TSC2101EVM
Touch Screen Controller Evaluation Module
User’s Guide
February 2004
Data Acquisition − Industrial Audio
SLAU112A
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Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2004, Texas Instruments Incorporated
EVM IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION
PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided
may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety measures typically found in the end product incorporating the goods.
As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic
compatibility and therefore may not meet the technical requirements of the directive.
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned
within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE
WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products
received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about temperatures
and voltages. For further safety concerns, please contact the TI application engineer.
Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any
machine, process, or combination in which such TI products or services might be or are used.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2004, Texas Instruments Incorporated
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 0 VDC to 10 VDC and the
output voltage range of 3 VDC as described in the EVM User’s Guide.
Exceeding the specified input range may cause unexpected operation and/or irreversible
damage to the EVM. If there are questions concerning the input range, please contact a TI
field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to
connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than
40°C. The EVM is designed to operate properly with certain components above 80°C as long
as the input and output ranges are maintained. These components include but are not limited
to linear regulators, switching transistors, pass transistors, and current sense resistors. These
types of devices can be identified using the EVM schematic located in the EVM User’s Guide.
When placing measurement probes near these devices during operation, please be aware
that these devices may be very warm to the touch.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2004, Texas Instruments Incorporated
Preface
Read This First
About This Manual
This user’s guide describes the function and operation of the TSC2101 touch
screen controller evaluation module. This manual helps the user quickly set
up the evaluation board and its accompanying software, to rapidly test and
evaluate the TSC2101. A complete circuit description, schematic diagram,
and bill of materials are included.
How to Use This Manual
This manual begins with an introductory chapter that describes the EVM and
what it can do. If the user is anxious to set up the EVM and start testing, it is
recommended that the user reads at least the first two chapters. These two
chapters introduce you to the board and how to set it up. Later chapters go into
more detail on the board’s design and how to access its many features.
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
Read This First
-3
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Related Documentation From Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas Instruments literature response center at (800) 477−8924 or the product information
center (PIC) at (972) 644−5580. When ordering, please identify this booklet
by its title and literature number. Updated documents can also be obtained
through the TI Web Site at www.ti.com.
Data Sheets
Literature Number
TSC2101
SLAS392
TAS1020B
SLES025A
TPS767D301/318
SLVS209D
SN74LVC125A
SCAS290M
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested
for compliance with the limits of computing devices pursuant to subpart J of
part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case
the user at his own expense will be required to take whatever measures may
be required to correct this interference.
Trademarks
3M is a trademark of 3M Company
I2S is a trademark of Philips Corporation
SPI is a trademark of Motorola
Windows is a registered trademark of Microsoft Corporation. (Windows 95, Windows)
-4
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
EVM Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
Analog Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4
External Voltage Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6
Computer Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-2
1-2
1-3
1-3
1-3
1-3
2
Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1
Unpacking the EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2
Default Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3
Quick Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-2
2-2
2-3
3
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.1 Power Supply Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.2 SPI Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.3 I2S Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.4 MCLK Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.5 USB Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.6 Cap or Capless Headset Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1 Power Supply Current Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2 MIC BIAS Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.3 MIC Input Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.4 EEPROM A1 Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.5 Power Supply Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.6 IOVDD Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.7 AUX Input Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
I/O Connector and Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.1 Audio Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.2 USB Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3 External Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4 Audio Data (I2S) Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.5 External SPI Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.6 Touch Screen Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.7 Analog Input Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.1 USB Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-2
3-2
3-2
3-3
3-3
3-3
3-3
3-3
3-4
3-4
3-4
3-4
3-4
3-5
3-5
3-5
3-5
3-6
3-6
3-7
3-7
3-8
3-8
3-8
3-8
Contents
-5
3.5
4
3.4.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.4.3 Touch Screen and Analog Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.4.4 Audio Interface Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Program Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.5.1 Human Interface Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.5.2 Data Acquisition Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.5.3 Configuration Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
3.5.4 Audio Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20
Physical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2
EVM Board Silk Screen/Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3
Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-2
4-5
4-6
Figures
1−1
2−1
3−1
3−2
3−3
3−4
3−5
3−6
3−7
3−8
3−9
3−10
3−11
3−12
3−13
3−14
3−15
3−16
3−17
3−18
4−1
-6
TSC2101 Evaluation Kit Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Default Software Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Human Interface Screen (Solid Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
Human Interface Screen (Dot Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
Data Acquisition Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
Data Acquisition Screen With Enabled Buffer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
Human Interface Screen WIth Enabled Buffer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
Reading Content List Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
Configuration Screen at Median Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Configuration Screen With External Reference Selection . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19
Audio 1 Screen at Default . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
Audio 2 Screen at Default . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
Base Boost Filter Screen at Default . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23
Audio 2 Screen With Headset AGC On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
Audio 2 Screen With Handset AGC On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
Audio 2 Screen With Cell-Phone AGC On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28
Bass Boost Filter Screen With Different Left/Right Channels . . . . . . . . . . . . . . . . . . . . . . . 3-30
Bass Boost Filter Screen With Bad Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31
Bass Boost Filter Screen With Boost Filter Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32
Top Board Layer Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
Tables
2−1
3−1
3−2
3−3
3−4
3−5
3−6
3−7
3−8
3−9
3−10
3−10
Default Configuration Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch Function Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Jumper Function Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JUMP4 Settings Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Other Audio Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USB Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio Data Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External SPI Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Touch Screen Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Input Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2-2
3-2
3-3
3-4
3-5
3-6
3-6
3-6
3-7
3-7
3-8
3-8
-7
-8
Chapter 1
Introduction
The TSC2101 is an advanced touch screen controller, which communicates
to a host processor through an SPI serial interface. In addition, a
mono-input/stereo-output audio codec is included in the TSC2101, and audio
data is communicated to the device over an I2S bus. The TSC2101EVM
accesses both of these buses through the use of a USB microcontroller, which
provides a way to generate data for both buses from a PC running
Windows 98SE, 2000, or XP.
Topic
Page
1.1
Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2
EVM Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3
Analog Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.4
External Voltage Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.5
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.6
Computer Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Introduction
1-1
Device Characteristics
1.1 Device Characteristics
The TSC2101 is a complete PDA analog interface circuit. It contains a
complete 12-bit A/D resistive touch screen converter, including the drivers and
the control to measure touch pressure. The TSC2101 interfaces to the host
controller through a standard SPI serial interface. The TSC2101 offers two
auxiliary analog inputs and one battery voltage measurements. The battery
measurement is capable of reading battery voltages up to 6 V, while operating
with only a 2.7-V supply. It also has an on-chip temperature sensor capable
of reading 1°C resolution.
In addition to these features, the TSC2101 has a high performance audio
codec. Access to the audio DAC and ADC sections of the TSC2101 is through
an I2S interface. For more detail about TSC2101 device, refer to the TSC2101
data sheet.
1.2 EVM Block Diagram
A block diagram of the TSC2101 evaluation kit is shown in Figure 1−1.
Figure 1−1. TSC2101 Evaluation Kit Block Diagram
J9
Loud Speaker
J8
OUT8
J7
OUT32
Headset
J6
External MICIN
SW2
TSC2101
CP_OUT
Y+
X−
Buffer
J3
(USB Controller)
3.3 VA
1.8 V
3.3 V
J4
3.9 V
SW1
GND
External SPI
AUX2
Firmware Storage
Voltage
Regulators
2
AUX1
VBAT
J5
GND
J10
VREF
USB
J11
J12
6−10 Vdc
External Inputs
EEPROM
2
External Ref
I2C
Touch Screen
3
J14
TAS1020B
CP_IN
X+
Analog
SPI
Buffer
4
BUZ_IN
Y−
4
External I2S
GND
J1
I2S
5
J2
MK1
Onboard
MIC
Audio
J13
2.5 mm
The digital control interface is through either the USB bus or an external SPI
bus, selectable through the SW2. While the SW2 is not at the USB-controlled
position, the onboard SPI bus from the onboard microprocessor is disabled,
allowing the external SPI bus to control the TSC2101.
1-2
Analog Inputs/Outputs
Power supplies are derived from the USB bus, or may be provided to the kit
through external connectors from an external user-supplied laboratory power
supply.
1.3 Analog Inputs/Outputs
Touch screen inputs are provided to the controller through J3. This connector
is standard on 3M Touch Systems (formerly MicroTouch) TouchTek 4 touch
screens. Alternate touch screen input connections are provided on the J1
terminal block. The other analog inputs are brought onto the board through the
J4 terminal block. The AUX inputs must be between 0 V and 3.3 V, whereas
the battery input VBAT can range from 0 V to 6 V.
On the audio side, there are various audio input/output connectors or plugs
that allow the onboard microphone (MK1) or external microphone (J6) signal,
and a cell phone input signal or a BUZZ input (J2), into the device. The J8
output terminal provides a connector to a 32-Ω speaker; and the J9 output
terminal provides a connector to an 8-Ω speaker. Also, a headset can be
directly connected into the EVM board through the J7 audio plug.
1.4 External Voltage Reference
If the external voltage reference is used, the reference can be input to the
TSC2101 device through the J5 terminal block.
1.5 Power Requirements
The TSC2101EVM can be powered from either the USB port or an external
6-Vdc to 10-Vdc power supply.
1.6 Computer Requirements
The TSC2101EVM software is designed for a Windows based platform PC
that supports USB (Windows 98SE, 2000, XP, etc).
Minimum requirements include:
-
IBM-compatible Pentium PC or higher
Windows 98SE/2000/XP
64-MByte RAM minimum
20-MByte available hard disk space
CD-ROM drive
USB port
Introduction
1-3
1-4
Chapter 2
Getting Started
This chapter guides you through unpacking your EVM and setting it up so you
can begin working with it immediately.
Topic
Page
2.1
Unpacking the EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2
Default Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3
Quick Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Getting Started
2-1
Unpacking the EVM
2.1 Unpacking the EVM
When unpacking the TSC2101EVM, check the material in the box. The EVM
kit includes the following:
- TSC2101EVM board, PWB 6444330
- CD−ROM, 6444333
If any of these components is missing, contact Texas Instruments for a
replacement.
2.2 Default Configuration
The TSC2101EVM features a few simple means of configuring its operation.
The default settings are shown in Table 2−1. When you unpack your
TSC2101EVM, ensure that the board is initially configured as listed in
Table 2−1.
Table 2−1. Default Configuration Settings
Board
Identifier
Description
SW1
Onboard power supply enables:
SW2
On/OFF board control selection:
Default Setting
1.8 V Enable
SW1_1
ON (Enabled)
3.9 V Enable
SW1_2
ON (Enabled)
3.3 V Enable
SW1_3
ON (Enabled)
Spare
SW1_4
OFF
Onboard I2S
SW1_1
ON (Onboard)
Onboard MCLK
SW1_2
ON (Onboard)
Onboard SPI
SW1_3
ON (Onboard)
USB Reset
SW1_4
ON (Enabled)
SW3
Headset cap/cap-less selection:
Cap-Less Output
JMP3
MIC BIAS source from (3.3 V or TSC2101)
2 to 3 (TSC2101)
JMP4
Differential MIC input selection
Removed (Single-ended)
JMP5
FW Boot source selection
Installed (EEPROM)
JMP6
Power Supply (USB or external) selection
1 to 2 (USB)
JMP7
TSC2101 IOVDD (3.3 V or 1.8 V) power selection
1 to 2 (3.3 V)
JMP8
AUX2 resistance measurement
Removed
JMP9
AUX1 resistance measurement
Removed
Notes:
1) For more detail about the onboard configurations, refer to the next chapter.
Notes:
2) JMP1, JMP2, and JMP10 through JMP13 are installed by default. These jumpers can be replaced by current meters
for evaluating or testing the corresponding power consumption.
2-2
Quick Start
2.3 Quick Start
Once the TSC2101EVM has been unpacked and you have verified that the
board is configured as shown in Table 2−1, install the software.
Place the CD-ROM into the CD-ROM drive of the PC. Locate and run the Setup
program on the disk. The Setup program installs the TSC2101EVM software
on your PC. Note that if you are running Windows 2000 or XP, you need
administrator privileges to install the software. Follow the instructions provided
by the installer.
When the installation is complete, connect a USB cable from the PC to the
TSC2101EVM. When the TSC2101EVM is connected to the PC the first time,
the user may see a message that a Human Interface / Audio Device has been
connected. Once this connection has been made, launch the TSC2101EVM
software on the PC.
The software should automatically find the TSC2101EVM. If the board is
found, the screen shown in Figure 2−1 appears.
Figure 2−1. Default Software Screen
Getting Started
2-3
Quick Start
In order to use the touch screen features, a 4-wire resistive touch screen must
be connected to J3 or J1 of the TSC2101EVM.
If a speaker is connected to J9 (the loud speaker connection terminal), a ding
sound is heard when the USB cable from the PC is plugged into J10 of the
EVM. Additional dings are heard when launching the software.
The EVM is set to default with the side-tone function enabled. Therefore, when
powered up, signals to the onboard, mini-microphone (MX1) are heard
through the speaker connected to J9.
2-4
−
Chapter 3
Operation
This chapter describes each function of the TSC2101 evaluation kit and how
to use the accompanying software to control and use the TSC2101.
Topic
Page
3.1
Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.2
Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3
I/O Connector and Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.4
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.5
Program Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Operation
3-1
Switches
3.1 Switches
Table 3−1 shows the function of each switch on the EVM.
Table 3−1. Switch Function Reference
Reference
Designator
SW1−1
SW1
SW1−2
SW1−3
SW2−1
SW2−2
SW2
SW2−3
SW2−4
SW3
3.1.1
Setting
Function
ON
1.8-V power supply enabled
OFF
1.8-V power supply disabled
ON
3.9-V power supply enabled
OFF
3.9-V power supply disabled
ON
3.3-V power supply enabled
OFF
3.3-V power supply disabled
ON
Onboard I2S selected
OFF
External I2S selected
ON
Onboard MCLK selected
OFF
External MCLK selected
ON
Onboard SPI selected
OFF
External SPI selected
ON
USB reset connected to the TSC2101
OFF
USB reset is not connected to the TSC2101
CAP
Output to headset jack with CAPs
CAPLESS
Output to headset jack without CAPs
Factory
Default
Subsection
ON
3.1.1
ON
3.1.3
ON
3.1.4
ON
3.1.2
ON
3.1.5
CAPLESS
3.1.6
Power Supply Selection
SW1 enables or disables the onboard power supplies, including the 1.8 V, the
3.3 VA, and the 3.9 V, so that the power up/down performance of the TSC2101
can be evaluated. The 1.8 V provides the 1.8-V digital core power for the
TSC2101; the 3.3 VA provides the analog power supply for the TSC2101; and
the 3.9 V gives the analog driver power for the TSC2101.
Note that the EVM board has four regulated power supplies. In addition to the
1.8 V, 3.3 VA and 3.9 V supplies, the forth power supply 3.3 V cannot be
disabled. This power supply provides the power for the TSC2101’s digital I/Os,
when selected, and the power for the USB control device TAS1020B.
3.1.2
SPI Selection
The SPI bus on the TSC2101 provides the main interface between a host
processor and the TSC2101 device. The onboard TAS1020B plays the role of
the host processor, if the SW2−3 is set ON. If an external processor or SPI
device is used, set the SW2−3 to the OFF position so as to disable the onboard
SPI interface and open the TSC2101 SPI port to the external SPI bus.
3-2
Jumpers
3.1.3
I2S Selection
The I2S bus on the TSC2101 can interface with the onboard host processor,
the TAS1020B USB controller, or with other offboard external I2S processor
or devices. When the SW2−1 is set to ON, the manufacture default, the
TSC2101 I2S is connected to the TAS1020B’s I2S. Otherwise, if the SW2−1
is shifted to OFF, the buffer between the onboard I2S ports is disabled so that
an external I2S can communicate with the TSC2101 I2S port.
3.1.4
MCLK Selection
The TSC2101 needs a proper MCLK for the basic audio ADC/DAC functions.
The onboard processor, TAS1020B, generates an 11.2896-MHz frequency to
provide the MCLK. If an external MCLK is preferred, turn off the SW2−2.
3.1.5
USB Reset
A reset signal output from the onboard TAS1020B processor can be used to
reset the TSC2101 whenever the TAS1020B is resetting. SW2−4
enables/disables the connection. By default, the connection is enabled. If the
processor is not active, the connection to TSC2101 should be disabled by
turning off the SW2−4.
3.1.6
Cap or Capless Headset Interface
Corresponding to the onchip cap or capless headset interface selection, the
EVM has the SW3 built in for use with the different headset interface
configurations. For more details, refer to the TSC2101 data sheet.
3.2 Jumpers
Table 3−2 shows the function of each jumper on the EVM.
Table 3−2. Jumper Function Reference
Reference Designator
JMP1, JMP2,
JMP10, JMP11,
JMP12, JMP13
JMP3
Setting
Function
Removed
Power is not provided to the TSC2101
Installed
Power is provided to the TSC2101
1 to 2
MIC BIAS from fixed resistor
2 to 3
MIC BIAS from TSC2101
JMP4
JMP5
JMP6
JMP7
JMP8
JMP9
Differential MIC input selection
Removed
FW boot from external resources
Installed
FW boot from EEPROM
1 to 2
EVM board power supply by USB
2 to 3
EVM board power supply externally
1 to 2
TSC2101 uses 3.3 V IOVDD
2 to 3
TSC2101 uses 1.8 V IOVDD
Removed
AUX2 as voltage measurement
Installed
AUX2 as resistance measurement
Removed
AUX1 as voltage measurement
Installed
AUX1 as resistance measurement
Factory Default
Subsection
Installed
3.2.1
2 to 3
3.2.2
Removed
3.2.3
Installed
3.2.4
1 to 2
3.2.5
1 to 2
3.2.6
Removed
3.2.7
Removed
Operation
3-3
Jumpers
3.2.1
Power Supply Current Measurement
Six jumpers are on the front of the six power supply pins of the TSC2101. The
jumpers can be replaced by current meters that measure and monitor the
currents to the corresponding power supply pins. Refer to Table 2−1, Note 2.
3.2.2
MIC BIAS Selection
JMP3 selects the handset microphone bias to come from the TSC2101
(MICBIAS_HND pin) or from an external resistor, R14, which is not installed
on the TSC2101EVM board. If an external bias is needed, the appropriate size
resistor can be soldered into the R14 location on the board, and JMP3 is set
to connect between positions 1 and 2. If the microphone bias is not required,
do not install the jumper top for JMP3 in any position.
3.2.3
MIC Input Selection
The headset microphone input MICIN_HED and the handset microphone
input MICIN_HND can be connected to the TSC2101 device in single-ended
mode.
Differential microphone input is selected using pins MICIN_HED and
AUX1/AUX2 as a differential input pair; and/or by using the pins MICIN_HND
and AUX1/AUX2 as differential input pair, selected through bits 5 to 7 (D5, D6,
D7) in the TSC2101 control register page 02 and address 0x03. If a differential
microphone input is selected, the JMP4 must be set to provide the
AUX1/AUX2 with microphone bias. Table 3−3 gives the JMP4 settings
corresponding to the selected differential inputs.
Table 3−3. JUMP4 Settings Reference
3.2.4
Reference
Designator
Setting
MICIN Selection
JMP4
All removed
Single-Ended MICINs
4 to 6
MICIN_HED and AUX1 differential pair
4 to 2
MICIN_HED and AUX2 differential pair
3 to 5
MICIN_HND and AUX1 differential pair
3 to 1
MICIN_HND and AUX2 differential pair
EEPROM A1 Select
The TSC2101EVM loads its firmware from an onboard EEPROM. In order to
use the firmware in this EEPROM, its A1 address line must be pulled low;
therefore, JMP5 should stay installed for normal use.
This jumper can be removed when firmware updates are to be made.
3.2.5
Power Supply Selection
The TSC2101EVM can be powered from the USB port directly, or an external
power supply can be provided through J11 or J12. JMP6 allows the user to
select either the USB or external power sources.
3-4
I/O Connector and Signals
3.2.6
IOVDD Voltage Selection
One of the features of the TSC2101 device is that the digital IO power supply
for the TSC2101 device is flexible, ranging from 1.1 V to 3.6 V. To evaluate the
feature, the EVM has the JMP7 for the selection of the IOVDD, either 3.3 V
(JMP7 to 1 and 2 position), or 1.8 V (JMP7 to 2 and 3 position).
3.2.7
AUX Input Selection
The auxiliary analog input pins, AUX1 and AUX2, can be used to measure the
voltages applied on the pins or the resistance on the pins, selectable in the
TSC2101 control register page 1 and address 0x0C. Also, under the
resistance measurement mode, there are two operation modes, either internal
bias or external bias resistance measurement. When AUX1 is used for the
external bias resistance measurement, install the JMP9; when AUX2 is used
for the external resistance measurement, install the JMP8. Otherwise, leave
the jumper(s) uninstalled. Refer to the TSC2101 data sheet for more details.
Additionally, the AUX1 or AUX2 can be paired with the MICIN−HED or
MICIN−HND to be used as the TSC2101 audio codec’s differential
microphone input port. Refer to section 3.2.3 and the TSC2101 data sheet for
more details.
3.3 I/O Connector and Signals
The various connectors on the TSC2101EVM are described in this section.
3.3.1
Audio Connectors
The TSC2101 audio inputs and outputs are routed through the 3,5-mm jacks
or terminal blocks. Note the polarity of channel assignments for these
connectors.
Table 3−4. Audio Connectors
Reference
Designator
Name
Description
Tip = mic input
J6
Mic In
Microphone input to handset
microphone in (MICIN_HND)
ring = mic bias voltage (or MICIN if
differential)
sleeve = ground
tip1 = headset microphone input
tip2= headset right output channel
J7
HEADSET
Headset input/output connection
ring = headset left output channel
sleeve = audio common ground
OUT32
Receiver driver (32-Ω output)
connection
J8+ = OUT32P(SPK1)
J8
OUT8
Loud speaker (8-Ω output)
connection
J9+ = OUT8P
J9
J8− = OUT32M
J9− = OUT8M
Operation
3-5
I/O Connector and Signals
Additionally, the cell-phone input and output signals can be brought to the EVM
board through the terminal block J2. The buzz input is also routed to J2.
Table 3−5. Other Audio Inputs
Reference
Designator
J2
3.3.2
Description
Other audio inputs
Pin
Number
Signal Name
Function
1
CP IN
Cell-phone input
2
CP OUT
Cell-phone output
3
BUZZ IN
Buzz signal input
4
GND
Ground
USB Interface Connector
Connection to a USB cable from a PC is made through J10, a standard USB
type-B receptacle.
Table 3−6. USB Interface Connector
Reference
Designator
J10
3.3.3
Description
USB slave connection to PC
Pin
Number
Signal Name
Function
1
VCC
+5-V supply from USB
2
D−
−Differential USB signal
3
D+
+Differential USB signal
4
GND
Ground
External Power Connectors
Whereas it is most convenient to power the TSC2101EVM from the USB bus,
external power supplies can be used. The two connectors detailed in
Table 3−7 are provided for the external power.
Table 3−7. External Power Connectors
Reference
Designator
J11
J12
3-6
Description
Pin Number
Signal Name
External power
1
6-Vdc to 10-Vdc input
Terminal block
2
Ground
External power jack
—
6-Vdc to 10-Vdc input, positive center terminal
I/O Connector and Signals
3.3.4
Audio Data (I2S) Connector
The I2S bus, which carries audio data to and from the TSC2101, is connected
to header J13. The I2S signals from the on-board host processor (TAS1020B)
can be disabled by turning off the SW2−1. Also refer to the previous section
on switch settings.
Table 3−8. Audio Data Connector
Reference
Designator
Audio data (I2S) connector
J13
3.3.5
Description
Pin Number
Signal Name
1
MCLK
3
BCLK
5
LRCLK
7
I2SDIN
9
I2SDOUT
11
Power down
2, 4, 6, 8, 10, 12
Ground
External SPI Connector
The TSC2101 SPI port is connected to header J14. It can be driven by an
external source if the onboard microprocessor is disabled by turning off the
SW2−3 and removing the A1 select jumper (JMP5). Also refer to the previous
sections on switch and jumper settings.
Table 3−9. External SPI Connector
Reference
Designator
J14
Description
External SPI bus
Pin
Signal Name
Function
1
RESET
Reset line
3
SS
Slave select for SPI bus
5
SCLK
Serial clock for SPI bus
7
MOSI
Master out, slave in data line
9
MISO
Master in, slave out data line
11
PENIRQ
Pen down or DAV interrupt line
2, 4, 6, 8,
10, 12
GND
Ground
Number
Operation
3-7
Circuit Description
3.3.6
Touch Screen Connectors
A 4-wire touch screen connects to the EVM board through connector J3. This
connector is standard on 3M Touch Systems (formerly MicroTouch) TouchTek
4 touch screens. A standard terminal block connection is available on J1 for
those users who have touch screen connectors that do not match the J3
configuration.
Table 3−10.Touch Screen Input
Reference
Designator
J3, J1
3.3.7
Description
Touch screen input
Pin
Number
Signal
Name
Function
1
X−
Touch screen X− electrode
2
Y+
Touch screen Y+ electrode
3
X+
Touch screen X+ electrode
4
Y−
Touch screen Y− electrode
Analog Input Connector
The auxiliary and battery inputs to the touch screen controller are brought onto
the EVM board through terminal block J4. The pinout is shown in Table 3− 11.
Table 3−11. Analog Input Connector
Reference
Designator
J4
Description
Battery and auxiliary inputs
to the touch screen control
Pin
Number
Signal
Name
Function
1
VBAT
Battery input, 0 V to 6 V
2
AUX1
Auxiliary input 1, 0 V to VREF
3
AUX2
Auxiliary input 2, 0 V to VREF
4
GND
Ground
3.4 Circuit Description
The TSC2101 evaluation kit circuitry consists of a USB microprocessor, power
supply circuitry, touch screen and analog input interfaces, and audio interface
circuitry (both analog and digital). These circuits are described in the following
sections.
3.4.1
USB Microprocessor
The TSC2101EVM has a USB interface for connecting to a PC. This
connection is made through a TAS1020B streaming audio processor, U10.
The SPI interface to the TSC2101 can be controlled from two sources: the
external SPI header, J14, or through the onboard microprocessor (U10) via
USB. The U10 outputs are enabled only when the supplied firmware is loaded,
and the corresponding bus(es) is enabled, refer to switch description for SW2
in section 3.1.
The firmware resides in the serial EEPROM chip, U2. U10 only loads firmware
from U2 when the U2 A1 address line is pulled low. To disable firmware
loading, A1 must be high, by having JM5 removed. Refer to section 3.2.4.
3-8
Circuit Description
When the firmware is loaded and active, D2 (a yellow LED) is lit. If no firmware
is loaded, the U10 output should be in 3-state. In order to ensure that the
onboard host processor does NOT effect the interface between the external
SPI bus to drive the TSC2101, turn OFF the SW2−3.
When the SW2−3 is ON and the firmware is loaded, the PC software enables
the onboard microprocessor to control the SPI bus.
Caution
Do not drive the external SPI bus when the firmware is loaded and
the onboard microprocessor is active. If you want to use the
external SPI bus, disable the microprocessor by removing JMP5,
turning OFF the SW2−3 to isolate the microprocessor SPI bus, and
cycling power to the TSC2101EVM.
Likewise, the I2S signals for the digital audio can be driven either externally by
J13 or by the USB audio controller.
Caution
Do not drive the external I2S bus when the firmware is loaded and
the onboard microprocessor is active. If you want to use the
external I2S bus, disable the microprocessor by removing JMP5,
turning OFF the SW2−1 to isolate the microprocessor I2S bus, and
cycling power to the TSC2101EVM.
3.4.2
Power Supply
Power to the TSC2101EVM can be derived directly from the USB interface or
externally supplied through the J11 terminal block or the J12 barrel jack
connector. Supply voltages of 6 Vdc to 10 Vdc must be supplied from an
external supply. Because it is regulated on the TSC2101EVM, this input
voltage does not need to be regulated as long as it falls within this range. D1
prevents damage to the board in the event a power supply is connected in
reverse polarity.
Two linear regulators are on the board. U3 regulates the digital power-supply
voltage to provide 1.8 V for the TSC2101 digital core, or the digital IO power
supply if the IOVDD is selected as 1.8 V by JMP7. Also, U3 provides the 3.3-V
digital power for all of other digital circuits. U4 regulates the analog power
supplies. Its 3.9-V power supply is used for the TSC2101 analog driver power
DRVDD2; its 3.3 VA powers the rest of the analog circuits on the board.
The regulated supply voltages have LEDs attached that alert the user that the
supply is working. D2 (red) is the indicator for the 1.8-V power supply; D4
(green) is the indicator for the 3.3-V power supply; D5 (green) is the indicator
for the 3.9-V driver power; and D6 (green) is the indicator for the 3.3-VA analog
power supply.
Operation
3-9
Program Description
3.4.3
Touch Screen and Analog Inputs
Terminal block J4 provides input connection points for the battery and auxiliary
inputs. Battery input can range from 0 V to 6 V, and the auxiliary inputs can
range from 0 V to VREF. The touch screen can be connected to J3 or to the J1
terminal block.
Each of these seven inputs has a provision for an RC filter to be placed in line
with the signal. As shipped, all resistors are 0 V, and the capacitors are not
installed. If noisy conditions prevent obtaining good readings from the
TSC2101, 0.1-µF capacitors can be installed in positions C1 through C7. If
more filtering is required, the 0-V resistors should be unsoldered from the
board and replaced with small resistors. Note that increasing the capacitance
on the touch screen inputs requires increased panel voltage stabilization time
and increased precharge and sense times, thus lowering the available number
of readings per second.
3.4.4
Audio Interface Circuitry
A mono Electret microphone can be connected to J6. This jack provides both
audio and bias connections. Bias for the microphone can be supplied either
from the TSC2101 mic bias circuitry or from an external resistor, R14. R14 is
not installed on the TSC2101EVM, but can be installed by the user. Internal
or external bias is selected by JMP3.
A small onboard microphone is also on the EVM, parallel to the J6. Without an
external electrical microphone, voice can be input to the TSC2101 through this
microphone.
The TSC2101 has a built-in headset interface. J7 is the jack for connection to
the headset where the microphone input is mono and the audio output can be
stereo. The signal to the headset can be dc-decoupled through the capacitors
(C21 and C22) or capless. Note that the switch SW3 must be used according
to the software settings to work either at the CAP mode or the CAPLESS
mode. Refer to the related description in the data sheet.
The audio output can also be connected to a 32-Ω speaker through J8, and
the 8-Ω loud speaker through J9.
Additionally, the cell-phone input/output, and the buzz input, can be connected
to the TSC2101 device through the onboard terminal block J2.
3.5 Program Description
After installing the software for the TSC2101EVM as described in section 2.3,
the user can begin to evaluate and develop with the TSC2101.
3.5.1
Human Interface Screen
The program’s interface is a simple, six-tab interface. Clicking on a tab takes
you to the functions associated with that tab. The program begins on the
Human Interface screen (the default) as shown in Figure 3−1.
3-10
Program Description
Figure 3−1. Human Interface Screen (Solid Mode)
This screen reflects the touch screen from the TSC2101EVM. The status bar
at the bottom of the screen is divided into four sections and shows the status
of communication between the PC and the EVM. Starting from the left, the first
section shows the status of the connection. If an error in communication
occurs, an error message appears here; otherwise, it looks as shown in
Figure 3−1. The final section, on the right side of the status bar, shows the
number of readings per second being taken from the touch screen.
The touch screen box on this screen is updated when a touch is detected on
the touch screen. As the touch screen is drawn on, the motion on the touch
screen is translated into pixels on the screen. The software takes X and Y, or
X, Y, and Z readings, which are shown at the top of this box. Even though
TSC2101 has five different touch screen scan modes, this EVM allows only
two selections at this tab, either X and Y, or X, Y, and Z. Default is the X, Y, and
Z mode. In X and Y mode, the pixel size is fixed. In the X, Y, and Z mode, as
the touch pressure is increased, the pixel size increases. A lighter touch results
in smaller pixel sizes. Refer to Figure 3−1.
The X and Y, or X, Y, and Z mode is selected by clicking on the option at the
A/D Mode Selection Box. The touch is shown on the screen in solid mode, as
shown in Figure 3−1, or dot mode as shown in Figure 3−2. The line or dot
mode is selected by the corresponding option on the top of the drawing screen.
Operation
3-11
Program Description
The display can be cleared by pressing the Enter or Backspace key on the PC
keyboard.
Figure 3−2. Human Interface Screen (Dot Mode)
By the right side of the screen, another window is used to show the touch
screen data when the TSC2101 is under the buffer mode, which is explained
in the next section: Data Acquisition Screen.
3.5.2
Data Acquisition Screen
The data acquisition functions of the TSC2101 can be accessed on this screen
as shown on the left side of the Figure 3−3.
3-12
Program Description
Figure 3−3. Data Acquisition Screen
3.5.2.1
Nontouch Data Acquisition
At this screen with the buffer mode NOT enabled, the TSC2101 is commanded
to perform the battery and auxiliary input voltage readings, and then a TEMP1
and TEMP2 measurement. These measurements are all repeated twice every
second, and the results are displayed on the three boxes at the left side of this
screen.
3.5.2.2
Buffer Function
In the middle of the screen, the buffer mode settings can be accessed. By
default, the buffer function is disabled and all touch or nontouch data are
converted and stored to the corresponding registers. When the buffer function
is enabled, by checking the Enable option, as shown at Figure 3−4, the data
is converted and saved to the buffer registers in page 3 of the TSC2101
memory space. Refer to the data sheet for the details of the buffer function.
Operation
3-13
Program Description
Figure 3−4. Data Acquisition Screen With Enabled Buffer Function
When the buffer function is enabled, the two data-reading buttons place the
TSC2101 into either self-controlled mode, by clicking on the button Read
Buffer for Touch Screen Data, or host-controlled mode, by clicking on the
button Read Buffer for Non Touch Screen Data.
When clicking on Read Buffer for Touch Screen Data, the SW shifts from this
screen to the Human Interface screen. The touch screen data in the TSC2101
page 3 registers shows up on the right side list box when the screen is touched,
as Figure 3−5 illustrates. Note that under the buffer mode, the touch screen
data does not show up on the touch screen drawing box.
3-14
Program Description
Figure 3−5. Human Interface Screen WIth Enabled Buffer Function
When clicking on Read Buffer for Non Touch Screen Data, the TSC2101
enters auto-scan mode to perform the auto scan on AUX1, AUX2, and TEMP1.
These nontouch screen raw data are moved into the Reading Content List on
the right side of the Data Acquistion tab, as shown in Figure 3−6. The data in
Figure 3−6 is listed in this order: AUX1, AUX2, TEMP1, AUX1, AUX2, etc.
Operation
3-15
Program Description
Figure 3−6. Reading Content List Screen
With this EVM, the buffer trigger level is either 8 or 16, selected by the Buffer
Trigger Level selection slide. Even though the TSC2101 can be set to a higher
trigger level up to 64, this EVM allows only 8 or 16. The buffer function can be
controlled in either Continuous or Single Shot mode, which is selected on the
mode control option box. Refer to the data sheet for more on TSC2101 buffer
function.
The data in the list is cleared by clicking on the Clear List button on this screen.
3.5.2.3
Register Readings
Five additional register reading buttons trigger the lead corresponding
registers and move the raw data into the list. This is helpful for testing and
debugging.
3.5.3
Configuration Screen
This screen accesses all the configurable settings for the TSC2101 A/C
converter and reference as shown in Figure 3−7.
3-16
Program Description
Figure 3−7. Configuration Screen
3.5.3.1
ADC Control Section
This section controls all of the parameters of the A/D converter. Each slider
controls one parameter, whose value is shown next to the slider. Each slider
is described as follows.
- Resolution—Selects between 8−, 10−, and 12−bit resolution.
- Conversion Clock—The internal clock which runs the A/D converter can
run at 8, 4, 2, or 1 MHz. When running at 8 MHz, only 8-bit resolution is
possible; when running at 4 MHz, 8- or 10-bit resolution is possible, but
12-bit is not. These restrictions are reflected in the operation of this
program, because only 1- or 2-MHz clock rates allow 12-bit resolution to
be chosen.
- Panel Voltage Stabilization Time—This is the time that the TSC2101
allows for the touch screen to settle after turning the drivers on.
- Precharge Time and Sense Time—These two parameters are the time
allowed to precharge the touch panel capacitance and then sense to see
if the screen is touched. For more details on these parameters, refer to the
TSC2101 data sheet.
Operation
3-17
Program Description
- Average/Median—There are two ways to reduce noise effect to the ADC
result. One is averaging, where 4, 8, or 16 readings are averaged; another
option is to find the median value among 5, 9, or 15 readings. The default
is the average mode, as shown in Figure 3−7. When Median mode is
selected, you see the configuration tab as shown in Figure 3−8.
Figure 3−8. Configuration Screen at Median Mode
Note that these settings apply to all operations of the A/D converter, not just
the touch screen operations. Thus, resolution and averaging can be changed
to increase accuracy in the data acquisition functions.
3.5.3.2
Reference Section
The touch screen function is always performed using a ratiometric mode; for
all other A/D functions, a reference voltage is needed for the A/D converter.
Figure 3−7 and Figure 3−8 show this section with the TSC2101 internal
reference chosen.
The internal reference voltage can be set to either 1.25 V or 2.5 V. The internal
reference powers down between conversions to save power if the Powered
at all times checkbox is not checked. Using the Powered at all times checkbox,
this can be overridden and the reference does not power down. If the reference
is allowed to power down, the TSC2101 must allow a delay time for the
reference to power up when a conversion is to take place. This delay time can
be set using the slider in this section.
3-18
Program Description
If an external reference is to be used, it can be selected as shown in
Figure 3−9. The value of the external reference should be entered in the text
box shown.
Figure 3−9. Configuration Screen With External Reference Selection
3.5.3.3
Measurement Section
The TSC2101 supports programmable auto-temperature and auto-auxiliary
measurement mode. In the auto measurement mode, the TSC2101 can auto
start the TEMP1, TEMP2, AUX1, and/or AUX2 measurement after a
programmable interval. The checkboxes in the Measurement section provide
choices.
Additionally, the AUX1 and AUX2 can be configured to measure voltage or
resistance. Under the resistance measurement, the bias can be configured as
external or internal by checking or unchecking the box Enable External Bias
Resistance.
3.5.3.4
Threshold Section
Another feature with the temperature and auxiliary input measurements in
TSC2101 is that the maximum and minimum of the analog input can be set up
so that whenever the corresponding input signal goes outside the thresholds,
the corresponding flags are set.
Operation
3-19
Program Description
In this section, if the threshold function has not been enabled, that is the Enable
checkbox has not been checked, the corresponding MAX/MIN slider does not
move. Also note that the MAX value must be larger or equal to the MIN value.
3.5.3.5
Continuous Conversion Delay Section
In the auto measurement mode, the delays between the conversions are
programmable. This section can be used to program to delays between the
continuous conversions.
The nontouch and touch auto measurement delays can be programmed
individually. Whenever the delay is enabled, by clicking on the corresponding
checkbox, the delay-time option shows up for the selection.
The clock used here can be the internal oscillator or the external MCLK. The
clock divider (CLKDIV) is used to get 1-MHz clock for the programmable delay.
This sets the CLKDIV so that MCLK/CLKDIV = 1 MHz.
3.5.3.6
Reinitialization and Reset
Two buttons on this screen allow the user to reset and reinitialize the TSC2101.
By clicking the button SW Reset , a software device reset is issued to the
TSC2101. By clicking the button Init TSC2101 , the control registers (for ADC
and audio) revert back to the startup (firmware) default settings.
To bring the TSC2101 EVM back to its power-up status, you can click SW
Reset, followed by Init TSC2101 .
3.5.4
Audio Screens
Three tabs control the TSC2101 audio functions: Audio 1, Audio 2, and Audio
Effects Filters tabs.
Figure 3−10 shows the default condition of the Audio 1 tab with the following
sections:
INTERFACE: set up the audio I2S port
PLL: set up PLL parameters to get the desired FSref frequency
ADC: set up the audio ADC, and select the ADC input source
DAC/Outputs: set up the audio DAC and the all analog output features
GPIO1: set up GPIO1 function/status
GPIO2: set up GPIO2 function/status
3-20
Program Description
Figure 3−10. Audio 1 Screen at Default
Figure 3−11 shows the default condition of the Audio 2 tab. The functions and
setting on Audio 2 mainly control the audio analog inputs with the following
sections:
HeadSet: set up the headset input power and gain control (PGA or AGC)
function and other headset specified functions.
HandSet: set up the handset input power and gain control (PGA or AGC)
function and other handset specified functions.
Cell Phone: set up the cell-phone input power and gain control (PGA or
AGC) function.
SideTone: set up the sidetone power and gain.
KeyClick: set up the key-click tone.
Buzz Input: set up the power and gain for the input from the BUZZ_IN pin.
Operation
3-21
Program Description
Figure 3−11. Audio 2 Screen at Default
Figure 3−12 shows the default condition of the AudioEffects Filters tab. This
tab displays the boost filters, the de-emphasis filter, and the DAC and output
driver pop noise reduction functions.
3-22
Program Description
Figure 3−12. Base Boost Filter Screen at Default
3.5.4.1
Interface Section
This section (refer to Figure 3−10) controls the behavior of the I2S port (BCLK,
LRCLK, DIN, and DOUT pins). In this EVM, the audio port transfers the 16 bit
data in I2S format, and the codec reference sample rate is at 44.1 kHz.
The TSC2101 is programmed as a slave by default. The onboard processor
TAS1020B is the master, which generates the BCLK and LRCLK signal.
If the TSC2101 is used as a master, the onboard processor should be disabled
and the I2S port should be detached from the processor by turning OFF the
onboard I2S interface. Refer to the previous chapter for the hardware settings.
3.5.4.2
PLL Section
There is an on-chip phase-locked loop (PLL) on the audio codec part of the
TSC2101. The PLL can be enabled or disabled, based on the given master
clock (MCLK) to the TSC2101 and the required reference frequency (FSref)
for the codec. For more details on the PLL, refer to the TSC2101 data sheet.
The PLL can be set on the PLL Secton of Audio 1 screen (Figure 3−10).
With the EVM board, the MCLK is at 11.2896 MHz, and the reference sample
rate is at 44.1 kHz by default.
Operation
3-23
Program Description
On the bottom of the section, the corresponding FSref frequency is shown
based on the selection of:
1) the Q-value if the PLL has not been enabled, or
2) the P, J, D values if the PLL has been enabled.
3.5.4.3
ADC Section
This section (Audio 1 Tab, Figure 3−10) sets up the audio ADC power and the
analog input source.
By default, the audio ADC has been powered up so that the audio recording
function can start to run with any SW settings. By checking Power Down ADC,
audio ADC power is disabled.
The ADC sample rate can be set as a divider frequency from the reference
frequency, FSref. For example, when FSref = 44.1 kHz (set at the INTERFACE
section of the same tab), an 8-K sample rate is achieved by setting the divider
to 5.5 (44100/5.5 = 8018 Hz).
The audio ADC also has a high-pass filter, which is a submultiple of the sample
rate, to remove dc or low frequency components from the input signal.
The input signal to the audio ADC can be obtained from different analog
resources and under a different mode, selectable from the Select ADC Input
Source option list. The microphone input from the headset or the handset can
be selected; the single-ended or the differential input (paired with AUX1 or
AUX2) can be used.
Also, there is the option to connect the above selected signal or the cell-phone
input to the audio ADC.
3.5.4.4
DAC/Outputs Section
This section sets up the audio DAC power and all functions of the analog
outputs, such as the power, the gain control, and the destination, which
identifies the analog output pin or pins where the analog output signal is sent.
In the Power Down subsection, the DAC and the output driver circuits can be
powered up/down individually. By checking a checkbox, the corresponding
TSC2101 circuit is powered down.
In the SC Protect subsection, the short-circuit (SC) protection function can be
enabled or disabled. When the short-circuit protection functon is enabled and
a short-circuit occurs, all analog outputs are disabled and the corresponding
flag is set. For example, to set the headset SC protection, check the box. In
the event of a headset short circuit, all analog outputs are disabled, and D1 of
control registers in page 2 address 0x1D is set. The TSC2101 requires
hardware or software reset to return to normal operation.
Similar to the ADC, the DAC sample rate can be set as a divider frequency from
the reference FSref frequency, through the DAC Sample Rate option list.
The TSC2101 has the capability to route the stereo DAC output signals to any
of the selected analog output. To route the signals to the headset drivers (SP1
3-24
Program Description
and SP2 pins), select from the DAC Output to lists. By default, the left channel
DAC output is routed to SP1 and the right channel to SP2.
The signal routed to SP1 can also be output to the loud speaker
(OUT8P/OUT8N), if the SP1 to Loud SP checkbox is checked.
The SP1 can be used in single-ended or differential mode. In the single-ended
mode, it is driven as one channel of the stereo headset outputs, and the audio
sound is received through a headset that has been plugged into the jack J7
on the EVM. In the differential mode, the SP1 is paired with the OUT32N pin
as the receiver driver, and the audio sound is received through a speaker that
has been connected to the terminal block J8 on the EVM. Note that the receiver
driver and the headphone drivers are not allowed to be turned on at the same
time. By default, the SP1 is set to single-ended mode.
Besides the DAC outputs, other inputs, such as the SideTone, KeyClick,
CP_IN, and BUZZ_IN can be routed to speaker 1 (SP1), speaker 2 (SP2),
and/or the loud speaker (LoudSP). The routing among these signals can be
done on this section by clicking on the corresponding checkbox. The signals
to SP1, SP2, or the ADC can be output to the TSC’s cellphone output pin.
Like the audio ADC gain controls, the DAC PGA gain, can be set to
soft-stepping mode. Under the soft-stepping mode, the soft stepping can be
set to either 0.5−dB per one sample, or 0.5−dB per two samples.
The stereo DAC audio volumes is controlled three different ways by the left (L)
and right (R) volume control slides, selectable through setting the master
volume controller: 1) independent, 2) right channel controlled, or 3) left
channel controlled.
In addition to the left and right DAC channel volume controls and mutes, the
analog signals from the SPK1, SPK2, OUT8P/OUT8N (loud speaker), and
CP_OUT pins can be individually muted or unmuted.
TSC2101 supports both capacitor-coupled (cap) and capacitor-less (capless)
interfaces for headset through software. Check the box Enable Capless
Headset Output to turn on the capless outputs. Note that SW3 on the EVM
board is associated with the software setting to have the proper cap or capless
audio outputs on the EVM.
3.5.4.5
GPIO1 and GPIO2 Sections
The two GPIO pins on the TSC2101 are programmed for several different
functions, selectable through the GPIO1 or GPIO2 section. Refer to the data
sheet for all of the functions. When a GPIO pin is used as a digital output, its
status can be controlled by the GPO Command to either logic high or low.
When not being used, the GPIO pin should be put on high impedance (Hi-Z)
status.
3.5.4.6
Headset Section
The headset section is in the Audio 2 tab, which is used mainly to set up the
headset input gain through the headset PGA or the AGC, selectable by the
Headset/AUX Input AGC ON checkbox.
Operation
3-25
Program Description
By default, the AGC is OFF and the programmable gain amplifier (PGA) on the
headset circuit is selected for the gain control, allowing analog input gain
control from 0 dB to 59.5 dB. When the AGC is OFF, moving the volume slide
on the AGC OFF subsection adjusts the PGA on the MICIN_HED path and
checking the Mute box mutes the headset input signal.
When the PGA changes from the current value to a newly programmed value,
the change rate can be controlled if the PGA Soft Stepping box is checked in
the Head/Handset MIC PGA section, where the PGA changes 0.5 dB at either
1 step per sample or one step per two samples.
When the box by AGC ON is checked, the AGC is enabled and all of the options
or settings for programming the AGC are now accessible, as shown in
Figure 3−13. Refer to the TSC 2101 data sheet for setting and using the AGC.
Figure 3−13. Audio 2 Screen With Headset AGC On
In addition to the input gain control, the headset microphone bias can be
selected. The programmable de-bounce features for the headset and button
detect can also set up in this section. Refer to data sheet for the details on the
detection and de-bounce.
3-26
Program Description
3.5.4.7
Handset Section
Similar to the headset section, the handset section is used mainly to set up the
handset input gain through the handset PGA or the AGC, selectable by the
Handset Input AGC ON checkbox.
By default, when the handset AGC is OFF, and the programmable gain
amplifier (PGA) is selected for the input gain control, allowing analog input gain
control from 0 dB to 59.5 dB. Under the case (AGC OFF), moving the volume
slide on the AGC OFF subsection adjusts the PGA on the MICIN_HND path
and checking the Mute box mutes the handset input signal.
The handset and headset share the soft-stepping settings. Refer to the
explanation in the Headset Section for the feature and settings.
Similar to the headset, when the box by AGC ON is checked, the handset AGC
is enabled, as shown in Figure 3−14. Refer to the TSC 2101 data sheet for
setting and using the AGC.
Figure 3−14. Audio 2 Screen With Handset AGC On
In addition to the handset input gain control, the handset microphone bias can
be selected inside the Handset Section, similar to that in the Headset Section.
Operation
3-27
Program Description
3.5.4.8
Cell-Phone Section
The cell-phone section is used to set up the cell-phone input gain, by using the
CP_IN PGA or AGC.
When the checkbox by Cell Phone Input AGC ON, is not checked, the PGA
controls the gain, from −34.5 dB to 12 dB, and in 0.5 dB steps if the
soft-stepping option was selected. The cell-phone input is muted when the
Mute box under the slider is checked.
When the box by AGC ON is checked, the cell-phone input AGC is enabled,
as shown in Figure 3−15. Refer to the TSC 2101 data sheet for setting and
using the AGC.
Figure 3−15. Audio 2 Screen With Cell-Phone AGC On
3-28
Program Description
3.5.4.9
Sidetone Section
The TSC2101 has an analog sidetone circuit. The audio outputs of the
TSC2101 includes a mix so that the sidetone can be mixed with the audio
output signals, in proportion to their respective volume settings.
The sidetone is enabled when the PowerUp box is checked. Its volume can
be adjusted by the analog volume control slider, ranging from −34.5 dB
to12 dB, and in 0.5-dB steps if the soft-stepping option is used. The sidetone
is muted when the Mute box under the slider is checked.
At the EVM power up, the sidetone is defaulted to power up.
3.5.4.10 Keyclick Section
When the Enable Key Click box is checked, a clicking sound is heard
whenever an audio-related setting is selected or checked in the Audio 1,
Audio 2 and the Audio Effects Filters screens.
The volume, frequency, and duration (length) of this keyclick can be adjusted
using the corresponding slider and selectors.
At the EVM power up, the keyclick is enabled by default.
3.5.4.11 Buzz Input Section
The buzzer input from the cell phone can be routed to TSC2101 through the
BUZZ_IN pin, if the checkbox by PowerDown is not selected. This input path
supports the PGA range of from −45 dB to 0 dB, and in 3 dB steps if the
soft-stepping option was chosen.
3.5.4.12 Audio Effects Filters Screen
The Audio Effects Filters screen displays all of the coefficients for the boost
filter function of the TSC2101. These coefficients are programmable. Refer to
the default Audio Effects Filters Screen shown in Figure 3−12.
Different filter coefficients can be loaded for left and right channels, although
usually these are set the same. Figure 3−16 shows an example with the
different left and right channel filters.
Operation
3-29
Program Description
Figure 3−16. Bass Boost Filter Screen With Different Left/Right Channels
If changes are made to coefficient values directly, the response can be viewed
on the graph by pressing the View Response button. It is recommended that
the user view the response before downloading values to the TSC2101, as
some values can cause clipping or oscillation of the filter. The filter equation
is described in the TSC2101 data sheet. When the entered data is outside the
range, a warning window appears to indicate the improper coefficient entered,
as shown in Figure 3−17.
3-30
Program Description
Figure 3−17. Bass Boost Filter Screen With Bad Data
In addition to the direct coefficient settings previously described, there are six
preconfigured filters designed with the EVM software, selectable using the
drop-down list of this screen, refer to Figure 3−18. On selection, the
coefficients are updated along with the graph of the filter response to the
selection. However, nothing is loaded into the TSC2101 until the Download
button is pressed.
Checking the Boost Filter box enables the filter selected.
In addition to the boost filter, is another digital filter, the de-emphasis filter is
provided by TSC2101 for the audio DAC. Checking the Deemphasis Filter On
box enables the filter.
Settings on this tab can reduce the pop noise heard at the moment the power
supply (-ies) is brought up to the TSC2101. The pop noise reduction can be
set on the DAC or the analog output driver circuit. Click on the Enable DAC PR
checkbox to enable the DAC pop reduction feature. Click on the Enable Driver
PR checkbox to enable the output driver pop reduction feature. Set the Clock
Frequency and duration to change and optimize the noise reduction effects.
Operation
3-31
Program Description
Figure 3−18. Bass Boost Filter Screen With Boost Filter Selection
3-32
Chapter 4
Physical Description
This chapter contains the bill of materials, the EVM board silk screen/top layer,
and the schematics.
Topic
Page
4.1
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2
EVM Silk Screen/Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.3
Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
Physical Description
4-1
Bill of Materials
4.1 Bill of Materials
Item
No.
Qty
Value
Ref Des
Description
Vendor
Part Number
1
6
0
R1−R4, R6, R7
1/8W 5% Chip resistor
Panasonic
ERJ−6GEY0R00V
2
1
0
R20
1/4W 5% Chip resisto
Panasonic
ERJ−8GEY0R00V
3
1
10
R37
1/16W 1% Chip resistor
Panasonic
ERJ−3EKF10R0V
4
2
27.4
R35, R36
1/16W 1% Chip resistor
Panasonic
ERJ−3EKF27R4V
5
2
220
R38, R39
1/10W 5% Chip resistor
Panasonic
ERJ−3GEYJ221V
6
1
220
R5
1/8W 5% Chip resistor
Panasonic
ERJ−6GEYJ221V
7
1
270
R43
1/10W 5% Chip resistor
Panasonic
ERJ−3GEYJ271V
8
1
649
R40
1/16W 1% Chip resistor
Panasonic
ERJ−3EKF6490V
9
1
680
R28
1/4W 5% Chip resistor
Panasonic
ERJ−8GEYJ681V
10
1
1.5 k
R34
1/10W 5% Chip resistor
Panasonic
ERJ−3GEYJ152V
11
1
2.2 k
R29
1/4W 5% Chip resistor
Panasonic
ERJ−8GEYJ222V
12
3
2.7 k
R18, R19, R21
1/10W 5% Chip resistor
Panasonic
ERJ−3GEYJ272V
13
1
2.7 k
R17
1/4W 5% Chip resistor
Panasonic
ERJ−8GEYJ272V
14
4
3.09 k
R30−R33
1/16W 1% Chip resistor
Panasonic
ERJ−3EKF3091V
15
1
30.1 k
R42
1/16W 1% Chip resistor
Panasonic
ERJ−3EKF3012V
16
1
69.8 k
R41
1/16W 1% Chip resistor
Panasonic
ERJ−3EKF6982V
17
6
100 k
R22−R27
1/10W 5% Chip resistor
Panasonic
ERJ−3GEYJ104V
18
2
10 k
RA1, RA2
1/16W 5% 4-resistor array,
8 terminal
CTS
Corporation
742C083103JTR
Not
Installed
9
19
2
33 pF
C41, C42
50-V Ceramic chip capacitor,
±5%, NPO
Panasonic
ECJ−1VC1H330J
20
2
47 pF
C37, C38
50-V Ceramic chip capacitor,
±5%, NPO
Panasonic
ECJ−1VC1H470J
21
1
100 pF
C43
50-V Ceramic chip capacitor,
±5%, NPO
Panasonic
ECJ−1VC1H101J
22
1
1000 pF
C44
50-V Ceramic chip capacitor,
±10%, X7R
Panasonic
ECJ−1VB1H102K
23
12
0.1 µF
C8−C16, C31,
C32, C40
16-V Ceramic chip capacitor,
±10%, X7R
Panasonic
ECJ−1VB1C104K
Not
Installed
7
0.1 µF
C1−C5, C7
16-V Ceramic chip capacitor,
±10%, X7R
Panasonic
ECJ−2VB1C104K
24
2
0.1 µF
C29, C30
16-V Ceramic chip capacitor,
±10%, X7R
Panasonic
ECJ−3VB1C104K
25
2
0.33 µF
C39, C47
10-V Ceramic chip capacitor,
±10%, X5R
Panasonic
ECJ−1VB1A334K
26
10
1 µF
C17, C33−C36,
C48−C51, C55
16-V Ceramic chip capacitor,
±10%, X5R
Panasonic
ECJ−1VB1C105K
27
12
10 µF
C18−C20,
C23−C28, C45,
C46, C57
6.3-V Ceramic chip capacitor,
±10%, X5R
Panasonic
ECJ−3YB0J106K
28
2
47 µF
C21, C22
6.3-V Ceramic chip capacitor,
±20%, X5R
Panasonic
ECJ−4YB0J476M
4-2
R8−R16
Bill of Materials
Item
No.
Qty
Value
Ref Des
Description
Vendor
Part Number
Not
Installed
3
C52, C53, C54
29
1
D1
50-V, 1-A diode SMD
Micro
Commercial
Corp.
DL4001
30
1
D2
Red LED, SMD
Lumex
SML−LX0603IW−TR
31
1
D3
Yellow LED, SMD
Lumex
SML−LX0603YW−TR
32
3
D4−D6
Green LED, SMD
Lumex
SML−LX0603GW−TR
Not
Installed
4
D7−D10
Schottky barrier diode, series
configuration
Zetex
BAT54STA
33
1
MK1
Omnidirectional microphone
cartridge
Knowles
Acoustics
MD9745APZ−F
34
1
X1
6-MHz crystal, SMD
Epson
MA−505 6.000M−C0
35
1
U1
Touch screen controller, audio
codec
Texas
Instruments
TSC2101RGZ
36
1
U2
64K, I2C EEPROM
Microchip
24LC64−I/SN
37
1
U3
Dual output LDO voltage
regulator
Texas
Instruments
TPS767D318PWP
38
1
U4
Dual output LDO voltage
regulator
Texas
Instruments
TPS767D301PWP
39
2
U5, U6
Quad IC buffer driver with
3-state output
Texas
Instruments
SN74LVC125APW
40
4
U7, U8, U9
Single IC buffer driver with open
drain o/p
Texas
Instruments
SN74LVC1G07DBVR
41
1
U10
USB Interface to SPI/I2S
Texas
Instruments
TAS1020BPFB
42
1
N/A
TSC2101EVM PWB
Texas
Instruments
6444330
43
3
J1, J2, J4
Screw terminal block, 4 position
On Shore
Technology
ED555/4DS
44
4
J5, J8, J9, J11
Screw terminal block, 2 position
On Shore
Technology
ED555/2DS
45
1
J3
Right angle 4 position socket
AMP/Tyco
Electronics
103634−3
46
1
J6
3,5 mm audio jack, T−R−S, SMD
CUI Inc.
SJ−3515−SMT−1
47
1
J7
3,5 mm audio jack, T−R−S−G,
Thru−Hole
CUI Inc.
SJ−43514
48
1
J12
2,5 mm Power Jack
CUI Inc.
PJ−102B
49
1
J10
USB type B socket, thru−hole
Mill−Max
897-30-004-90-000000
50
2
J13, J14
5 × 2 Position header, 0.1”
spacing
Samtec
TSW−105−07−L−D
51
3
JMP5, JMP8,
JMP9
2 Position jumper, 0.1” spacing
Samtec
TSW−102−07−L−S
52
3
JMP3, JMP6,
JMP7
3 Position jumper, 0.1” spacing
Samtec
TSW−103−07−L−S
53
1
JMP4
3 X 2 Position header, 0.1”
spacing
Samtec
TSW−103−07−L−D
Physical Description
4-3
Bill of Materials
Item
No.
Qty
Value
Ref Des
Description
Vendor
Part Number
54
1
JMP2
Bus wire
55
5
JMP1, JMP10,
JMP11, JMP12,
JMP13
Bus wire
56
2
SW1, SW2
4 Position DIP switch, SMD half
pitch
C&K
TDA04H0SK1
57
1
SW3
4 PDT right angle switch
E−Switch
EG4208
Not
Installed
46
TP1−TP16,
TP18−TP27,
TP29−TP48
Miniature test point terminal
Keystone
Electronics
5000
58
2
TP17, TP28
Miniature test point large loop
terminal
Keystone
Electronics
5011
59
8
N/A
Jumper top
Samtec
SNT−100−BK−T
60
4
N/A
0.25” × 0.625” Hex 4−40
threaded standoff
Keystone
Electronics
1808
61
4
N/A
Pan head machine screw
4−40 × 1/2” phillips
Building
Fasteners
PMS 440 0050 PH
4-4
EVM Board Silk Screen/Top Layer
4.2 EVM Board Silk Screen/Top Layer
Table 4−1. Top Board Layer Silk Screen
X
Physical Description
4-5
Schematics
4.3 Schematics
Schematic diagrams of the TSC2101EVM showing the TSC2101 connections
and the USB and connectors are shown on the following pages.
4-6
1
2
3
4
6
5
Revision History
REV
D7 through D10 are not installed, but can be added
for extra ESD protection, or for reducing touch
panel noise.
JMP11
1
2
TP9
SDOUT
I2SDOUT
+3.3VA
TP10
SDIN
C19
10uF
I2SDIN
DRVDD
C16
TP14
C18
10uF
DVDD
0
J3
TP2
R2
XY+
X+
Y-
0
TP3
R3
0
103634-3
15
17
16
Y+
14
X+
TP4
R4
TOUCH SCREEN
0
20
YC2
0.1uF
C1 through C7 are not installed, but
can be added for noise filtering.
C3
0.1uF
C4
0.1uF
C8
0.1uF
C26
10uF
C5
0.1uF
19
18
X+
Y+
XY-
34
47
42
46
45
44
43
BVDD
R1
MCLK
BCLK
WCLK
SDIN
SDOUT
TOUCH SCREEN
9
10
11
12
VBAT
AUX1
AUX2
MICBIAS_HND
MICIN_HND
MIC_DETECT_IN
MICIN_HED
MICBIAS_HED
VREF
CP_IN
OUT32N
SPK1
SPK2
SPKFC
VGND
CP_OUT
BUZZ_IN
OUT8P
OUT8N
0
B
DRVSS2
DRVSS1
BUZZ_IN
36
32
TP21
CP_IN
GPIO1
GPIO2
TP8
AUX1
5
4
TP6
RESET
PWR_DN
R7
AUX1
3
2
3
220
PINTDAV
R6
37
2
VBAT
VBAT
41
38
39
40
R5
DVSS
1
48
J4
SCLK
SS
MOSI
MISO
TP5
TP17
4
C12
0.1uF
GND
C1
0.1uF
C6
0.1uF
ED555/4DS
C7
0.1uF
0.1uF
R8 through R11, JMP8 and JMP9
are not installed, but can be used
for resistance measurements on
the AUX pins.
ED555/2DS
EXT VREF
J2
1
CP IN
2
CP OUT
JMP9
1
2
TP18
SPIDOUT
R11
NI
35
33
TP26
VGND
ESW_EG4208
TP40
SPK1
TP27
OUT8N
J8
TSC2101RGZ/TLV320AIC28RGZ
TP28
TP41
SPKFC
PLUS 1
TP29
OUT8P
IOVDD
TP42
OUT32N
R22
R27
B
OUT32
J9
PLUS 2
MINUS 1
100K
RESET
OUT8
TP32
GPIO2
MISO
TP34
GPIO1
MOSI
IOVDD
TP20
SPI_CSZ
R12
NI
SS
CP_OUT
TP36
SPICLK
3
CUI_SJ-43514
HEADSET INPUT
47uF
PEN_IRQZ
TP33
TP35
SPIDIN
TP19
A
C21 47uF
C22
PENIRQ
JPR-2X1
J7
MICBIAS_HED
100K
R9
NI
R10
NI
TP39
SW3
TP25 NI
2.7K
26
27
28
30
31
J5
JPR-2X1
SPK2
C54
PWR_DWN
TP30
PWR_DNZ
JMP8
1
2
MICROPHONE
MINUS 2
TP31
RESETZ
2
C29
R17
C
MD9745APZ-F
MICIN_HND
MIC_DETECT_IN
TP24
MICIN_HED
MK1
NI
TP38
22
21
25
23
24
EXT MIC IN
R28
680
0.1uF
C53
NI
C11
0.1uF
TP7
AUX2
R8
NI
MICBIAS_HND
DVSS
EXTERNAL INPUTS
1
SJ-3515-SMT-1
C30
AVSS
AUX2
0
2.2K
TP37
TP23
J6
R29
10uF
U1
DIFF. MIC INPUT
0
JMP3
1
2
MIC BIAS SEL
3
C52
0.1uF
X-
0.1uF
C56
AUX2
10uF
C52, C53, and C54 are
not installed, but can
be used to filter noise
on microphone bias
outputs.
AVDD2
JMP4
5
6
3
4
1
2
0.1uF
R20
TP48
0.1uF
10uF
C10
ED555/4DS
1
2
3
4
C9
DVDD
C
TP16
C25
TP1
C32
C20
JMP2
1
2
D
AUX1
0.1uF
R14
NI
JMP13
1
2
JMP10
IOVDD
Y-
+3.3VA
2
TP13
MCLK
JMP1
1
2
1
4
TP22
AVDD1
TP45
IOVDD
X+
IOVDD
C31
+3.3VA
JMP12
1
2
1
X-
10uF
10uF
TP12
BCLK
BCLK
D10A
NI
C28
C27
8
6
D9A
NI
0.1uF
AVDD1
AVDD2
D8A
NI
TP11
LRCLK
LRCLK
D10B
NI
J1
3
JMP4 is used to select
AUX inputs for differential
microphone input mode.
AVSS1
AVSS2
D9B
NI
13
7
D8B
NI
+1.8V
Y+
C14
29
D7B
NI
MCLK
2
0.1uF
C13
0.1uF
D7A
NI
1
C15
DRVDD
DRVDD
PLEASE NOTE:
Components within dashed
box are not included on the
AIC28 version of the board.
Approved
+3.9V
TP15
D
ECN Number
BUZZ IN
R15
NI
SCLK
R13
NI
4
ti
R12, R13, R15 and R16 are not
installed, but can be used as pull
ups or pull downs on the GPIO
lines.
DATA ACQUISITION PRODUCTS
R16
NI
HIGH PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
ED555/4DS
ENGINEER BOB BENJAMIN
CELL I/O
DRAWN BY BOB BENJAMIN
DOCUMENT CONTROL NO. 6444329
SHEET 1
1
2
3
4
5
OF
2
TITLE
TSC2101-AIC28EVM
TOUCH SCREEN CONTROLLER/AUDIO CODEC
SIZE A
DATE 12-Jan-2004
REV A
FILEG:\TSC2101EVM\Schematic\TSC2101EVM.ddb - Documents\TSC2101
6
A
1
2
3
4
6
5
REVISION HISTORY
REV
ENGINEERING CHANGE NUMBER
APPROVED
IOVDD
C48
+3.3V
TP43
1uF
U5
TP44
R30
3.09K
SCL
C44
1.5K
46
47
48
1
3
5
6
7
4
16
28
45
R33
.001uF
3.09K
R35
27.4
R36
C38
47pF
1IN
1IN
1EN
3
9
1OUT
1OUT
1GND
2GND
10
11
12
B
1RESET
2RESET
2EN
2IN
2IN
2OUT
2OUT
TPS767D318PWP
J11
28
24
23
22
18
17
R23
100K
XTALO
XTALI
PLLFILI
PLLFILO
MCLKI
PUR
DP
DM
DVSS
DVSS
DVSS
AVSS
TP46
MRESET
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
DVDD
DVDD
DVDD
AVDD
C50
5
R19
2.7K
4
5
1uF
U9
31
30
29
27
26
25
24
23
8
21
33
2
2
MISO
SN74LVC1G07DBV
C
MOSI
SS
C51 IOVDD
SCLK
RESET
1uF
U6
+3.3V
2
5
9
12
1
4
10
13
1A
2A
3A
4A
1OE
2OE
3OE
4OE
VCC
1Y
2Y
3Y
4Y
GND
14
J14
1
3
5
7
9
11
3
6
8
11
7
2
4
6
8
10
12
EXTERNAL SPI
C55
1uF
C34
1uF
C35
1uF
USB RST
USB SPI
C36
1uF
+3.3V
100K
+3.3V
R38
220
C46
10uF
D4
SML-LX0603GW-TR
+3.3V
GREEN
649
1uF
D3
2
PENIRQ
U4
1
2
3
3
9
JMP6
PWR SELECT
10
11
12
DL4001
1IN
1IN
1EN
1GND
2GND
1RESET
1FB
1OUT
1OUT
2RESET
2EN
2IN
2IN
2OUT
2OUT
28
25
24
23
R25
R41
R42
100K
69.8K
30.1K
R37
10
+3.9V
SML-LX0603IW-TR
RED
R43
R26
22
100K
18
17
270
+3.3VA
D5
SML-LX0603GW-TR
C24
10uF
GREEN
R39
220
TPS767D301PWP
C47
0.33uF
+1.8V
D2
SML-LX0603YW-TR
6VDC-10VDC IN
RA1
10K
4
SN74LVC1G07DBV
EXT PWR IN
CUI-STACK PJ102-B
2.5 MM
B
U8
USB AUDIO ACTIVE
R40
IOVDD
C17
R21
2.7K
ED555/2DS
+3.3V
IOVDD
TAS1020BPFB
5
6
4
C40
0.1uF
TAS ENABLE
R24
YELLOW
D1
D6
SML-LX0603GW-TR
GREEN
ti
C23
10uF
IOVDD +1.8V
SW1
JMP7
1
2
3
A
1
2
3
4
8
7
6
5
1.8V ENABLE
3.3VA ENABLE
3.9V ENABLE
DATA ACQUISITION PRODUCTS
HIGH PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
IOVDD SELECT
TSC PWR ENABLE
DRAWN BY BOB BENJAMIN
DOCUMENT CONTROL NO. 6444329
SHEET 2
2
TITLE
ENGINEER BOB BENJAMIN
TP47
TESTPOINT
1
1
2
3
4
AUDIO DATA
U10
10uF
2
J12
2
2
4
6
8
10
12
8
7
6
5
SN74LVC125APW
+1.8V C45
C39
0.33uF
1
1uF
5
U3
5
6
4
1
3
5
7
9
11
C49
3
C37
47pF
27.4
J13
3
6.00 MHZ
100pF
897-30-004-90-000000
LRCLK
MA-505 6.000M-C0
R34
SW2
USB I2S
USB MCK
USB SPI
USB RST
PWR_DWN
C43
4
3
2
1
BCLK
I2SDOUT
+3.3V
JMP5
A1 SELECT
J10 USB SLAVE CONN
GND
D+
DVCC
I2SDIN
SN74LVC1G07DBV
X1
2
D
RA2
10K
MCLK
7
GND
U7
4
MRESET
TEST
EXTEN
RSTO
P3.0
P3.1
P3.2/XINT
P3.3
P3.4
P3.5
NC
NC
C
1Y
2Y
3Y
4Y
IOVDD
C42
33pF
44
43
42
41
40
39
37
38
36
35
34
32
1
3.09K
3
6
8
11
3
C41
33pF
R31
14
VCC
R18
2.7K
SCL
SDA
VREN
RESET
MCLKO2
MCLKO1
CSCLK
CDATO
CDATI
CSYNC
CRESET
CSCHNE
24LC64I/SN
+3.3V
WP
VSS
1A
2A
3A
4A
1OE
2OE
3OE
4OE
SN74LVC125APW
7
A0
A1
A2
4
1
2
3
C33
1uF
VCC
SDA
8
6
5
+3.3V
U2
2
5
9
12
1
USB MCK
4
10
USB I2S
13
R32
3.09K
+3.3V
9
10
11
12
13
14
15
17
18
19
20
22
D
3
4
5
OF
2
FILE
SIZE B
TSC2101-AIC28EVM
USB INTERFACE
REV A
DATE 12-Jan-2004
G:\TSC2101EVM\Schematic\TSC2101EVM.ddb - Documents\TSCUSB
6
A