TRSF3243
SLLS862B – AUGUST 2007 – REVISED OCTOBER 2022
3-V to 5.5-V Multichannel RS-232 Compatible Line Driver and Receiver
1 Features
3 Description
•
•
The TRSF3243 consists of three line drivers,
five line receivers, and a dual charge-pump
circuit with ±15-kV ESD protection pin to pin
(serial-port connection pins, including GND). This
device provides the electrical interface between
an asynchronous communication controller and the
serial-port connector. The charge pump and four small
external capacitors allow operation from a single 3-V
to 5.5-V supply. In addition, this device includes an
always-active noninverting output (ROUT2B), which
allows applications using the ring indicator to transmit
data while the device is powered down. The device
operates at data signaling rates up to 1 Mbit/s and an
increased slew-rate range of 24 V/μs to 150 V/μs.
•
•
•
•
•
•
Operates with 3-V to 5.5-V VCC supply
Always-active noninverting receiver output
(ROUT2B)
Low standby current: 1 μA typical
External capacitors: 4 × 0.1 μF
Accepts 5-V logic input with 3.3-V supply
Inter-operable with SN65C3238, SN75C3238
Supports operation from 250 kbit/s to
1 Mbit/s
RS-232 Bus-pin esd protection exceeds
±15 kV using human-body model (HBM)
2 Applications
•
•
•
•
•
•
Battery-powered systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-held equipment
Package Information
PACKAGE(1)
PART NUMBER
TRS3243
(1)
3.3 V, 5 V
BODY SIZE (NOM)
SSOP (DB)
10.20 mm × 5.30 mm
SOIC (DW)
17.90 mm x 7.50mm
TSSOP (PW)
9.70 mm × 4.40 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
POWER
FORCEOFF
AUTOPOWERDOWN
FORCEON
3
DIN
3
DOUTx
RS-232
TX
5
5
ROUT
RX
RIN
RS-232
ROUT2B
RX
RIN2
RS-232
STATUS
INVALID
Simplified Circuit
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TRSF3243
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SLLS862B – AUGUST 2007 – REVISED OCTOBER 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 Recommended Operating Conditions.........................4
6.3 Thermal Information....................................................4
6.4 Electrical Characteristics.............................................5
6.5 Electrical Characteristics: Driver................................. 5
6.6 Switching Characteristics: Driver................................ 6
6.7 Electrical Characteristics: Receiver............................ 6
6.8 Switching Characteristics: Receiver............................6
6.9 Electrical Characteristics: Auto-Powerdown............... 7
6.10 Switching Characteristics: Auto-Powerdown............ 7
Parameter Measurement Information............................... 8
7 Detailed Description......................................................12
7.1 Overview................................................................... 12
7.2 Device Functional Modes..........................................12
8 Device and Documentation Support............................14
8.1 Receiving Notification of Documentation Updates....14
8.2 Support Resources................................................... 14
8.3 Trademarks............................................................... 14
8.4 Electrostatic Discharge Caution................................14
8.5 Glossary....................................................................14
9 Mechanical, Packaging, and Orderable Information.. 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2008) to Revision B (October 2022)
Page
• Deleted the Ordering Information table...............................................................................................................1
• Changed the Package Information table............................................................................................................ 1
• Added the Simplified Schematic ........................................................................................................................ 1
• Added the Pin Configuration and Functions ...................................................................................................... 3
• Added the Thermal Information table................................................................................................................. 4
• Changed the ICC Supply current auto-powerdown disabled MAX value from 1 mA to 1.2 mA in the Electrical
Characteristics ................................................................................................................................................... 5
• Added the Detailed Description section............................................................................................................12
2
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5 Pin Configuration and Functions
C2+
1
28
C1+
C2-
2
27
V+
V-
3
26
V
CC
RIN1
4
25
GND
RIN2
5
24
C1-
RIN3
6
23
FORCEON
RIN4
7
22
FORCEOFF
RIN5
8
21
INVALID
DOUT1
9
20
ROUT2B
DOUT2
10
19
ROUT1
DOUT3
11
18
ROUT2
DIN3
12
17
ROUT3
DIN2
13
16
ROUT4
DIN1
14
15
ROUT5
Not to scale
Figure 5-1. DB, DW, or PW Package, 28 Pin (SSOP, SOIC, TSSOP)
(Top View)
Table 5-1. Pin Functions
PIN
NO.
NAME
TYPE
DESCRIPTION
1
C2+
—
Positive terminal of the voltage-doubler charge-pump capacitor
2
C2-
—
Negative terminal of the voltage-doubler charge-pump capacitor
3
V-
4
RIN1
5
RIN2
6
RIN3
7
RIN4
8
RIN5
9
DOUT1
10
DOUT2
11
DOUT3
12
DIN3
13
DIN2
14
DIN1
15
ROUT5
16
ROUT4
17
ROUT3
18
ROUT2
19
ROUT1
20
21
Negative charge pump output voltage
I
RS-232 receiver inputs
O
RS-232 driver outputs
I
Driver inputs
O
Receiver outputs
ROUT2B
—
Always-active noninverting receiver output;
INVALID
O
Invalid Output Pin
22
FORCEOFF
I
Auto Powerdown Control input (Refer to Truth Table)
23
FORCEON
I
Auto Powerdown Control input (Refer to Truth Table)
24
C1-
—
Negative terminal of the voltage-doubler charge-pump capacitor
25
GND
—
Ground
26
VCC
—
3-V to 5.5-V supply voltage
27
V+
—
Positive charge pump output voltage
28
C1+
—
Positive terminal of the voltage-doubler charge-pump capacitor
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage range(2)
VCC
range(2)
V+
Positive-output supply voltage
V–
Negative-output supply voltage range(2)
V+ – V–
Supply voltage
Input voltage range
VO
Output voltage range
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(2)
MAX
6
V
–0.3
7
V
0.3
–7
V
13
V
difference(2)
VI
(1)
MIN
–0.3
UNIT
Driver ( FORCEOFF, FORCEON)
–0.3
6
Receiver
–25
25
–13.2
13.2
V
150
°C
150
°C
Driver
–65
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
6.2 Recommended Operating Conditions
see Figure 7-6 (1)
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage DIN, FORCEOFF, FORCEON
VIL
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
VI
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
(1)
VCC = 3.3 V
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
2
VCC = 5 V
TRSF3243C
V
V
2.4
TRSF3243I
Operating free-air temperature
MIN
0.8
V
0
5.5
V
–25
25
V
–40
85
0
70
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.3 Thermal Information
THERMAL METRIC(1)
SOIC (DW)
DB (SSOP)
28 PINS
28 PINS
28 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
70.3
59.0
76.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
21.0
28.8
35.8
°C/W
RθJB
Junction-to-board thermal resistance
29.2
30.3
37.4
°C/W
ψJT
Junction-to-top characterization parameter
1.3
7.8
7.4
°C/W
ψJB
Junction-to-board characterization parameter
28.8
30.0
37.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
°C/W
(1)
4
TSSOP (PW)
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
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6.4 Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-6) (2)
PARAMETER
II
ICC
(1)
(2)
Input leakage current
Supply current
TEST CONDITIONS
MIN
FORCEOFF, FORCEON
TYP(1)
MAX
UNIT
±0.01
±1
μA
No load,
Auto-powerdown disabled FORCEOFF and FORCEON = VCC
For DB and PW package
0.3
1.2
mA
No load,
Auto-powerdown disabled FORCEOFF and FORCEON = VCC
For DW package
0.3
1
mA
Powered off
No load, FORCEOFF = GND
1
10
Auto-powerdown enabled
No load, FORCEOFF = VCC,
FORCEON = GND,
All RIN are open or grounded,
All DIN are grounded
1
10
μA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.5 Electrical Characteristics: Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-6)
TEST CONDITIONS(3)
PARAMETER
MIN
TYP(1)
MAX
UNIT
VOH
High-level output
voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
VOL
Low-level output
voltage
All DOUT at RL = 3 kΩ to GND
–5
–5.4
V
VO
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
IIH
High-level input current VI = VCC
IIL
Low-level input current
VI = GND
IOS
Short-circuit output
current(2)
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
Ioff
Output leakage current
FORCEOFF = GND
(1)
(2)
(3)
V
±0.01
300
±1
μA
±0.01
±1
μA
±35
±60
±35
±90
10M
mA
Ω
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
μA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.6 Switching Characteristics: Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-6)
TEST CONDITIONS(3)
PARAMETER
MIN
CL = 1000 pF
MAX
UNIT
250
Maximum data rate
(see Figure 7-1)
RL = 3 kΩ,
One DOUT switching
tsk(p)
Pulse skew(2)
CL = 150 pF to 2500 pF,
SR(tr)
Slew rate,
transition region
(see Figure 7-1)
CL = 150 pF to 1000 pF,
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
(1)
(2)
(3)
TYP(1)
CL = 250 pF,
VCC = 3 V to 4.5 V
1000
CL = 1000 pF,
VCC = 4.5 V to 5.5 V
1000
RL = 3 kΩ to 7 kΩ,
See Figure 7-2
kbit/s
25
18
ns
150
V/μs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.7 Electrical Characteristics: Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-6)
TEST CONDITIONS(2)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
Ioff
Output leakage current (except ROUT2B)
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V to ±25 V
(1)
(2)
MIN
TYP(1)
VCC – 0.6
VCC – 0.1
MAX
V
0.4
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
V
V
0.5
V
±0.05
±10
μA
5
7
kΩ
3
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.8 Switching Characteristics: Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS(3)
PARAMETER
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 7-3
150
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 7-3
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 7-4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 7-4
200
ns
50
ns
tsk(p)
(1)
(2)
(3)
6
TYP(1)
Pulse
skew(2)
See Figure 7-3
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.9 Electrical Characteristics: Auto-Powerdown
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND, FORCEOFF = VCC
VT–(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND, FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND, FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = –1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC – 0.6
V
V
0.4
V
6.10 Switching Characteristics: Auto-Powerdown
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-5)
PARAMETER
tvalid
Propagation delay time, low- to high-level output
tinvalid
Propagation delay time, high- to low-level output
ten
Supply enable time
(1)
TYP(1)
UNIT
1
μs
30
μs
100
μs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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Parameter Measurement Information
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
Output
SR(tr) +
tTLH
tTHL
6V
t THL or tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 7-1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPLH
tPHL
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 7-2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
3V
FORCEOFF
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 7-3. Receiver Propagation Delay Times
8
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3V
Input
VCC
3 V or 0 V
FORCEON
S1
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
±3 V
1.5 V
GND
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
50 Ω
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 7-4. Receiver Enable and Disable Times
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2.7 V
2.7 V
0V
Receiver
Input
0V
−2.7 V
−2.7 V
ROUT
Generator
(see Note B)
3V
50 Ω
tinvalid
tvalid
50% VCC
50% VCC
−3 V
VCC
INVALID
Output
Autopowerdown
FORCEOFF
DIN
ten
INVALID
CL = 30 pF
(see Note A)
FORCEON
0V
V+
≈V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
DOUT
V−
TEST CIRCUIT
≈V−
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
−0.3 V
If Signal Remains Within This Region
for More Than 30 µs, INVALID Is Low†
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 7-5. INVALID Propagation Delay Times and Supply Enabling Time
10
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C1+
1
+
C2
−
2
3
C2−
VCC
V−
GND
+
C1−
RIN1
RIN2
Serial-Port Inputs
RIN3
RIN4
RIN5
DOUT1
Serial-Port Outputs
DOUT2
4
27
+
−
26
25
C3†
+ CBYPASS
− = 0.1 µF
+
−
C1
24
23
FORCEON
5
AutoPowerdown
C4
−
V+
C2+
28
6
7
22
FORCEOFF
8
21
9
20
10
19
INVALID
ROUT2B
ROUT1
5 kΩ
DOUT3
11
18
ROUT2
5 kΩ
DIN3
12
Logic Outputs
17
ROUT3
5 kΩ
Logic Inputs
DIN2
13
16
ROUT4
5 kΩ
DIN1
14
15
ROUT5
5 kΩ
†
C3 can be connected to VCC or GND.
NOTE A: Resistor values shown are nominal.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 7-6. Typical Operating Circuit and Capacitor Values
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7 Detailed Description
7.1 Overview
Flexible control options for power management are available when the serial port is inactive. The autopowerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if
the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low, both
drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 μA. Disconnecting
the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7
V or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if all receiver input
voltages are between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 7-5 for receiver input levels.
7.2 Device Functional Modes
7.2.1 Function Tables
EACH DRIVER(1)
INPUTS
(1)
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with auto-powerdown disabled
Normal operation with auto-powerdown enabled
Powered off by auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER(1)
INPUTS
RIN1,
RIN3–RIN5
RIN2
(1)
12
OUTPUTS
FORCEOFF
VALID RIN
RS-232
LEVEL
ROUT2B ROUT2
ROUT1,
ROUT3–5
L
X
L
X
L
Z
Z
H
X
L
X
H
Z
Z
L
L
H
YES
L
H
H
L
H
H
YES
L
L
L
H
L
H
YES
H
H
H
H
H
H
YES
H
L
L
Open
Open
H
YES
L
H
H
RECEIVER STATUS
Powered off while
ROUT2B is active
Normal operation with
auto-powerdown
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TRSF3243
TRSF3243
www.ti.com
SLLS862B – AUGUST 2007 – REVISED OCTOBER 2022
DIN1
DIN2
DIN3
FORCEOFF
14
9
DOUT1
13
10
DOUT2
12
11
DOUT3
22
21
23
INVALID
Auto-Powerdown
FORCEON
ROUT1
19
4
RIN1
20
ROUT2B
ROUT2
18
5
RIN2
17
6
ROUT3
ROUT4
ROUT5
RIN3
7
16
RIN4
15
8
RIN5
Figure 7-1. LOGIC DIAGRAM (POSITIVE LOGIC)
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TRSF3243
13
TRSF3243
www.ti.com
SLLS862B – AUGUST 2007 – REVISED OCTOBER 2022
8 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
8.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
8.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
8.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TRSF3243
PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TRSF3243CPWR
LIFEBUY
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
RT43C
TRSF3243IDB
ACTIVE
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
TRSF3243I
Samples
TRSF3243IPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
RT43I
Samples
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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