TSB43AA82A
TSB43AA82AI
www.ti.com
SLLA205 – MAY 2006
(iSphynx II) 1394 Integrated PHY and Link-Layer Controller
for SBP-2 Products and DPP Products
FEATURES
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IEEE 1394a-2000 Compliant
Single 3.3-V Supply
Internal 1.8-V Circuit to Reduce Power
Consumption
Integrated 400-Mbps Two-Port Physical Layer
(PHY)
Internal Voltage Regulator
IEEE 1394 Related Functions:
– Automated Read Response for ConfigROM
Register Access
– Automated Single Retry Protocol and Split
Transaction Control
SBP-2 Related Functions:
– Supports Four Initiators by Automated
Transactions and More Can Be Supported
Through Firmware.
– Automated Management ORB Fetching
– Automated Linked Command ORB Fetching
– Automated PageTable Fetching
– Automated Status Block Transmit
Ability to Support Direct Print Protocol (DPP)
Mode
•
Data Transfers:
– Auto Address Increment of Direct/Indirect
Addressing on Data Transfer (Packetizer)
– Automated Header Insert/Strip for DMA
Data Transfers
– 8-/16-Bit Asynchronous and Synchronous
DMA I/F With Handshake and Burst Mode
– Supports ATAPI (Ultra-DMA) Mode and
SCSI Mode
– 8-/16-Bit Data/Address Multiplex
Microcontroller and 8-/16-Bit Separated
Data/Address Bus
– Three FIFO Configurations That Support
High Performance for the DMA and for
Command Exchanges
• Asynchronous Command FIFO: 1512
Bytes
• Config ROM/LOG FIFO: 504 Bytes
• DMA FIFO: 4728 Bytes
DESCRIPTION
The TSB43AA82A is a high performance 1394 integrated PHY and link layer controller. It is compliant with the
IEEE 1394-1995 and IEEE 1394a-2000 specifications and supports asynchronous transfers.
TSB43AA82A has a generic 16-/8-bit host bus interface. It supports parallel or multiplexed connections to the
microcontroller (MCU) at rates up to 40 MHz.
The TSB43AA82A offers large data transfers with three mutually independent FIFOs: 1) the asynchronous
command FIFO with 1512 Bytes, 2) the DMA FIFO with 4728 bytes and 3) the Config ROM/LOG FIFO with 504
bytes.
The features of the TSB43AA82A support the serial bus protocol 2 (SBP-2). It handles up to four initiators with
the SBP-2 transaction/timer manager. This SBP-2 transaction engine supports fully automated operation request
block (ORB) fetches and fully automated memory page table fetches for both read and write transactions.
Automated responses to other node requests are provided; this includes responding to another node’s read
request to the Config ROM and issuing ack_busy_X for a single retry. Various control registers enable the user
to program IEEE 1394 asynchronous transaction settings. The user can program the number of retries and the
split transaction time-out value by setting the time limit register in the CFR.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TSB43AA82A
TSB43AA82AI
www.ti.com
SLLA205 – MAY 2006
The TSB43AA82A also supports the direct print protocol (DPP). The asynchronous receive FIFO (ARF) in the
TSB43AA82A is large enough to satisfy the connection register area, the DRF receiving FIFO can be used as
the segment data unit (SDU) register to fulfill the large data transfer.
This document is not intended to serve as a tutorial on IEEE 1394; users are referred to IEEE Std 1394-1995
and IEEE 1394a-2000 . (1)
NOTE:
This product is for high-volume CE applications only. For a complete datasheet or
more information contact support@ti.com.
(1)
2
IEEE Std 1394-1995, IEEE Standard for a High Performance Serial Bus IEEE Std 1394a–2000, IEEE Standard for a High Performance
Serial Bus – Amendment 1
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
13-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
TSB43AA82APGE
ACTIVE
LQFP
PGE
144
60
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
TSB43AA82A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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