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TS5A22362
SCDS364E – JUNE 2015 – REVISED OCTOBER 2019
TS5A22362 0.65-Ω 2-channel SPDT Analog Switches With Negative Signaling Capability
1 Features
3 Description
•
•
The TS5A22362 is a bidirectional, 2-channel singlepole double-throw (SPDT) analog switch designed to
operate from 2.3 V to 5.5 V. The device features
negative signal swing capability that allows signals
below ground to pass through the switch without
distortion. The break-before-make feature prevents
signal distortion during the transferring of a signal
from one path to another. Low ON-state resistance,
excellent channel-to-channel ON-state resistance
matching, and minimal total harmonic distortion
(THD) performance are ideal for audio applications.
The 3.00 mm × 3.00 mm DRC package is also
available as a nonmagnetic package for medical
imaging application.
1
•
•
•
•
•
•
Specified break-before-make switching
Negative signaling capability: maximum swing
from –2.75 V to 2.75 V (VCC = 2.75 V)
Low ON-state resistance (0.65 Ω typical)
Low charge injection
Excellent ON-state resistance matching
2.3-V to 5.5-V Power supply (VCC)
Latch-Up performance exceeds 100 mA Per JESD
78, Class II
ESD Performance tested per JESD 22
– 2500-V Human-body model
(A114-B, class II)
– 1500-V Charged-device model (C101)
– 200-V Machine model (A115-A)
2 Applications
•
•
•
•
•
Device Information(1)
PART NUMBER
TS5A22362
Cell phones
Personal digital assistant (PDAs)
Portable instrumentation
Audio routing
Medical imaging
PACKAGE
BODY SIZE (NOM)
VSON (10)
3.00 mm × 3.00 mm
DSBGA (10)
1.86 mm × 1.36 mm
VSSOP (10)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Schematic
OUT+
Audio
Source 1
NC1
OUT–
COM1
NO1
IN1
8-Ω Speaker
TS5A22362
NC2
OUT–
IN2
COM2
OUT+
Audio
Source 2
Input Select
NO2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TS5A22362
SCDS364E – JUNE 2015 – REVISED OCTOBER 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
5
5
6
7
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics for 2.5-V Supply................
Electrical Characteristics for 3.3-V Supply................
Electrical Characteristics for 5-V Supply ..................
Typical Characteristics ..............................................
Parameter Measurement Information ................ 11
Detailed Description ............................................ 15
8.1 Overview ................................................................. 15
8.2 Functional Block Diagram ....................................... 15
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 15
9
Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application .................................................. 16
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
11.2 Layout Example .................................................... 18
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2018) to Revision E
•
Page
Changed the YZP Package view From: Top View To: Bottom View ..................................................................................... 3
Changes from Revision C (June 2017) to Revision D
Page
•
Changed the YZP Package From: Laser Marketing View and Bump View To: Top View..................................................... 3
•
Changed the QC TYP value From: 10 pC To: 150 pC in the Electrical Characteristics for 5-V Supply table ....................... 8
Changes from Revision B (September 2015) to Revision C
•
Changed the VIN MAX value From: VCC To: 5.5 V in the Recommended Operating Conditions table .................................. 4
Changes from Revision A (August 2015) to Revision B
•
2
Page
Changed CL TEST CONDITION value for all THD PARAMETERs from 15 pf to 35 pf. ....................................................... 6
Changes from Original (June 2015) to Revision A
•
Page
Page
Changed the Functional Block Diagram. .............................................................................................................................. 15
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Copyright © 2015–2019, Texas Instruments Incorporated
Product Folder Links: TS5A22362
TS5A22362
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SCDS364E – JUNE 2015 – REVISED OCTOBER 2019
5 Pin Configuration and Functions
connected as a secondary GND or left
electrically open.
DRC Package
10-Pin VSON
Top View
DGS Package
10-Pin VSSOP
Top View
VCC
1
10
NO1
2
9
COM2
VCC
1
10
COM1
3
8
NC2
NO1
2
9
COM2
NC1
4
7
IN2
COM1
3
8
NC2
IN1
5
6
GND
NC1
4
7
IN2
IN1
5
6
GND
Thermal
Pad
NO2
NO2
Not to scale
Not to scale
The exposed center pad, if used, must be
YZP Package
10-Pin DSBGA
Bottom View
1
2
3
D
IN2
GND
IN1
C
NC2
NC1
B
COM2
COM1
A
NO2
VCC
NO1
Not to scale
Pin Functions
PIN
NAME
TYPE
DESCRIPTION
VSON
VSSOP
DSBGA
VCC
1
1
A2
—
Power Supply
NO1
2
2
A3
I/O
Normally Open (NO) signal path, Switch 1
COM1
3
3
B3
I/O
Common signal path, Switch 1
NC1
4
4
C3
I/O
Normally Closed (NC) signal path, Switch 1
IN1
5
5
D3
I
GND
6
6
D2
—
IN2
7
7
D1
I
NC2
8
8
C1
I/O
Normally Closed (NC) signal path, Switch 2
COM2
9
9
B1
I/O
Common signal path, Switch 2
NO2
10
10
A1
I/O
Normally Open (NO) signal Path, Switch 2
Digital control pin , Switch 1
Ground
Digital control pin, Switch 2
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SCDS364E – JUNE 2015 – REVISED OCTOBER 2019
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
–0.5
6
V
VCC – 6
VCC + 0.5
V
–50
50
mA
–150
150
–300
300
–350
350
–500
500
–0.5
6.5
V
–50
50
mA
Continuous current through VCCor GND
–100
100
mA
Storage temperature
–65
150
°C
Supply voltage
(3)
VNC
VNO
VCOM
Analog voltage
(3) (4) (5)
II/OK
Analog port diode current
INC
INO
ICOM
ON-state switch current
INC (3) (7) (8)
INO (3) (7) (8)
ICOM (3) (7) (8)
ON-state switch current
VI
Digital input voltage
IIK
Digital input clamp current
ICC
IGND
Tstg
(2)
VCC
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(1)
VNC, VNO, VCOM < 0
or
VNC, VNO, VCOM > VCC
ON-state peak switch current
ON-state peak switch current
(6)
VNC, VNO, VCOM = 0 to VCC
(6)
VNC, VNO, VCOM = 0 to VCC
(3) (4)
VI < 0
mA
mA
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 5.5 V maximum.
Pulse at 1-ms duration < 10% duty cycle.
VCC = 3.0 V to 5.0 V, TA = –40°C to 85°C.
For YZP package only.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
Electrostatic discharge
(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
(1)
(2)
UNIT
±2500
±1500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
VNC
VNO
VCOM
Signal path voltage
VIN
Digital control
4
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MIN
MAX
UNIT
2.3
5.5
V
VCC – 5.5
VCC
V
GND
5.5
V
Copyright © 2015–2019, Texas Instruments Incorporated
Product Folder Links: TS5A22362
TS5A22362
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SCDS364E – JUNE 2015 – REVISED OCTOBER 2019
6.4 Thermal Information
TS5A22362
THERMAL METRIC
(1)
DGS (VSSOP)
DRC (VSON)
YZP (DSBGA)
10 PINS
10 PINS
10 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
163.3
44.3
90.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
56.4
70.1
0.3
°C/W
RθJB
Junction-to-board thermal resistance
83.1
19.3
8.3
°C/W
ψJT
Junction-to-top characterization parameter
6.8
2.0
3.2
°C/W
ψJB
Junction-to-board characterization parameter
81.8
19.4
8.3
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics for 2.5-V Supply
VCC = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
UNIT
VCC
V
Analog Switch
VCOM,
VNO, VNC
Analog signal
range
Ron
ON-state
resistance
VNC or VNO = VCC, 1.5 V,
VCC – 5.5 V
ICOM = –100 mA,
COM to NO or NC,
see Figure 13
ΔRon
ON-state
resistance match
between channels
VNC or VNO = 1.5 V,
ICOM = –100 mA,
COM to NO or NC,
see Figure 13
Ron(flat)
ON-state
resistance
flatness
VNC or VNO = VCC, 1.5 V,
VCC – 5.5 V
ICOM = –100 mA,
COM to NO or NC,
see Figure 13
INC(OFF),
INO(OFF)
NC, NO
OFF leakage
current
VNC = 2.25 V, VCC – 5.5 V
VCOM = VCC – 5.5 V, 2.25 V
VNO = Open
COM to NO
or
VNO = 2.25 V, VCC – 5.5 V,
VCOM = VCC – 5.5 V, 2.25 V
VNC = Open
COM to NC
See Figure 14
ICOM(ON)
COM
ON leakage
current
VNC and VNO = Floating,
VCOM = VCC,VCC – 5.5 V
See Figure 15
Digital Control Inputs (IN)
VCC – 5.5
25°C
Full
0.65
2.7 V
1.3
25°C
Full
0.023
2.7 V
0.18
2.7 V
25°C
Full
2.7
25°C
Full
2.7 V
Ω
0.11
0.15
25°C
Full
0.94
Ω
0.46
0.5
–50
50
–375
375
–50
50
–375
375
1.4
5.5
Ω
nA
nA
(2)
VIH
Input logic high
VIL
Input logic low
IIH, IIL
Input leakage
current
VIN = VCC or 0
tON
Turnon time
VCOM = VCC,
RL = 300 Ω,
CL = 35 pF,
see Figure 17
tOFF
Turnoff time
VCOM = VCC,
RL = 300 Ω,
CL = 35 pF,
see Figure 17
tBBM
Break-before-make
time
See Figure 18
QC
Charge injection
VGEN = 0,
RGEN = 0,
CNC(OFF),
CNO(OFF)
NC, NO
OFF capacitance
VNC or VNO = VCC or GND,
Full
25°C
Full
0.6
2.7 V
–250
250
–250
250
V
nA
Dynamic
(1)
(2)
25°C
2.5 V
Full
2.3 V to 2.7
V
25°C
2.5 V
Full
2.3 V to 2.7
V
25°C
2.5 V
CL = 1 nF,
see Figure 22
25°C
See Figure 16
25°C
44
80
120
22
70
70
1
ns
ns
7
ns
2.5 V
150
pC
2.5 V
70
pF
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
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Electrical Characteristics for 2.5-V Supply (continued)
VCC = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
TA
VCC
See Figure 16
25°C
2.5 V
370
pF
VI = VCC or GND
See Figure 16
25°C
2.5 V
2.6
pF
RL = 50 Ω, –3 dB
See Figure 18
25°C
2.5 V
17
MHz
25°C
2.5 V
–66
dB
dB
CCOM(ON)
NC, NO, COM
ON capacitance
VCOM = VCC or GND,
Switch ON, f = 10 MHz
CI
Digital input
capacitance
BW
Bandwidth
MIN
TYP
OISO
OFF isolation
RL = 50 Ω
f = 100 kHz,
see Figure 20
XTALK
Crosstalk
RL = 50 Ω
f = 100 kHz,
see Figure 21
25°C
2.5 V
–75
THD
Total harmonic
distortion
RL = 600 Ω,
CL = 35 pF
f = 20 Hz to
20 kHz,
see Figure 23
25°C
2.5 V
0.01%
ICC
Positive
supply current
VCOM and VIN = VCC or GND,
VNC and VNO = Floating
ICC
Positive
supply current
VCOM = VCC – 5.5 V,
VIN = VCC or GND,
VNC and VNO = Floating
MAX
UNIT
Supply
25°C
Full
Full
0.2
2.7 V
1.1
1.3
2.7 V
3.3
μA
μA
6.6 Electrical Characteristics for 3.3-V Supply
VCC = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
UNIT
VCC
V
ANALOG SWITCH
VCOM,
VNO, VNC
Analog signal
range
Ron
ON-state
resistance
VNC or VNO ≤ VCC,
1.5 V,
VCC – 5.5 V,
ICOM = –100 mA
COM to NO or NC,
see Figure 13
ΔRon
ON-state
resistance match
between channels
VNC or VNO = 1.5 V,
ICOM = –100 mA,
COM to NO or NC,
see Figure 13
Ron(flat)
ON-state
resistance
flatness
VNC or VNO ≤ VCC,
1.5 V,
VCC – 5.5 V,
ICOM = –100 mA
COM to NO or NC,
see Figure 13
INC(OFF),
INO(OFF)
NC, NO
OFF leakage
current
VNC = 3 V, VCC – 5.5 V
VCOM = VCC – 5.5 V, 3 V
VNO = Open
COM to NO
or
VNO = 3 V, VCC – 5.5 V,
VCOM = VCC – 5.5 V, 3 V
VNC = Open
COM to NC
See Figure 14
ICOM(ON)
COM
ON leakage
current
VNC and VNO = Floating,
VCOM = VCC,VCC – 5.5 V
COM to NO or NC,
see Figure 15
DIGITAL CONTROL INPUTS (IN)
VIH
Input logic high
VIL
Input logic low
IIH, IIL
Input leakage current
(1)
(2)
6
VCC – 5.5
25°C
Full
0.61
3V
0.97
25°C
Full
0.024
3V
0.12
3V
25°C
Full
3.6 V
25°C
Full
3.6 V
Ω
0.13
0.13
25°C
Full
0.87
Ω
0.46
0.5
–50
50
–375
375
–50
50
–375
375
1.4
5.5
Ω
nA
nA
(2)
Full
VIN = VCC or 0
25°C
Full
0.8
3.6 V
–250
250
–250
250
V
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Electrical Characteristics for 3.3-V Supply (continued)
VCC = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
34
80
UNIT
DYNAMIC
tON
Turnon time
VCOM = VCC,
RL = 300 Ω
CL = 35 pF,
see Figure 17
tOFF
Turnoff time
VCOM = VCC,
RL = 300 Ω
CL = 35 pF,
see Figure 17
tBBM
Break-before-make
time
See Figure 18
QC
Charge injection
VGEN = 0,
RGEN = 0
CNC(OFF),
CNO(OFF)
NC, NO
OFF capacitance
CCOM(ON)
25°C
3.3 V
Full
3 V to
3.6 V
25°C
3.3 V
Full
3 V to
3.6 V
25°C
3.3 V
CL = 1 nF,
see Figure 22
25°C
VNC or VNO = VCC or
VCC – 5.5 V
See Figure 16
NC, NO, COM
ON capacitance
VCOM = VCC or GND,
f = 10 MHz
CI
Digital input
capacitance
BW
120
19
70
70
1
ns
ns
7
ns
3.3 V
150
pC
25°C
3.3 V
70
pF
See Figure 16
25°C
3.3 V
370
pF
VI = VCC or GND
See Figure 16
25°C
3.3 V
2.6
pF
Bandwidth
RL = 50 Ω, –3 dB
Switch ON,
see Figure 18
25°C
3.3 V
17.5
MHz
OISO
OFF isolation
RL = 50 Ω
f = 100 kHz,
see Figure 20
25°C
3.3 V
–68
dB
XTALK
Crosstalk
RL = 50 Ω
f = 100 kHz,
see Figure 21
25°C
3.3 V
–76
dB
THD
Total harmonic
distortion
RL = 600 Ω,
CL = 35 pF
f = 20 Hz to 20 kHz,
see Figure 23
25°C
3.3 V
0.008%
SUPPLY
Positive
supply current
ICC
25°C
VCOM and VIN = VCC or GND,
VNC and VNO = Floating
Full
VCOM = VCC – 5.5 V,
VIN = VCC or GND,
VNC and VNO = Floating
0.1
3.6 V
Full
3.6 V
TA
VCC
1.2
1.3
3.4
μA
μA
6.7 Electrical Characteristics for 5-V Supply
VCC = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCC
V
ANALOG SWITCH
VCOM,
VNO, VNC
Analog signal
range
Ron
ON-state
resistance
VNC or VNO = VCC, 1.6 V,
VCC = –5.5 V,
ICOM = –100 mA
COM to NO or NC,
see Figure 13
ΔRon
ON-state
resistance match
between channels
VNC or VNO = 1.6 V,
ICOM = –100 mA
COM to NO or NC,
see Figure 13
Ron(flat)
ON-state
resistance
flatness
VNC or VNO = VCC, 1.6 V,
VCC = –5.5 V,
ICOM = –100 mA
COM to NO or NC,
see Figure 13
INC(OFF),
INO(OFF)
NC, NO
OFF leakage
current
VNC = 4.5 V, VCC – 5.5 V,
VCOM = VCC – 5.5 V, 4.5 V,
VNO = Open,
COM to NO
or
VNO = 4.5 V, VCC – 5.5 V,
VCOM = VCC – 5.5 V, 4.5 V,
VNC = Open,
COM to NC
See Figure 14
ICOM(ON)
COM
ON leakage
current
VNC and VNO = Floating,
VCOM = VCC, VCC – 5.5 V
See Figure 15
(1)
VCC – 5.5
25°C
Full
0.52
4.5 V
0.83
25°C
Full
0.04
4.5 V
0.076
4.5 V
25°C
Full
5.5 V
25°C
Full
5.5 V
Ω
0.23
0.30
25°C
Full
0.74
Ω
0.46
0.5
–50
50
–375
375
–50
50
–375
375
Ω
nA
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
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Electrical Characteristics for 5-V Supply (continued)
VCC = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted) (1)
PARAMETER
DIGITAL CONTROL INPUTS (IN)
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
UNIT
(2)
VIH
Input logic high
VIL
Input logic low
IIH, IIL
Input leakage
current
VIN = VCC or 0
tON
Turnon time
VCOM = VCC,
RL = 300 Ω
CL = 35 pF,
see Figure 17
tOFF
Turnoff time
VCOM = VCC,
RL = 300 Ω
CL = 35 pF,
see Figure 17
tBBM
Break-before-make
time
VNC = VNO = VCC/2
RL = 300 Ω
QC
Charge injection
CNC(OFF),
CNO(OFF)
2.4
Full
25°C
Full
5.5
0.8
5.5 V
–250
250
–250
250
V
nA
DYNAMIC
25°C
5V
Full
4.5 V to
5.5 V
25°C
5V
Full
4.5 V to
5.5 V
CL = 35 pF,
see Figure 18
25°C
5V
VGEN = 0,
RGEN = 0
CL = 1 nF,
see Figure 22
25°C
NC, NO
OFF capacitance
VNC or VNO = VCC or
VCC – 5.5 V
See Figure 16
CCOM(ON)
NC, NO, COM
ON capacitance
VCOM = VCC or GND,
CI
Digital input
capacitance
BW
Bandwidth
27
80
80
13
70
70
1
ns
ns
3.5
ns
5V
150
pC
25°C
5V
70
pF
See Figure 16
25°C
5V
370
pF
VI = VCC or GND
See Figure 16
25°C
5V
2.6
pF
RL = 50 Ω
See Figure 18
25°C
5V
18.3
MHz
25°C
5V
–70
dB
dB
OISO
OFF isolation
RL = 50 Ω
f = 100 kHz,
see Figure 20
XTALK
Crosstalk
RL = 50 Ω
f = 100 kHz,
see Figure 21
25°C
5V
–78
THD
Total harmonic
distortion
RL = 600 Ω,
CL = 35 pF
f = 20 Hz to 20 kHz,
see Figure 23
25°C
5V
0.009%
SUPPLY
ICC
(2)
8
Positive
supply current
VCOM and VIN = VCC or GND,
VNC and VNO = Floating
VCOM = VCC – 5.5 V,
VIN = VCC or GND,
VNC and VNO = Floating
25°C
0.2
Full
1.3
3.5
5.5 V
Full
μA
5
All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
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6.8 Typical Characteristics
0.8
1.2
0.6
VCC = 2.3 V
R on (Ÿ)
0.8
R on Ÿ)
TA = 85°C
T A = 25°C
TA =-40°C
0.7
1.0
0.6
VCC = 3.0 V
0.4
0.5
0.4
0.3
0.2
0.2
VCC = 4.5 V
0.1
0.0
±3
0.0
-4.0
-2.0
0.0
2.0
6.0
4.0
±2
±1
0
1
2
3
VCOM (V)
VCOM (V)
Figure 1. Ron vs VCOM
Figure 2. Ron vs VCOM (VCC = 2.7 V)
0.50
0.6
0.45
0.5
0.40
0.35
R on (Ω)
R on Ÿ)
0.4
0.3
T A = 85 qC
TA = 25 qC
TA = -40 qC
0.2
0.30
0.25
0.20
TA = 85°C
TA = 25°C
TA = -40°C
0.15
0.10
0.1
0.05
0.0
-3
-2
-1
0
1
2
3
0.00
-1
4
VCOM (V)
2
3
4
5
Figure 4. Ron vs VCOM (VCC = 5 V)
0
0
–2
-10
–4
-20
–6
-30
Attenuation (dB)
Magnitude (dB)
1
V COM (V)
Figure 3. Ron vs VCOM (VCC = 3.3 V)
–8
–10
–12
–14
-40
-50
-60
-70
-80
–16
-90
–18
0
1
Frequency (MHz)
1000
1
Frequency (MHz)
1000
Figure 6. Off Isolation vs Frequency
Figure 5. Insertion Loss
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500
0
400
-10
-20
300
VCC = 3.3 V
Attenuation (dB)
Charge Injection (pC)
Typical Characteristics (continued)
200
100
VCC = 5 V
0
VCC = 2.5 V
-30
-40
-50
-60
–100
-70
–200
-80
0
1.8
2.5
-90
5
3.3
1000
1
Frequency (MHz)
Voltage (V)
Figure 8. Crosstalk (VCC = 3.3 V)
Figure 7. Charge Injection (QC) vs VCOM
3.5E-08
0.0091
0.0081
3.0E-08
0.0071
2.5E-08
ICC (μA)
THD
0.0061
0.0051
0.0041
2.0E-08
1.5E-08
0.0031
1.0E-08
0.0021
5.0E-09
0.0011
0.0001
10
100
1000
10000
100000
0.0E+00
0.0
0.5
Frequency (Hz)
Figure 9. Total Harmonic Distortion vs Frequency
3.5
4.0
4.5
5.5
Figure 10. Power-Supply Current vs VCC
tOFF
tON
160
40
140
35
120
30
tON/tOFF (ns)
tON/tOFF (ns)
2.5 3.0
VCC (V)
45
180
100
80
60
tOFF
tON
25
20
15
40
10
20
5
1.0
2.0
3.0
4.0
5.0
6.0
0
–40
Supply Voltage (V)
Figure 11. tON And tOFF vs Supply Voltage
10
1.5
50
200
0
0.0
1.0
25
Temperature(°C)
85
Figure 12. tON And tOFF vs Temperature (2.5-V Supply)
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7 Parameter Measurement Information
VCC
R
-
Ω
IN
IN
++
Figure 13. ON-state resistance (Ron)
VCC
++
IN
Off-State leakage current
Channel Off
VIN = V IH or VIL
IN
+
Figure 14. OFF-state leakage current (ICOM(OFF), INO(OFF))
VCC
On-state leakage current
Channel On
VIN = VIH or VIL
IN
IN
++
Figure 15. ON-state leakage current
(ICOM(ON), INO(ON))
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Parameter Measurement Information (continued)
VCC
VNO
Capacitance
Meter
COM
NO
VBIAS = VCC or GND and
VIN = VIH or VIL
Capacitance is measured at NO,
COM, and IN inputs during ON
and OFF conditions.
COM
BIAS
IN
Figure 16. Capacitance
(CI, CCOM(OFF), CCOM(ON), CNO(OFF), CNO(ON))
VCC
IN
TEST
RL
CL
tON
300 Ω
35 pF
VCC
OFF
300 Ω
35 pF
VCC
VCOM
IN
Logic
Input
(VIN)
VCC
tON
tOFF
90%
Switch
Output
(VNO)
90%
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 17. Turnon (tON) and Turnoff time (tOFF)
12
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Parameter Measurement Information (continued)
VCC
VNC
or
VNO
VCC
VCC
NC or NO
RPU
IN
NC or NO
VOH
10%
10%
IN
VNC or VNO = GND
RL = 1 kΩ
RPU = 100 Ω
CL = 35 pF
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
Figure 18. Break-Before-Make Time (tBBM)
VCC
Channel ON:NO to COM
VIN = VIH or VIL
50 Ω
Network Analyzer Setup
Source power = 0 dBm
(632-mV P-P at 50-Ω load)
DC Bias=350 mV
IN
IN
50 Ω
+
Figure 19. Bandwidth (BW)
VCC
50 Ω
Channel OFF: NO to COM
VIN = VIH or VIL
50 Ω
NetworkAnalyzerSetup
Source power = 0 dBm
(632-mV P-P at 50-Ω load)
DC bias = 350 mV
IN
IN
+
Figure 20. OFF isolation (OISO)
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Parameter Measurement Information (continued)
VCC
VNC
50 Ω
Channel ON: NC to COM
Channel OFF: NO to COM
VIN = VIH or VIL
NCNO
VNO
NetworkAnalyzerSetup
50 Ω
50 Ω
Source power = 0 dBm
(632-mV P-P at 50-Ω load)
DC bias = 350 mV
IN
IN
+
Figure 21. Crosstalk (XTALK)
VCC
IN)
Δ
IN
VCC
IN
xΔ
VIN = VIH or VIL
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 22. Charge injection (QC)
Channel ON: COM to NO
VSOURCE = 0.5 V P-P
VIN = VIH or VIL
RL = 600 Ω
fSOURCE = 20 Hz to 20 kHz CL = 35 pF
VCC
Audio Analyzer
NO
600 Ω
COM
IN
IN
+
600 Ω
A.
CL includes probe and jig capacitance.
Figure 23. Total Harmonic Distortion (THD)
14
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8 Detailed Description
8.1 Overview
The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switches designed to
operate from 2.3 V to 5.5 V. The devices feature negative signal capability that allows signals below ground
to pass through the switch without distortion. The break-before-make feature prevents signal distortion during
the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel
ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio
applications
8.2 Functional Block Diagram
OUT+
Audio
Source 1
NC1
OUT–
COM1
NO1
IN1
8-Ω Speaker
TS5A22362
IN2
NC2
COM2
OUT+
Audio
Source 2
OUT–
Input Select
NO2
8.3 Feature Description
8.3.1 Negative Signaling Capacity
The TS5A22362 dual SPDT switches feature negative signal capability that allows signals below ground to pass
through without distortion. These analog switches operate from a single +2.3-V to +5.5-V supply. The input and
output signal swing of the device is dependant of the supply voltage VCC: the devices pass signals as high as
VCC and as low as VCC – 5.5 V, including signals below ground with minimal distortion.
Table 1 shows the input/output signal swing the user can get with different supply voltages.
Table 1. Input/Output signal swing
MINIMUM
(VNC, VNO, VCOM) = VCC – 5.5
MAXIMUM
(VNC, VNO, VCOM) = VCC
5.5 V
0V
5.5 V
4.5 V
–1.9 V
4.5 V
3.6 V
–2.5 V
3.6 V
3.0 V
–2.5 V
3.0 V
2.7 V
–2.8 V
2.7 V
2.3 V
–3.2 V
2.3 V
SUPPLY VOLTAGE, VCC
8.4 Device Functional Modes
The function table for TS5A22362 is shown in Table 2
Table 2. Function Table
IN
NC TO COM,
COM TO NC
NO TO COM,
COM TO NO
L
ON
OFF
H
OFF
ON
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Ensure that the device is powered up with a supply voltage on VCC before a voltage can be applied to the signal
paths NC and NO.
Tie the digitally controlled inputs select pins IN1 and IN2 to VCC or GND to avoid unwanted switch states that
could result if the logic control pins are left floating.
All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to
the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.
9.2 Typical Application
OUT+
Audio
Source 1
NC1
OUT–
COM1
NO1
IN1
Input Select
8-Ω Speaker
TS5A22362
NC2
COM2
OUT+
Audio
Source 2
OUT–
IN2
NO2
Figure 24. Typical Application
9.2.1 Design Requirements
Tie the digitally controlled inputs select pins IN1 and IN2 to VCC or GND to avoid unwanted switch states that
could result if the logic control pins are left floating.
9.2.2 Detailed Design Procedure
Select the appropriate supply voltage to cover the entire voltage swing of the signal passing through the
switch because the TS5A22362 operates from a single +2.3-V to +5.5-V supply and the input/output signal
swing of the device is dependant of the supply voltage VCC. The device will pass signals as high as VCC and
as low as VCC – 5.5 V. Use table 2 as a guide for selecting supply voltage based on the signal passing
through the switch.
Ensure that the device is powered up with a supply voltage on VCC before a voltage can be applied to the
signal paths NC and NO.
16
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Typical Application (continued)
9.2.3 Application Curve
1.2
1.0
VCC = 2.3 V
R on Ÿ)
0.8
0.6
VCC = 3.0 V
0.4
0.2
VCC = 4.5 V
0.0
-4.0
-2.0
0.0
2.0
4.0
6.0
VCOM (V)
Figure 25. Ron vs VCOM
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10 Power Supply Recommendations
The TS5A22362 operates from a single 2.3-V to 5.5-V supply. The device must be powered up with a supply
voltage on VCC before a voltage can be applied to the signal paths NC and NO. It is recommended to
include a 100-μs delay after VCC is at voltage before applying a signal on NC and NO paths
It is also good practice to place a 0.1-μF bypass capacitor on the supply pin VCC to GND to smooth out
lower frequency noise to provide better load regulation across the frequency spectrum.
11 Layout
11.1 Layout Guidelines
TI recommends placing a bypass capacitor as close to the supply pin VCC as possible to help smooth out
lower frequency noise to provide better load regulation across the frequency spectrum.
Minimize trace lengths and vias on the signal paths in order to preserve signal integrity.
11.2 Layout Example
LEGEND
VIA to Power Plane
Polygonal Copper Pour
VIA to GND
Bypass Capacitor
VCC
To System
1
VCC
2
NO1
NO2 10
To System
To System
COM2
9
NC2
8
IN2
7
GND
6
To System
To System
3 COM1
To System
To System
4
NC1
5
IN1
To System
Figure 26. Layout example of TS5A22362
18
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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15-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
HPA02208YZPR
ACTIVE
DSBGA
YZP
10
3000
TBD
Call TI
Call TI
-40 to 85
TS5A22362DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
39R
Samples
TS5A22362DGSRG4
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
39R
Samples
TS5A22362DRCR
ACTIVE
VSON
DRC
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ZVG
Samples
TS5A22362DRCT-NM
ACTIVE
VSON
DRC
10
250
RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 85
ZVGNM
Samples
TS5A22362YZPR
ACTIVE
DSBGA
YZP
10
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(39, 392)
Samples
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of