User's Guide
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
This user's guide describes the characteristics, operation, and use of the
TSC2003EVM, both by itself and as part of the TSC2003EVM-PDK. This evaluation
module (EVM) is a 4-wire touch screen controller EVM which also has auxiliary inputs
and battery and temperature measurement capabilities. A complete circuit description,
schematic diagram and bill of materials are included.
The following related documents are available through the Texas Instruments web site
at www.ti.com.
Table 1. EVM-Compatible Device Data Sheets
1
2
3
4
5
6
7
8
9
DEVICE
LITERATURE NUMBER
TSC2003
SBAS162
TAS1020B
SLES025
REG1117-5
SBVS001
TPS767D318
SLVS209
SN74LVC125A
SCAS290
SN74LVC1G125
SCES223
SN74LVC1G07
SCES296
Contents
EVM Overview ............................................................................................................... 2
Analog Interface.............................................................................................................. 2
Digital Interface .............................................................................................................. 3
Power Supplies .............................................................................................................. 3
EVM Operation ............................................................................................................... 4
Kit Operation ................................................................................................................. 5
EVM Bill of Materials ....................................................................................................... 10
TSC2003EVM Schematic ................................................................................................. 12
USB-MODEVM Schematic ................................................................................................ 12
List of Figures
1
2
TSC2003EVM-PDK Block Diagram ...................................................................................... 6
Default Software Screen ................................................................................................... 8
List of Tables
1
2
3
4
5
6
EVM-Compatible Device Data Sheets ....................................................................................
Analog Interface Pin Out ....................................................................................................
Digital Interface Pin Out .....................................................................................................
Power Supply Pin Out .......................................................................................................
Power Selection Options - JMP5 ..........................................................................................
List of Jumpers ...............................................................................................................
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
1
2
3
3
3
5
1
www.ti.com
EVM Overview
TSC2003EVM Bill of Materials ........................................................................................... 10
USB-MODEVM Bill of Materials .......................................................................................... 11
7
8
1
EVM Overview
1.1
Features
•
•
Full-featured evaluation board for the TSC2003 4-wire resistive touch screen controller (TSC).
Modular design for use with a variety of DSP and microcontroller interface boards.
The TSC2003EVM-PDK is a complete evaluation kit, which includes a USB-based motherboard and
evaluation software for use with a personal computer running Microsoft Windows™ operating systems.
1.2
Introduction
The TSC2003EVM is in Texas Instruments' modular EVM form factor, which allows direct evaluation of the
performance and operating characteristics of the TSC2003, and eases software development and system
prototyping. This EVM is compatible with the 5-6K Interface Evaluation Module (SLAU104) from Texas
Instruments and additional third-party boards such as the HPA449 demonstration board from SoftBaugh,
Inc. (www.softbaugh.com) and the Speedy33™ from Hyperception, Inc. (www.hyperception.com)
The TSC2003EVM-PDK is a complete evaluation/demonstration kit, which includes a USB-based
motherboard called the USB-MODEVM Interface board and evaluation software for use with a personal
computer running Microsoft Windows operating systems.
2
Analog Interface
For maximum flexibility, the TSC2003EVM is designed for easy interfacing to multiple analog sources.
Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin dual
row header/socket combination at J1. This header/socket provides access to the analog input pins of the
TSC. Consult Samtec at www.samtec.com or call 1-800-SAMTEC-9 for a variety of mating connector
options.
Table 2. Analog Interface Pin Out
PIN NUMBER
SIGNAL
DESCRIPTION
J1.2
X+
Touch screen X+ electrode
J1.4
X-
Touch screen X- electrode
J1.6
Y+
Touch screen Y+ electrode
J1.8
Y-
Touch screen Y- electrode
J1.10
VBAT1
Battery Input, 0V to 6V
J1.12
AUX1
Auxiliary Input, 0V to VREF
J1.14
VBAT2
Battery Input, 0V to 6V
J1.16
AUX2
Auxiliary Input, 0V to VREF
J1.18
REF(-)
Tied to analog ground
J1.20
REF(+)
External reference Source Input (2.5V NOM)
J1.15
Unused
J1.1-J1.19 (odd)
AGND
Analog ground connections (except J1.15)
Speedy33 is a trademark of Hyperception, Inc.
I2C is a trademark of Koninklijke Philips Electronics N.V., The Netherlands.
Windows is a trademark of Microsoft Corporation.
SPI is a trademark of Motorola, Inc.
WinZip is a trademark of WinZip Computing, Inc..
2
TSC2003EVM and TSC2003EVM-PDK User's Guide
SBAU109 – March 2005
www.ti.com
Digital Interface
3
Digital Interface
The TSC2003EVM is designed to easily interface with multiple control platforms. Samtec part numbers
SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin dual row header/socket
combination at J2. This header/socket provides access to the digital control and serial data pins of the
TSC. Consult Samtec at www.samtec.com or call 1-800-SAMTEC-9 for a variety of mating connector
options.
Table 3. Digital Interface Pin Out
4
PIN NUMBER
SIGNAL
DESCRIPTION
J2.15
PENIRQ
Pen Interrupt Output from TSC
J2.16
SCL
I2C™ bus serial clock
J2.4, J2.10, J2.18
DGND
Digital ground
J2.1-J2.19 (odd, except
J2.15)
Unused
J2.20
SDA
I2C bus data line
Power Supplies
J3 provides connection to the common power bus for the TSC2003EVM. Power is supplied on the pins
listed in Table 4.
Table 4. Power Supply Pin Out
SIGNAL
PIN NUMBER
SIGNAL
Unused
1
2
Unused
Unused
3
4
Unused
DGND
5
6
AGND
Unused
7
8
+VD1
+3.3VD
9
10
+5VD
When power is supplied to J3, JMP5 allows for one of three different DC voltages to be selected as power
for the TSC. See the schematic and PCB silkscreen for details.
The TSC2003EVM-PDK motherboard (the USB-MODEVM Interface board) supplies power to J3 of the
TSC2003EVM. Power for the motherboard is supplied either through its USB connection or via terminal
blocks on the board.
4.1
TSC Power
Power for the TSC2003 VCC can be supplied either from the +5VD terminal or from the +3.3VD terminal.
JMP5 selects which of these voltages is routed to the TSC2003. When JMP5 is in the default factory
condition (shunt on pins 3-4), power to the TSC comes from J3.9 (+3.3VD). When the shunt is installed on
JMP4 pins 5-6, power comes from J3.10 (+5VD). A shunt on JMP4 pins 1-2 connects power to J3.8, an
unspecified voltage level that the user may supply.
Table 5. Power Selection Options - JMP5
SHUNT ON PINS
VDD
VOLTAGE FROM J3 PIN
1-2
+VD1
8
3-4
+3.3VD
9
5-6
+5VD
10
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
3
www.ti.com
EVM Operation
4.2
Stand-Alone Operation
When used as a stand-alone EVM, power can be applied to TP2, referenced to TP1.
CAUTION
Verify that all power supplies are within the safe operating limits shown on
the TSC2003 data sheet before applying power to the EVM.
4.3
USB-MODEVM Interface Power
The USB-MODEVM Interface board can be powered from several different sources:
• USB
• 6VDC-10VDC AC/DC external wall supply (not included)
• Lab power supply
When powered from the USB connection, JMP6 should have a shunt from pins 1-2 (this is the default
factory configuration). When powered from 6V-10VDC, either through the J8 terminal block or J9 barrel
jack, JMP6 should have a shunt installed on pins 2-3. If power is applied in any of these ways, onboard
regulators generate the required supply voltages and no further power supplies are necessary.
If lab supplies are used to provide the individual voltages required by the USB-MODEVM Interface, JMP6
should have no shunt installed. Voltages are then applied to J2 (+5VA), J3 (+5VD), J4 (+1.8VD), and J5
(+3.3VD). The +1.8VD and +3.3VD can also be generated on the board by the onboard regulators from
the +5VD supply; to enable this supply, the switches on SW1 need to be set to enable the regulators by
placing them in the ON position (lower position, looking at the board with text reading right-side up). If
+1.8VD and +3.3VD are supplied externally, disable the onboard regulators by placing SW1 switches in
the OFF position.
Each power supply voltage has an LED (D1-D7) which will light when the power supplies are active.
4.4
Reference Voltage
The TSC2003 has an internal voltage reference. An external reference may be supplied through pin 20 of
J1 on the TSC2003EVM, referenced to analog ground (pin 18 of J1 on the TSC2003EVM). JMP1 must be
installed in order to route this external reference voltage to the TSC2003.
CAUTION
Verify that the external reference voltage is within the safe operating limits
shown on the TSC2003 data sheet before applying power to the EVM. Also,
program the TSC2003 to use an external reference, if one is used.
5
EVM Operation
The following section provides information on the analog input, digital control, and general operating
conditions of the TSC2003EVM.
5.1
Analog Input
The analog input sources (touch screen, auxiliary inputs, and battery inputs) can be applied directly to J1
(top or bottom side) or through signal conditioning modules available for the modular EVM system.
4
TSC2003EVM and TSC2003EVM-PDK User's Guide
SBAU109 – March 2005
www.ti.com
Kit Operation
5.2
Digital Control
The digital control signals can be applied directly to J2 (top or bottom side). The modular TSC2003EVM
can also be connected directly to a DSP or microcontroller interface board, such as the HPA449, or to the
USB-MODEVM Interface board if purchased as part of the TSC2003EVM-PDK. See the product folder for
the EVM or the TSC2003 for a current list of compatible interface and/or accessory boards.
5.3
Default Jumper Locations
Table 6 provides a list of jumpers found on the EVM and their factory default conditions.
Table 6. List of Jumpers
6
JUMPER
SHUNT POSITION
JUMPER DESCRIPTION
JMP1
OPEN
Connects External reference to TSC2003 (default is disconnected, using internal TSC2003
reference)
JMP2
CLOSED
EEPROM Address Select - when installed and used with the USB-MODEVM, firmware for the
motherboard is executed from the EEPROM on the TSC2003EVM. This is the default mode.
JMP3
CLOSED
Sets TSC2003 I2C address bit A0. Installed A0=0, uninstalled A0=1. Default is jumper
installed.
JMP4
CLOSED
Sets TSC2003 I2C address bit A1. Installed A1=0, uninstalled A1=1. Default is jumper
installed.
JMP5
3-4
Analog Power Select (default is +3.3VD)
JMP6
CLOSED
Connects analog ground (AGND) to digital ground (DGND). Default is connected.
Kit Operation
The following section provides information on using the TSC2003EVM-PDK, including setup, program
installation, and program usage.
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
5
www.ti.com
Kit Operation
6.1
TSC2003EVM-PDK Block Diagram
A block diagram of the TSC2003EVM-PDK is shown in Figure 1. The evaluation kit consists of two circuit
boards connected together. The motherboard is designated as the USB-MODEVM Interface board, while
the daughtercard is the TSC2003EVM described previously in this manual.
TSC2003EVM
X+
X−
Y+
Y−
VBAT1,2
AUX1,2
SDA
SCL
TSC2003
PENIRQ
EVM Position 1
Control Interface
SPI, I2C
TAS1020B
USB 8051
microcontroller
EVM Position 2
USB
I2S, AC97
Audio Interface
Figure 1. TSC2003EVM-PDK Block Diagram
The USB-MODEVM Interface board is intended to be used in USB mode, where control of the installed
EVM is accomplished using the onboard USB controller device. Provision is made, however, for driving all
the data buses (I2C, SPI™, I2S/AC97) externally. The source of these signals is controlled by SW2 on the
USB-MODEVM.
6.2
Quick Start
Ensure that the TSC2003EVM is installed on the USB-MODEVM Interface board. The TSC2003EVM
should be installed in the topmost position, using J11, J12, and J13 on the USB-MODEVM.
Place the CD-ROM into your PC CD-ROM drive. Locate the Setup program on the disk, and run it. The
Setup program will install the TSC2003 Evaluation software on your PC.
6
TSC2003EVM and TSC2003EVM-PDK User's Guide
SBAU109 – March 2005
www.ti.com
Kit Operation
After the main program is installed, a dialog box appears with instructions for installing NI-VISA 3.2
Runtime, a self-extracting archive. Click OK to proceed. A WinZip™ dialog appears. Click Unzip, and the
archive extracts itself and automatically runs the NI-VISA 3.2 Runtime installer.
Follow the instructions in the NI-VISA 3.2 Runtime Installer. When prompted for which features to install,
do the following:
1. Click on the disk icon next to NI-VISA 3.2
2. Select, Do not install this feature.
3. Click on the disk icon next to USB.
4. Select the option which installs this feature.
5. Click Next.
Accept the license agreement, and continue the installation.
When the installation completes, click Finish on the TSC2003EVM installer window. You may be prompted
to restart your computer.
When installation is complete, attach a USB cable from your PC to the USB-MODEVM Interface board. As
configured at the factory, the board will be powered from the USB interface, so the power indicator LEDs
on the USB-MODEVM should light. Once this occurs, launch the TSC2003 Evaluation software on your
PC.
The software should automatically find the TSC2003EVM, and a screen similar to the one shown in
Figure 2 should appear.
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
7
www.ti.com
Kit Operation
Figure 2. Default Software Screen
In order to use the touch screen features, a 4-wire resistive touch screen will need to be connected to J1
of the TSC2003EVM, as described earlier.
6.3
USB-MODEVM Interface Board
The simple diagram shown in Figure 1 shows only the basic features of the USB-MODEVM Interface
board. The board is built around a TAS1020B streaming audio USB controller with an 8051-based core.
The board features two positions for modular EVMs, or one double-wide serial modular EVM may be
installed.
For use with the TSC2003, the TSC2003EVM is installed in the topmost EVM slot, which connects the
TSC2003 digital control interface to the I2C port realized using the TAS1020B. Since the TSC2003 has no
audio features, the lower EVM slot, which is connected to the TAS1020B digital audio interface, is not
used.
As configured from the factory, the board is ready to use with the TSC2003EVM. However, if external SPI
control is desired, the signals may be applied to J15, as long as the SW2 is set so that USB SPI control is
disabled. To view all the functions and configuration options available on this board, see the
USB-MODEVM Interface Board schematic in Section 9.
8
TSC2003EVM and TSC2003EVM-PDK User's Guide
SBAU109 – March 2005
www.ti.com
Kit Operation
6.4
Program Description
After the TSC2003EVM-PDK software installation (described in Section 6.2), evaluation and development
with the TSC2003 can begin.
6.4.1
Touch Screen Functions Panel
The touch screen box in this panel will be updated when a touch is detected on the touch screen. As the
touch screen is drawn upon, the motion on the touch screen will be translated into pixels on this box. The
software takes X, Y, and Z readings which are shown to the right of the touch screen box. As the touch
pressure is increased, the pixel size increases; a lighter touch results in smaller pixel sizes.
The Z-value displayed is not what is described in the TSC2003 data sheet, because in the data sheet
equation, it is assumed that the sheet resistance of the touch screen being used is known. The value used
in this program is calculated by Equation 2 of the TSC2003 data sheet, but without multiplying it by the
RX-plate resistance. This value ranges from 0 to 3, and larger, with smaller numbers representing a more
forceful press on the screen. Using the Maximum Z Value to Display knob, you can set a threshold so
that the program does not display lightly pressed points. This threshold setting helps to eliminate display
of spurious points that may result from touch screen mechanical bouncing.
The display can be cleared by pressing the Clear Graph button on the screen.
6.4.2
Data Acquisition Functions Panel
The TSC2003 has provision for measuring two battery voltages (VBAT1 and VBAT2), two auxiliary input
voltages (AUX1 and AUX2), and temperature. This panel displays the measured values for these
parameters. Measurements are updated only when the touch screen is not being pressed.
Temperature is displayed using both methods described in the TSC2003 data sheet. Using the TEMP0
and TEMP1 measurements, a temperature reading with 2°C resolution and accuracy is achieved. Using
only the TEMP0 measurement, a reading with 0.3°C resolution is possible, but this option requires
knowing the TEMP0 value at +25°C; this would normally be a calibration that the user would perform. This
program assumes that TEMP0 = 600mV at +25°C.
6.4.3
Configuration Panel
The TSC2003 can be configured to operate in 8-bit or 12-bit resolution modes. Control over the mode
used is selected in this panel.
In the middle of this panel is an indicator light that shows the I2C Bus Status. If the TSC2003 is
acknowledging the address sent, the light is green; if the TSC2003 cannot acknowledge, the light is red.
The address that the TSC2003 is set to is shown in binary format in the box labeled, Device Address
A1-A0. The address set here should correspond to the bit settings determined by JMP3 and JMP4 on the
TSC2003EVM.
The two power-down bits of the TSC2003 can be set from this panel as well. A brief description of the
mode selected is shown on the screen when setting these bits; see Table II (Power-Down Bit Functions)
of the TSC2003 data sheet for details on what these bits do.
6.4.4
Datalogging
The software can record the data it takes from the TSC2003 to a tab-delimited file, suitable for importing
into spreadsheets. To do this, first go into the File menu, and select Log Data to File..., which opens a
file-select window and allows you to specify a file to which to write the data. At the same time, this enables
the Datalogging menu.
When ready to begin recording data to a file, select Datalogging → Start Logging. Data is written to the file
until Datalogging → Stop Logging is selected. When the screen is not touched, the VBAT1, VBAT2,
AUX1, AUX2 and TEMP values are written to the file, and the X, Y, Z1, and Z2 parameters are written to
the file with values of 9999, to indicate that they are not updated. When the screen is touched, the X, Y,
Z1, and Z2 parameters are written while the VBAT1, VBAT2, AUX1, AUX2 and TEMP values are written
to the file as 9999. Because the program constantly updates at a rate of about 400 readings per second,
datalog files can quickly grow large; therefore, log only that data which is necessary.
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
9
www.ti.com
EVM Bill of Materials
The format of the data file has the first column as the time in milliseconds (which is just a timer in the
program; it can arbitrarily start at any number), then X, Y, Z1, Z2, VBAT1, VBAT2, AUX1, AUX2, TEMP0,
and TEMP1 columns. Every new reading is a new row in the file.
7
EVM Bill of Materials
Table 7 and Table 8 contain a complete bill of materials for the modular TSC2003EVM and the
USB-MODEVM Interface Board (included only in the TSC2003EVM-PDK).
Table 7. TSC2003EVM Bill of Materials
10
REFERENCE DESIGNATOR
DESCRIPTION
MANUFACTURER
MFG. PART NUMBER
R1, R2, R3, R4
0Ω 1/8W 5% Chip Resistor
Panasonic
ERJ-6GEY0R00V
R5, R6, R7, R8
100Ω 1/8W 5% Chip Resistor
Panasonic
ERJ-6GEYJ101V
R9, R10, R11, R12, R13
2.7KΩ 1/10W 5% Chip Resistor
Panasonic
ERJ-3GEYJ272V
R14
51KΩ 1/10W 5% Chip Resistor
Panasonic
ERJ-3GEYJ272V
C11
1µF 16V Ceramic Chip
Capacitor, +/ - 10%, X7R
TDK
C1608X7R1C105K
C9, C10
10µF 16V Ceramic Chip
Capacitor, +/ - 20%, X5R
TDK
C3216X5R1C106M
C1, C2, C3, C4, C5, C6, C7,
C8
Ceramic Chip Capacitor Not installed
U1
I2C Touch Screen Controller
Texas Instruments
TSC2003IPW
U2
64K I2C EEPROM
MicroChip
24LC64-I/SN
TSC2003EVM PCB
Texas Instruments
6437755
J1A, J2A
20-pin SMT plug
Samtec
TSM-110-01-L-DV-P
J1B, J2B
20-pin SMT socket
Samtec
SSW-110-22-F-D-VS-K
J3A
10-pin SMT plug
Samtec
TSM-105-01-L-DV-P
J3B
10-pin SMT socket
Samtec
SSW-105-22-F-D-VS-K
JMP1, JMP2, JMP3, JMP4
2-position jumper , 0 .1" spacing
Samtec
TSW-102-07-L-S
JMP5
2 X 3 position header , 0 .1"
spacing
Samtec
TSW-103-07-L-D
TP1
Multipurpose test point terminal
Keystone Electronics
5011
TP2
Miniature test point terminal
Keystone Electronics
5000
Header shorting block
Samtec
SNT-100-BK-T
TSC2003EVM and TSC2003EVM-PDK User's Guide
SBAU109 – March 2005
www.ti.com
EVM Bill of Materials
Table 8. USB-MODEVM Bill of Materials
REFERENCE DESIGNATOR
DESCRIPTION
MANUFACTURER
MFG. PART NUMBER
R4
10Ω 1/10W 5% Chip Resistor
Panasonic
ERJ-3GEYJ100V
R10, R11
27.4Ω 1/16W 1% Chip Resistor Panasonic
ERJ-3EKF27R4V
R20
75Ω 1/4W 1% Chip Resistor
Panasonic
ERJ-14NF75R0U
R19
220Ω 1/10W 5% Chip Resistor
Panasonic
ERJ-3GEYJ221V
R14, R21, R22
390Ω 1/10W 5% Chip Resistor
Panasonic
ERJ-3GEYJ391V
R13
649Ω 1/16W 1% Chip Resistor
Panasonic
ERJ-3EKF6490V
R9
1.5KΩ 1/10W 5%
Chip Resistor
Panasonic
ERJ-3GEYJ152V
R1, R2, R3, R5, R6, R7, R8
2.7KΩ 1/10W 5%
Chip Resistor
Panasonic
ERJ-3GEYJ272V
R12
3.09KΩ 1/16W 1%
Chip Resistor
Panasonic
ERJ-3EKF3091V
R15, R16
10KΩ 1/10W 5%
Chip Resistor
Panasonic
ERJ-3GEYJ103V
R17, R18
100KΩ 1/10W 5%
Chip Resistor
Panasonic
ERJ-3GEYJ104V
RA1
10KΩ 1/8W Octal Isolated
Resistor Array
CTS Corporation
742C163103JTR
C18, C19
33pF 50V Ceramic
Chip Capacitor, ±5%, NPO
TDK
C1608C0G1H330J
C13, C14
47pF 50V Ceramic
Chip Capacitor, ±5%, NPO
TDK
C1608C0G1H470J
C20
100pF 50V Ceramic
Chip Capacitor, ±5%, NPO
TDK
C1608C0G1H101J
C21
1000pF 50V Ceramic
Chip Capacitor, ±5%, NPO
TDK
C1608C0G1H102J
C15
0.1µF 16V Ceramic
Chip Capacitor, ±10%,X7R
TDK
C1608X7R1C104K
C16, C17
0.33µF 16V Ceramic
Chip Capacitor, +/-20%,Y5V
TDK
C1608X5R1C334K
C9, C10, C11, C12, C22, C23,
C24, C25, C26, C27, C28
1µF 6.3V Ceramic
Chip Capacitor, ±10%, X5R
TDK
C1608X5R0J105K
C1, C2, C3, C4, C5, C6, C7,
C8
10µF 6.3V Ceramic
Chip Capacitor, ±10%, X5R
TDK
C3216X5R0J106K
D1
50V, 1A, Diode MELF SMD
Micro Commercial Components DL4001
D2
Yellow Light Emitting Diode
Lumex
SML-LX0603YW-TR
D3, D4, D6, D7
Green Light Emitting Diode
Lumex
SML-LX0603GW-TR
D5
Red Light Emitting Diode
Lumex
SML-LX0603IW-TR
Q1, Q2
N-Channel MOSFET
Zetex
ZXMN6A07F
X1
6MHz Crystal SMD
Epson
MA-505 6.000M-C0
U8
USB Streaming Controller
Texas Instruments
TAS1020BPFB
U2
5V LDO Regulator
Texas Instruments
REG1117-5
U9
3.3V/1.8V Dual Output LDO
Regulator
Texas Instruments
TPS767D318PWP
U3, U4
Quad, Tri-State Buffers
Texas Instruments
SN74LVC125APW
U5, U6, U7
Single IC Buffer Driver with
Open Drain o/p
Texas Instruments
SN74LVC1G07DBVR
U10
Single Tri-State Buffer
Texas Instruments
SN74LVC1G125DBVR
U1
64K 2-Wire Serial EEPROM
I2C
Microchip
24LC64I/SN
USB-MODEVM PCB
Texas Instruments
6463995
SBAU109 – March 2005
TSC2003EVM and TSC2003EVM-PDK User's Guide
11
www.ti.com
TSC2003EVM Schematic
Table 8. USB-MODEVM Bill of Materials (continued)
8
REFERENCE DESIGNATOR
DESCRIPTION
MANUFACTURER
MFG. PART NUMBER
TP1, TP2, TP3, TP4, TP5,
TP6, TP9, TP10, TP11
Miniature test point terminal
Keystone Electronics
5000
TP7, TP8
Multipurpose test point
terminal
Keystone Electronics
5011
J7
USB Type B Slave Connector
Thru-Hole
Mill-Max
897-30-004-90-000000
J1, J2, J3, J4, J5, J8
2-position terminal block
On Shore Technology
ED555/2DS
J9
2.5mm power connector
CUI Stack
PJ-102B
J10
BNC connector, female,
PC mount
AMP/Tyco
414305-1
J11A, J12A, J21A, J22A
20-pin SMT plug
Samtec
TSM-110-01-L-DV-P
J11B, J12B, J21B, J22B
20-pin SMT socket
Samtec
SSW-110-22-F-D-VS-K
J13A, J23A
10-pin SMT plug
Samtec
TSM-105-01-L-DV-P
J13B, J23B
10-pin SMT socket
Samtec
SSW-105-22-F-D-VS-K
J6
4-pin double row header (2x2)
0.1"
Samtec
TSW-102-07-L-D
J14, J15
12-pin double row header (2x6) Samtec
0.1"
TSW-106-07-L-D
JMP1-JMP4
2-position jumper,
0.1" spacing
Samtec
TSW-102-07-L-S
JMP8-JMP14
2-position jumper,
0.1" spacing
Samtec
TSW-102-07-L-S
JMP5, JMP6
3-position jumper,
0.1" spacing
Samtec
TSW-103-07-L-S
JMP7
3-position dual row jumper,
0.1" spacing
Samtec
TSW-103-07-L-D
SW1
SMT, half-pitch 2-position
switch
C&K Division, ITT
TDA02H0SK1
SW2
SMT, half-pitch 8-position
switch
C&K Division, ITT
TDA08H0SK1
Jumper plug
Samtec
SNT-100-BK-T
TSC2003EVM Schematic
The schematic diagram is provided as a reference.
9
USB-MODEVM Schematic
The schematic diagram is provided as a reference.
12
TSC2003EVM and TSC2003EVM-PDK User's Guide
SBAU109 – March 2005
1
2
3
4
6
5
REVISION HISTORY
REV
ENGINEERING CHANGE NUMBER
APPROVED
D
D
Vcc
Vcc
R9
2.7K
C10
A0
1
0
R2
0
R4
9
VBAT1
VBAT2
VREF
GND
100
R6
100
R7
C9
10uF
100
R8
IN1
IN2
A0
A1
SCL
SDA
6
C
2
4
6
8
10
12
14
16
18
20
PENIRQ
JMP4
1
2
16
15
A1
14
13
12
11
Vcc
R14
51K
C1
NI
J2
1
3
5
7
9
11
13
15
17
19
TSC2003IPW
C2
NI
C3
NI
C4
NI
C5
NI
C6
NI
C7
NI
C8
NI
JMP1
1
HEADER-10X2
J2A (TOP) = SAM_TSM-110-01-L-DV-P
J2B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K
10
100
2
1
3
5
7
9
11
13
15
17
19
7
8
0
R5
X+
Y+
XY-
U1
+VCC
2
3
4
5
0
R3
X+
XY+
YVBAT1
AUX1
VBAT2
AUX2
REFREF+
JMP3
1
2
10uF
R1
J1
R10
2.7K
CNTL
CLKX
CLKR
FSX
FSR
DX
DR
INT
TOUT
GPIO5
2
4
6
8
10
12
14
16
18
20
GPIO0
DGND
GPIO1
GPIO2
DGND
GPIO3
GPIO4
SCL
DGND
SDA
C
Vcc
R11
2.7K
DAUGHTER-SERIAL
R12
2.7K
2
4
6
-VA
-5VA
AGND
VD1
+5VD
2
4
6
8
10
6
SCL
WP
JMP5
JMP2
1
3
5
+VA
+5VA
DGND
+1.8VD
+3.3VD
2
J3
1
3
5
7
9
B
Vcc
GND
TP1
GND
VSS
24LC64
TP2
1
B
Vcc
4
7
JMP6
1
2
C11
1uF
VCC
SDA
R13
2.7K
A0
A1
A2
U2
8
1
2
3
Vcc
5
J1A (TOP) = SAM_TSM-110-01-L-DV-P
J1B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K
+VD1
+5V
DAUGHTER-POWER
+3.3V
J3A (TOP) = SAM_TSM-105-01-L-DV-P
J3B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K
ti
A
DATA ACQUISITION PRODUCTS
HIGH-PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
ENGINEER
TITLE
RICK DOWNS
DRAWN BY ROBERT BENJAMIN
DOCUMENT CONTROL NO. 6437756
SHEET 1
1
2
3
4
5
OF 1
TSC2003 Evaluation Module
SIZE B
DATE 31-Jan-2005
REV
B
FILE D:\tsc2003EVM\TSC2003EVM.ddb - SCH\TSC2003EVM.Sch
6
A
1
2
3
4
6
5
REVISION HISTORY
REV
IOVDD
R5
2.7K
2
5
9
12
1
USB MCK
4
10
USB I2S
13
J6
Q2
ZXMN6A07F
EXTERNAL I2C
SDA
SCL
WP
8
A0
A1
A2
U1
VCC
C9
1uF
4
1
1
3
5
7
9
11
3
2
44
43
42
41
40
39
37
38
36
35
34
32
R12
3.09K
.001uF
R10
27.4
R11
C13
47pF
C14
47pF
R7
2.7K
JMP8
1
2
P1.2
P1.1
P1.0
+3.3VD
C11
1uF
C12
1uF
C
MOSI
SS
SCLK
RESET
14
VCC
J15
1
3
5
7
9
11
3
6
8
11
1Y
2Y
3Y
4Y
7
GND
2
4
6
8
10
12
EXTERNAL SPI
USB RST
USB SPI
P3.5
JMP13
1
2
D2
+3.3VD
YELLOW
C25
R8
2.7K
P3.4
JMP14
1
2
IOVDD
P3.3
B
U6
1uF
4
2
INT
3
J8
5
B
1A
2A
3A
4A
1OE
2OE
3OE
4OE
JMP12
1
2
SML-LX0603YW-TR
MISO
SN74LVC1G07DBV
SN74LVC125APW
MRESET
649
2
U4
2
5
9
12
1
4
10
13
USB ACTIVE
R13
4
1uF
JMP11
1
2
C10
1uF
EXTERNAL AUDIO DATA
C27 IOVDD
JMP10
1
2
C24
1uF
SW DIP-8
P1.3
JMP9
1
2
SN74LVC1G07DBV
ED555/2DS
+5VD
EXT PWR IN
+1.8VD
R14
390
U9
5
6
4
1
2
3
6VDC-10VDC IN
D3
SML-LX0603GW-TR
JMP6
PWR SELECT
GREEN
3
9
U2
REG1117-5
3
C15 DL4001
0.1uF
VIN
C16
0.33uF
VOUT
GND
D1
10
11
12
2
R15
10K
C6
10uF
1
J9
R16
10K
+5VD
A
+3.3VD
+1.8VD
IOVDD
JMP7
1
2
3
4
5
6
TP6
1IN
1IN
1EN
1GND
2GND
2EN
2IN
2IN
1RESET
1OUT
1OUT
2RESET
2OUT
2OUT
TPS767D318PWP
CUI-STACK PJ102-B
2.5 MM
SW1
1
2
4
3
24
23
22
18
17
R17
100K
C7
10uF
D5
SML-LX0603IW-TR
R18
100K
R4
10
+3.3VD
RED
R19
220
!"
C8
10uF
D4
SML-LX0603GW-TR
C17
0.33uF
1.8VD ENABLE
3.3VD ENABLE
28
GREEN
DATA ACQUISITION PRODUCTS
REGULATOR ENABLE
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
TITLE
ENGINEER RICK DOWNS
USB-MODEVM INTERFACE
DRAWN BY ROBERT BENJAMIN
DOCUMENT CONTROL NO. 6463996
SHEET 1
2
A
HIGH PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
IOVDD SELECT
1
SW2
1
2
3
4
5
6
7
8
PWR_DWN
U7
31
30
29
27
26
25
24
23
8
21
33
2
16
15
14
13
12
11
10
9
2
4
6
8
10
12
1uF
TP11
+3.3VD
IOVDD
C26
3
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
DVDD
DVDD
DVDD
AVDD
9
10
11
12
13
14
15
17
18
19
20
22
27.4
XTALO
XTALI
PLLFILI
PLLFILO
MCLKI
PUR
DP
DM
DVSS
DVSS
DVSS
AVSS
MRESET
TEST
EXTEN
RSTO
P3.0
P3.1
P3.2/XINT
P3.3
P3.4
P3.5
NC
NC
7
1
2
3
1.5K
+3.3VD
U8
TAS1020BPFB
SCL
SDA
VREN
RESET
MCLKO2
MCLKO1
CSCLK
CDATO
CDATI
CSYNC
CRESET
CSCHNE
46
47
48
1
3
5
6
7
4
16
28
45
100pF
C21
R9
J14
1uF
33pF
MA-505 6.000M-C0
6.00 MHZ
J7 USB SLAVE CONN
897-30-004-90-000000
I2SDOUT
C23
U5
C19
C20
4
3
2
1
BCLK
SN74LVC1G07DBV
33pF
24LC64I/SN
GND
D+
DVCC
X1
C18
A0
A1
A2
USB I2S
USB MCK
USB SPI
USB RST
EXT MCK
LRCLK
IOVDD
4
VSS
R20
75
MCLK
7
GND
R6
2.7K
RA1
10K
I2SDIN
6
5
+3.3VD
SCL
C
SN74LVC1G125DBV
3
6
8
11
1Y
2Y
3Y
4Y
D
2
SN74LVC125APW
+3.3VD
TP10
14
VCC
+3.3VD
5
1
3
1A
2A
3A
4A
1OE
2OE
3OE
4OE
5
2
4
4
1uF
U3
APPROVED
J10
EXT MCLK
U10
3
R3
2.7K
TP9
SDA
1uF
5
C22
Q1
ZXMN6A07F
D
C28 IOVDD
IOVDD
+3.3VD
ENGINEERING CHANGE NUMBER
3
4
5
OF
2
FILE
SIZE B
REV B
DATE 28-Oct-2004
D:\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\USB Interface
6
1
2
3
4
5
6
REVISION HISTORY
REV
ENGINEERING CHANGE NUMBER
APPROVED
D
1
2
3
D
J11
J12
A0(+)
A1(+)
A2(+)
A3(+)
A4
A5
A6
A7
REFREF+
2
4
6
8
10
12
14
16
18
20
+5VA
J13A (TOP) = SAM_TSM-105-01-L-DV-P
J13B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K
DAUGHTER-ANALOG
J11A (TOP) = SAM_TSM-110-01-L-DV-P
J11B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K
+5VA
+5VD
JMP1
1
2
+VA
+5VA
DGND
+1.8VD
+3.3VD
-VA
-5VA
AGND
VD1
+5VD
2
4
6
8
10
GPIO0
DGND
GPIO1
GPIO2
DGND
GPIO3
GPIO4
SCL
DGND
SDA
SCLK
SS
P3.3
J12A (TOP) = SAM_TSM-110-01-L-DV-P
J12B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K
+5VA
TP2
10uF
C2
+5VD
TP3
10uF
C3
TP4
10uF
JMP3
PWR_DWN
INT
JMP4
MISO
+3.3VD
MOSI
R1
R21
390
J1
-5VA
R22
390
SCL
2.7K
J2
+5VA
D6
SML-LX0603GW-TR
D7
SML-LX0603GW-TR
GREEN
GREEN
J3
+5VD
TP5
+1.8VD
C
RESET
IOVDD
2
C1
P3.5
P1.0
1
-5VA
P3.4
+5VD
JMP2
1
2
TP1
JMP5
2
4
6
8
10
12
14
16
18
20
-5VA
DAUGHTER-POWER
TP7
TP8
AGND
DGND
JPR-2X1
C
CNTL
CLKX
CLKR
FSX
FSR
DX
DR
INT
TOUT
GPIO5
DAUGHTER-SERIAL
J13
1
3
5
7
9
1
3
5
7
9
11
13
15
17
19
2
A0(-)
A1(-)
A2(-)
A3(-)
AGND
AGND
AGND
VCOM
AGND
AGND
1
1
3
5
7
9
11
13
15
17
19
C4
C5
10uF
10uF
J4
+1.8VD
R2
SDA
2.7K
I2SDOUT
J5
+3.3VD
I2SDIN
LRCLK
BCLK
J21
1
3
5
7
9
11
13
15
17
19
B
A0(-)
A1(-)
A2(-)
A3(-)
AGND
AGND
AGND
VCOM
AGND
AGND
J22
A0(+)
A1(+)
A2(+)
A3(+)
A4
A5
A6
A7
REFREF+
2
4
6
8
10
12
14
16
18
20
1
3
5
7
9
11
13
15
17
19
+5VA
DAUGHTER-ANALOG
J21A (TOP) = SAM_TSM-110-01-L-DV-P
J21B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K
+1.8VD
+VA
+5VA
DGND
+1.8VD
+3.3VD
GPIO0
DGND
GPIO1
GPIO2
DGND
GPIO3
GPIO4
SCL
DGND
SDA
2
4
6
8
10
12
14
16
18
20
P1.1
B
P1.2
P1.3
MCLK
DAUGHTER-SERIAL
J23
1
3
5
7
9
CNTL
CLKX
CLKR
FSX
FSR
DX
DR
INT
TOUT
GPIO5
-VA
-5VA
AGND
VD1
+5VD
2
4
6
8
10
-5VA
J22A (TOP) = SAM_TSM-110-01-L-DV-P
J22B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K
DAUGHTER-POWER
+3.3VD
+5VD
J23A (TOP) = SAM_TSM-105-01-L-DV-P
J23B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K
!"
A
DATA ACQUISITION PRODUCTS
A
HIGH-PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
TITLE
ENGINEER
RICK DOWNS
DRAWN BY
ROBERT BENJAMIN
USB-MODEVM INTERFACE
DOCUMENT CONTROL NO. 6463996
SHEET 2
1
2
3
4
5
OF
2
FILE
SIZE B
REV B
DATE 28-Oct-2004
D:\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\Daughtercard Interface
6
FCC Warnings
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency
energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules,
which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which case the user at his own expense will be required to
take whatever measures may be required to correct this interference.
EVM IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY
and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of
required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically
found in the end product incorporating the goods. As a prototype, this product does not fall within the scope of the European Union
directive on electromagnetic compatibility and therefore may not meet the technical requirements of the directive.
Should this evaluation kit not meet the specifications indicated in the EVM User's Guide, the kit may be returned within 30 days
from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER
TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY
WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all
claims arising from the handling or use of the goods. Please be aware that the products received may not be regulatory compliant
or agency certified (FCC, UL, CE, etc.). Due to the open construction of the product, it is the user's responsibility to take any and all
appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE Liable to the other FOR
ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of
patents or services described herein.
Please read the EVM User's Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM User's Guide prior to
handling the product. This notice contains important safety information about temperatures and voltages. For further safety
concerns, please contact the TI application engineer.
Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 3.3 V to 5 V and the output voltage range of 0 V to 5 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are
questions concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the
EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load
specification, please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 30 °C. The EVM is designed to
operate properly with certain components above 85 °C as long as the input and output ranges are maintained. These components
include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of
devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near
these devices during operation, please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2005, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated