TSC2003EVM-PDK

TSC2003EVM-PDK

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

  • 数据手册
  • 价格&库存
TSC2003EVM-PDK 数据手册
User's Guide SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide This user's guide describes the characteristics, operation, and use of the TSC2003EVM, both by itself and as part of the TSC2003EVM-PDK. This evaluation module (EVM) is a 4-wire touch screen controller EVM which also has auxiliary inputs and battery and temperature measurement capabilities. A complete circuit description, schematic diagram and bill of materials are included. The following related documents are available through the Texas Instruments web site at www.ti.com. Table 1. EVM-Compatible Device Data Sheets 1 2 3 4 5 6 7 8 9 DEVICE LITERATURE NUMBER TSC2003 SBAS162 TAS1020B SLES025 REG1117-5 SBVS001 TPS767D318 SLVS209 SN74LVC125A SCAS290 SN74LVC1G125 SCES223 SN74LVC1G07 SCES296 Contents EVM Overview ............................................................................................................... 2 Analog Interface.............................................................................................................. 2 Digital Interface .............................................................................................................. 3 Power Supplies .............................................................................................................. 3 EVM Operation ............................................................................................................... 4 Kit Operation ................................................................................................................. 5 EVM Bill of Materials ....................................................................................................... 10 TSC2003EVM Schematic ................................................................................................. 12 USB-MODEVM Schematic ................................................................................................ 12 List of Figures 1 2 TSC2003EVM-PDK Block Diagram ...................................................................................... 6 Default Software Screen ................................................................................................... 8 List of Tables 1 2 3 4 5 6 EVM-Compatible Device Data Sheets .................................................................................... Analog Interface Pin Out .................................................................................................... Digital Interface Pin Out ..................................................................................................... Power Supply Pin Out ....................................................................................................... Power Selection Options - JMP5 .......................................................................................... List of Jumpers ............................................................................................................... SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide 1 2 3 3 3 5 1 www.ti.com EVM Overview TSC2003EVM Bill of Materials ........................................................................................... 10 USB-MODEVM Bill of Materials .......................................................................................... 11 7 8 1 EVM Overview 1.1 Features • • Full-featured evaluation board for the TSC2003 4-wire resistive touch screen controller (TSC). Modular design for use with a variety of DSP and microcontroller interface boards. The TSC2003EVM-PDK is a complete evaluation kit, which includes a USB-based motherboard and evaluation software for use with a personal computer running Microsoft Windows™ operating systems. 1.2 Introduction The TSC2003EVM is in Texas Instruments' modular EVM form factor, which allows direct evaluation of the performance and operating characteristics of the TSC2003, and eases software development and system prototyping. This EVM is compatible with the 5-6K Interface Evaluation Module (SLAU104) from Texas Instruments and additional third-party boards such as the HPA449 demonstration board from SoftBaugh, Inc. (www.softbaugh.com) and the Speedy33™ from Hyperception, Inc. (www.hyperception.com) The TSC2003EVM-PDK is a complete evaluation/demonstration kit, which includes a USB-based motherboard called the USB-MODEVM Interface board and evaluation software for use with a personal computer running Microsoft Windows operating systems. 2 Analog Interface For maximum flexibility, the TSC2003EVM is designed for easy interfacing to multiple analog sources. Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin dual row header/socket combination at J1. This header/socket provides access to the analog input pins of the TSC. Consult Samtec at www.samtec.com or call 1-800-SAMTEC-9 for a variety of mating connector options. Table 2. Analog Interface Pin Out PIN NUMBER SIGNAL DESCRIPTION J1.2 X+ Touch screen X+ electrode J1.4 X- Touch screen X- electrode J1.6 Y+ Touch screen Y+ electrode J1.8 Y- Touch screen Y- electrode J1.10 VBAT1 Battery Input, 0V to 6V J1.12 AUX1 Auxiliary Input, 0V to VREF J1.14 VBAT2 Battery Input, 0V to 6V J1.16 AUX2 Auxiliary Input, 0V to VREF J1.18 REF(-) Tied to analog ground J1.20 REF(+) External reference Source Input (2.5V NOM) J1.15 Unused J1.1-J1.19 (odd) AGND Analog ground connections (except J1.15) Speedy33 is a trademark of Hyperception, Inc. I2C is a trademark of Koninklijke Philips Electronics N.V., The Netherlands. Windows is a trademark of Microsoft Corporation. SPI is a trademark of Motorola, Inc. WinZip is a trademark of WinZip Computing, Inc.. 2 TSC2003EVM and TSC2003EVM-PDK User's Guide SBAU109 – March 2005 www.ti.com Digital Interface 3 Digital Interface The TSC2003EVM is designed to easily interface with multiple control platforms. Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin dual row header/socket combination at J2. This header/socket provides access to the digital control and serial data pins of the TSC. Consult Samtec at www.samtec.com or call 1-800-SAMTEC-9 for a variety of mating connector options. Table 3. Digital Interface Pin Out 4 PIN NUMBER SIGNAL DESCRIPTION J2.15 PENIRQ Pen Interrupt Output from TSC J2.16 SCL I2C™ bus serial clock J2.4, J2.10, J2.18 DGND Digital ground J2.1-J2.19 (odd, except J2.15) Unused J2.20 SDA I2C bus data line Power Supplies J3 provides connection to the common power bus for the TSC2003EVM. Power is supplied on the pins listed in Table 4. Table 4. Power Supply Pin Out SIGNAL PIN NUMBER SIGNAL Unused 1 2 Unused Unused 3 4 Unused DGND 5 6 AGND Unused 7 8 +VD1 +3.3VD 9 10 +5VD When power is supplied to J3, JMP5 allows for one of three different DC voltages to be selected as power for the TSC. See the schematic and PCB silkscreen for details. The TSC2003EVM-PDK motherboard (the USB-MODEVM Interface board) supplies power to J3 of the TSC2003EVM. Power for the motherboard is supplied either through its USB connection or via terminal blocks on the board. 4.1 TSC Power Power for the TSC2003 VCC can be supplied either from the +5VD terminal or from the +3.3VD terminal. JMP5 selects which of these voltages is routed to the TSC2003. When JMP5 is in the default factory condition (shunt on pins 3-4), power to the TSC comes from J3.9 (+3.3VD). When the shunt is installed on JMP4 pins 5-6, power comes from J3.10 (+5VD). A shunt on JMP4 pins 1-2 connects power to J3.8, an unspecified voltage level that the user may supply. Table 5. Power Selection Options - JMP5 SHUNT ON PINS VDD VOLTAGE FROM J3 PIN 1-2 +VD1 8 3-4 +3.3VD 9 5-6 +5VD 10 SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide 3 www.ti.com EVM Operation 4.2 Stand-Alone Operation When used as a stand-alone EVM, power can be applied to TP2, referenced to TP1. CAUTION Verify that all power supplies are within the safe operating limits shown on the TSC2003 data sheet before applying power to the EVM. 4.3 USB-MODEVM Interface Power The USB-MODEVM Interface board can be powered from several different sources: • USB • 6VDC-10VDC AC/DC external wall supply (not included) • Lab power supply When powered from the USB connection, JMP6 should have a shunt from pins 1-2 (this is the default factory configuration). When powered from 6V-10VDC, either through the J8 terminal block or J9 barrel jack, JMP6 should have a shunt installed on pins 2-3. If power is applied in any of these ways, onboard regulators generate the required supply voltages and no further power supplies are necessary. If lab supplies are used to provide the individual voltages required by the USB-MODEVM Interface, JMP6 should have no shunt installed. Voltages are then applied to J2 (+5VA), J3 (+5VD), J4 (+1.8VD), and J5 (+3.3VD). The +1.8VD and +3.3VD can also be generated on the board by the onboard regulators from the +5VD supply; to enable this supply, the switches on SW1 need to be set to enable the regulators by placing them in the ON position (lower position, looking at the board with text reading right-side up). If +1.8VD and +3.3VD are supplied externally, disable the onboard regulators by placing SW1 switches in the OFF position. Each power supply voltage has an LED (D1-D7) which will light when the power supplies are active. 4.4 Reference Voltage The TSC2003 has an internal voltage reference. An external reference may be supplied through pin 20 of J1 on the TSC2003EVM, referenced to analog ground (pin 18 of J1 on the TSC2003EVM). JMP1 must be installed in order to route this external reference voltage to the TSC2003. CAUTION Verify that the external reference voltage is within the safe operating limits shown on the TSC2003 data sheet before applying power to the EVM. Also, program the TSC2003 to use an external reference, if one is used. 5 EVM Operation The following section provides information on the analog input, digital control, and general operating conditions of the TSC2003EVM. 5.1 Analog Input The analog input sources (touch screen, auxiliary inputs, and battery inputs) can be applied directly to J1 (top or bottom side) or through signal conditioning modules available for the modular EVM system. 4 TSC2003EVM and TSC2003EVM-PDK User's Guide SBAU109 – March 2005 www.ti.com Kit Operation 5.2 Digital Control The digital control signals can be applied directly to J2 (top or bottom side). The modular TSC2003EVM can also be connected directly to a DSP or microcontroller interface board, such as the HPA449, or to the USB-MODEVM Interface board if purchased as part of the TSC2003EVM-PDK. See the product folder for the EVM or the TSC2003 for a current list of compatible interface and/or accessory boards. 5.3 Default Jumper Locations Table 6 provides a list of jumpers found on the EVM and their factory default conditions. Table 6. List of Jumpers 6 JUMPER SHUNT POSITION JUMPER DESCRIPTION JMP1 OPEN Connects External reference to TSC2003 (default is disconnected, using internal TSC2003 reference) JMP2 CLOSED EEPROM Address Select - when installed and used with the USB-MODEVM, firmware for the motherboard is executed from the EEPROM on the TSC2003EVM. This is the default mode. JMP3 CLOSED Sets TSC2003 I2C address bit A0. Installed A0=0, uninstalled A0=1. Default is jumper installed. JMP4 CLOSED Sets TSC2003 I2C address bit A1. Installed A1=0, uninstalled A1=1. Default is jumper installed. JMP5 3-4 Analog Power Select (default is +3.3VD) JMP6 CLOSED Connects analog ground (AGND) to digital ground (DGND). Default is connected. Kit Operation The following section provides information on using the TSC2003EVM-PDK, including setup, program installation, and program usage. SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide 5 www.ti.com Kit Operation 6.1 TSC2003EVM-PDK Block Diagram A block diagram of the TSC2003EVM-PDK is shown in Figure 1. The evaluation kit consists of two circuit boards connected together. The motherboard is designated as the USB-MODEVM Interface board, while the daughtercard is the TSC2003EVM described previously in this manual. TSC2003EVM X+ X− Y+ Y− VBAT1,2 AUX1,2 SDA SCL TSC2003 PENIRQ EVM Position 1 Control Interface SPI, I2C TAS1020B USB 8051 microcontroller EVM Position 2 USB I2S, AC97 Audio Interface Figure 1. TSC2003EVM-PDK Block Diagram The USB-MODEVM Interface board is intended to be used in USB mode, where control of the installed EVM is accomplished using the onboard USB controller device. Provision is made, however, for driving all the data buses (I2C, SPI™, I2S/AC97) externally. The source of these signals is controlled by SW2 on the USB-MODEVM. 6.2 Quick Start Ensure that the TSC2003EVM is installed on the USB-MODEVM Interface board. The TSC2003EVM should be installed in the topmost position, using J11, J12, and J13 on the USB-MODEVM. Place the CD-ROM into your PC CD-ROM drive. Locate the Setup program on the disk, and run it. The Setup program will install the TSC2003 Evaluation software on your PC. 6 TSC2003EVM and TSC2003EVM-PDK User's Guide SBAU109 – March 2005 www.ti.com Kit Operation After the main program is installed, a dialog box appears with instructions for installing NI-VISA 3.2 Runtime, a self-extracting archive. Click OK to proceed. A WinZip™ dialog appears. Click Unzip, and the archive extracts itself and automatically runs the NI-VISA 3.2 Runtime installer. Follow the instructions in the NI-VISA 3.2 Runtime Installer. When prompted for which features to install, do the following: 1. Click on the disk icon next to NI-VISA 3.2 2. Select, Do not install this feature. 3. Click on the disk icon next to USB. 4. Select the option which installs this feature. 5. Click Next. Accept the license agreement, and continue the installation. When the installation completes, click Finish on the TSC2003EVM installer window. You may be prompted to restart your computer. When installation is complete, attach a USB cable from your PC to the USB-MODEVM Interface board. As configured at the factory, the board will be powered from the USB interface, so the power indicator LEDs on the USB-MODEVM should light. Once this occurs, launch the TSC2003 Evaluation software on your PC. The software should automatically find the TSC2003EVM, and a screen similar to the one shown in Figure 2 should appear. SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide 7 www.ti.com Kit Operation Figure 2. Default Software Screen In order to use the touch screen features, a 4-wire resistive touch screen will need to be connected to J1 of the TSC2003EVM, as described earlier. 6.3 USB-MODEVM Interface Board The simple diagram shown in Figure 1 shows only the basic features of the USB-MODEVM Interface board. The board is built around a TAS1020B streaming audio USB controller with an 8051-based core. The board features two positions for modular EVMs, or one double-wide serial modular EVM may be installed. For use with the TSC2003, the TSC2003EVM is installed in the topmost EVM slot, which connects the TSC2003 digital control interface to the I2C port realized using the TAS1020B. Since the TSC2003 has no audio features, the lower EVM slot, which is connected to the TAS1020B digital audio interface, is not used. As configured from the factory, the board is ready to use with the TSC2003EVM. However, if external SPI control is desired, the signals may be applied to J15, as long as the SW2 is set so that USB SPI control is disabled. To view all the functions and configuration options available on this board, see the USB-MODEVM Interface Board schematic in Section 9. 8 TSC2003EVM and TSC2003EVM-PDK User's Guide SBAU109 – March 2005 www.ti.com Kit Operation 6.4 Program Description After the TSC2003EVM-PDK software installation (described in Section 6.2), evaluation and development with the TSC2003 can begin. 6.4.1 Touch Screen Functions Panel The touch screen box in this panel will be updated when a touch is detected on the touch screen. As the touch screen is drawn upon, the motion on the touch screen will be translated into pixels on this box. The software takes X, Y, and Z readings which are shown to the right of the touch screen box. As the touch pressure is increased, the pixel size increases; a lighter touch results in smaller pixel sizes. The Z-value displayed is not what is described in the TSC2003 data sheet, because in the data sheet equation, it is assumed that the sheet resistance of the touch screen being used is known. The value used in this program is calculated by Equation 2 of the TSC2003 data sheet, but without multiplying it by the RX-plate resistance. This value ranges from 0 to 3, and larger, with smaller numbers representing a more forceful press on the screen. Using the Maximum Z Value to Display knob, you can set a threshold so that the program does not display lightly pressed points. This threshold setting helps to eliminate display of spurious points that may result from touch screen mechanical bouncing. The display can be cleared by pressing the Clear Graph button on the screen. 6.4.2 Data Acquisition Functions Panel The TSC2003 has provision for measuring two battery voltages (VBAT1 and VBAT2), two auxiliary input voltages (AUX1 and AUX2), and temperature. This panel displays the measured values for these parameters. Measurements are updated only when the touch screen is not being pressed. Temperature is displayed using both methods described in the TSC2003 data sheet. Using the TEMP0 and TEMP1 measurements, a temperature reading with 2°C resolution and accuracy is achieved. Using only the TEMP0 measurement, a reading with 0.3°C resolution is possible, but this option requires knowing the TEMP0 value at +25°C; this would normally be a calibration that the user would perform. This program assumes that TEMP0 = 600mV at +25°C. 6.4.3 Configuration Panel The TSC2003 can be configured to operate in 8-bit or 12-bit resolution modes. Control over the mode used is selected in this panel. In the middle of this panel is an indicator light that shows the I2C Bus Status. If the TSC2003 is acknowledging the address sent, the light is green; if the TSC2003 cannot acknowledge, the light is red. The address that the TSC2003 is set to is shown in binary format in the box labeled, Device Address A1-A0. The address set here should correspond to the bit settings determined by JMP3 and JMP4 on the TSC2003EVM. The two power-down bits of the TSC2003 can be set from this panel as well. A brief description of the mode selected is shown on the screen when setting these bits; see Table II (Power-Down Bit Functions) of the TSC2003 data sheet for details on what these bits do. 6.4.4 Datalogging The software can record the data it takes from the TSC2003 to a tab-delimited file, suitable for importing into spreadsheets. To do this, first go into the File menu, and select Log Data to File..., which opens a file-select window and allows you to specify a file to which to write the data. At the same time, this enables the Datalogging menu. When ready to begin recording data to a file, select Datalogging → Start Logging. Data is written to the file until Datalogging → Stop Logging is selected. When the screen is not touched, the VBAT1, VBAT2, AUX1, AUX2 and TEMP values are written to the file, and the X, Y, Z1, and Z2 parameters are written to the file with values of 9999, to indicate that they are not updated. When the screen is touched, the X, Y, Z1, and Z2 parameters are written while the VBAT1, VBAT2, AUX1, AUX2 and TEMP values are written to the file as 9999. Because the program constantly updates at a rate of about 400 readings per second, datalog files can quickly grow large; therefore, log only that data which is necessary. SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide 9 www.ti.com EVM Bill of Materials The format of the data file has the first column as the time in milliseconds (which is just a timer in the program; it can arbitrarily start at any number), then X, Y, Z1, Z2, VBAT1, VBAT2, AUX1, AUX2, TEMP0, and TEMP1 columns. Every new reading is a new row in the file. 7 EVM Bill of Materials Table 7 and Table 8 contain a complete bill of materials for the modular TSC2003EVM and the USB-MODEVM Interface Board (included only in the TSC2003EVM-PDK). Table 7. TSC2003EVM Bill of Materials 10 REFERENCE DESIGNATOR DESCRIPTION MANUFACTURER MFG. PART NUMBER R1, R2, R3, R4 0Ω 1/8W 5% Chip Resistor Panasonic ERJ-6GEY0R00V R5, R6, R7, R8 100Ω 1/8W 5% Chip Resistor Panasonic ERJ-6GEYJ101V R9, R10, R11, R12, R13 2.7KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V R14 51KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V C11 1µF 16V Ceramic Chip Capacitor, +/ - 10%, X7R TDK C1608X7R1C105K C9, C10 10µF 16V Ceramic Chip Capacitor, +/ - 20%, X5R TDK C3216X5R1C106M C1, C2, C3, C4, C5, C6, C7, C8 Ceramic Chip Capacitor Not installed U1 I2C Touch Screen Controller Texas Instruments TSC2003IPW U2 64K I2C EEPROM MicroChip 24LC64-I/SN TSC2003EVM PCB Texas Instruments 6437755 J1A, J2A 20-pin SMT plug Samtec TSM-110-01-L-DV-P J1B, J2B 20-pin SMT socket Samtec SSW-110-22-F-D-VS-K J3A 10-pin SMT plug Samtec TSM-105-01-L-DV-P J3B 10-pin SMT socket Samtec SSW-105-22-F-D-VS-K JMP1, JMP2, JMP3, JMP4 2-position jumper , 0 .1" spacing Samtec TSW-102-07-L-S JMP5 2 X 3 position header , 0 .1" spacing Samtec TSW-103-07-L-D TP1 Multipurpose test point terminal Keystone Electronics 5011 TP2 Miniature test point terminal Keystone Electronics 5000 Header shorting block Samtec SNT-100-BK-T TSC2003EVM and TSC2003EVM-PDK User's Guide SBAU109 – March 2005 www.ti.com EVM Bill of Materials Table 8. USB-MODEVM Bill of Materials REFERENCE DESIGNATOR DESCRIPTION MANUFACTURER MFG. PART NUMBER R4 10Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ100V R10, R11 27.4Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF27R4V R20 75Ω 1/4W 1% Chip Resistor Panasonic ERJ-14NF75R0U R19 220Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ221V R14, R21, R22 390Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ391V R13 649Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF6490V R9 1.5KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ152V R1, R2, R3, R5, R6, R7, R8 2.7KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V R12 3.09KΩ 1/16W 1% Chip Resistor Panasonic ERJ-3EKF3091V R15, R16 10KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ103V R17, R18 100KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ104V RA1 10KΩ 1/8W Octal Isolated Resistor Array CTS Corporation 742C163103JTR C18, C19 33pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H330J C13, C14 47pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H470J C20 100pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H101J C21 1000pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H102J C15 0.1µF 16V Ceramic Chip Capacitor, ±10%,X7R TDK C1608X7R1C104K C16, C17 0.33µF 16V Ceramic Chip Capacitor, +/-20%,Y5V TDK C1608X5R1C334K C9, C10, C11, C12, C22, C23, C24, C25, C26, C27, C28 1µF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C1608X5R0J105K C1, C2, C3, C4, C5, C6, C7, C8 10µF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C3216X5R0J106K D1 50V, 1A, Diode MELF SMD Micro Commercial Components DL4001 D2 Yellow Light Emitting Diode Lumex SML-LX0603YW-TR D3, D4, D6, D7 Green Light Emitting Diode Lumex SML-LX0603GW-TR D5 Red Light Emitting Diode Lumex SML-LX0603IW-TR Q1, Q2 N-Channel MOSFET Zetex ZXMN6A07F X1 6MHz Crystal SMD Epson MA-505 6.000M-C0 U8 USB Streaming Controller Texas Instruments TAS1020BPFB U2 5V LDO Regulator Texas Instruments REG1117-5 U9 3.3V/1.8V Dual Output LDO Regulator Texas Instruments TPS767D318PWP U3, U4 Quad, Tri-State Buffers Texas Instruments SN74LVC125APW U5, U6, U7 Single IC Buffer Driver with Open Drain o/p Texas Instruments SN74LVC1G07DBVR U10 Single Tri-State Buffer Texas Instruments SN74LVC1G125DBVR U1 64K 2-Wire Serial EEPROM I2C Microchip 24LC64I/SN USB-MODEVM PCB Texas Instruments 6463995 SBAU109 – March 2005 TSC2003EVM and TSC2003EVM-PDK User's Guide 11 www.ti.com TSC2003EVM Schematic Table 8. USB-MODEVM Bill of Materials (continued) 8 REFERENCE DESIGNATOR DESCRIPTION MANUFACTURER MFG. PART NUMBER TP1, TP2, TP3, TP4, TP5, TP6, TP9, TP10, TP11 Miniature test point terminal Keystone Electronics 5000 TP7, TP8 Multipurpose test point terminal Keystone Electronics 5011 J7 USB Type B Slave Connector Thru-Hole Mill-Max 897-30-004-90-000000 J1, J2, J3, J4, J5, J8 2-position terminal block On Shore Technology ED555/2DS J9 2.5mm power connector CUI Stack PJ-102B J10 BNC connector, female, PC mount AMP/Tyco 414305-1 J11A, J12A, J21A, J22A 20-pin SMT plug Samtec TSM-110-01-L-DV-P J11B, J12B, J21B, J22B 20-pin SMT socket Samtec SSW-110-22-F-D-VS-K J13A, J23A 10-pin SMT plug Samtec TSM-105-01-L-DV-P J13B, J23B 10-pin SMT socket Samtec SSW-105-22-F-D-VS-K J6 4-pin double row header (2x2) 0.1" Samtec TSW-102-07-L-D J14, J15 12-pin double row header (2x6) Samtec 0.1" TSW-106-07-L-D JMP1-JMP4 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP8-JMP14 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP5, JMP6 3-position jumper, 0.1" spacing Samtec TSW-103-07-L-S JMP7 3-position dual row jumper, 0.1" spacing Samtec TSW-103-07-L-D SW1 SMT, half-pitch 2-position switch C&K Division, ITT TDA02H0SK1 SW2 SMT, half-pitch 8-position switch C&K Division, ITT TDA08H0SK1 Jumper plug Samtec SNT-100-BK-T TSC2003EVM Schematic The schematic diagram is provided as a reference. 9 USB-MODEVM Schematic The schematic diagram is provided as a reference. 12 TSC2003EVM and TSC2003EVM-PDK User's Guide SBAU109 – March 2005 1 2 3 4 6 5 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D D Vcc Vcc R9 2.7K C10 A0 1 0 R2 0 R4 9 VBAT1 VBAT2 VREF GND 100 R6 100 R7 C9 10uF 100 R8 IN1 IN2 A0 A1 SCL SDA 6 C 2 4 6 8 10 12 14 16 18 20 PENIRQ JMP4 1 2 16 15 A1 14 13 12 11 Vcc R14 51K C1 NI J2 1 3 5 7 9 11 13 15 17 19 TSC2003IPW C2 NI C3 NI C4 NI C5 NI C6 NI C7 NI C8 NI JMP1 1 HEADER-10X2 J2A (TOP) = SAM_TSM-110-01-L-DV-P J2B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K 10 100 2 1 3 5 7 9 11 13 15 17 19 7 8 0 R5 X+ Y+ XY- U1 +VCC 2 3 4 5 0 R3 X+ XY+ YVBAT1 AUX1 VBAT2 AUX2 REFREF+ JMP3 1 2 10uF R1 J1 R10 2.7K CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 4 6 8 10 12 14 16 18 20 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA C Vcc R11 2.7K DAUGHTER-SERIAL R12 2.7K 2 4 6 -VA -5VA AGND VD1 +5VD 2 4 6 8 10 6 SCL WP JMP5 JMP2 1 3 5 +VA +5VA DGND +1.8VD +3.3VD 2 J3 1 3 5 7 9 B Vcc GND TP1 GND VSS 24LC64 TP2 1 B Vcc 4 7 JMP6 1 2 C11 1uF VCC SDA R13 2.7K A0 A1 A2 U2 8 1 2 3 Vcc 5 J1A (TOP) = SAM_TSM-110-01-L-DV-P J1B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +VD1 +5V DAUGHTER-POWER +3.3V J3A (TOP) = SAM_TSM-105-01-L-DV-P J3B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K ti A DATA ACQUISITION PRODUCTS HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA ENGINEER TITLE RICK DOWNS DRAWN BY ROBERT BENJAMIN DOCUMENT CONTROL NO. 6437756 SHEET 1 1 2 3 4 5 OF 1 TSC2003 Evaluation Module SIZE B DATE 31-Jan-2005 REV B FILE D:\tsc2003EVM\TSC2003EVM.ddb - SCH\TSC2003EVM.Sch 6 A 1 2 3 4 6 5 REVISION HISTORY REV IOVDD R5 2.7K 2 5 9 12 1 USB MCK 4 10 USB I2S 13 J6 Q2 ZXMN6A07F EXTERNAL I2C SDA SCL WP 8 A0 A1 A2 U1 VCC C9 1uF 4 1 1 3 5 7 9 11 3 2 44 43 42 41 40 39 37 38 36 35 34 32 R12 3.09K .001uF R10 27.4 R11 C13 47pF C14 47pF R7 2.7K JMP8 1 2 P1.2 P1.1 P1.0 +3.3VD C11 1uF C12 1uF C MOSI SS SCLK RESET 14 VCC J15 1 3 5 7 9 11 3 6 8 11 1Y 2Y 3Y 4Y 7 GND 2 4 6 8 10 12 EXTERNAL SPI USB RST USB SPI P3.5 JMP13 1 2 D2 +3.3VD YELLOW C25 R8 2.7K P3.4 JMP14 1 2 IOVDD P3.3 B U6 1uF 4 2 INT 3 J8 5 B 1A 2A 3A 4A 1OE 2OE 3OE 4OE JMP12 1 2 SML-LX0603YW-TR MISO SN74LVC1G07DBV SN74LVC125APW MRESET 649 2 U4 2 5 9 12 1 4 10 13 USB ACTIVE R13 4 1uF JMP11 1 2 C10 1uF EXTERNAL AUDIO DATA C27 IOVDD JMP10 1 2 C24 1uF SW DIP-8 P1.3 JMP9 1 2 SN74LVC1G07DBV ED555/2DS +5VD EXT PWR IN +1.8VD R14 390 U9 5 6 4 1 2 3 6VDC-10VDC IN D3 SML-LX0603GW-TR JMP6 PWR SELECT GREEN 3 9 U2 REG1117-5 3 C15 DL4001 0.1uF VIN C16 0.33uF VOUT GND D1 10 11 12 2 R15 10K C6 10uF 1 J9 R16 10K +5VD A +3.3VD +1.8VD IOVDD JMP7 1 2 3 4 5 6 TP6 1IN 1IN 1EN 1GND 2GND 2EN 2IN 2IN 1RESET 1OUT 1OUT 2RESET 2OUT 2OUT TPS767D318PWP CUI-STACK PJ102-B 2.5 MM SW1 1 2 4 3 24 23 22 18 17 R17 100K C7 10uF D5 SML-LX0603IW-TR R18 100K R4 10 +3.3VD RED R19 220 !" C8 10uF D4 SML-LX0603GW-TR C17 0.33uF 1.8VD ENABLE 3.3VD ENABLE 28 GREEN DATA ACQUISITION PRODUCTS REGULATOR ENABLE 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER RICK DOWNS USB-MODEVM INTERFACE DRAWN BY ROBERT BENJAMIN DOCUMENT CONTROL NO. 6463996 SHEET 1 2 A HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP IOVDD SELECT 1 SW2 1 2 3 4 5 6 7 8 PWR_DWN U7 31 30 29 27 26 25 24 23 8 21 33 2 16 15 14 13 12 11 10 9 2 4 6 8 10 12 1uF TP11 +3.3VD IOVDD C26 3 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 DVDD DVDD DVDD AVDD 9 10 11 12 13 14 15 17 18 19 20 22 27.4 XTALO XTALI PLLFILI PLLFILO MCLKI PUR DP DM DVSS DVSS DVSS AVSS MRESET TEST EXTEN RSTO P3.0 P3.1 P3.2/XINT P3.3 P3.4 P3.5 NC NC 7 1 2 3 1.5K +3.3VD U8 TAS1020BPFB SCL SDA VREN RESET MCLKO2 MCLKO1 CSCLK CDATO CDATI CSYNC CRESET CSCHNE 46 47 48 1 3 5 6 7 4 16 28 45 100pF C21 R9 J14 1uF 33pF MA-505 6.000M-C0 6.00 MHZ J7 USB SLAVE CONN 897-30-004-90-000000 I2SDOUT C23 U5 C19 C20 4 3 2 1 BCLK SN74LVC1G07DBV 33pF 24LC64I/SN GND D+ DVCC X1 C18 A0 A1 A2 USB I2S USB MCK USB SPI USB RST EXT MCK LRCLK IOVDD 4 VSS R20 75 MCLK 7 GND R6 2.7K RA1 10K I2SDIN 6 5 +3.3VD SCL C SN74LVC1G125DBV 3 6 8 11 1Y 2Y 3Y 4Y D 2 SN74LVC125APW +3.3VD TP10 14 VCC +3.3VD 5 1 3 1A 2A 3A 4A 1OE 2OE 3OE 4OE 5 2 4 4 1uF U3 APPROVED J10 EXT MCLK U10 3 R3 2.7K TP9 SDA 1uF 5 C22 Q1 ZXMN6A07F D C28 IOVDD IOVDD +3.3VD ENGINEERING CHANGE NUMBER 3 4 5 OF 2 FILE SIZE B REV B DATE 28-Oct-2004 D:\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\USB Interface 6 1 2 3 4 5 6 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D 1 2 3 D J11 J12 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 2 4 6 8 10 12 14 16 18 20 +5VA J13A (TOP) = SAM_TSM-105-01-L-DV-P J13B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K DAUGHTER-ANALOG J11A (TOP) = SAM_TSM-110-01-L-DV-P J11B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +5VA +5VD JMP1 1 2 +VA +5VA DGND +1.8VD +3.3VD -VA -5VA AGND VD1 +5VD 2 4 6 8 10 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA SCLK SS P3.3 J12A (TOP) = SAM_TSM-110-01-L-DV-P J12B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +5VA TP2 10uF C2 +5VD TP3 10uF C3 TP4 10uF JMP3 PWR_DWN INT JMP4 MISO +3.3VD MOSI R1 R21 390 J1 -5VA R22 390 SCL 2.7K J2 +5VA D6 SML-LX0603GW-TR D7 SML-LX0603GW-TR GREEN GREEN J3 +5VD TP5 +1.8VD C RESET IOVDD 2 C1 P3.5 P1.0 1 -5VA P3.4 +5VD JMP2 1 2 TP1 JMP5 2 4 6 8 10 12 14 16 18 20 -5VA DAUGHTER-POWER TP7 TP8 AGND DGND JPR-2X1 C CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 DAUGHTER-SERIAL J13 1 3 5 7 9 1 3 5 7 9 11 13 15 17 19 2 A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND 1 1 3 5 7 9 11 13 15 17 19 C4 C5 10uF 10uF J4 +1.8VD R2 SDA 2.7K I2SDOUT J5 +3.3VD I2SDIN LRCLK BCLK J21 1 3 5 7 9 11 13 15 17 19 B A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND J22 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 2 4 6 8 10 12 14 16 18 20 1 3 5 7 9 11 13 15 17 19 +5VA DAUGHTER-ANALOG J21A (TOP) = SAM_TSM-110-01-L-DV-P J21B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +1.8VD +VA +5VA DGND +1.8VD +3.3VD GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA 2 4 6 8 10 12 14 16 18 20 P1.1 B P1.2 P1.3 MCLK DAUGHTER-SERIAL J23 1 3 5 7 9 CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 -VA -5VA AGND VD1 +5VD 2 4 6 8 10 -5VA J22A (TOP) = SAM_TSM-110-01-L-DV-P J22B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K DAUGHTER-POWER +3.3VD +5VD J23A (TOP) = SAM_TSM-105-01-L-DV-P J23B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K !" A DATA ACQUISITION PRODUCTS A HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER RICK DOWNS DRAWN BY ROBERT BENJAMIN USB-MODEVM INTERFACE DOCUMENT CONTROL NO. 6463996 SHEET 2 1 2 3 4 5 OF 2 FILE SIZE B REV B DATE 28-Oct-2004 D:\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\Daughtercard Interface 6 FCC Warnings This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. 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TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Please read the EVM User's Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For further safety concerns, please contact the TI application engineer. Persons handling the product must have electronics training and observe good laboratory practice standards. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. EVM WARNINGS AND RESTRICTIONS It is important to operate this EVM within the input voltage range of 3.3 V to 5 V and the output voltage range of 0 V to 5 V. 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TSC2003EVM-PDK
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