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TSB12LV26IPZT

TSB12LV26IPZT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    100-TQFP

  • 描述:

    IC IEEE 1394 HOST CNTRLR 100TQFP

  • 数据手册
  • 价格&库存
TSB12LV26IPZT 数据手册
TSB12LV26 TSB12LV26I www.ti.com SLLA214 – JUNE 2006 OHCI-Lynx™ PCI-Based IEEE 1394 Host Controller FEATURES • • • • • • • 3.3-V and 5-V PCI bus signaling 3.3-V supply (core voltage is internally regulated to 1.8 V) Serial bus data rates of 100M bits/s, 200M bits/s, and 400M bits/s Physical write posting of up to three outstanding transactions Serial ROM interface supports 2-wire devices • • • • External cycle timer control for customized synchronization PCI burst transfers and deep FIFOs to tolerate large host latency Two general-purpose I/Os Fabricated in advanced low-power CMOS process Packaged in 100-terminal LQFP (PZT) PCI_CLKRUN protocol DESCRIPTION The Texas Instruments TSB12LV26 device is a PCI-to-1394 host controller compliant with the PCI Local Bus Specification, PCI Bus Power Management Interface Specification, IEEE Std 1394-1995, and 1394 Open Host Controller Interface Specification. The chip provides the IEEE 1394 link function and is compatible with 100M bits/s, 200M bits/s, and 400M bits/s serial bus data rates. As required by the 1394 Open Host Controller Interface Specification (OHCI) and IEEE Std 1394a-2000, internal control registers are memory-mapped and nonprefetchable. The PCI configuration header is accessed through configuration cycles specified by PCI and provides plug-and-play (PnP) compatibility. Furthermore, the TSB12LV26 device is compliant with the PCI Bus Power Management Interface Specification, per the PC 99 Design Guide requirements. TSB12LV26 device supports the D0, D2, and D3 power states. The TSB12LV26 design provides PCI bus master bursting and is capable of transferring a cacheline of data at 132M bytes/s after connection to the memory controller. Since PCI latency can be large, deep FIFOs are provided to buffer 1394 data. The TSB12LV26 device provides physical write posting buffers and a highly-tuned physical data path for SBP-2 performance. The TSB12LV26 device also provides multiple isochronous contexts, multiple cacheline burst transfers, advanced internal arbitration, and bus-holding buffers on the PHY/link interface. An advanced CMOS process achieves low power consumption and allows the TSB12LV26 device to operate at PCI clock rates up to 33 MHz. NOTE: This product is for high-volume PC applications only. For a complete datasheet or more information contact support@ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. OHCI-Lynx is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TSB12LV26PZT ACTIVE TQFP PZT 100 90 RoHS & Green NIPDAU Level-4-260C-72 HR 0 to 70 TSB12LV26 F731652A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
TSB12LV26IPZT 价格&库存

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