TS3USB3200EVM

User's Guide SCDU007 – October 2013 TS3USB3200 EVM User's Guide This document is the EVM user guide for TS3USB3200. The TS3USB3200 is a double-pole, double throw (DPDT) USB, Mobile High-Definition Link (MHL), Mobility Display Port(MyDP) high-performance 2:1 Multiplexer/De-Multiplexer with an integrated ID switch. 1 2 3 4 5 Contents About this Manual ........................................................................................................... Introduction .................................................................................................................. Quick Start Evaluation ...................................................................................................... Board Documentation ...................................................................................................... Related Documentation .................................................................................................... 1 2 3 5 8 List of Figures 1 TS3USB3200 EVM Block Diagram ....................................................................................... 2 2 Quick Start Diagram ........................................................................................................ 3 3 TS3USB3200 Schematic................................................................................................... 5 4 Top Layer .................................................................................................................... 7 5 Ground Plane ................................................................................................................ 7 6 Power Plane ................................................................................................................. 7 7 Bottom Layer ................................................................................................................ Board Stackup ............................................................................................................... 7 8 8 List of Tables 1 1 PSEL Jumper Configuration ............................................................................................... 3 2 SEL1 and SEL2 Jumper ................................................................................................... 4 3 Bill of Materials .............................................................................................................. 6 4 Board Stackup and Dielectric Material ................................................................................... 8 About this Manual This user’s guide describes the TS3USB3200 Evaluation Module (EVM) and its intended use. This guide contains the jumper configurations, EVM schematics, bill of materials (BOM), and board layer information. 1.1 Information about Cautions and Warnings The information in a caution or a warning is provided for your protection. Read each caution and warning carefully. ATTENTION STATIC SENSITIVE DEVICES HANDLE ONLY AT STATIC SAFE WORK STATIONS SCDU007 – October 2013 Submit Documentation Feedback TS3USB3200 EVM User's Guide Copyright © 2013, Texas Instruments Incorporated 1 Introduction www.ti.com CAUTION This EVM contains components that can potentially be damaged by electrostatic discharge. Always transport and store the EVM in its supplied ESD bag when not in use. Handle using an antistatic wristband. Operate on an antistatic work surface. For more information on proper handling, see the Electrostatic Discharge (ESD) application note (SSYA008). 2 Introduction The TS3USB3200EVM is an evaluation module for TI's 1:2 multiplexer/de-multiplexer high-performance USB/MHL/MyDP switch. It is specifically designed for high-speed signal switching that supports bidirectional operation and offers a high bandwidth (5.5 GHz typical). When interfacing other USB/MHL/MyDP devices with this EVM, the switch allows signals to pass with minimum edge and phase distortion as well as little or no signal attenuation. The evaluation module is designed to demonstrate the small printed-circuit board (PCB) areas that can be achieved when designing with the TS3USB3200 switch. The TS3USB3200 offers the flexibility of powering from either a VCC rail (2.7 V to 4.3 V) or the VBUS power rail from the USB connector (4.75 V to 5.25 V) with the capability of switching between power rails using the PSEL pin. See Figure 1 for the EVM block diagram. Figure 1. TS3USB3200 EVM Block Diagram 2.1 Hardware Items for Operation The following items are required for EVM evaluation: • TS3USB3200 EVM • USB cables with connector type depending on the surrounding system The following items are optional for EVM evaluation: • MHL/MyDP source capable of interfacing through a female-to-male micro-B connection • MHL-to-HDMI adapter • Display capable of displaying MHL/MyDP/HDMI at appropriate frame rate 2 TS3USB3200 EVM User's Guide SCDU007 – October 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Quick Start Evaluation www.ti.com 3 Quick Start Evaluation 3.1 Evaluation Overview Figure 2 provides a diagram of the setup, for evaluation. Figure 2. Quick Start Diagram 3.2 Jumper Configuration Tables Table 1 displays the jumper configuration for VCC, VBUS, and PSEL. Table 1. PSEL Jumper Configuration VCC VBUS PSEL (1) Power Source L L X No Power L H X VBUS H L X VCC H H L VCC H H H VBUS (1) The PSEL pin has a 6-MΩ weak pull-down resistor to GND to make its default value LOW SCDU007 – October 2013 Submit Documentation Feedback TS3USB3200 EVM User's Guide Copyright © 2013, Texas Instruments Incorporated 3 Quick Start Evaluation www.ti.com Table 2 displays the jumper configuration for SEL1 and SEL2. Table 2. SEL1 and SEL2 Jumper SEL1 (1) SEL2 (1) Data Connection ID Connection L L J6 to J5 (USB) J6 to J5 (USB) L H J6 to J5 (USB) J6 to J5 (MHL) H L J6 to J5 (MHL) J6 to J5 (USB) H J6 to J5 (MHL) J6 to J5 (MHL) H (1) 3.3 The SEL1 and SEL2 pins have 6-MΩ weak pull-down resistors to GND to make their default value LOW Device Charging Charging through the EVM is not supported and may cause damage to the board. Low current (< 100 mA) charging is allowed through the EVM. 3.4 USB Communication Set up the USB communication for the EVM by following steps 1 through 5. 1. Configure the SEL1 and SEL2 jumpers so both are in the high position (shorting pins 1 and 2 of the headers). 2. If VCC is powered, place the PSEL jumper to choose which power source is desired for evaluation. 3. Connect the TS3USB3200 J6 male connector to a USB device with a female micro-B receptacle. 4. Connect a USB-A to micro-B cable from a powered PC to the J5 micro-B receptacle on the EVM. • The VBUS led indicator should turn on when the powered cable from the PC connects to the EVM. 5. If the device is capable (not on low battery), USB communication should occur between the peripheral connector to J6 and the PC connected to J5 through the TS3USB3200. The device may also begin charging. 3.5 MHL/MyDP Communication Set up MHL/MyDP communication for the EVM by following steps 1 through 4. 1. Configure the SEL1 and SEL2 jumpers so both are in the “GND” position (shorting pins 2 and 3 of the headers). 2. If VCC is powered, place the PSEL jumper to choose which power source is desired for evaluation. 3. Connect the TS3USB3200 J6 Male Connector to a MHL/MyDP source with a female micro-B receptacle. 4. Connect a USB-A to micro-B cable from an appropriate MHL/MyDP-compatible display to the J7 microB receptacle on the EVM. • An alternative is using an MHL/MyDP-to-HDMI Dongle to connect to an HDMI-compatible display. 4 TS3USB3200 EVM User's Guide SCDU007 – October 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Board Documentation www.ti.com 4 Board Documentation This section contains the schematic, bill of materials, PCB layout, and board stackup for the TS3USB3200 EVM. 4.1 TS3USB3200 EVM Schematic The schematic for this EVM is illustrated in Figure 3. 1 2 3 4 5 6 Power inputs to board VCC Input Range: 2.7 V to 4.3 V J1 VBUS Input Range: 4.75 V to 5.25 V J2 VCC 1 TSW-101-07-G-S C1 10µF J3 1 A VBUS 1 TSW-101-07-G-S J4 1 TSW-101-07-G-S C2 10µF USB Path Female Micro-B Port A TSW-101-07-G-S J5 GND GND VBUS 1 VCC MAX continuous current through board is 100 mA VCC C3 0.1µF J6 VBUS C4 1µF D1 Green D2 Green 2 D_N 3 D_P 2 3 14 1 8 GND 4 R1 374 R2 510 GND 5 SEL1 SEL2 PSEL 5 9 4 GND Common Male Micro-B Port VBUS VCC 2 USB_P 3 C6 1µF 6 7 8 9 10 11 4 16 5 GND D+ DID_COM GND GND USB+ USBID_USB SEL1 SEL2 PSEL MHL+ MHLID_MHL GND 7 6 12 GND 105017-0001 J7 11 10 13 VBUS 1 MHL_N 2 MHL_P 3 6 7 8 9 10 11 TS3USB3200RSV ZX64-B-5S-UNIT(14) GND C5 0.1µF U1 15 VBUS 1 USB_N GND 4 B B 5 GND GND 105017-0001 MHL Path Female Micro-B Port J8 J9 1 6 7 8 9 10 11 1 2 Through_path_N 2 3 Through_path_P 3 4 4 5 5 GND GND 105017-0001 ZX64-B-5S-UNIT(14) Through Path C C VCC PSEL 1 2 3 J10 VCC GND VBUS D3 B230-13-F 0.5V D4 B230-13-F 0.5V SEL1 1 2 3 J11 GND SEL2 1 2 3 J12 GND D D 3 pin Jumpers for Select Lines Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application. 1 2 3 4 Number: HVL050 Rev: A SVN Rev: Not in version control Drawn By: Andrew Mason Engineer: Andrew Mason 5 Designed for: Catalog Project Title: TS3USB3200EVM Sheet Title: HVL050 Assembly Variant: 001 File: HVL050A.SchDoc Contact: http://www.ti.com/support Mod. Date: 7/24/2013 Sheet: 1 of 1 Size: B http://www.ti.com © Te xas Instruments 2013 6 Figure 3. TS3USB3200 Schematic SCDU007 – October 2013 Submit Documentation Feedback TS3USB3200 EVM User's Guide Copyright © 2013, Texas Instruments Incorporated 5 Board Documentation 4.2 www.ti.com Bill of Materials The BOM for this EVM is listed in Table 3. Table 3. Bill of Materials Designator Qty Value Description Package Reference Part Number C1, C2 2 10uF CAP, CERM, 10uF, 10V, ±10%, C0G/NP0, 0603 0603 C1608X5R1A106M C3, C5 2 0.1uF CAP, CERM, 0.1uF, 6.3V, ±10%, X5R, 0402 0402 C1005X5R0J104K C4, C6 2 1uF CAP, CERM, 1uF, 10V, ±20%, X5R, 0201 0201 CL03A105MP3NSNC D1, D2 2 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT D3, D4 2 0.5V Diode, Schottky, 30V, 2A, SMB SMB B230-13-F FID1, FID2, FID3, FID4, FID5, FID6 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A J1, J2, J3, J4 4 Header, TH, 100mil, 1pos, Gold plated, 230 mil above insulator Testpoint TSW-101-07-G-S J5, J7, J8 3 Receptacle, Micro-USB-B, Right Angle, SMD Micro USB receptacle 105017-0001 J6, J9 2 Connector, micro USB Type B, Receptacle, R/A, SMD Micro USB-B receptacle ZX64-B-5S-UNIT(14) J10, J11, J12 3 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator TSW-103-07-G-S TSW-103-07-G-S R1 1 374 RES, 374 ohm, 1%, 0.063W, 0402 0402 CRCW0402374RFKED R2 1 510 RES, 510 ohm, 5%, 0.063W, 0402 0402 CRCW0402510RJNED SH-J1, SH-J2, SH- 3 J3 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 2 Micro USB-B Receptacle Housing Receptacle housing ZX64-B-SLDC 1 DPDT USB 2.0 High-Speed (480Mbps) and Mobile HighRSV0016A Definition Link (MHL) Switch with ID Select and Flexible Power Control, RSV0016A U1 6 TS3USB3200 EVM User's Guide TS3USB3200RSV SCDU007 – October 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Board Documentation www.ti.com 4.3 PCB Layout The PCB layouts for this EVM are displayed in Figure 4 through Figure 7. Figure 4. Top Layer Figure 5. Ground Plane Figure 6. Power Plane Figure 7. Bottom Layer SCDU007 – October 2013 Submit Documentation Feedback TS3USB3200 EVM User's Guide Copyright © 2013, Texas Instruments Incorporated 7 Related Documentation 4.4 www.ti.com Board Stackup Figure 8 depicts the board stackup. • Core: ROGERS4350B • Prepreg: FR-4 Figure 8. Board Stackup Table 4 lists the stackup along with the dielectric material. Table 4. Board Stackup and Dielectric Material Layer 1 2 Top 3 4 Ground 5 6 Power 7 8 9 5 Bottom Type Thickness (mils) Surface 0.4 Conductor 0.7 Dielectric 4 Plane 1.4 Dielectric 49 Plane 1.4 Dielectric 4 Conductor 0.7 Surface 0.4 Copper Weight Dielectric Constant Loss Tangent 0.5 oz 3.66 0.0037 4.5 0.035 3.66 0.007 Coupling Type Width (mils) Spacing (mils) Diff ZO (Ω) Coupled MS 7 7 98.6 1 oz 1 oz 0.5 oz Related Documentation TS3USB3200 data sheet: DPDT USB 2.0 High-Speed (480Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch with ID Select and Flexible Power Control (SCDS333) 8 TS3USB3200 EVM User's Guide SCDU007 – October 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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