TSC2020IRTVR

TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C™ Serial Interface for 3 × 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • • • • • • • (1) Supports up to 3.5-Inch Analog Matrix Sensor with 3 × 5 Multiple Touch Resolution and 12-Bit Global Resolution Supports Both Finger and Stylus Ratiometric Conversion Single 1.6V to 3.6V Supply Preprocessing to Reduce Bus Activity I2C Interface Supports Standard, Fast, and High-Speed Modes Internal Detection of Screen Touch Register-Based, Programmable: – Sampling Rates, System Timing, Zoning, Normal/Fast Scan Mode On-Chip Temperature Measurement Auto Power-Down Control Low Power: – 70.72µW at 1.6V, at 8.2kSPS Eq Rate, ST – 87.5µW at 1.8V, at 8.2kSPS Eq Rate, ST – 675µW at 1.8V, at 250SSPS Worst-Case, MT (average 300µW at 1.8V, 50SSPS, 3T) Enhanced ESD Protection to Assist IEC Testing: – ±12kV Air – ±11kV Contact Packages: 5 × 5 QFN-32, 2.5 × 2.5 WCSP(1) Smart Phones, Feature Phones MIDs, Netbooks, and eBooks Digital Picture Frames Portable Instruments MP3 Players, GPSs, PNDs, and PMPs DESCRIPTION The TSC2020 is a very low power, resistive touch screen controller designed to work with power-sensitive, handheld applications that are based on advanced low-voltage processors. This device works with a supply voltage as low as 1.6V that can be supplied by a single-cell battery. The TSC2020 contains a complete, ultra-low power, 12-bit, analog-to-digital converter (ADC) including sensor drivers and the control logic to measure touch pressure. Unlike other resistive touch screen controllers, the TSC2020 is capable of detecting at least three touches simultaneously and delivers a very low power standby touch detection scheme. This flexibility allows for many new applications that require multiple touches but must remain at low power. The TSC2020 supports the I2C serial bus and data transmission protocol for all three defined modes: standard, fast, and high-speed. The TSC2020 offers programmable resolution, single-/multi-touch modes to accommodate different screen types, sizes, and application needs. The TSC2020 is available in a 32-pin 5 × 5 QFN package, and is characterized for the –40°C to +85°C industrial temperature range. WCSP (YZK) package available Q2, 2011. U.S. Patent Nos. 6,246,394; 7,812,830; other patents pending. Functional Block Diagram AUX GND Analog Matrix Touch Screen Drivers Interface TEMP Sensor PENIRQ DAV Multi-Touch Control PINTDAV SCL Touch Engine with Analog Signal Processing Preprocessing XiYjXi+ Yj+ Zoning Control Internal Clock VDD I2C Serial Interface and Control SDA AD0 RESET 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. I C is a trademark of NXP Semiconductors. All other trademarks are the property of their respective owners. 2 2 3 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT TYPICAL INTEGRAL LINEARITY (LSB) TSC2020I (1) (2) TYPICAL GAIN ERROR (LSB) ±0.5 NO MISSING CODES RESOLUTION (BITS) +0.1 PACKAGE TYPE PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING 32-Pin, 0.75 × 5 x 5 Thin QFN RTV –40°C to +85°C TSC2020I 25-Pin 2.5 × 2.5 WCSP 5 × 5 Matrix YZK (2) ORDERING NUMBER TSC2020IRTVT Small Tape and Reel, 250 TSC2020IRTVR Tape and Reel, 3000 TSC2020IYZKT Small Tape and Reel, 250 TSC2020IYZKR Tape and Reel, 3000 11 –40°C to +85°C TRANSPORT MEDIA, QUANTITY TSC2020I For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or visit the device product folder at www.ti.com. WCSP (YZK) package available Q2, 2011. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). Analog inputs Xi+, Xi–, Yj+, Yj–, AUX to GND Voltage range TSC2020 UNIT –0.4 to VDD + 0.1 V –0.3 to 5 V VDD to GND –0.3 to 5 V Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Digital pin voltages to GND Junction temperature, TJ Max +150 °C IEC contact discharge (2) Xi+, Xi–, Yj+, Yj– ±11 kV IEC air discharge (2) Xi+, Xi–, Yj+, Yj– ±12 kV (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details. THERMAL INFORMATION TSC2020 THERMAL METRIC (1) RTV YZK 32 PINS 25 PINS θJA Junction-to-ambient thermal resistance 32.1 99.4 θJCtop Junction-to-case (top) thermal resistance 15.4 5.5 θJB Junction-to-board thermal resistance 5.8 35 ψJT Junction-to-top characterization parameter 0.2 13.0 ψJB Junction-to-board characterization parameter 5.7 37.7 θJCbot Junction-to-case (bottom) thermal resistance 1.2 N/A (1) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TSC2020 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TSC2020IRTVR ACTIVE WQFN RTV 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TSC2020IRTVT ACTIVE WQFN RTV 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TSC2020IRTVR WQFN RTV 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 TSC2020IRTVT WQFN RTV 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSC2020IRTVR WQFN RTV 32 3000 367.0 367.0 35.0 TSC2020IRTVT WQFN RTV 32 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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