TRF37B75EVM

www.ti.com Table of Contents User’s Guide TRF37x73 and TRF37x75 EVM Chris Pearson ABSTRACT This document outlines the basic steps and functions that are required to ensure the proper operation and quick setup of the TRF37x73 and TRF37x75 EVM. This document also includes a schematic diagram, a bill of materials (BOM), printed-circuit board (PCB) layouts, board loss plots, and test block diagrams. Throughout this document, the abbreviations EVM, TRF37x73/75 EVM, and the term evaluation module are synonymous with the TRF37x73 and TRF37x75 EVM, unless otherwise noted. Table of Contents 1 Contents.................................................................................................................................................................................. 2 2 EVM Overview......................................................................................................................................................................... 2 2.1 Schematic and BOM.......................................................................................................................................................... 2 2.2 TRF37x73/75 EVM Bill of Material..................................................................................................................................... 3 2.3 General Usage Information................................................................................................................................................ 4 3 EVM Layout............................................................................................................................................................................. 5 3.1 Description: Stack up and Material.................................................................................................................................... 5 3.2 PCB Layers........................................................................................................................................................................ 5 4 EVM Board Loss..................................................................................................................................................................... 7 5 Test Block Diagrams...............................................................................................................................................................8 5.1 Noise Figure.......................................................................................................................................................................8 5.2 Gain and P1dB...................................................................................................................................................................8 5.3 OIP3................................................................................................................................................................................... 9 6 Revision History......................................................................................................................................................................9 List of Figures Figure 2-1. TRF37x73/75 EVM Schematic.................................................................................................................................. 2 Figure 3-1. Top Layer...................................................................................................................................................................5 Figure 3-2. Layers 2 and 3...........................................................................................................................................................5 Figure 3-3. Bottom Layer (Through Top Side)............................................................................................................................. 6 Figure 4-1. S11, S22 (Open), U1 Uninstalled.............................................................................................................................. 7 Figure 4-2. S11, S22 (Open), U1 and L1 Uninstalled, Copper Tape Replaced C1 and C2......................................................... 7 List of Tables Table 2-1. TRF37x73/75 EVM BOM............................................................................................................................................ 3 SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated TRF37x73 and TRF37x75 EVM 1 Contents www.ti.com 1 Contents The TRF37x73/75 EVM consists of the following components: • TRF37x73/75 EVM board 2 EVM Overview This section includes the schematic diagram, a bill of materials (BOM), and general usage information. 2.1 Schematic and BOM The TRF37x73/75 EVM for RF gain blocks comes in a 2 × 2 WSON package. The device type is visually identified in component U1 by the 0402 selection resistors TRF37A73, TRF37B73, TRF37C73, TRF37A75, TRF37B75, and TRF37C75. The TRF37x73 are a family of 3.3-V, RF gain blocks that have 3 gain variants (A73 = 12 dB, B73 = 15 dB, and C73 = 18 dB). The TRF37x75 are a family of 5-V, RF gain blocks that have 3 gain variants (A75 = 12 dB, B75 = 15 dB, and C75 = 18 dB). The TRF37x73/75 EVM schematic is shown in Figure 2-1. J4: GND J3: VCC C5 10 µF R2 see BOM R1 0Ω C6 DNI C3 10 pF C4 0.01 µF L1 100 nH J1 RFIN C1 1000 pF 1 8 2 7 3 6 4 5 J2 RFOUT C2 1000 pF U1: TRF37x7x TRF37A73 TRF37A75 TRF37B73 TRF37B75 TRF37C73 TRF37C75 JP1: PWDN Default Shunt 1-2 1 GND 2 3 VCC Figure 2-1. TRF37x73/75 EVM Schematic 2 TRF37x73 and TRF37x75 EVM SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com EVM Overview 2.2 TRF37x73/75 EVM Bill of Material Table 2-1. TRF37x73/75 EVM BOM Common BOM Component Description (Footprint) Value Manufacturer Part Number C1, C2, C6 AC coupling capacitor (0402) 1000 pF Murata GRM1555C1H102JA01D C3 Power Supply Decoupling (0402) 10 pF Murata GRM1555C1H100JZ01D C4 Power Supply Decoupling (0603) 0.01 µF Kemet C0603C103K1RACTU C5 Power Supply Decoupling (Tantalum) 10 µF Kemet T494A106M016AS J1, J2 AC signal SMA connector Emerson Connectivity (Johnson) 142-0701-851 J3 Terminals for VCC (Clip) Red Keystone 5005 J4 Terminal for GND (Clip) Black Keystone 5006 JP1 Terminals for PWDN L1 DC biasing inductor (0603) 100 nH R1 DC Biasing resistor (0603) 0Ω 1:3 10 mil header CoilCraft 0603HP-R10XJLW TRF37A75-Specific BOM R2 DC biasing resistor (0603) 1.8 Ω U1 TRF37A75 5 V, 12 dB gain TI Panasonic TRF37A75 0402 BOM Identification resistor 0Ω ERG-3GEYJ1R8V TRF37A75 TRF37B75-Specific BOM R2 DC biasing resistor (0603) 3.9 Ω U1 TRF37B75 5 V, 15 dB gain TI Panasonic TRF37B75 0402 BOM Identification resistor 0Ω ERG-3GEYJ3R9V TRF37B75 TRF37C75-Specific BOM R2 DC biasing resistor (0603) 6.8 Ω U1 TRF37C75 5 V, 18 dB gain TI Panasonic TRF37C75 0402 BOM Identification resistor 0Ω ERG-3GEYJ6R8V TRF37C75 TRF37A73-Specific BOM R2 DC biasing resistor (0603) 0Ω U1 TRF37A73 3.3 V, 12 dB gain TRF37A73 0402 BOM Identification resistor 0Ω R2 DC biasing resistor (0603) 0Ω U1 TRF37B73 3.3 V, 15 dB gain TRF37B73 0402 BOM Identification resistor 0Ω TI TRF37A73 TRF37B73-Specific BOM TI TRF37B73 TRF37C73-Specific BOM R2 DC biasing resistor (0603) 0Ω U1 TRF37C73 3.3 V, 18 dB gain TRF37C73 0402 BOM Identification resistor 0Ω TI SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated TRF37C73 TRF37x73 and TRF37x75 EVM 3 EVM Overview www.ti.com 2.3 General Usage Information This section provides general usage information for the EVM. 1. Recommended power up sequence: a. Connect GND to J4 (black – GND) b. Connect Vcc to J3 (red – VCC) c. Connect RF input signal to J1 (RFIN) d. Connect measurement instrument to J2 (RFOUT) e. Ensure the device is not in power-down mode by shorting JP1 terminals 1 and 2 or simply remove JP1 to take advantage of the TRF37x73/75’s internal pull-down resistor. 2. Power supply options: a. For TRF37x73 devices, set VCC to 3.3 V b. For TRF37x75 devices, set VCC to 5.0 V 3. PWDN option: a. Short terminals 2 and 3 on JP1 to put the TRF37x73/75 in its power down state. 4. Tuning options: a. Solder mask has been removed along the RF signal paths and VCC path allowing an easy method to slide surface mount components along these traces for optimal tuning. 4 TRF37x73 and TRF37x75 EVM SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com EVM Layout 3 EVM Layout 3.1 Description: Stack up and Material The TRF37x73/75 EVM is a 62-mil, 4-layer board whose material type is Isola® 370HR. The top layer routes the power, ground, and signals to and from the device. The signal impedance is targeted at 49.9 Ω. The bottom 3 layers are ground layers. 3.2 PCB Layers Figure 3-1 through Figure 3-3 illustrate the PCB layers for this EVM. Figure 3-1. Top Layer Figure 3-2. Layers 2 and 3 SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated TRF37x73 and TRF37x75 EVM 5 EVM Layout www.ti.com Figure 3-3. Bottom Layer (Through Top Side) 6 TRF37x73 and TRF37x75 EVM SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com EVM Board Loss 4 EVM Board Loss Performance plots of the TRF37x73/75 EVM board are illustrated in Figure 4-1 and Figure 4-2, with the following modifications to the BOM: • • U1 gain block uninstalled C1 and C2 removed, terminals shorted with strip of copper whose width equaled the trace width. Figure 4-1 and Figure 4-2 show the S11 and S22 log magnitude responses to a –10-dBm input signal. These measurements were taken with an Agilent E5071B vector network analyzer calibrated from 1 MHz to 6 GHz to the end of the coaxial cables. The coaxial cables were connected directly to J1 and J2 on the EVM board. Port 1 refers to J1 in the schematic and Port 2 refers to J2 in the schematic. 0.0 ±0.5 Sxx (dB) ±1.0 ±1.5 ±2.0 ±2.5 S11 RFIN S22 RFOUT ±3.0 0 1000 2000 3000 4000 5000 6000 Freq (MHz) C001 Figure 4-1. S11, S22 (Open), U1 Uninstalled 0.0 ±0.5 Sxx (dB) ±1.0 ±1.5 ±2.0 ±2.5 S11 RFIN S22 RFOUT ±3.0 0 1000 2000 3000 4000 5000 6000 Freq (MHz) C002 Figure 4-2. S11, S22 (Open), U1 and L1 Uninstalled, Copper Tape Replaced C1 and C2 SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated TRF37x73 and TRF37x75 EVM 7 Test Block Diagrams www.ti.com 5 Test Block Diagrams This section includes recommendations, comments, and test block diagrams for noise figure, gain and P1dB, and OIP3. 5.1 Noise Figure Recommendations and comments: 1. Use the traditional Y-factor method 2. Take into account losses of coax to the EVM board 3. Take into account losses of traces on the board up to the input pin of the device under test (DUT) TRF37x73/75 EVM Spectrum or Noise Figure Analyzer ENR DIODE 5.2 Gain and P1dB Recommendations and comments: 1. Take into account losses of coax and attenuators to and from the EVM board 2. Take into account losses of traces on the board up to the I/O pins of the DUT 3. Power meters are typically a few tenths of dB more accurate than a signal generator's level controls and spectrum analyzer measurement capability. For precise measurements, use a power meter to measure the output of the signal generator and output of the TRF37x73/75 EVM. TRF37x73/75 EVM Signal Generator Spectrum Analyzer 3dB Attn (Optional) 8 TRF37x73 and TRF37x75 EVM 3dB Attn (Optional) SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated www.ti.com Test Block Diagrams 5.3 OIP3 Recommendations and comments: 1. This setup can also be used for gain and P1dB, if desired 2. For wideband measurements, the 30-dB gain stage and 10-dB attenuators are used to improve the input IP3 level that is created from the interaction of the 2 signal generators via the isolation of the combiner. For narrow band measurements, it maybe possible to create a setup with enough isolation using an isolator and/or combiner. In this case the 10-dB pads could be reduced or removed. 3. Power meter A is used to ensure the amplitude of the two tones at the input of the TRF37x73/75 EVM are within a certain tolerance. The gain stages will have unique gain characteristics and their gain can drift over time 4. Power meter B can be used for measuring the amplitude of individual tones for more accurate measurements. 5. Keep spectrum analyzer RBW and VBW settings identical for main tone and IM3 products 6. Take into account losses of coax and attenuators to and from the EVM board 7. Take into account losses of traces on the board up to the I/O pins of the DUT Power Meter Input B Power Meter Input A Signal Generator A 30dB Gain 10dB Attn 3dB Attn Combiner Signal Generator B 3dB Attn 3dB Attn 30dB Gain TRF37x73/75 EVM 3dB Attn Coupler Splitter or Coupler 3dB Attn Spectrum Analyzer 10dB Attn 6 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (March 2014) to Revision A (October 2021) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................2 • Updated the L1 components part number from -6-3HP-F10XJLU to 0603HP-R10XJLW in the TRF37x73/75 EVM BOM table.................................................................................................................................................. 3 SLAU546A – MARCH 2014 – REVISED OCTOBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated TRF37x73 and TRF37x75 EVM 9 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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