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TS5A3167
SCDS187C – FEBRUARY 2005 – REVISED AUGUST 2018
TS5A3167 0.9-Ω 1-channel 1:1 SPST Analog Switch
1 Features
3 Description
•
•
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The TS5A3167 is a bidirectional, single-channel,
single-pole double-throw (SPDT) analog switch that is
designed to operate from 1.65 V to 5.5 V. The
TS5A3167 device offers a low ON-state resistance.
The device has excellent total harmonic distortion
(THD) performance and consumes very low power.
These features make this device suitable for portable
audio applications.
1
•
Isolation in Powered-Off Mode, VCC = 0
Low ON-State Resistance (0.9 Ω)
Control Inputs Are 5.5-V Tolerant
Low Charge Injection
Low Total Harmonic Distortion (THD)
1.65-V to 5.5-V Single-Supply Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Device Information(1)
PART NUMBER
TS5A3167
BODY SIZE (NOM)
2.90 mm x 1.60 mm
SC70
2.00 mm x 1.25 mm
DSBGA
1.50 mm x 0.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
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PACKAGE
SOT-23
Cell Phones
PDAs
Portable Instrumentation
Audio and Video Signal Routing
Low-Voltage Data-Acquisition Systems
Communication Circuits
Modems
Hard Drives
Computer Peripherals
Wireless Terminals and Peripherals
Microphone Switching – Notebook Docking
SPACER
Simple Schematic
COM
VI/O
NC
VI/O
IN
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TS5A3167
SCDS187C – FEBRUARY 2005 – REVISED AUGUST 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
Absolute Maximum Ratings ..................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics for 5-V Supply .................. 5
Electrical Characteristics for 5-V Supply (continued) 6
Electrical Characteristics for 3.3-V Supply ............... 7
Electrical Characteristics for 3.3-V Supply
(continued) ................................................................. 8
6.9 Electrical Characteristics for 2.5-V Supply ............... 9
6.10 Electrical Characteristics for 2.5-V Supply
(continued) ............................................................... 10
6.11 Electrical Characteristics for 1.8-V Supply ........... 11
6.12 Electrical Characteristics for 1.8-V Supply
(continued) ............................................................... 12
6.13 Typical Performance ............................................. 13
7
8
Parameter Measurement Information ................ 15
Detailed Description ............................................ 18
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
18
18
18
18
Application and Implementation ........................ 19
9.1 Application Information............................................ 19
9.2 Typical Application ................................................. 19
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5
12.6
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
23
23
23
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (March 2017) to Revision C
Page
•
Changed the DSBGA Body Size From: 1.50 mm x 9.00 mm To: 1.50 mm x 0.90 mm in the Device Information table ....... 1
•
Changed the YZP package pinout view From: Top View To: Bottom View .......................................................................... 3
Changes from Revision A (October 2012) to Revision B
Page
•
Added the Device Information table, Pin Configuration and Functions, ESD Ratings, Recommended Operating
Conditions, Thermal Information, Detailed Description, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support................................. 1
•
Removed ORDERING INFORMATION table......................................................................................................................... 1
Changes from Original (February 2005) to Revision A
•
2
Page
Updated ORDERING INFORMATION table........................................................................................................................... 1
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SCDS187C – FEBRUARY 2005 – REVISED AUGUST 2018
5 Pin Configuration and Functions
DBV or DCK Package
5- Pin (SOT-23 or SC70)
Top View
NC
1
COM
2
GND
3
5
VCC
4
IN
Pin Functions
PIN NUMBER
NAME
1
NC
DESCRIPTION
2
COM
Common
3
GND
Ground
4
IN
5
VCC
Normally Closed
Digital control pin, COM connected to NC when logic low
Power Supply
YZP Package
5-Pin (DSBGA)
Bottom View
C
1
2
GND
IN
B
COM
A
NC
VCC
Pin Functions
PIN NUMBER
NAME
A1
NC
DESCRIPTION
B1
COM
Common
C1
GND
Ground
A2
VCC
Power Supply
C2
IN
Normally Closed
Digital control pin, COM connected to NC when logic low
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (3)
–0.5
6.5
V
VNC
VCOM
Analog voltage range (3) (4) (5)
–0.5
VCC +
0.5
V
IK
Analog port diode current
INC
ICOM
On-state switch current
VI
Digital input voltage range (3) (4)
IIK
Digital clamp current
ICC
Continuous current through VCC
IGND
Continuous current through GND
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
VNC, VCOM < 0
–50
VNC, VCOM = 0 to VCC
On-state peak switch current (6)
UNIT
VI < 0
mA
–200
200
–400
400
–0.5
6.5
mA
V
–50
mA
100
mA
–100
mA
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 5.5 V maximum.
Pulse at 1-ms duration < 10% duty cycle.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
1.65
5.5
V
VNC
VCOM
Analog voltage range
0
VCC
V
VI
Digital input voltage range
0
VCC
V
6.4 Thermal Information
TS5A3167
THERMAL METRIC
(1)
DBV (SOT-23) DCK (SOT-23) YZP (DSBGA)
UNIT
5 PINS
5 PINS
5 PINS
146.2
°C/W
RθJA
Junction-to-ambient thermal resistance
230.3
268.0
RθJC(top)
Junction-to-case (top) thermal resistance
111.9
171.8
1.4
°C/W
RθJB
Junction-to-board thermal resistance
69.5
64.5
39.3
°C/W
ψJT
Junction-to-top characterization parameter
33.0
40.5
0.7
°C/W
ψJB
Junction-to-board characterization parameter
69.0
62.9
39.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SCDS187C – FEBRUARY 2005 – REVISED AUGUST 2018
6.5 Electrical Characteristics for 5-V Supply (1)
VCC = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
TYP MAX
UNIT
Analog Switch
Peak ON resistance
rpeak
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
ON-state resistance
ron
VNC = 2.5 V,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
ON-state resistance
flatness
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
ron(flat)
INC(OFF)
NC
OFF leakage current
INC(PWROFF)
ICOM(OFF)
COM
OFF leakage current
ICOM(PWROFF)
NC
ON leakage current
COM
ON leakage current
VNC = 1 V, 1.5 V, 2.5 V,
ICOM = –100 mA,
VNC = 1 V,
VCOM = 4.5 V,
or
VNC = 4.5 V,
VCOM = 1 V,
Full
Full
25°C
Full
VCOM = 1 V,
VNC = 4.5 V,
or
VCOM = 4.5 V,
VNC = 1 V,
25°C
Full
Switch OFF,
See Figure 14
25°C
VCOM = 5.5 V to 0,
VNC = 0 to 5.5 V,
ICOM(ON)
VCOM = 1 V,
VNC = Open,
or
VCOM = 4.5 V,
VNC = Open,
Full
Full
Full
0.15
Full
Ω
0.25
Ω
0.25
0
5.5 V
0V
4
–150
–10
5.5 V
0V
0.2
–50
5.5 V
0.2
10
50
0.4
µA
nA
µA
5
50
0.4
nA
20
150
–50
–5
5.5 V
4
–50
–5
10
50
–150
–10
20
150
0
25°C
Switch ON,
See Figure 15
Ω
0.2
4.5 V
25°C
Switch ON,
See Figure 15
0.9
1
Full
25°C
INC(ON)
0.75
4.5 V
25°C
Switch OFF,
See Figure 14
1.1
1.2
25°C
Switch ON,
See Figure 13
VNC = 0 to 5.5 V,
VCOM = 5.5 V to 0,
VNC = 1 V,
VCOM = Open,
or
VNC = 4.5 V,
VCOM = Open,
0.8
4.5 V
nA
5
–20
20
nA
Digital Control Inputs (IN)
Input logic high
VIH
Full
2.4
5.5
V
Input logic low
VIL
Full
0
0.8
V
25°C
–2
Input leakage
current
(1)
IIH, IIL
VI = 5.5 V or 0
Full
5.5 V
0.3
–20
2
20
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.6 Electrical Characteristics for 5-V Supply (1) (continued)
VCC = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
25°C
5V
1
Full
4.5 V to
5.5 V
1
TYP MAX
UNIT
Dynamic
Turn-on time
tON
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Turn-off time
tOFF
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Charge injection
QC
VGEN = 0,
RGEN = 0 ,
NC
OFF capacitance
CNC(OFF)
COM
OFF capacitance
CCOM(OFF)
NC
ON capacitance
CNC(ON)
COM
ON capacitance
CCOM(ON)
Digital input
capacitance
CI
4.5
7.5
9
8
ns
25°C
5V
4.5
Full
4.5 V to
5.5 V
11
3.5
CL = 1 nF,
See Figure 20
25°C
5V
6
pC
VNC = VCC or GND,
Switch OFF,
See Figure 16
25°C
5V
19
pF
VCOM = VCC or GND,
Switch OFF,
See Figure 16
25°C
5V
18
pF
VNC = VCC or GND,
Switch ON,
See Figure 16
25°C
5V
35.5
pF
VCOM = VCC or GND,
Switch ON,
See Figure 16
25°C
5V
35.5
pF
VI = VCC or GND,
See Figure 16
25°C
5V
2
pF
13
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 18
25°C
5V
150
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 1 MHz,
Switch OFF,
See Figure 19
25°C
5V
–62
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 21
25°C
5V
0.005%
VI = VCC or GND,
Switch ON or OFF
Supply
Positive supply
current
(1)
6
ICC
25°C
Full
5.5 V
0.01
0.1
1
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.7 Electrical Characteristics for 3.3-V Supply (1)
VCC = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
TYP MAX
UNIT
Analog Switch
Peak ON resistance
rpeak
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
ON-state resistance
ron
VNC = 2 V,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
ON-state resistance
flatness
ron(flat)
INC(OFF)
NC
OFF leakage current
INC(PWROFF)
ICOM(OFF)
COM
OFF leakage current
ICOM(PWROFF)
NC
ON leakage current
COM
ON leakage current
INC(ON)
ICOM(ON)
VNC = 2 V, 0.8 V,
ICOM = –100 mA,
VNC = 1 V,
VCOM = 3 V,
or
VNC = 3 V,
VCOM = 1 V,
Full
Full
25°C
Full
VNC = 0 to 3.6 V,
VCOM = 3.6 V to 0,
25°C
VCOM = 1 V,
VNC = 3 V,
or
VCOM = 3 V,
VNC = 1 V,
25°C
Full
Switch OFF,
See Figure 14
Full
25°C
VCOM = 3.6 V to 0,
VNC = 0 to 3.6 V,
Full
Full
0.15
Full
Ω
0.25
Ω
0.25
–5
3.6 V
0V
3.6 V
0V
–5
5
25
0.5
0.1
5
25
0.3
–20
µA
nA
µA
2
20
0.3
nA
5
50
–25
–2
3.6 V
0.1
–50
–5
5
50
–25
–2
3.6 V
0.5
–50
–5
25°C
Switch ON,
See Figure 15
Ω
0.3
3V
25°C
Switch ON,
See Figure 15
1.5
1.7
Full
Switch OFF,
See Figure 14
VCOM = 1 V,
VNC = Open,
or
VCOM = 3 V,
VNC = Open,
1.1
25°C
Switch ON,
See Figure 13
1.6
1.8
3V
25°C
VNC = 1 V,
VCOM = Open,
or
VNC = 3 V,
VCOM = Open,
1.3
3V
nA
2
–20
20
nA
Digital Control Inputs (IN)
Input logic high
VIH
Full
2
5.5
V
Input logic low
VIL
Full
0
0.8
V
25°C
–2
Input leakage current
(1)
IIH, IIL
VI = 5.5 V or 0
Full
3.6 V
0.3
–20
2
20
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.8 Electrical Characteristics for 3.3-V Supply (1) (continued)
VCC = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
25°C
3.3 V
1.5
Full
3 V to
3.6 V
1.0
25°C
3.3 V
4.5
Full
3 V to
3.6 V
3
TYP MAX
UNIT
Dynamic
5
9.5
Turn-on time
tON
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Turn-off time
tOFF
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Charge injection
QC
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 20
25°C
3.3 V
6
pC
NC
OFF capacitance
CNC(OFF)
VNC = VCC or GND,
Switch OFF,
See Figure 16
25°C
3.3 V
19.5
pF
Switch OFF,
See Figure 16
25°C
3.3 V
18.5
pF
VNC = VCC or GND,
Switch ON,
See Figure 16
25°C
3.3 V
36
pF
VCOM = VCC or GND,
Switch ON,
See Figure 16
25°C
3.3 V
36
pF
VI = VCC or GND,
See Figure 16
25°C
3.3 V
2
pF
COM
OFF capacitance
CCOM(OFF) VCOM = VCC or GND,
NC
ON capacitance
CNC(ON)
COM
ON capacitance
CCOM(ON)
Digital input
capacitance
CI
10
8.5
ns
11
12.5
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 18
25°C
3.3 V
150
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 1 MHz,
Switch OFF,
See Figure 19
25°C
3.3 V
–62
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 21
25°C
3.3 V
0.01%
VI = VCC or GND,
Switch ON or OFF
Supply
Positive supply
current
(1)
8
ICC
25°C
Full
3.6 V
0.001
0.05
0.3
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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SCDS187C – FEBRUARY 2005 – REVISED AUGUST 2018
6.9 Electrical Characteristics for 2.5-V Supply (1)
VCC = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
TYP MAX
UNIT
Analog Switch
Peak ON resistance
rpeak
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
ON-state resistance
ron
VNC = 2 V,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
ON-state resistance
flatness
ron(flat)
INC(OFF)
NC
OFF leakage current
INC(PWROFF)
ICOM(OFF)
COM
OFF leakage current
ICOM(PWROFF)
NC
ON leakage current
COM
ON leakage current
INC(ON)
ICOM(ON)
VNC = 2 V, 0.8 V,
ICOM = –100 mA,
VNC = 1 V,
VCOM = 3 V,
or
VNC = 3 V,
VCOM = 1 V,
Full
Full
25°C
Full
VNC = 0 to 3.6 V,
VCOM = 3.6 V to 0,
25°C
VCOM = 1 V,
VNC = 3 V,
or
VCOM = 3 V,
VNC = 1 V,
25°C
Full
Switch OFF,
See Figure 14
Full
25°C
VCOM = 3.6 V to 0,
VNC = 0 to 3.6 V,
Full
Full
0.4
Full
Ω
0.6
Ω
0.6
–5
2.7 V
0V
2.7 V
0V
–2
2
15
0.3
0.05
2
15
0.3
–20
µA
nA
µA
2
20
0.3
nA
5
50
–15
–2
2.7 V
0.05
–50
–2
5
50
–15
–2
2.7 V
0.3
–50
–5
25°C
Switch ON,
See Figure 15
Ω
0.7
2.3 V
25°C
Switch ON,
See Figure 15
2.1
2.4
Full
Switch OFF,
See Figure 14
VCOM = 1 V,
VNC = Open,
or
VCOM = 3 V,
VNC = Open,
1.2
25°C
Switch ON,
See Figure 13
2.4
2.6
2.3 V
25°C
VNC = 1 V,
VCOM = Open,
or
VNC = 3 V,
VCOM = Open,
1.8
2.3 V
nA
2
–20
20
nA
Digital Control Inputs (IN)
Input logic high
VIH
Full
1.8
5.5
V
Input logic low
VIL
Full
0
0.6
V
25°C
–2
Input leakage current
(1)
IIH, IIL
VI = 5.5 V or 0
Full
2.7 V
0.3
–20
2
20
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.10
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Electrical Characteristics for 2.5-V Supply (1) (continued)
VCC = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
25°C
2.5 V
2
Full
2.3 V to
2.7 V
1
TYP MAX
UNIT
Dynamic
Turn-on time
tON
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Turn-off time
tOFF
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Charge injection
QC
VGEN = 0,
RGEN = 0,
NC
OFF capacitance
CNC(OFF)
VNC = VCC or GND,
COM
OFF capacitance
CNC(ON)
COM
ON capacitance
CCOM(ON)
Digital input
capacitance
CI
10
12
4.5
8
ns
25°C
2.5 V
Full
2.3 V to
2.7 V
CL = 1 nF,
See Figure 20
25°C
2.5 V
4
pC
Switch OFF,
See Figure 16
25°C
2.5 V
19.5
pF
Switch OFF,
See Figure 16
25°C
2.5 V
18.5
pF
VNC = VCC or GND,
Switch ON,
See Figure 16
25°C
2.5 V
36.5
pF
VCOM = VCC or GND,
Switch ON,
See Figure 16
25°C
2.5 V
36.5
pF
VI = VCC or GND,
See Figure 16
25°C
2.5 V
2
pF
CCOM(OFF) VCOM = VCC or GND,
NC
ON capacitance
6
3
10.5
15
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 18
25°C
2.5 V
150
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 1 MHz,
Switch OFF,
See Figure 19
25°C
2.5 V
–62
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 21
25°C
2.5 V
0.02%
VI = VCC or GND,
Switch ON or OFF
Supply
Positive supply
current
(1)
10
ICC
25°C
Full
2.7 V
0.001
0.02
0.25
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.11 Electrical Characteristics for 1.8-V Supply (1)
VCC = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
TYP MAX
UNIT
Analog Switch
Peak ON resistance
rpeak
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
ON-state resistance
ron
VNC = 2 V,
ICOM = –100 mA,
Switch ON,
See Figure 13
25°C
0 ≤ VNC ≤ VCC,
ICOM = –100 mA,
ON-state resistance
flatness
ron(flat)
INC(OFF)
NC
OFF leakage current
INC(PWROFF)
ICOM(OFF)
COM
OFF leakage current
ICOM(PWROFF)
NC
ON leakage current
COM
ON leakage current
INC(ON)
ICOM(ON)
VNC = 2 V, 0.8 V,
ICOM = –100 mA,
VNC = 1 V,
VCOM = 3 V,
or
VNC = 3 V,
VCOM = 1 V,
Full
Full
25°C
Full
VNC = 0 to 3.6 V,
VCOM = 3.6 V to 0,
25°C
VCOM = 1 V,
VNC = 3 V,
or
VCOM = 3 V,
VNC = 1 V,
25°C
Full
Switch OFF,
See Figure 14
Full
25°C
VCOM = 0 to 3.6 V,
VNC = 3.6 V to 0,
Full
Full
Full
Ω
4.1
22
Ω
27
1.95 V
0V
1.95 V
0V
1.95 V
25°C
Switch ON,
See Figure 15
Ω
2.8
1.65 V
25°C
Switch ON,
See Figure 15
3.9
4.0
Full
Switch OFF,
See Figure 14
VCOM = 1 V,
VNC = Open,
or
VCOM = 3 V,
VNC = Open,
1.6
25°C
Switch ON,
See Figure 13
25
30
1.65 V
25°C
VNC = 1 V,
VCOM = Open,
or
VNC = 3 V,
VCOM = Open,
4.2
1.65 V
1.95 V
–5
5
–50
50
–2
2
–10
10
–5
5
–50
50
–2
2
–10
10
–2
2
–20
20
–2
2
–20
20
nA
µA
nA
µA
nA
nA
Digital Control Inputs (IN)
Input logic high
VIH
Full
1.5
5.5
V
Input logic low
VIL
Full
0
0.6
V
25°C
–2
Input leakage current
(1)
IIH, IIL
VI = 5.5 V or 0
Full
1.95 V
0.3
–20
2
20
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.12 Electrical Characteristics for 1.8-V Supply (1) (continued)
VCC = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
VCC
MIN
25°C
1.8 V
3
Full
1.65 V to
1.95 V
1
25°C
1.8 V
5
Full
1.65 V to
1.95 V
4
TYP MAX
UNIT
Dynamic
9
18
Turn-on time
tON
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Turn-off time
tOFF
VCOM = VCC,
RL = 50 Ω,
CL = 35 pF,
See Figure 17
Charge injection
QC
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 20
25°C
1.8 V
2
pC
NC
OFF capacitance
CNC(OFF)
VNC = VCC or GND,
Switch OFF,
See Figure 16
25°C
1.8 V
19.5
pF
COM
OFF capacitance
CCOM(OFF)
VCOM = VCC or GND,
Switch OFF,
See Figure 16
25°C
1.8 V
18.5
pF
NC
ON capacitance
CNC(ON)
VNC = VCC or GND,
Switch ON,
See Figure 16
25°C
1.8 V
36.5
pF
COM
ON capacitance
CCOM(ON)
VCOM = VCC or GND,
Switch ON,
See Figure 16
25°C
1.8 V
36.5
pF
VI = VCC or GND,
See Figure 16
25°C
1.8 V
2
pF
Digital input
capacitance
CI
20
10
ns
15.5
18.5
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON,
See Figure 18
25°C
1.8 V
150
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 1 MHz,
Switch OFF,
See Figure 19
25°C
1.8 V
–62
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz
See Figure 21
25°C
1.8 V
0.055%
VI = VCC or GND,
Switch ON or OFF
Supply
Positive supply
current
(1)
12
ICC
25°C
Full
1.95 V
0.001
0.01
0.15
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
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6.13 Typical Performance
3.5
1.4
3.0
1.2
TA = 85_C
1.0
VCC = 1.8 V
ron (Ω)
r on (V)
2.5
2.0
1.5
0.8
TA = −40_C
0.6
VCC = 2.5 V
1.0
VCC = 3.3 V
0.5
VCC = 5 V
0.0
0
TA = 25_C
0.4
0.2
0.0
0.5
1
1.5 2
2.5
3
3.5
4
4.5
0
5
0.5
VCOM (V)
1.5
VCOM (V)
2
2.5
3
Figure 2. ron vs VCOM (VCC = 3 V)
Figure 1. ron vs VCOM
14
1.0
0.9
TA = 85_C
12
Leakage Current (nA)
TA = 25_C
0.8
0.7
ron (Ω)
1
0.6
0.5
0.4
TA = −40_C
0.3
0.2
0.1
INO/NC(OFF)
10
8
ICOM(OFF)
6
INO/NC(ON)
4
ICOM(ON)
2
0
−60
0.0
0
0.5
1
1.5
2 2.5
3
VCOM (V)
3.5
4
4.5
−40
−20
0
5
20
40
60
80
100
TA (°C)
Figure 4. Leakage Current vs Temperature (VCC = 5.5 V)
Figure 3. ron vs VCOM (VCC = 5 V)
1.5
14
V CC = 3.3 V
1
12
tOFF
10
V CC = 5 V
0
−0.5
tON/tOFF (ns)
QC (pC)
0.5
−1
tON
8
6
4
2
−1.5
0
0.5
1
1.5
2 2.5 3
3.5
Bias V oltage (V)
4
4.5
5
0
0
Figure 5. Charge Injection (QC) vs VCOM
1
2
3
V+ (V)
4
5
Figure 6. tON and tOFF vs Supply Voltage
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Typical Performance (continued)
3.0
12
10
2.5
8
Logic Threshold (V)
tON/tOFF (ns)
tOFF
6
tON
4
2
2.0
VIH
1.5
VIL
1.0
0.5
0
−60
−40
−20
0
20
40
60
80
100
0.0
0
TA (°C)
1
4
5
6
Figure 8. Logic Threshold vs VCC
0
0
−1
−10
−2
−20
Attenuation (dB)
Gain (dB)
3
VCC (V)
Figure 7. tON and tOFF vs Temperature (VCC = 5 V)
−3
−4
−5
−6
−30
−40
−50
−60
−70
−7
−80
−8
0.1
1
10
100
−90
0.1
1000
Frequency (MHz)
1
10
Frequency (MHz)
100
1000
Figure 10. OFF Isolation vs Frequency (VCC = 5 V)
Figure 9. Gain vs Frequency (VCC = 5 V)
60
0.009
VCC = 3.3 V
0.008
50
0.007
0.006
40
0.005
VCC = 5 V
0.004
0.003
I+ (nA)
THD (%)
2
30
20
0.002
10
0.001
0.000
0
10
14
100
1000
10000
100000
Frequency (Hz)
Figure 11. Total Harmonic Distortion vs Frequency
(VCC = 5 V)
0
−60
−40
−20
0
20
40
60
80
100
TA (°C)
Figure 12. Power-Supply Current vs Temperature
(VCC = 5 V)
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7 Parameter Measurement Information
VCC
VNC NC
COM
+
VCOM
Channel ON
r on
VI
ICOM
IN
VCOM - VNC
ICOM
VI = VIH or V IL
+
GND
Figure 13. ON-State Resistance (ron)
Vcc
VNC NC
COM
+
VCOM
+
VI
OFF-State Leakage Current
Channel OFF
VI = VIH
IN
+
GND
Figure 14. OFF-State Leakage Current (ICOM(OFF), INC(OFF), ICOM(PWROFF), INC(PWROFF))
Vcc
VNC NC
COM
+
VI
VCOM
ON-State Leakage Current
Channel ON
VI = VIH or V IL
IN
+
GND
Figure 15. ON-State Leakage Current (ICOM(ON), INC(ON))
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Parameter Measurement Information (continued)
Vcc
VNC
NC
Capacitance
Meter
VBIAS = Vcc or GND
VI = VIH or V IL
VCOM COM
VBIAS
Capacitance is measured at NC,
COM, and IN inputs during ON
and OFF conditions.
IN
VI
GND
Figure 16. Capacitance (CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON))
Vcc
VNC
NC
VCOM
VI
TEST
RL
CL
VCOM
t ON
50 Ω
35 pF
Vcc
t OFF
50 Ω
35 pF
Vcc
COM
CL(2)
RL
IN
Logic
Input (1)
Vcc
Logic
Input
(VI)
GND
50%
50%
0
t ON
Switch
Output
(VNC)
t OFF
90%
90%
(1)
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
(2)
CL includes probe and jig capacitance.
Figure 17. Turn-On (tON) and Turn-Off Time (tOFF)
Vcc
Network Analyzer
50 Ω
VNC
NC
Channel ON: NC to COM
COM
VCOM
Source
Signal
VI = Vcc or GND
Network Analyzer Setup
50 Ω
VI
+
IN
Source Power = 0 dBm
(632-mV P-P at 50-Ω load)
GND
DC Bias = 350 mV
Figure 18. Bandwidth (BW)
16
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Parameter Measurement Information (continued)
VCC
Network Analyzer
Channel OFF: NC to COM
50 Ω
VNC
NC
VI = VCC or GND
VCOM
COM
Source
Signal
50 Ω
Network Analyzer Setup
VI
50 Ω
Source Power = 0 dBm
(632-mV P-P at 50-Ω load)
IN
+
GND
DC Bias = 350 mV
Figure 19. OFF Isolation (OISO)
VCC
RGEN
Logic
Input
(VI)
VIH
OFF
ON
OFF V
IL
NC
COM
+
VCOM
VCOM
ΔVCOM
VGEN
CL(1)
VI
VGEN = 0 to VCC
IN
Logic
Input (2)
RGEN = 0
CL = 1 nF
QC = CL × DVCOM
VI = VIH or V IL
GND
(1)
CL includes probe and jig capacitance.
(2)
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
Figure 20. Charge Injection (QC)
Channel ON: COM to NO
VSOURCE = VCC P-P
VI = VIH or V IL
RL = 600 Ω
f SOURCE = 20 Hz to 20 kHz
CL = 50 pF
VCC /2
Audio Analyzer
NO
Source
Signal
COM
CL(1)
600 Ω
VI
IN
GND
600 Ω
VCC /2
(1)
CL includes probe and jig capacitance.
Figure 21. Total Harmonic Distortion (THD)
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8 Detailed Description
8.1 Overview
The TS5A3167 is a bidirectional, single-channel, single-pole single-throw (SPST) analog switch that is designed
to operate from 1.65 V to 5.5 V. This device provides a signal switching solution while maintaining excellent
signal integrity, which makes the TS5A3367 suitable for a wide range of applications in various markets including
personal electronics, portable instrumentation, and test and measurement equipment. The device maintains the
signal integrity by its low ON-state resistance, excellent ON-state resistance matching, and total harmonic
distortion (THD) performance. The device consumes very low power and provides isolation when VCC = 0.
8.2 Functional Block Diagram
SPST
NC
COM
Logic
Control
IN
8.3 Feature Description
8.3.1 Isolation in Powered-Off Mode, VCC = 0
When power is not supplied to the VCC pin, VCC = 0 , the signal paths NC and COM are high impedance. This is
specificed in the electrical characterisitics table under the COM and NC OFF leakage current when VCC = 0.
Because the device is high impedance when it is not powered, you may connect other signals to the signal chain
without interference of the TS5A3167.
8.4 Device Functional Modes
Placing a logic low signal on the IN pin of the device will turn on the switch and provide a low impedance path
from NC to COM.
Table 1. Function Table
18
IN
NC TO COM,
COM TO NC
L
ON
H
OFF
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TS5A3167 switch is bidirectional, so the NC and COM pins can be used as either inputs or outputs. This
switch is typically used when there is one signal path that needs to be isolated at certian times.
9.2 Typical Application
3.3 V
0.1 µF
0.1 µF
VCC
TASA3167
NC
System
Controller
Device 1
IN1
Switch
Control
Logic
Signal
Path
COM
GND
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Figure 22. Typical Application
9.2.1 Design Requirements
The TS5A3167 device can be properly operated without any external components.
Unused pin may be left floating or connected to ground.
TI recommends pulling up the digital control pin (IN) to VCC or pulling down to GND to avoid undesired switch
positions that could result from the floating pin. A floating digital pin could cause excess current consumption
refer to Implications of Slow or Floating CMOS Inputs.
9.2.2 Detailed Design Procedure
Select the appropriate supply voltage to cover the entire voltage swing of the signal passing through the switch
because the TS5A3167 input and output signal swing through NC and COM are dependent on the supply
voltage VCC. For example, if the desired signal level to pass through the switch is 5 V, VCC must be greater than
or equal to 5 V. VCC = 3.3 V would not be valid for passing a 5-V signal since the analog signal voltage cannot
exceed the supply.
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Typical Application (continued)
9.2.3 Application Curves
3.5
3.0
r on (V)
2.5
VCC = 1.8 V
2.0
1.5
VCC = 2.5 V
1.0
VCC = 3.3 V
0.5
VCC = 5 V
0.0
0
0.5
1
1.5 2
2.5
3
3.5
4
4.5
5
VCOM (V)
Figure 23. ron vs VCOM
10 Power Supply Recommendations
TI recommends proper power-supply sequencing for all CMOS devices. Do not exceed the absolute maximum
ratings, because stresses beyond the listed ratings can cause permanent damage to the device. It is
recommended that VCC is powered on first, followed by NC or COM but not required because of the Isolation in
Powered-Off Mode, VCC = 0 feature.
Although it is not required, power-supply bypassing improves noise margin and prevents switching noise
propagation from the VCC supply to other components. A 0.1-μF capacitor, connected from VCC to GND, is
adequate for most applications.
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11 Layout
11.1 Layout Guidelines
TI recommends following common printed-circuit board layout guidelines to ensure reliability of the device.
• Bypass capacitors should be used on power supplies.
• Short trace lengths should be used to avoid excessive loading.
11.2 Layout Example
VCC
= VIA to GND Plane
0603 Cap
To Device 1
VCC
NC
To System
COM
To System Controller
GND
IN
Figure 24. Example Layout
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12 Device and Documentation Support
12.1 Documentation Support
Table 2. Parameter Description
SYMBOL
DESCRIPTION
VCOM
Voltage at COM.
VNC
Voltage at NC.
ron
Resistance between COM and NC ports when the channel is ON.
rpeak
Peak on-state resistance over a specified voltage range.
ron(flat)
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions.
INC(OFF)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state under
worst-case input and output conditions.
INC(PWROFF)
Leakage current measured at the NC port during the power-down condition, VCC = 0.
ICOM(OFF)
Leakage current measured at the COM port, with the corresponding channel (COM to NC) in the OFF state under
worst-case input and output conditions.
ICOM(PWROFF)
Leakage current measured at the COM port during the power-down condition, VCC = 0.
INC(ON)
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state.
and the output (COM) open
ICOM(ON)
Leakage current measured at the COM port, with the corresponding channel (COM to NC) in the ON state.
and the output (NC) open.
VIH
Minimum input voltage for logic high for the control input (IN).
VIL
Maximum input voltage for logic low for the control input (IN).
VI
Voltage at the control input (IN).
IIH, IIL
Leakage current measured at the control input (IN).
tON
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog output (COM or NC) signal when the switch is turning ON.
tOFF
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog output (COM or NC) signal when the switch is turning OFF.
QC
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or COM)
output. This is measured in coulombs (C) and measured by the total charge induced due to switching of the control input.
Charge injection, QC = CL × ΔVCOM, CL is the load capacitance, and ΔVCOM is the change in analog output voltage.
CNC(OFF)
Capacitance at the NC port when the corresponding channel (NC to COM) is OFF.
CCOM(OFF)
Capacitance at the COM port when the corresponding channel (COM to NC) is OFF.
CNC(ON)
Capacitance at the NC port when the corresponding channel (NC to COM) is ON.
CCOM(ON)
Capacitance at the COM port when the corresponding channel (COM to NC) is ON.
CI
Capacitance of control input (IN).
OISO
OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific
frequency, with the corresponding channel (NC to COM) in the OFF state.
BW
Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain.
THD
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root
mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental
harmonic.
ICC
Static power-supply current with the control (IN) pin at VCC or GND.
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
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TS5A3167
www.ti.com
SCDS187C – FEBRUARY 2005 – REVISED AUGUST 2018
Community Resources (continued)
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Copyright © 2005–2018, Texas Instruments Incorporated
Product Folder Links: TS5A3167
23
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TS5A3167DBVR
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
(JATF, JATR)
(JATH, JATP)
TS5A3167DBVRE4
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
JATF
TS5A3167DBVRG4
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
JATF
TS5A3167DCKR
ACTIVE
SC70
DCK
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
(JG5, JGF, JGR)
(JGH, JGP, JGS)
TS5A3167DCKRG4
ACTIVE
SC70
DCK
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
(JG5, JGF, JGR)
(JGH, JGP, JGS)
TS5A3167YZPR
ACTIVE
DSBGA
YZP
5
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
JGN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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