1 Setup........................................................................................................................................................................................3 1.1 Test Points..........................................................................................................................................................................3 1.2 Jumpers..............................................................................................................................................................................5 2 Operation.................................................................................................................................................................................6 2.1 Quick Start..........................................................................................................................................................................6 3 Schematic................................................................................................................................................................................7 4 Board Layout...........................................................................................................................................................................8 5 Bill of Materials......................................................................................................................................................................11 6 Typical Characteristics.........................................................................................................................................................12 7 Application Curves............................................................................................................................................................... 16 List of Figures Figure 1-1. EVM Board Connections........................................................................................................................................... 4 Figure 1-2. Jumper Locations...................................................................................................................................................... 5 Figure 3-1. TPSM365R6V3EVM Schematic................................................................................................................................7 Figure 4-1. Top View of EVM....................................................................................................................................................... 8 Figure 4-2. EVM Top Copper Layer............................................................................................................................................. 8 Figure 4-3. EVM Mid Layer One.................................................................................................................................................. 9 Figure 4-4. EVM Mid Layer Two.................................................................................................................................................. 9 Figure 4-5. EVM Bottom Copper Layer..................................................................................................................................... 10 Figure 6-1. Efficiency 3.3-V Output, FSW = 1 MHz, Auto Mode................................................................................................. 12 Figure 6-2. Efficiency 3.3-V Output, FSW = 1 MHz, FPWM........................................................................................................12 Figure 6-3. Efficiency 5-V Output, FSW = 1 MHz, Auto Mode.................................................................................................... 13 Figure 6-4. Efficiency 5-V Output, FSW = 1 MHz, FPWM...........................................................................................................13 Figure 6-5. Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz with EMI Filter (Standard EVM Layout and BOM)......................................................................................................................................................................................14 Figure 6-6. Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz without EMI Filter (Standard EVM Layout and BOM)......................................................................................................................................................................................14 Figure 6-7. Typical CISPR 11 Class B Radiated EMI 30 kHz - 1000 MHz (Standard EVM Layout and BOM, Input Filter Removed)...............................................................................................................................................................................15 Figure 7-1. Start-Up Waveforms................................................................................................................................................ 16 Figure 7-2. Shutdown Waveforms............................................................................................................................................. 16 Figure 7-3. Load Transient, 0 A to 0.6 A, 1 A/µs........................................................................................................................16 Figure 7-4. Load Transient, 0.3 A to 0.6 A, 1 A/µs.....................................................................................................................16 Figure 7-5. Load Transient, 0 A to 0.6 A, 1 A/µs........................................................................................................................16 Figure 7-6. Load Transient, 0.3 A to 0.6 A, 1 A/µs.....................................................................................................................16 List of Tables Table 1-1. Device and Package Configurations...........................................................................................................................1 Table 1-1. Test Point Descriptions............................................................................................................................................... 3 Table 5-1. Bill Of Materials......................................................................................................................................................... 11 Trademarks HotRod™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 2 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Setup 1 Setup Figure 1-1 shows a typical setup with the EVM. The VIN power terminal block (J1) is used for connection to the host input supply and the VOUT power terminal block (J4) is used for connection to the load. 1.1 Test Points The test points on the top of the board can be used for connecting to the input and output of the EVM. Table 1-1 describes each test point. Table 1-1. Test Point Descriptions Test Point(1) VINS+ Sense line for measuring the input voltage. Not meant to be used to power the device. VINS- Ground test point located near the ground terminal of the high frequency bypass capacitor. Meant to be connected to the ground sense line for VIN, but can be used in place of a general ground test point. VOUTS+ Sense line test point for the output voltage. Do not connect to an output load. VOUTS- Ground test point located near the ground terminal of the output capacitors. Meant to be connected to the ground sense line for VOUT, but can be used in place of a general ground test point. GND Test points for ground connection. Not meant to be used as a ground connection for the input power supply. EN Input voltage scope monitor. Connect an oscilloscope probe to this set of points to measure input ripple voltage. PGOOD This test point is connected to the PGOOD pin from the IC. This test point is an open-drain output of the PGOOD pin. In this EVM configuration, the pin is pulled up to VOUT by R4. EN SYNC VCC (1) Description This test point is connected to the EN pin. By default, there is a pullup resistor R2 (RENT) to VIN to enable the IC. This test point is connected to the RT pin of the IC when the R4 (RMODE) is installed. In a MODE/SYNC trimmed part, this test point is connected to the SYNC pin of the IC. This can be connected to an external clock to synchronize the IC. In a MODE/SYNC configuration, make sure J6 is configured to the SYNC setting in order to hookup to an external clock signal. This test point is connected to the VCC pin. Refer to the product data sheet for absolute maximum ratings associated with the features in this table. SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 3 Setup www.ti.com (-) Input (-) Supply (+) (+) (+) Load (-) DMM (VOUT) (+) (-) DMM (VIN) Figure 1-1. EVM Board Connections 4 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Setup 1.2 Jumpers See Figure 1-2 for jumper locations. • • • • J2 EN- This jumper allows the ENABLE input to be connected to GND in order to disable the IC. The "ON" position is the same as an unconnected jumper as EN is pulled up by R2. The "OFF" position shorts EN to ground which will disable TPSM365R6V3RDNR. J3 Mode Select- This EVM is supplied with an MODE/SYNC trimmed version of TPSM365R6 to allow to adjust between PFM and FPWM modes at a fixed 1MHz swithcing frequency. J5 DUMMY CONNECTOR- If an RT device is installed into U1, then this pin can be configured to add a feedback resistor network between VOUT and the RT pin. J6 Mode/Sync- This connector selects between whether the pin 11 of the device is connected to J3's Mode setting or to the signal connected to the SYNC test point. Dummy Connector Mode/Sync Mode Select Enable Figure 1-2. Jumper Locations SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 5 Operation www.ti.com 2 Operation 2.1 Quick Start 1. Make sure that a jumper is connected to one of the frequencies on the frequency select header. The device does not function properly if this is not connected. 2. Connect the load between the VOUT and GND points on J4. Make sure GND is connected on the top terminal, and VOUT is located on the bottom terminal. 3. Set the supply voltage at an appropriate level between 3.0 V to 65 V. Set the current limit of the supply to an appropriate level. 4. Turn on the power supply. With the default configuration, the EVM powers up and provides VOUT = 3.3 V. 5. Monitor the output voltage. The maximum load current is limited to 0.6 A with the TPSM36506 device. 6. Connect the voltage supply between the VIN and GND points on J1. 6 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic 3 Schematic TP2 TP8 GND GND GND GND VIN S+ TP1 VIN Vin_emi Vin L1 1.5µH C12 100V 2.2uF J1 C11 100V 2.2uF C10 100V 2.2uF C9 100V 2.2uF C14 DNP100V 2.2uF + C3 100V 22uF C1 100V 2.2uF 2 1 DNPC15 C2 100nF 100nF 100V 100V U1 C4 1µF 16V 3 VCC R1 0 VIN 8 VIN BOOT VCC SW SW GND EN 2 PGOOD 1 MODE/SYNC 11 EN VOUT PGOOD BIAS MODE/SYNC GND TPSM365R6V3RDNR EN TP3 ENABLE 3 2 1 ON OFF VOUT S+ 5 SW 6 4 9 J4 TP7 VIN- MODE SYNC R2 100k C5 25V 22uF FB 10 C6 25V 22uF C8 C7 DNP25V 50V 22uF 0.1uF VOUT R9 0 GND GND TP9 TP6 VOUT S- SYNC R10 0 Mode/Sync R3 100k J2 1 2 VOUT GND GND 1 2 3 VIN TP5 7 BOOT J6 TP4 PGOOD Vout R4 49.9k GND VOUT SELECT 1.8 1.8V 2.5V 3.3V 5.0V 12V 12 2.5 3.3 5 MODE SELECT 2 4 6 FPWM VCC 8 10 PFM GND 1 3 5 7 9 2 4 6 8 10 1 3 5 7 9 J5 R6DNP40.2k R8DNP27.0k R11 DNP 8.20k R7 20.0k DNP R12 DNP 6.98k R13 DNP 8.06k R14 DNP 16.9k R15 DNP 69.8k R16 DNP 10.0k J3 GND Figure 3-1. TPSM365R6V3EVM Schematic SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 7 Board Layout www.ti.com 4 Board Layout Figure 4-1. Top View of EVM Figure 4-2. EVM Top Copper Layer 8 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Board Layout Figure 4-3. EVM Mid Layer One Figure 4-4. EVM Mid Layer Two SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 9 Board Layout www.ti.com Figure 4-5. EVM Bottom Copper Layer 10 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Bill of Materials 5 Bill of Materials Table 5-1. Bill Of Materials DESIGNATOR PARTNUMBER DESCRIPTION MANUFACTURER QUANTITY C1, C9, C10, C11, C12 C3225X7R2A225K230AB Multilayer Ceramic Capacitors 2.2uF ±10% 100V X7R SMD 1210 TDK 5 C2 GRM188R72A104KA35J CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, 0603 MuRata 1 C3 UT226M100HFKTA Cap Aluminum 22uF 100V 20% (8 X 10.2mm) SMD 1.3 Ohm 70mA 2000h 125 C T/R Aillen 1 C4 C1608X7R1C105K080AC CAP, CERM, 1 uF, 16 V, +/- 10%, X7R, 0603 TDK 1 C5, C6 C3225X7R1E226M250AB Cap Ceramic 22uF 25V X7R 20% Pad SMD 1210 125C T/R TDK 2 C7 C1005X7R1H104K050BE CAP, CERM, 0.1 uF, 50 V,+/- 10%, X7R, 0402 TDK 1 C8 C3225X7R1E226M250AB Cap Ceramic 22uF 25V X7R 20% Pad SMD 1210 125C T/R TDK 0 C14 C3225X7R2A225K230AB Multilayer Ceramic Capacitors 2.2uF ±10% 100V X7R SMD 1210 TDK 0 C15 GRM188R72A104KA35J CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, 0603 MuRata 0 J1, J4 1729018 TERM BLOCK 2POS 5mm, TH Phoenix Contact 2 J2, J6 PEC03SAAN Header, 100mil, 3x1, Tin, TH Sullins Connector Solutions 2 J3, J5 PEC05DAAN Header, 100mil, 5x2, Tin, TH Sullins Connector Solutions 2 L1 XGL4020-152MEC Shielded Power Inductors Coilcraft 1 R1, R9 RC0603JR-070RL RES, 0, 5%, 0.1 W, 0603 Yageo 2 R2, R3 CRCW0603100KJNEAC RES, 100 k, 5%, 0.1 W, 0603 Vishay-Dale 2 R4 RC0603FR-0749K9L RES, 49.9 k, 1%, 0.1 W, 0603 Yageo 1 R6 RC0603FR-0740K2L RES, 40.2 k, 1%, 0.1 W, 0603 Yageo 0 R7 RC0603FR-0720KL RES, 20.0 k, 1%, 0.1 W, 0603 Yageo 0 R8 RC0603FR-0727KL RES, 27.0 k, 1%, 0.1 W, 0603 Yageo 0 R10 CRCW04020000Z0EDHP RES, 0, 0%, 0.2 W, AEC-Q200 Grade 0, 0402 Vishay-Dale 1 R11 RC0201FR-078K2L RES, 8.20 k, 1%, 0.05 W, 0201 Yageo America 0 R12 CRCW04026K98FKED RES, 6.98 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale 0 R13 CRCW04028K06FKED RES, 8.06 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale 0 R14 CRCW040216K9FKED RES, 16.9 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale 0 R15 CRCW040269K8FKED RES, 69.8 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale 0 R16 RC0201FR-7D10KL RES, 10.0 k, 1%, 0.05 W, 0201 Yageo America 0 SH-J1, SH-J2, SH-J3, SH-J4 SNT-100-BK-G Shunt, 100mil, Gold plated, Black Samtec 4 TP1, TP5 5010 Test Point, Multipurpose, Red, TH Keystone 2 TP2, TP6, TP7, TP8 5011 Test Point, Multipurpose, Black, TH Keystone 4 TP3, TP4, TP9 5012 Test Point, Multipurpose, White, TH Keystone 3 TPSM365R6V3RDNR 3 V to 65 V Input, 1 V to 13 V Output, 600-mA Synchronous Buck Converter Power Module in a HotRod™ QFN Package Texas Instruments 1 U1 SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 11 Typical Characteristics www.ti.com 6 Typical Characteristics Efficiency (%) Unless otherwise specified, the following conditions apply: TA = 25°C, VIN = 24 V 100 VIN = 12V 90 VIN = 24V VIN = 36V 80 VIN = 48V VIN = 54V 70 60 50 40 30 20 10 0 1E-5 0.0001 0.001 0.01 Load Current (A) 0.1 0.2 0.5 1 Figure 6-1. Efficiency 3.3-V Output, FSW = 1 MHz, Auto Mode 100 90 80 Efficiency (%) 70 VIN = 12V VIN = 24V VIN = 36V VIN = 48V VIN = 54V 60 50 40 30 20 10 0 1E-5 0.0001 0.001 0.01 Load Current (A) 0.1 0.2 0.5 1 Figure 6-2. Efficiency 3.3-V Output, FSW = 1 MHz, FPWM 12 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Typical Characteristics 100 90 80 Efficiency (%) 70 VIN = 12V VIN = 24V VIN = 36V VIN = 48V VIN = 54V 60 50 40 30 20 10 0 1E-5 0.0001 0.001 0.01 Load Current (A) 0.1 0.2 0.5 1 Figure 6-3. Efficiency 5-V Output, FSW = 1 MHz, Auto Mode 100 90 80 Efficiency (%) 70 VIN = 12V VIN = 24V VIN = 36V VIN = 48V VIN = 54V 60 50 40 30 20 10 0 1E-5 0.0001 0.001 0.01 Load Current (A) 0.1 0.2 0.5 1 Figure 6-4. Efficiency 5-V Output, FSW = 1 MHz, FPWM SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 13 Typical Characteristics www.ti.com CISPR 11 Class B Conducted Emmissions 130 120 Amplitude dB(uVolts) 110 100 Class B QPk Limit Class B Average Limit Qpk Amplitude Average Amplitude 90 80 70 60 50 40 30 20 10 0.15 0.3 VIN = 24 V 0.5 0.7 1 2 3 4 5 6 7 8 10 Frequency (MHz) VOUT = 5 V 20 30 fSW = 1 MHz Load = 500 mA Figure 6-5. Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz with EMI Filter (Standard EVM Layout and BOM) CISPR 11 Class B Conducted Emmissions 130 120 Amplitude dB(uVolts) 110 100 Class B QPk Limit Class B Average Limit Qpk Amplitude Average Amplitude 90 80 70 60 50 40 30 20 10 0.15 VIN = 24 V 0.3 0.5 0.7 1 2 3 4 5 6 7 8 10 Frequency (MHz) VOUT = 5 V 20 30 fSW = 1 MHz Load = 500 mA Figure 6-6. Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz without EMI Filter (Standard EVM Layout and BOM) 14 TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Typical Characteristics CISPR 11 Class B QPk Radiated Emissions 3-Meter 60 Class B QPk Limit Horizontal Amplitude Vertical Amplitude 55 Amplitude (dBuV/m) 50 45 40 35 30 25 20 15 10 5 30 VIN = 24 V 40 50 6070 100 200 300 400500 700 1000 Frequency (MHz) VOUT = 5 V fSW = 1 MHz Load = 500 mA Figure 6-7. Typical CISPR 11 Class B Radiated EMI 30 kHz - 1000 MHz (Standard EVM Layout and BOM, Input Filter Removed) SNVU846 – DECEMBER 2022 Submit Document Feedback TPSM365R6V3EVM User’s Guide Copyright © 2022 Texas Instruments Incorporated 15 Application Curves www.ti.com 7 Application Curves Unless otherwise indicated, VIN = 24 V, VOUT = 5 V, IOUT = 0.5 A, and FSW = 1 MHz EN (5 V/DIV) EN (5 V/DIV) VOUT (5 V/DIV) VOUT (5 V/DIV) PGOOD (5 V/DIV) PGOOD (5 V/DIV) IOUT (500 mA/DIV) IOUT (500 mA/DIV) 2 ms/DIV VIN = 24 V 2 ms/DIV VOUT = 5 V VIN = 24 V Figure 7-1. Start-Up Waveforms VOUT = 5 V Figure 7-2. Shutdown Waveforms VOUT (50 mV/DIV) VOUT (100 mV/DIV) 300 mA Load Current (0.5 A/DIV) 400
s/DIV 400
s/DIV VIN = 24 V VOUT = 3.3 V Load Current (200 mA/DIV) FSW = 1 MHz COUT = 2 × 22 µF Figure 7-3. Load Transient, 0 A to 0.6 A, 1 A/µs VIN = 24 V VOUT = 3.3 V FSW = 1 MHz COUT = 2 × 22 µF Figure 7-4. Load Transient, 0.3 A to 0.6 A, 1 A/µs VOUT (50 mV/DIV) VOUT (100 mV/DIV) Load Current (200 mA/DIV) 300 mA Load Current (0.5 A/DIV) 400
s/DIV VIN = 24 V VOUT = 5 V 400
s/DIV FSW = 1 MHz COUT = 2 × 22 µF Figure 7-5. Load Transient, 0 A to 0.6 A, 1 A/µs 16 VIN = 24 V VOUT = 5 V F SW = 1 MHz COUT = 2 × 22 µF Figure 7-6. Load Transient, 0.3 A to 0.6 A, 1 A/µs TPSM365R6V3EVM User’s Guide SNVU846 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected. 2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. WARNING Evaluation Kits are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User shall operate the Evaluation Kit within TI’s recommended guidelines and any applicable legal or environmental requirements as well as reasonable and customary safeguards. Failure to set up and/or operate the Evaluation Kit within TI’s recommended guidelines may result in personal injury or death or property damage. Proper set up entails following TI’s instructions for electrical ratings of interface circuits such as input, output and electrical loads. NOTE: EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG. www.ti.com 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. 2 www.ti.com Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 3 www.ti.com 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. 4 USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. www.ti.com 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated 5 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated