TSU5611YZPR

TSU5611 SCDS326A – AUGUST 2011 – REVISED NOVEMBER 2011 www.ti.com DP3T SWITCH WITH IMPEDANCE DETECTION MICRO-USB SWITCH TO SUPPORT USB, UART, AUDIO, AND CHARGER DETECTION Check for Samples: TSU5611 FEATURES APPLICATIONS • • • • • • 1 Compatible Accessories – USB Data Cable – UART Cable – Charger (Dedicated Charger or Host/Hub Charger) – Stereo Headset With Mic Integrated LDOs for VREF and Mic Bias USB and UART Path Supports USB 2.0 High Speed Audio Path Provides Negative Rail Support and Click/Pop Reduction Supports Factory Test Mode 1.8-V Compatible I2C Interface ESD Performance Tested Per JESD 22 – 1500-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) • • • • • • Cell Phones & Smart Phones Tablet PCs Digital Cameras & Camcorders GPS Navigation Systems Micro USB Interface with USB/UART YZP PACKAGE TOP VIEW A B C D E 4 3 2 1 DESCRIPTION The TSU5611 is designed to interface the cellular phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see the State Machine for details). It will then switch to the appropriate channel—data, audio, or UART. The TSU5611 has an I2C interface for communication with the cellular phone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged. ORDERING INFORMATION (1) TA –40°C to 85°C (1) (2) PACKAGE (2) WSCP–YZP (0.5-mm pitch) Tape and Reel ORDERABLE PART NUMBER TOP-SIDE MARKING TSU5611YZPR A7 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TSU5611 SCDS326A – AUGUST 2011 – REVISED NOVEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. SUMMARY OF TYPICAL CHARACTERISTICS USB PATH UART PATH AUDIO PATH MIC PATH 1 1 1 1 ON-state resistance (rON) 5Ω 5Ω 3Ω 8.8 Ω ON-state resistance match (ΔrON) 1Ω 1Ω 1.1 Ω N/A 0.24 Ω 0.24 Ω 0.1 Ω 0.5 Ω 1 ms 1 ms 1 ms 1 ms Number of switches ON-state resistance flatness (rON(flat)) Turn-on/turn-off time (tON/tOFF) Bandwidth (BW) 830 MHz 830 MHz 788 MHz 573 MHz OFF isolation (OISO) –22 dB –22 dB –75 dB –100 dB Crosstalk (XTALK) –40 dB –40 dB –50 dB –50 dB Total harmonic distortion (THD) Leakage current (INO(OFF)/INC(OFF)) Package options N/A N/A 0.05% 0.0017% 100 nA 100 nA 100 nA 100 nA YZP package, 0.5-mm pitch APPLICATION BLOCK DIAGRAM 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TSU5611 To request a full data sheet, please send an email to: signal-switches@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TSU5611YZPR ACTIVE DSBGA YZP 20 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 A7 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of