TRS3223-Q1
www.ti.com .......................................................................................................................................................................................... SLLS950 – SEPTEMBER 2008
3-V To 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
FEATURES
1
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
PW PACKAGE
(TOP VIEW)
EN
C1+
V+
C1C2+
C2VDOUT2
RIN2
ROUT2
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
DESCRIPTION/ORDERING INFORMATION
The TRS3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver
output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is
used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 µs. See Figure 4 for receiver input levels.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
TSSOP – PW
Reel of 2000
ORDERABLE PART NUMBER
TRS3223QPWRQ1
TOP-SIDE MARKING
T3223
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TRS3223-Q1
SLLS950 – SEPTEMBER 2008 .......................................................................................................................................................................................... www.ti.com
DRIVER FUNCTION TABLE (EACH DRIVER) (1)
INPUTS
DIN
(1)
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
X
X
L
X
Z
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
DRIVER STATUS
Powered off
Normal operation with auto-powerdown disabled
Normal operation with auto-powerdown enabled
Powered off by auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
RECEIVER FUNCTION TABLE (EACH RECEIVER) (1)
INPUTS
(1)
OUTPUT
ROUT
RIN
EN
VALID RIN
RS-232 LEVEL
L
L
X
H
L
X
L
X
H
X
Z
Open
L
No
H
H
H = high level, L = low level, X = irrelevant, Z = high impedance (off),
Open = input disconnected or connected driver off
LOGIC DIAGRAM
DIN1
DIN2
FORCEOFF
17
13
DOUT1
12
8
DOUT2
20
14
Auto-powerdown
11
INVALID
FORCEON
1
EN
ROUT1
ROUT2
2
15
16
10
9
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RIN1
RIN2
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TRS3223-Q1
TRS3223-Q1
www.ti.com .......................................................................................................................................................................................... SLLS950 – SEPTEMBER 2008
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range
–0.3 V to 6 V
V+
Positive output supply voltage range
–0.3 V to 7 V
V–
Negative output supply voltage range
0.3 V to –7 V
V+ – V–
Supply voltage difference
13 V
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal impedance (3)
TJ
Operating virtual-junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
Driver, FORCEOFF, FORCEON, EN
–0.3 V to 6 V
Receiver
–25 V to 25 V
Driver
–13.2 V to 13.2 V
Receiver, INVALID
–0.3 V to VCC + 0.3 V
83°C/W
150°C
–65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
see Figure 6
VCC = 3.3 V
VCC
Supply voltage
VIH
High-level input voltage
Driver and control,
DIN, EN, FORCEOFF, FORCEON
VIL
Low-level input voltage
Driver and control, DIN, EN, FORCEOFF, FORCEON
VI
Input voltage
TA
Operating free-air temperature
(1)
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
Driver and control, DIN, EN, FORCEOFF, FORCEON
Receiver
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
2
UNIT
V
V
2.4
0.8
0
5.5
–25
25
–40
125
V
V
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
II
Input leakage current
Supply current
Powered off
Auto-powerdown
enabled
(1)
(2)
MAX
±0.01
±1
µA
0.3
2
mA
No load, FORCEOFF at GND
1
20
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
20
EN, FORCEOFF, FORCEON
Auto-powerdown
disabled
ICC
MIN TYP (2)
TEST CONDITIONS
No load, FORCEOFF and
FORCEON at VCC
VCC = 3.3 V or 5 V,
TA = 25°C
UNIT
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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DRIVER SECTION ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND
5
5.4
V
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND
–5
–5.4
V
IIH
High-level input current
VI = VCC
±0.01
±1
µA
IIL
Low-level input current
VI = GND
±0.01
±1
µA
VCC = 3.6 V, VO = 0 V
±35
±60
VCC = 5.5 V, VO = 0 V
±35
±60
IOS
Short-circuit output current (3)
ro
Output resistance
Ioff
(1)
(2)
(3)
Output leakage current
VCC, V+, and V– = 0 V, VO = ±2 V
FORCEOFF = GND
300
mA
Ω
10M
VO = ±12 V, VCC = 3 V to 3.6 V
±25
VO = ±10 V, VCC = 4.5 V to 5.5 V
±25
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
DRIVER SECTION SWITCHING CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
tsk(p)
SR(tr)
(1)
(2)
(3)
4
MIN TYP (2)
TEST CONDITIONS
Maximum data rate
CL = 1000 pF, One DOUT switching, RL = 3 kΩ (see Figure 1)
Pulse skew (3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ (see Figure 2)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V, RL = 3 kΩ to 7 kΩ
MAX
250
UNIT
kbit/s
100
ns
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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www.ti.com .......................................................................................................................................................................................... SLLS950 – SEPTEMBER 2008
RECEIVER SECTION ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
Ioff
Output leakage current
EN = VCC
ri
Input resistance
VI = ±3 V to ±25 V
(1)
(2)
MIN
TYP (2)
VCC – 0.6
VCC – 0.1
TEST CONDITIONS
MAX
V
0.4
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
V
V
0.5
V
±0.05
±10
µA
5
8.3
kΩ
3
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
RECEIVER SECTION SWITCHING CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
TYP (2)
UNIT
tPLH
Propagation delay time, low-level to high-level output
CL = 150 pF, See Figure 3
150
ns
tPHL
Propagation delay time, high-level to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tsk(p)
Pulse skew (3)
See Figure 3
50
ns
(1)
(2)
(3)
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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AUTO-POWERDOWN SECTION ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold for INVALID
high-level output voltage
FORCEON = GND, FORCEOFF = VCC
VT–(valid)
Receiver input threshold for INVALID
high-level output voltage
FORCEON = GND, FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold for INVALID
low-level output voltage
FORCEON = GND, FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = –1 mA, FORCEON = GND, FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC – 0.6
V
V
0.4
V
AUTO-POWERDOWN SECTION SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
tvalid
Propagation delay time, low- to high-level output
tinvalid
Propagation delay time, high- to low-level output
ten
Supply enable time
(1)
6
TYP (1)
UNIT
1
µs
30
µs
100
µs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
3V
FORCEOFF
tTLH
3V
3V
Output
-3 V
-3 V
TEST CIRCUIT
VOH
VOL
VOLTAGE WAVEFORMS
SR(tr)
t
THL
6V
or t
TLH
A.CL includes probe and jig capacitance.
B.The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
0V
tPHL
CL
(see Note A)
3V
FORCEOFF
1.5 V
1.5 V
tPLH
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.CL includes probe and jig capacitance.
B.The pulse generator has the following characteristics: PRR = 250 kbit/s, Z O = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0V
3V
Input
1.5 V
1.5 V
-3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
0V
FORCEOFF
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.CL includes probe and jig capacitance.
B.The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION (continued)
3V
VCC
FORCEON
3 V or 0 V
GND
S1
1.5 V
0V
tPHZ
(S1 at GND)
Output
CL
(see Note A)
EN
Generator
(see Note B)
1.5 V
tPHZ
(S1 at GND)
RL
3 V or 0 V
Input
VOH
Output
50%
0.3 V
tPLZ
(S1 at VCC)
0.3 V
50 Ω
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.CL includes probe and jig capacitance.
B.The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
8
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PARAMETER MEASUREMENT INFORMATION (continued)
2.7 V
2.7 V
0V
Receiver
Input
0V
50 Ω
INVALID
Output
50% VCC
0V
ten
V+
CL = 30 pF
(see Note A)
FORCEON
VCC
50% VCC
INVALID
≈V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
FORCEOFF
DIN
-3 V
tvalid
tinvalid
Autopowerdown
-2.7 V
-2.7 V
ROUT
Generator
(see Note B)
3V
DOUT
≈V-
VTEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 level, INV ALID high
2.7 V
Indeterminate
0.3 V
0V
If signal remains within this region
for more than 30 µs, INVALID is low †
-0.3 V
Indeterminate
-2.7 V
Valid RS-232 level, INV ALID high
†
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
A.CL includes probe and jig capacitance.
B.The pulse generator has the following characteristics: PRR = 5 kbit/s, Z O = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
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APPLICATION INFORMATION
2
20
Auto
Powerdown
1
EN
VCC
C1+
FORCEOFF
19
+
+
C1
-
3
+
C3
V+
GND
18
-
CBYPASS
(0.1 µF)
4
5
17
C1-
16
C2+
DOUT1
RIN1
+
C2
-
6
15
C2-
ROUT1
5 kΩ
7
C4
-
14
V-
FORCEON
+
DOUT2
RIN2
ROUT2
8
13
9
12
10
11
DIN1
DIN2
INVALID
5 kΩ
A.C3 can be connected to VCC or GND.
B.Resistor values shown are nominal.
C.Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
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PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
TRS3223QPWRQ1
Package Package Pins
Type Drawing
TSSOP
PW
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
6.95
B0
(mm)
K0
(mm)
P1
(mm)
7.0
1.4
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRS3223QPWRQ1
TSSOP
PW
20
2000
356.0
356.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0020A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
A
SEATING
PLANE
C
6.6
TYP
6.2
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1
2X
5.85
6.6
6.4
NOTE 3
10
11
B
20X
4.5
4.3
NOTE 4
0.30
0.19
0.1
1.2 MAX
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
A 20
TYPICAL
4220206/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.5)
(R0.05) TYP
1
20
20X (0.45)
SYMM
18X (0.65)
11
10
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220206/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
20X (1.5)
SYMM
(R0.05) TYP
1
20
20X (0.45)
SYMM
18X (0.65)
10
11
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220206/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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