TUSB522PRGER

Order Now Product Folder Support & Community Tools & Software Technical Documents TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 TUSB522P 3.3 V Dual-Channel USB 3.1 GEN 1 Redriver, Equalizer 1 Features 3 Description • The TUSB522P is a fourth generation, dual-channel, single-lane USB 3.1 GEN1 redriver and signal conditioner supporting 5 Gbps. The device offers low power consumption on a 3.3 V supply with its ultralow-power architecture. The redriver also supports the USB 3.1 low power modes, which further reduces idle power consumption. 1 • • • • • • • • USB3.1 GEN1 5 Gbps, Dual-Channel Re-Driver with 3.3-V Power Supply Ultra-Low-Power Architecture – Active: 98 mA – U2, U3: 1.2 mA – Disconnect 265 µA – Shutdown 60 µA Optimal Receiver Equalization – of 3, 6, 9 dB at 2.5 GHz Output Driver De-emphasis of 0, 3.5, and 6 dB Automatic LFPS De-Emphasis Control to Meet USB 3.1 Certification Requirements No Host/Device-Side Requirement Hot-Plug Capable Industrial Temperature Range: –40ºC to 85ºC TUSB522PI Commercial Temperature Range: 0ºC to 70ºC TUSB522P The dual-channel capability enables the system to maintain signal integrity on both transmit and receive data paths. The receiver equalization has three gain settings to overcome channel degradation from insertion loss and inter-symbol interference. These settings are controlled from the EQ pins. To compensate for transmission line losses, the output driver supports configuration of De-Emphasis with pins DE. Additionally, automatic LFPS De-Emphasis control allows for full USB 3.1 compliance. These settings allow optimal performance, increased signaling distance, and flexibility in placement of the TUSB522P in the USB 3.1 GEN1 path. Device Information(1) PART NUMBER 2 Applications • • • • • • TUSB522P Cell Phones Tablets Notebooks Desktops Docking Stations Backplanes and Active Cables PACKAGE BODY SIZE (NOM) VQFN (24) TUSB522PI 4.00 mm x 4.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. SPACER Simplified Schematic Main PCB RX1P RX1N Connector Device DE1 TX2N TX2N 20" 3m USB 3.0 Cable 1"-6" TX1N DEMP CNTRL DE2 Dual Termination Device PCB Redriver TX1P EQ CNTRL EQ2 Main PCB USB Host Driver CHANNEL 1 LFPS CONTROLLER EQ1 20" Receiver/ Equalizer Dual Termination USB Connector Detect Driver Receiver/ Equalizer CHANNEL 2 OS Cntrl. Dual Termination Redriver Dual Termination Detect USB Host RX2P RX2N EN_RXD OS1 OS2 Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 5 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics, Power Supply .................. Electrical Characteristics, DC ................................... Electrical Characteristics, AC.................................... Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 9 7.4 Device Functional Modes........................................ 10 8 Application and Implementation ........................ 11 8.1 Application Information............................................ 11 8.2 Typical Application ................................................. 11 9 Power Supply Recommendations...................... 13 10 Layout................................................................... 14 10.1 Layout Guidelines ................................................. 14 10.2 Layout Example .................................................... 14 11 Device and Documentation Support ................. 15 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Documentation Support ....................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 15 15 15 15 15 15 15 12 Mechanical, Packaging, and Orderable Information ........................................................... 15 4 Revision History Changes from Revision C (May 2019) to Revision D • Changed pin 11 From: TX1N To: TX2N and pin 12 From: TX1P To: TX2P in Figure 2...................................................... 11 Changes from Revision B (November 2017) to Revision C • 2 Page Changed the values in the FOR OS = HIGH column of Table 1 ......................................................................................... 10 Changes from Original (July 2016) to Revision A • Page Deleted the RGE0024F mechanical pages .......................................................................................................................... 15 Changes from Revision A (October 2016) to Revision B • Page Page Changed the device From Preview To: Production................................................................................................................ 1 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 5 Pin Configuration and Functions RGE Package 24-Pin (VQFN) Top View EN_RXD OS2 NC 6 NC 7 RX1N 8 5 4 DE2 EQ1 VCC 3 2 1 24 NC 23 TX1N 22 TX1P 21 GND 20 RX2N 19 RX2P CH1 RX1P 9 GND 10 TX2N 11 PAD (must be soldered to GND) CH2 TX2P 12 13 14 15 16 17 18 VCC RSV OS1 DE1 EQ2 NC Pin Functions PIN NAME NO. RX1N 8 I/O DESCRIPTION Differential I Differential input for 5 Gbps negative signal on Channel 1 Differential input for 5 Gbps positive signal on Channel 1 RX1P 9 Differential I TX1N 23 Differential O Differential output for 5 Gbps negative signal on Channel 1 TX1P 22 Differential O Differential output for 5 Gbps positive signal on Channel 1 RX2N 20 Differential I Differential input for 5 Gbps negative signal on Channel 2 RX2P 19 Differential I Differential input for 5 Gbps positive signal on Channel 2 TX2N 11 Differential O Differential output for 5 Gbps negative signal on Channel 2 TX2P 12 Differential O Differential output for 5 Gbps positive signal on Channel 2 EQ1 DE1 OS1 EQ2 2 16 15 17 I, CMOS Sets the receiver equalizer gain for Channel 1. 3-state input with integrated pull-up and pulldown resistors. EQ1 = Low = 3 dB EQ1 = Mid = 6 dB EQ1 = High = 9 dB I, CMOS Sets the output de-emphasis for Channel 1. 3-state input with integrated pull-up and pulldown resistors. DE1 = Low = 0 dB DE1 = Mid = -3.5 dB DE1 = High = -6.2 dB Note: When OS = Low I, CMOS Sets the output swing (differential voltage amplitude) for Channel 1. 2-state input with an integrated pull down resistor. OS1 = Low = 0.9 mV OS1 = High = 1.1 mV I, CMOS Sets the receiver equalizer gain for Channel 2. 3-state input with integrated pull-up and pulldown resistors. EQ2 = Low = 3 dB EQ2 = Mid = 6 dB EQ2 = High = 9 dB Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P 3 TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com Pin Functions (continued) PIN NAME I/O NO. DE2 3 DESCRIPTION I, CMOS Sets the output de-emphasis for Channel 2. 3-state input with integrated pull-up and pulldown resistors. DE2 = Low = 0 dB DE2 = Mid = -3.5 dB DE2 = High = -6.2 dB Note: When OS = Low OS2 4 I, CMOS Sets the output swing (differential voltage amplitude) for Channel 2. 2-state input with an integrated pull down resistor. OS2 = Low = 0.9 mV OS2 = High = 1.1 mV EN_RXD 5 I, CMOS Enable. The device has a 660-kΩ pulldown resistor. Device is active when EN_RXD = High. Drive actively high or install a pullup resistor (recommend 4.7 KΩ) for normal operation. Does reset state machine. RSV 14 I, CMOS Reserved. Can be left as No-connect. VCC 1, 13 P Positive Power Supply. Power Supply is 3.3 V. GND 10, 21, PAD G Ground. PAD must be connected to Ground. Pins 10, 21 can be connected to Ground or left unconnected. NC 6, 7, 18, 24 No Connection. These pins can be tied to any desired voltages including connecting them to GND. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply Voltage Range (2) Voltage Range at any input or output terminal MIN MAX UNIT VCC –0.5 4 V Differential I/O –0.5 1.5 V CMOS Inputs –0.5 4 V 105 °C 150 °C Junction temperature, TJ Storage temperature, Tstg (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the GND terminals. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) NOM 3 3.3 MAX UNIT 3.6 V Supply Ramp Requirement 100 ms V(PSN) Supply Noise on VCC Terminals 100 mV TA Operating free-air temperature °C C(AC) AC coupling capacitor VCC 4 Main power supply MIN TUSB522P 0 70 TUSB522PI –40 85 °C 200 nF 75 Submit Documentation Feedback 100 Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 6.4 Thermal Information TUSB522P THERMAL METRIC (1) RGE (VQFN) UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 51.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 55.9 °C/W RθJB Junction-to-board thermal resistance 28.3 °C/W ψJT Junction-to-top characterization parameter 2.0 °C/W ψJB Junction-to-board characterization parameter 28.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 9.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics, Power Supply over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS ICC(ACTIVE) Average active current Link in U0 with GEN1 data transmission. RSV, EQ cntrl pins = NC, EN_RXD = VCC, k28.5 pattern at 5 Gbps, VID = 1000 mVpp, OS = 900 mV and DE = 3.5 dB ICC(U2U3) Average current in U2/U3 ICC(NC) Average current disconnect mode ICC(SHUTDOWN) Average shutdown current EN_RXD = L MIN TYP MAX UNIT 98 mA Link in U2 or U3 1.2 mA Link in Disconnect mode 265 µA 60 µA 6.6 Electrical Characteristics, DC over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 3-State CMOS Inputs(EQ1/2, DE1/2) VIH High-level input voltage VIM Mid-level input voltage VCC x 0.8 VIL Low-level input voltage VF Floating voltage RPU Internal pull-up resistance RPD Internal pull-down resistance IIH High-level input current VIN = 3.6 V IIL Low-level input current VIN = GND, VCC = 3.6.V V VCC / 2. V VCC x 0.2 VIN = High impedance V 0.36 x VCC V 410 kΩ 240 kΩ 26 –26 µA µA 2-State CMOS Input (OS1/2, EN_RXD) VIH High-level input voltage VIL Low-level input voltage VCC x 0.7 RPD Internal pull-down resistance IIH Low-level input current VIN = 3.6 V IIL Low-level input current VIN = GND, VCC = 3.6.V V VCC x 0.3 660 25 –10 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P V kΩ µA µA 5 TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com 6.7 Electrical Characteristics, AC over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 1200 mVpp Differential Receiver (RXP, RXN) AC-coupled differential peak-to-peak signal measured post CTLE through a reference channel Input differential voltage swing. V(RX-DIFF-PP) V(RX-DC-CM) Common-mode voltage bias in the receiver (DC) R(RX-DIFF-DC) Differential input impedance (DC) R(RX-CM-DC) Receiver DC Common Mode impedance Z(RX-HIGH-IMP-DC-POS) 0.7 Present after a GEN1 device is detected on TXP/TXN Common-mode input impedance with termination disabled (DC) Present when no GEN1 device is detected on TXP/TXN. Measured over the range of 0-500 mV with respect to GND. V(RX-SIGNAL-DET-DIFF-PP) Input Differential peak-to-peak Signal Detect Assert Level V(RX-IDLE-DET-DIFF-PP) Input Differential peak-to-peak Signal Detect De-assert Level V(RX-LFPS-DET-DIFF-PP) Low Frequency Periodic Signaling (LFPS) Detect Threshold Below the minimum is squelched. V(RX-CM-AC-P) Peak RX AC common mode voltage V(detect) Voltage change to allow receiver detect C(RX-PARASITIC) Voltage change to allow receiver detect At 2.5 GHz RL(RX-DIFF) Differential Return Loss RL(RX-CM) Common Mode Return Loss 100 V 72 120 Ω 18 30 Ω 25 At 5 Gbps, no input channel loss clock pattern kΩ 85 mV 85 mV 100 300 mV Measured at package pin 150 mV Positive voltage to sense receiver termination 600 mV 0.17 0.63 0.99 pF 50 MHz – 1.25 GHz at 90 Ω –19 dB 2.5 GHz at 90 Ω –14 dB 50 MHz – 1.25 GHz at 90 Ω –13 dB Differential Transmitter (TXP, TXN) V(TX-DIFF-PP) Transmitter differential voltage swing (transition-bit) OS Low, 0dB DE V(TX-DIFF-PP-LFPS) LFPS differential voltage swing OS Low, High 0.8 OS High, 0dB DE 1.1 0.8 DE = Low V(TX-DE-RATIO) Transmitter differential voltage DeEmphasis ratio dB dB DE = High –6.2 dB Transmitter idle common-mode voltage change while in U2/U3 and not actively transmitting LFPS V(TX-DC-CM) Common-mode voltage bias in the transmitter (DC) V(TX-CM-AC-PP-ACTIVE) Tx AC Common-mode voltage active Max mismatch from Txp + Txn for both time and amplitude V(TX-IDLE-DIFF-AC-PP) AC Electrical idle differential peak-topeak output voltage At package pins V(TX-IDLE-DIFF-DC) DC Electrical idle differential output voltage At package pins after low pass filter to remove AC component DELTA) Absolute DC common mode voltage between U1 and U0 C(TX) TX input capacitance to GND R(TX-DIFF) Differential impedance of the driver R(TX-CM) Common-mode impedance of the driver Measured with respect to AC ground over 0-500 mV I(TX-SHORT) TX short circuit current TX± shorted to GND C(TX-PARASITIC) TX input capacitance for return loss Package Pins 6 Vpp –3.5 V(TX-CM-IDLE-DELTA) Differential Return Loss Vpp 1.2 DE = Floating V(TX-RCV-DETECT) RL(RX-DIFF) Vpp 1.2 0 Amount of voltage change allowed during Receiver Detection V(TX-CM-DC-ACTIVE-IDLE- 0.9 –600 600 mV 600 mV 0.7 V 100 mVpp 0 10 mV 0 10 mV At package pin 200 mV At 2.5 GHz 1.25 pF 72 120 Ω 18 30 Ω 60 mA 50 MHz – 1.25 GHz at 90 Ω 1.25 – 2.5 GHz at 90 Ω Submit Documentation Feedback 0.63 1.02 F 12 dB 8 dB Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 Electrical Characteristics, AC (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER RL(RX-CM) TEST CONDITIONS Common Mode Return Loss MIN TYP MAX UNIT 50 MHz – 1.25 GHz at 90 Ω 13 dB 1.25 –2.5 GHz 11 dB –40 dB AC Characteristic Xtalk Differential Cross Talk between TX and RX signal Pairs At 2.5 GHz V(CM-TX-AC) AC Common-mode voltage swing in active mode Within U0 and within LFPS V(TX-IDLE-DIFF -AC-PP) Differential voltage swing during electrical idle Tested with a high-pass filter RL(TX-DIFF) Differential Return Loss RL(TX-CM) Common Mode Return Loss 0 f = 50 MHz - 1.25 GHz Total Jitter V(TX-CM-ΔU1-U0) Absolute delta of DC CM voltage during active and idle states V(TX-IDLE-DIFF-DC) DC Electrical idle differential output voltage mVpp 10 V 12 dB 8 dB f = 50 MHz - 1.25 GHz 16 dB 1.25 –2.5 GHz 13 dB Minimum input and output trace at 2.5 GHz, VCC = 3.3 V 15 ps 1.25 –2.5 Ghz tJ 100 Voltage must be low pass filtered to remove any AC component 0 100 mV 12 mV Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P 7 TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com 7 Detailed Description 7.1 Overview The TUSB522P is designed to overcome channel loss due to inter-symbol interference and crosstalk when 5 Gbps USB3.1 GEN1 signals travel across a PCB or cable. The dual channel architecture is a one-chip, lowpower solution, extending the possible channel length for transmit and receive data paths in an application. For a Host application, this enables the system to pass both transmitter compliance and receiver jitter tolerance tests. The re-driver recovers incoming data by applying equalization that compensates for channel loss, and drives out signals with a high differential voltage. Each channel has a receiver equalizer with selectable gain settings. The equalization should be set based on the amount of insertion loss in channel 1 or 2 before the TUSB522P receivers. Likewise, the output drivers support configuration of De-Emphasis. Independent equalization and deemphasis control for each channel can be set using EQ1/2 and DE1/2 pins. The TUSB522P advanced state machine makes it transparent to hosts and devices. After power up, the TUSB522P periodically performs receiver detection on the TX pairs. If it detects a USB3.1 GEN1 receiver, the RX termination is enabled, and the TUSB522P is ready to re-drive. The device ultra-low-power architecture operates at a 3.3-V power supply and achieves Enhanced performance. The automatic LFPS De-Emphasis control further enables the system to be USB3.1 compliant. 7.2 Functional Block Diagram EQ1 DE1 OS1 TX1+ CHANNEL 1 Driver Detect Receiver/ Equalizer Termination Termination RX1+ TX1- RX1-1 4th Generation State Machine VCC GND LFPS Controller RX2- CHANNEL 2 Driver Receiver/ Equalizer RX2+ TX2+ OS2 8 Termination Termination Detect TX2- DE2 Submit Documentation Feedback EQ2 Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 7.3 Feature Description 7.3.1 Receiver Equalization The purpose of receiver equalization is to compensate for channel insertion loss and inter-symbol interference in the system before the input of the TUSB522P. The receiver overcomes these losses by attenuating the low frequency components of the signals with respect to the high frequency components. The proper gain setting should be selected to match the channel insertion loss before the input of the TUSB522P receivers. The gain setting may differ for channel 1 and channel 2. 7.3.2 De-Emphasis Control and Output Swing The differential driver output provides selectable de-emphasis and output swing control in order to achieve USB3.1 compliance. The TUSB522P offers a unique way to adjust output de-emphasis and transmitter swing based on the OS1/2 and DE1/2 pins. The level of de-emphasis required in the system depends on the channel length after the output of the re-driver. The output swing and de-emphasis levels may differ for channel 1 and channel 2. Figure 1. Transmitter Differential Voltage, OS = Floating 7.3.3 Automatic LFPS Detection The TUSB522P features an intelligent low frequency periodic signaling (LFPS) controller. The controller senses the low frequency signals and automatically disables the driver de-emphasis, for full USB3.1 compliance. Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P 9 TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com 7.4 Device Functional Modes 7.4.1 Device Configuration Table 1. Control Pin Settings (Typical Values) PIN EQ1/EQ2 DESCRIPTION Equalization Amount PIN DESCRIPTION OS1/OS2 Output Swing Amplitude LOGIC STATE GAIN Low 3 dB Floating 6 dB High 9 dB LOGIC STATE OUTPUT DIFFERENTIAL VOLTAGE FOR THE TRANSISTION BIT LOW 0.9 Vpp HIGH 1.1 Vpp DE-EMPHASIS RATIO PIN DESCRIPTION LOGIC STATE Low 0 dB 0 dB DE1/DE2 De-Emphasis Amount Floating –3.5 dB –3.5 dB High –6.2 dB –6.2 dB FOR OS = LOW FOR OS = HIGH 7.4.2 Power Modes The TUSB522P has 3 primary power modes: 7.4.2.1 U0 Mode (Active Power Mode) During active power mode, U0, the device is transmitting USB SS data or USB LFPS signaling. The U0 mode is the highest power state of the TUSB522P. Anytime super-speed traffic is being received, the TUSB522P remains in this mode. 7.4.2.2 U2/U3 (Low Power Mode) While in this mode, the TUSB522P periodically performs far-end receiver detection. 7.4.2.3 Disconnect Mode - RX Detect In this state, the TUSB522P periodically checks for far-end receiver termination on both TX. Upon detection of the far-end receiver’s termination on both ports, the TUSB522P will transition to U0 mode. 7.4.2.4 Shutdown Mode Shutdown mode is entered when the EN_RXD pin is driven low. This is lowest power setting for the device. 10 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TUSB522P is a dual-channel single-lane re-driver and signal conditioner designed to compensate for ISI jitter caused by attenuation through passive mediums such as traces or cables. The TUSB522P has two independent channels to allow optimization in both upstream and downstream directions through three EQ and six De-Emphasis settings. 8.2 Typical Application 2 DN 3 DP TXN USB Host TXP RXN RXP 3.3 V 10 mF 0.1 mF 0.1 mF 8 0.1 mF 9 0.1 mF 11 12 0.1 mF TX1N RX1N RX1P TX1P TX2N RX2N TX2P RX2P 3.3 V 1 13 VCC 7 NC NC 24 NC 6 NC 0.1 mF NC 18 14 NC RSV Thermal Pad 10 21 GND DN DP 23 0.1 mF 8 SSTXN 22 0.1 mF 9 SSTXP 5 20 19 6 SSRXN SSRXP 3.3 V TUSB522P 47 kW OS1 DE1 EQ1 OS2 DE2 EQ2 EN_RXD 15 16 2 4 3 17 5 USB3.1 Type-A Receptacle 47 kW Figure 2. Embedded Host Application Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P 11 TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com Typical Application (continued) 8.2.1 Design Requirements For this design example, use the parameters shown in Table 2. Table 2. Design Parameters PARAMETERS VALUE VCC Supply (3 V – 3.6 V) 3.3 V AC Coupling Capacitor (75nF to 265nF) 100 nF Host to TUSB522P FR4 Length (Inches) 20 Host to TUSB522P FR4 Trace Width (mils) 4 TUSB522P to Connector FR4 Length (Inches) 6 TUSB522P to Connector FR4 Trace Width (mils) 4 EQ1 (RX1P/RX1N) 9 dB (EQ1 = High) De-Emphasis 2 (TX2P/TX2N) -6.2 dB (OS2 = Low, DE2 = High) EQ2 (RX2P/RX2N) 6 dB (EQ2 = Floating) De-Emphasis 1 (TX1P/TX1N) -3.5 dB (OS1 = Low, DE1 = Floating) Output Swing 1 (OS1) 900 mV (OS1 = Low) Output Swing 2 (OS2) 900 mV (OS2 = Low) 8.2.2 Detailed Design Procedure The TUSB522P differential receivers and transmitters have internal BIAS and termination. Due to this, the TUSB522P must be connected to the USB Host and receptacle through ac-coupling capacitors. In this example, as depicted in Table 1, 100 nF capacitors are placed on TX2P, TX2N, RX1P, RX1N, TX1P and TX1N. No accoupling capacitors are placed on the RX2P and RX2N pins because it is assumed the device downstream of the TUSB522P will have ac-coupling capacitors on its transmitter as defined by the USB 3.1 specification. 12 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 8.2.3 Application Curves BERT > 24"6mil > char-board > RX2-to-TX2 > char-board > Scope 1ft SMP-SMP cable 1ft SMP-SMP cable MP1800 BERT 5Gbps, 680mVpp PRBS7 TUSB522 RX2 > TX2 1ft SMP-SMP cable Input PCB trace Output PCB trace 25" FR-4 1.0" FR-4 -10.5dB Loss DCAX 35GHz BW PTB -0.8dB Loss EQ = H, OS = L, DE = L 9 Power Supply Recommendations The TUSB522P is designed to operate with a 3.3-V power supply. Levels above those listed in the Absolute Ratings table should not be used. If using a higher voltage system power supply, a voltage regulator can be used to step down to 3.3 V. Decoupling capacitors should be used to reduce noise and improve power supply integrity. A 0.1-µF capacitor should be used on each power pin. Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P 13 TUSB522P SLLSEV9D – JULY 2016 – REVISED MAY 2019 www.ti.com 10 Layout 10.1 Layout Guidelines • • • • • • • • • • • • • • • RXP/N and TXP/N pairs should be routed with controlled 90-Ω differential impedance (±15%). Keep away from other high speed signals. Intra-pair routing should be kept to within 2mils. Length matching should be near the location of mismatch. Each pair should be separated at least by 3 times the signal trace width. The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This will minimize any length mismatch causes by the bends and therefore minimize the impact bends have on EMI. Route all differential pairs on the same of layer. The number of VIAS should be kept to a minimum. It is recommended to keep the VIAS count to 2 or less. Keep traces on layers adjacent to ground plane. Do NOT route differential pairs over any plane split. Adding Test points will cause impedance discontinuity; and will therefore, negatively impact signal performance. If test points are used, they should be placed in series and symmetrically. They must not be placed in a manner that causes a stub on the differential pair. The 100-nF capacitors on the TXP and SSTXN nets must be placed close to the USB connector (Type A, Type B, and so forth). The ESD and EMI protection devices (if used) must also be placed as close as possible to the USB connector. Place voltage regulators as far away as possible from the differential pairs. In order to minimize crosstalk, TI recommends keeping high-speed signals away from each other. Each pair must be separated by at least 5 times the signal trace width. Separating with ground also helps minimize crosstalk. 10.2 Layout Example Figure 3. Example Layout 14 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P TUSB522P www.ti.com SLLSEV9D – JULY 2016 – REVISED MAY 2019 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: TUSB522P 15 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TUSB522PIRGER ACTIVE VQFN RGE 24 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 TUSB 522P TUSB522PIRGET ACTIVE VQFN RGE 24 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 TUSB 522P TUSB522PRGER ACTIVE VQFN RGE 24 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 70 TUSB 522P TUSB522PRGET ACTIVE VQFN RGE 24 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 70 TUSB 522P (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of