TRPGR30ATGC

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TRPGR30ATGC SCBS904 – AUGUST 2014 TRPGR30ATGC 12-mm Low-Frequency Glass-Encapsulated Transponder, Read Only 1 Device Overview 1.1 Features 1 • Best-in-Class Performance Through Patented HDX Technology • Patented Transponder Tuning Provides Stable and 1.2 • Applications Industrial Automation 1.3 High Read Performance • 80-Bit UID (64-Bit ID, 16-Bit CRC) • Insensitive to Almost All Nonmetallic Materials • Asset Tracking Description Texas Instruments' 12-mm low-frequency (LF) glass transponders provide superior performance and operate at a resonance frequency of 134.2 kHz. The products are compliant to ISO/IEC 11784 and ISO/IEC 11785 global open standards. Texas Instruments LF glass transponders are manufactured with TI's patented tuning process to provide consistent read performance. Before delivery, the transponders undergo complete functional and parametric testing to provide the high quality customers have come to expect from TI. Device Information (1) PART NUMBER TRPGR30ATGC (1) (2) PACKAGE BODY SIZE (NOM) (2) TGC (0) 2.12 mm x 12.0 mm For the most current device, package, and ordering information, see the Package Option Addendum in Section 5, or see the TI web site at www.ti.com. The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 5. Figure 1-1 shows the transponder. Figure 1-1. TRPGR30ATGC Transponder 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TRPGR30ATGC SCBS904 – AUGUST 2014 www.ti.com Table of Contents 1 2 3 4 Device Overview ......................................... 1 4.1 Documentation Support 1.1 Features .............................................. 1 4.2 Community Resources ............................... 4 .............................. 1.2 Applications ........................................... 1 4.3 Trademarks ........................................... 4 1.3 Description ............................................ 1 4.4 Electrostatic Discharge Caution ...................... 4 Revision History ......................................... 2 Specifications ............................................ 3 4.5 Export Control Notice ................................. 4 4.6 Glossary .............................................. 4 4 3.1 Absolute Maximum Ratings .......................... 3 3.2 Handling Ratings ..................................... 3 Mechanical Packaging and Orderable Information ................................................ 5 3.3 Electrical Characteristics ............................. 3 5.1 5 Packaging Information ................................ 5 Device and Documentation Support ................. 4 2 Revision History 2 DATE REVISION NOTES August 2014 * Initial Release Revision History Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TRPGR30ATGC TRPGR30ATGC www.ti.com SCBS904 – AUGUST 2014 3 Specifications 3.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) TA Operating temperature range 3.2 MIN MAX UNIT -25 85 °C MIN MAX UNIT -40 85 °C Handling Ratings TSTG 3.3 Storage temperature range Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TRPGR30ATGC Functionality Read only Memory (bits) 80 (64-bit UID + 16-bit CRC) Memory (pages) 1 Resonance frequency 134.6 kHz Modulation FSK (frequency shift keying) 134.2 kHz and 124.2 kHz Transmission principle HDX (half duplex) Power source Powered from the reader signal (battery-less) Typical reading range ≤60 cm (1) Typical reading time 70 ms Case material Glass Protection glass Hermetically sealed EMC Programmed code is not affected by natural electromagnetic interference or x-rays Signal penetration Transponder can be read through almost all nonmetallic material Mechanical shock IEC 60068-2-32 free-fall drop test, 20 times from 1.5-m height Dimensions Ø 2.12 ± 0.05 mm x 12.0 ± 0.5 mm Weight 0.10 g (1) Depends on RF regulation in country of use, the reader antenna configuration used, and the environmental conditions. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TRPGR30ATGC 3 TRPGR30ATGC SCBS904 – AUGUST 2014 www.ti.com 4 Device and Documentation Support 4.1 Documentation Support The following documents describe the TRPGR30ATGC device. Copies of these documents are available on the Internet at www.ti.com. 4.2 SPAT178 RFID Systems Product Specifications. Texas Instruments Radio Frequency Identification Systems is an industry leader in RFID technology, and the world’s largest integrated manufacturer of TI-RFid™ tags, TI-RFid smart labels, and TI-RFid reader systems. With more than 1 billion RFID tags manufactured, TI-RFid technology is used in a broad range of RFID applications worldwide. TI is an active member of many standards bodies, including ISO, ISO/IEC, ECMA International, ETSI, and several national standardization bodies working to drive the adoption of global standards for RFID technology. SPAT184 12mm Glass Encapsulated HDX Transponders. Product bulletin that provides an overview of the features of the glass encapsulated transponders from TI. Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. 4.3 Trademarks TI-RFid, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 4.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.5 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 4.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 4 Device and Documentation Support Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TRPGR30ATGC TRPGR30ATGC www.ti.com SCBS904 – AUGUST 2014 5 Mechanical Packaging and Orderable Information 5.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2014, Texas Instruments Incorporated Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: TRPGR30ATGC 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TRPGR30ATGC ACTIVE RFIDT TGC 0 2000 RoHS & Non-Green Call TI N / A for Pkg Type -25 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of