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TS3DV642Q1EVM-105

TS3DV642Q1EVM-105

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    TS3DV642-Q1 多路复用器,解复用器(MUX,DEMUX) 接口 评估板

  • 数据手册
  • 价格&库存
TS3DV642Q1EVM-105 数据手册
www.ti.com Table of Contents User’s Guide TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide ABSTRACT The TS3DV642-Q1 is a 12 channels 1:2 or 2:1 bidirectional multiplexer/demultiplexer. The TS3DV642-Q1 operates from a 2.6 V to 4.5 V supply, making it suitable for battery-powered applications. It offers low and flat on-state resistance (RON) as well as low I/O capacitance which allows it to achieve a typical bandwidth of up to 7.5 GHz. The device provides the high bandwidth necessary for MIPI C-PHY, D-PHY, HDMI and DisplayPort applications. This user guide describes how to setup and configure the EVM to test functionality and signal integrity. Table of Contents 1 Introduction.............................................................................................................................................................................2 2 Setup and Configuration........................................................................................................................................................3 2.1 Power................................................................................................................................................................................. 3 2.2 Jumper Configuration.........................................................................................................................................................4 2.3 Signal Connection.............................................................................................................................................................. 4 2.4 Optional AC Coupling Capacitors and Termination Resistors............................................................................................4 2.5 Calibration Trace................................................................................................................................................................ 4 2.6 REACH Compliance...........................................................................................................................................................4 3 Schematic................................................................................................................................................................................5 4 Bill of Materials ...................................................................................................................................................................... 6 Trademarks All trademarks are the property of their respective owners. SCDU022 – NOVEMBER 2020 Submit Document Feedback TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated 1 www.ti.com Introduction 1 Introduction The TS3DV642-Q1 is a 12 channels 1:2 or 2:1 bidirectional multiplexer/demultiplexer. The TS3DV642-Q1 operates from a 2.6 V to 4.5 V supply, The device provides switching on differential channels between Port DA or Port DB to Port D (see Figure 1-1). Figure 1-1. TS3DV642-Q1 Functional Block Diagram 2 TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated SCDU022 – NOVEMBER 2020 Submit Document Feedback Setup and Configuration www.ti.com 2 Setup and Configuration Figure 2-1 shows a top view photo of the EVM. Figure 2-1. TS3DV642-Q1 EVM 2.1 Power The TS3DV642-Q1 EVM is designed to operate from an external 2.6-4.5 V power supply using standard banana jack plug cables. Terminal P1 should be connected to the supply positive output and P2 to ground. A power supply current limit of 100 mA is more than adequate to power the EVM. SCDU022 – NOVEMBER 2020 Submit Document Feedback TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated 3 Setup and Configuration www.ti.com 2.2 Jumper Configuration The TS3DV642-Q1 EVM is controlled by an active-high enable signal and port select signals. Jumper JMP8 (EN) is used to enable or disable the switch. Jumper JMP1 (SEL1) and JMP2 (SEL2) control the port selection: Port D to Port DB, or Port D to Port DA. Both jumpers and their operational positions are labeled with silkscreens on the EVM for ease of use. EN SEL1 SEL2 FUNCTION L X X Switch disabled. All channel are Hi-Z H L L Channel D0+/D0– to D0+A/D0–A is ON. All the other channels (D1+/D1-, D2+/D2-, D3+/D3-, SCL, SDA, HPD, CEC) are Hi-Z. H L H Channel D0+/D0– to D0+B/D0–B is ON. All the other channels (D1+/D1-, D2+/D2-, D3+/D3-, SCL, SDA, HPD, CEC) are Hi-Z H H L All A channels are enabled. All B channels are Hi-Z. H H H All B channels are enabled. All A channels are Hi-Z. 2.3 Signal Connection The EVM provides SMP receptacles for the high-speed signal connections. Each SMP receptacle is labeled with the signal's port (D, DA, or DB), channel (0 or 1), and polarity (P or N). SMA to SMP cables may be required to connect to test equipment or fixtures. The signal traces are all equal length and have 50 Ω single-ended impedance. 2.4 Optional AC Coupling Capacitors and Termination Resistors Most interfaces require AC coupling between the transmitter and receiver. For example, the DisplayPort specification requires AC coupling capacitors in the range of 75 – 200 nF on the TX. By default, the TS3DV642Q1 EVM is populated with 0 Ω resistors on the input and output which can be replaced with capacitors if needed. The TS3DV642-Q1 EVM also includes external termination resistors option on the Port D. When populating the external termination reisstors, it is important to provide the external termination through the banana jack plug VTERM and GND. For now, the EVM leaves the external termination resistors to be un-populated. 2.5 Calibration Trace The TS3DV642-Q1 EVM provides a pair of calibration traces to allow the EVM trace to be de-embedded from the TS3DV642-Q1 during measurement. The calibration traces are length matched to the combined length of the input and output traces to the TS3DV642-Q1. They are also populated with the same capacitors and resistors. 2.6 REACH Compliance In compliance with the Article 33 provision of the EU REACH regulation we are notifying you that this EVM includes component(s) containing at least one Substance of Very High Concern (SVHC) above 0.1%. These uses from Texas Instruments do not exceed 1 ton per year. The SVHC is shown in: 4 Component Manufacturer Component Type Component Part Number SVHC Substance SVHC CAS (when available) Rosenberger Connector 19S101-40ML5 7439-92-1 Lead TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated SCDU022 – NOVEMBER 2020 Submit Document Feedback www.ti.com Schematic 3 Schematic Figure 3-1 shows the TS3DV642-Q1 schematic J37 R42 J39 R44 SDA_A SCL_B 0 SMP J38 0 R43 SMP J40 R45 SCL_A SDA_B 0 SMP 0 0.22uF 0.22uF J13 VCC3P3 SCL_A SDA_A SCL_B SDA_B 39 J15 R12 10K 0 J9 R5 10 D2n 11 D3p 12 D3n 13 HPD 14 0 SMP J10 R6 D1n 0 SMP JMP8 D2p J11 CEC 15 SEL1 16 SEL2 17 R7 0 SMP SDA_B 43 PPAD DA1P SDA DA1N D0P DA2P D0N DA2N D1P D1N NC1 DA3P DA3N NC2 D2P DB0P D2N DB0N D3P DB1P D3N DB1N HPD DB2P CEC DB2N SEL1 SEL2 DB3P 18 D2p SCL_B 8 SCL_A 7 D1n DA0N SCL GND 6 D1p 9 D1p VCC3P3 1 2 3 D0n R4 SMP EN_PU EN EN_PD 5 D0n R14 10K R34 10K D0p DA0P EN HPD_B J8 SEL2 4 VCC TS3DV642-Q1 SEL1 0 SMP JMP2 1 2 3 SDA R3 D0p SEL2_PU SEL2 SEL2_PD 3 CEC_B J7 R13 10K JMP1 1 2 3 2 SCL HPD_A 0 SMP R11 10K 1 EN R2 SDA DA1n DA1p DB3N 38 DA0P 37 DA0N 36 DA1P 35 DA1N 34 DA2P 33 DA2N 32 DA3P 31 DA3N SMP C10 SMP 0.22uF J17 0.22uF J18 DA2p DA2n SMP C11 SMP C12 0.22uF J20 J19 0.22uF 30 DA3p DA3n 29 DB0P 28 DB0N 27 DB1P 26 DB1N 25 DB2P 24 DB2N 23 DB3P 22 DB3N SMP C14 SMP C13 0.22uF 0.22uF J22 J21 DB0p DB0n SMP C16 SMP C15 0.22uF 0.22uF J24 J23 DB1p DB1n SMP C18 SMP C17 21 VCC3P3 CEC_A 0 J6 SEL1_PU SEL1 SEL1_PD C9 SDA_A SCL SMP VCC3P3 U1 20 Banana-Jack R1 19 J5 J16 0.22uF 0.22uF 1 GND SMP C8 C26 0.01uF 40 C25 0.1uF 41 C4 0.01uF C2 1uF 42 C3 0.1uF C1 10uF P2 DA0n SMP C7 1 Banana-Jack J14 DA0p VCC3P3 P1 3.3V IN SMP EN R35 10K J12 R8 0.22uF D2n J29 VCC J25 0.22uF 0 SMP DB2p D3p 0 SMP J30 1 C27 10uF P4 C28 C29 1uF 0.1uF C30 0.01uF 1 DB3p DB3n SMP C22 SMP C21 J31 J28 J27 0.22uF 0 SMP GND 0.22uF R33 D3n Banana-Jack SMP C20 P3 VCC J26 DB2n SMP C19 R32 R36 VCC HPD 0 SMP Banana-Jack J32 R37 CEC 0 SMP J33 R38 CEC_A R53 R54 R55 R56 R57 R58 R59 R46 R47 R48 R49 R50 R51 0 0 0 0 0 0 0 0 0 0 0 0 0 0 D0n 0 SMP R52 D0p D1p J34 D1n R39 HPD_A D2p 0 SMP D2n J35 R40 D3p CEC_B D3n 0 SMP SCL J36 SDA R41 HPD_B SCL_A 0 SMP SDA_A J1 R9 C5 J2 SCL_B CALp CALp 0 SMP J3 R10 C6 J4 CALn SMP SDA_B SMP 0.22uF CALn 0 SMP 0.22uF Figure 3-1. TS3DV642-Q1 Schematic SCDU022 – NOVEMBER 2020 Submit Document Feedback TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated 5 Bill of Materials www.ti.com 4 Bill of Materials Table 4-1 shows the TS3DV642-Q1 EVM Bill of Materials Table 4-1. Bill of Materials Item Quantity Reference Value Manufacturer Man. Part Number Footprint 1 2 C1,C27 10 uF TDK Corporation C1608X5R1A106 K080AC cap_0603 2 2 C2,C28 1 uF Taiyo Yuden LMK107B7105KA- cap_0603 T 3 3 C3,C25,C29 0.1 uF Murata Electronics GRM155R71C104 cap_0402 North America KA88D 4 3 C4,C26,C30 0.01 uF Samsung CL05B103KB5NN cap_0402 NC 5 18 C5,C6,C7,C8,C9, C10,C11, 0.22 uF Taiyo Yuden LMK063BJ224MP cap_0201 -F C12,C13,C14,C15 ,C16,C17, C18,C19,C20,C21 ,C22 6 3 JMP1,JMP2,JMP8 HDR3X1 M .1 AMP 68000-103HLF berg1x3tee 7 40 J1,J2,J3,J4,J5,J6, SMP J7,J8, Rosenberger 19S101-40ML5 SMP Brady THT-46-487-10 THT-46-487-10 J9,J10,J11,J12,J1 3,J14, J15,J16,J17,J18,J 19,J20, J21,J22,J23,J24,J 25,J26, J27,J28,J29,J30,J 31,J32, J33,J34,J35,J36,J 37,J38, J39,J40 8 1 LB1 PCB Label 0.650"W x 0.200"H 9 1 PCB1 Any PCB 10 4 P1,P2,P3,P4 Banana-Jack Emerson Network 108-0740-001 Power 4mm 11 36 R1,R2,R3,R4,R5, R6,R7,R8, 0 Panasonic Electronic Components ERJ-1GN0R00C res_0201 res_0402 R9,R10,R32,R33, R36,R37, R38,R39,R40,R41 ,R42,R43, R44,R45,R46,R47 ,R48,R49, R50,R51,R52,R53 ,R54,R55, R56,R57,R58,R59 6 12 6 R11,R12,R13,R14 10K ,R34,R35 Panasonic Electronic Components ERA-2AED103X 13 4 SCRW1,SCRW2, SCRW3,SCRW4 B&F Fastener NY PMS 440 0050 4-40 Phillips PH Panhead NY PMS 440 005 PH TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated SCDU022 – NOVEMBER 2020 Submit Document Feedback www.ti.com Bill of Materials Table 4-1. Bill of Materials (continued) Item Quantity Reference Value Manufacturer Man. Part Number Footprint 14 2 SHNT1,SHNT2 QPC02SXGN-RC Kobiconn 151-8000-E 0.1" SP 15 4 STDOFF1,STDOF 1902E F2,STDOFF3, Keystone 1902E OD3.96 L7.95 OL7.94 16 1 U1 Ts3DV642-Q1 Texas Instruments TS3DV642-Q1 RUA0042A 17 1 U2 DNI DNI RUA0042A STDOFF4 SCDU022 – NOVEMBER 2020 Submit Document Feedback DNI TS3DV642-Q1 12-channel 1:2 MUX/DEMUX with 1.8 V Compatible Control Power-down Mode Evaluation Module User Guide Copyright © 2020 Texas Instruments Incorporated 7 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated
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