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Table of Contents
User’s Guide
TPSM8290x Step-Down Converter Evaluation Module
User's Guide
ABSTRACT
The TPSM8290xEVM (BSR188) facilitates the evaluation of the TPSM8290x 1-A, 2-A, and 3-A pin-to-pin
compatible buck converter modules in a small 3.0-mm by 2.8-mm MicroSiP™ package with integrated inductor.
The BSR188-003 uses the 3-A TPSM82903 to output a 1.2-V output voltage from input voltages between 3
V and 17 V. The BSR188-002 uses the 2-A TPSM82902 to output a 1.8-V output voltage from input voltages
between 3 V and 17 V. The BSR188-001 uses the 1-A TPSM82901 to output a 3.3-V output voltage from input
voltages up to 17 V. The TPSM8290x is a high-efficiency, low IQ buck converter module for use in a variety of
industrial, enterprise, and personal electronics applications, such as the following:
•
•
•
•
•
•
•
Factory and building automation
IP network cameras
Industrial PC
Data center switches
Servo drives
Mobile and embedded computing
Any application with a 12-V input voltage or a 1-4 cell lithium battery pack
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Performance Specification................................................................................................................................................. 2
1.2 Modifications...................................................................................................................................................................... 2
2 Setup........................................................................................................................................................................................3
2.1 Input/Output Connector Descriptions................................................................................................................................. 3
3 Safety Instructions..................................................................................................................................................................4
4 Test Results.............................................................................................................................................................................4
5 Board Layout ..........................................................................................................................................................................5
6 Schematic and Bill of Materials...........................................................................................................................................10
6.1 Schematic........................................................................................................................................................................ 10
6.2 Bill of Materials.................................................................................................................................................................13
List of Figures
Figure 4-1. Thermal Performance (VIN = 12 V, VOUT = 1.2 V, IOUT = 3000 mA, JP3 Open).........................................................4
Figure 5-1. Top Assembly............................................................................................................................................................ 5
Figure 5-2. Top Layer...................................................................................................................................................................6
Figure 5-3. Internal Layer 1 ........................................................................................................................................................ 7
Figure 5-4. Internal Layer 2......................................................................................................................................................... 8
Figure 5-5. Bottom Layer ............................................................................................................................................................ 9
Figure 6-1. TPSM82901EVM Schematic...................................................................................................................................10
Figure 6-2. TPSM82902EVM Schematic................................................................................................................................... 11
Figure 6-3. TPSM82903EVM Schematic...................................................................................................................................12
List of Tables
Table 1-1. TPSM82903EVM Performance Specification Summary.............................................................................................2
Table 1-2. TPSM82902EVM Performance Specification Summary.............................................................................................2
Table 1-3. TPSM82901EVM Performance Specification Summary.............................................................................................2
Table 6-1. TPSM8290xEVM Bill of Materials............................................................................................................................. 13
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Trademarks
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Trademarks
MicroSiP™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
1 Introduction
The TPSM8290x are synchronous, step-down converter modules in a small 3.0-mm × 2.8-mm × 1.6-mm
MicroSiP package. Three different devices in this family support 1 A, 2 A, or 3 A of output current.
1.1 Performance Specification
Table 1-1, Table 1-2, and Table 1-3 provide a summary of the TPSM8290xEVM performance specifications.
Table 1-1. TPSM82903EVM Performance Specification Summary
Specification
Test Conditions
Input voltage
MIN
3
Output voltage setpoint
TYP
MAX
Unit
12
17
V
1.2
Output current
0
MODE/S-CONF (R7) setting
2.5 MHz, auto PFM/PWM with AEE, external
FB, output discharge disabled
V
3
7.15
A
kΩ
Table 1-2. TPSM82902EVM Performance Specification Summary
Specification
Test Conditions
Input voltage
MIN
3
Output voltage setpoint
TYP
MAX
Unit
12
17
V
1.8
Output current
0
MODE/S-CONF (R7) setting
2.5 MHz, auto PFM/PWM with AEE, external
FB, output discharge disabled
V
2
7.15
A
kΩ
Table 1-3. TPSM82901EVM Performance Specification Summary
Specification
Test Conditions
Input voltage
MIN
TYP
MAX
Unit
3.4
12
17
V
Output voltage setpoint
3.3
Output current
MODE/S-CONF (R7) setting
0
2.5 MHz, auto PFM/PWM with AEE, external
FB, output discharge disabled
V
1
7.15
A
kΩ
1.2 Modifications
The printed-circuit board (PCB) for this EVM is designed to accommodate some modifications by the user.
Additionally, the following modifications can be made:
•
•
•
•
•
•
Input and output capacitors can be added.
The input voltage at which the IC turns on can be adjusted with two resistors
The soft-start time can be changed.
The output voltage can track an applied voltage
A feedforward capacitor can be added.
The switching frequency, output discharge setting, MODE setting, and output voltage setting configuration
can be changed.
See the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiP
Package with an Integrated Inductor Data Sheet for details of the various settings.
1.2.1 Input and Output Capacitors
C2, C3, and C4 are provided for additional input capacitors. These capacitors are not required for proper
operation but can be used to reduce the input voltage ripple.
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Introduction
C7, C8, C9, and C10 are provided for additional bulk output capacitors. These capacitors are not required for
proper operation but can be used to reduce the output voltage ripple. The total output capacitance must remain
within the recommended range in the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter
Module in a MicroSiPTM Package with an Integrated Inductor Data Sheet for proper operation.
1.2.2 Configurable Enable Threshold Voltage
With JP2 removed, R3 and R4 can be installed to set a user-selectable input voltage at which the IC turns on.
1.2.3 SS/TR Capacitor
C12 sets the soft-start time. This capacitor can be changed to set other soft-start times.
1.2.4 Feedforward Capacitor
C11 is provided as an optional feedforward capacitor (CFF).
1.2.5 MODE/S-CONF Resistor
R7 selects the switching frequency, output discharge, MODE setting, and output voltage setting configuration.
When using the VSET configuration for setting the output voltage, remove R2 and change the value of R5.
See the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiPTM
Package with an Integrated Inductor Data Sheet for details of the various settings.
2 Setup
This section describes how to properly use the EVM.
2.1 Input/Output Connector Descriptions
J2, Pin 1 and 2 – VIN
Positive input connection from the input supply for the EVM
J2, Pin 3 and 4 – S+/S-
Input voltage sense connections. Measure the input voltage at this point.
J2, Pin 5 and 6 – GND
Return connection from the input supply for the EVM
J3, Pin 1 and 2 – VOUT
Output voltage connection
J3, Pin 3 and 4 – S+/S-
Output voltage sense connections. Measure the output voltage at this point.
J3, Pin 5 and 6 – GND
Output return connection
J4 – PG/GND
The PG output is on pin 1 of this header with a convenient ground on pin 2.
J5 – TRACK-IN/SS/TR/GND By removing C12, the IC tracks an externally applied voltage. Apply the voltage
on pin 1 to scale the applied voltage through R8 and R9. The SS/TR voltage can
be measured on pin 2.
JP1 – PG Pullup Voltage
PG pin pullup voltage jumper. Place the supplied jumper on JP1 to connect the
PG pin pullup resistor to VOUT. Alternatively, the jumper can be removed and a
different voltage can be supplied on pin 1 to pull up the PG pin to a different level.
This externally applied voltage must remain below 18 V.
JP2 – EN
EN pin input jumper. Place the supplied jumper across ON and EN to turn on the IC. Place the
jumper across OFF and EN to turn off the IC. Remove the jumper to set a configurable enable
threshold voltage with R3 and R4.
JP3 –
MODE/SCONF
MODE/S-CONF pin input jumper. Place the supplied jumper across PWM and MODE/S-CONF to
operate the IC in forced PWM mode. Place the jumper across PFM/PWM and MODE/S-CONF
to operate the IC in auto PFM/PWM mode. Remove the jumper to operate the IC with the
MODE/S-CONF settings set by R7.
Note
If it is desired to change between PWM and PFM/PWM modes during operation, JP3
must be set to either PWM or PFM/PWM before enabling the IC.
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Safety Instructions
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3 Safety Instructions
WARNING
Hot surface. Contact may cause burns. Do not touch.
4 Test Results
The TPSM8290xEVM was used to take all the data in the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and
Low IQ Buck Converter Module in a MicroSiPTM Package with an Integrated Inductor Data Sheet. See the
device data sheet for the performance of this EVM.
Figure 4-1 shows the thermal performance of the EVM. "Spot" shows the temperature of the PCB.
Figure 4-1. Thermal Performance (VIN = 12 V, VOUT = 1.2 V, IOUT = 3000 mA, JP3 Open)
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Board Layout
5 Board Layout
This section provides the EVM board layout and illustrations in Figure 5-1 through Figure 5-5. The Gerbers are
available on the EVM product page.
Figure 5-1. Top Assembly
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Board Layout
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Figure 5-2. Top Layer
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Board Layout
Figure 5-3. Internal Layer 1
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Board Layout
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Figure 5-4. Internal Layer 2
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Board Layout
Figure 5-5. Bottom Layer
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Schematic and Bill of Materials
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6 Schematic and Bill of Materials
This section provides the EVM schematic and bill of materials (BOM).
6.1 Schematic
Figure 6-1, Figure 6-2, and Figure 6-3 illustrate the EVM schematics.
U1
J2
VIN
1
2
3
4
5
6
VIN
3V to 17V
S+
SGND
1
2
C1
47uF
C2
10uF
C3
10uF
C4
10uF
C5
10uF
EN
MODE
S S /TR
ON
EN
OFF
MODE/S-CONF
SS/TR
PG
GND
R2
113k
8
7
FB/VSET
6
PG
C11
22pF
C6
22uF
C7
22uF
C8
22uF
C9
22uF
VOUT
2
3
4
5
6
C10
47uF
S+
SGND
R5
24.9k
11
PG P ULL-UP
VOUT
2
1
VOUT
J P1
R4
100k
GND
P WM
MODE/S-CONF
P FM/PWM
5
SW/NC
FB/VSET
VOUT 1
9
10
1.00M
J P2
1
2
3
4
EN
VOUT
VOUT
TPSM82901SISR
R3
VIN
1
2
3
3
J3
VIN
VIN
R6
100k
VIN
J4
PG
R7
7.15k
J P3
1
2
PG
GND
R8
1
2
3
TRACK-IN
S S /TR
GND
J5
100k
R9
100k
C12
3300pF
Figure 6-1. TPSM82901EVM Schematic
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Schematic and Bill of Materials
U1
J2
VIN
1
2
3
4
5
6
VIN
3V to 17V
S+
SGND
1
2
C1
47uF
C2
10uF
C3
10uF
C4
10uF
C5
10uF
EN
MODE
S S /TR
MODE/S-CONF
SS/TR
PG
GND
R2
200k
8
7
FB/VSET
6
PG
C11
22pF
C6
22uF
C7
22uF
C8
22uF
C9
22uF
VOUT
2
3
4
5
6
C10
47uF
S+
SGND
R5
100k
11
PG P ULL-UP
VOUT
2
1
VOUT
J P1
R4
100k
GND
P WM
MODE/S-CONF
P FM/PWM
5
SW/NC
FB/VSET
VOUT 1
9
10
1.00M
J P2
1
2
3
4
EN
VOUT
VOUT
TPSM82902SISR
R3
VIN
1
2
3
ON
EN
OFF
3
J3
VIN
VIN
R6
100k
VIN
J4
PG
R7
7.15k
J P3
1
2
PG
GND
R8
1
2
3
TRACK-IN
S S /TR
GND
J5
100k
R9
100k
C12
3300pF
Figure 6-2. TPSM82902EVM Schematic
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Schematic and Bill of Materials
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U1
J2
VIN
1
2
3
4
5
6
VIN
3V to 17V
S+
SGND
1
2
C1
47uF
C2
10uF
C3
10uF
C4
10uF
C5
10uF
EN
MODE
S S /TR
MODE/S-CONF
SS/TR
PG
GND
R2
100k
8
7
FB/VSET
6
PG
C11
22pF
C6
22uF
C7
22uF
C8
22uF
C9
22uF
VOUT
2
3
4
5
6
C10
47uF
S+
SGND
R5
100k
11
PG P ULL-UP
VOUT
2
1
VOUT
J P1
R4
100k
GND
P WM
MODE/S-CONF
P FM/PWM
5
SW/NC
FB/VSET
VOUT 1
9
10
1.00M
J P2
1
2
3
4
EN
VOUT
VOUT
TPSM82903SISR
R3
VIN
1
2
3
ON
EN
OFF
3
J3
VIN
VIN
R6
100k
VIN
J4
PG
R7
7.15k
J P3
1
2
PG
GND
R8
1
2
3
TRACK-IN
S S /TR
GND
J5
100k
R9
100k
C12
3300pF
Figure 6-3. TPSM82903EVM Schematic
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Schematic and Bill of Materials
6.2 Bill of Materials
Table 6-1 lists the BOM for this EVM.
Table 6-1. TPSM8290xEVM Bill of Materials
-001
-002
-003
Reference
Designator
1
1
1
C1
47 µF
CAP, TA, 47 µF, 35 V, ±10%, 0.3 Ω
7343-43
1
1
1
C5
10 µF
CAP, CERM, 10 µF, 25 V, ±10%, X7R
1206
C3216X7R1E106K160AE
TDK
1
1
1
C6
22 µF
CAP, CERM, 22 µF, 10 V, ±20%, X7S
0805
C2012X7S1A226M125AC
TDK
1
1
1
C12
3300 pF
CAP, CERM, 3300 pF, 50 V, ±5%, C0G/NP0
0603
GRM1885C1H332JA01D
muRata
1
0
0
R2
113 kΩ
RES, 113 k, 1%, 0.1 W, 0603
0603
Std
Std
0
1
0
R2
200 kΩ
RES, 200 kΩ, 1%, 0.1 W
0603
Std
Std
0
0
1
R2
100 kΩ
RES, 100 kΩ, 1%, 0.1 W
0603
Std
Std
0
1
1
R5
100 kΩ
RES, 100 kΩ, 1%, 0.1 W
0603
Std
Std
1
0
0
R5
24.5 kΩ
RES, 24.9 k, 1%, 0.1 W, 0603
0603
Std
Std
1
1
1
R6
100 kΩ
RES, 100 k, 1%, 0.1 W, 0603
0603
Std
Std
1
1
1
R7
7.15 kΩ
RES, 7.15 kΩ, 1%, 0.1 W
0603
Std
Std
1
0
0
U1
TPSM82901(1)
3-V to 17-V, Low IQ Buck Converter Module in
MicroSiP Package with Integrated Inductor
3 × 2.8 mm
TPSM82901SISR
Texas Instruments
0
1
0
U1
TPSM82902(1)
3-V to 17-V, Low IQ Buck Converter Module in
MicroSiP Package with Integrated Inductor
3 × 2.8 mm
TPSM82902SISR
Texas Instruments
0
0
1
U1
TPSM82903(1)
3-V to 17-V, Low IQ Buck Converter Module in
MicroSiP Package with Integrated Inductor
3 × 2.8 mm
TPSM82903SISR
Texas Instruments
(1)
Value
Description
Package
Part Number
Manufacturer
T495X476K035ATE300
Kemet
The TPSM8290xEVM may be populated with TPSM8290x (U1) devices that do not contain the correct top-side markings on the top of the device itself. These devices are still fully tested
TPSM8290x devices.
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