TUSB542EVM

www.ti.com HPA/High-Speed Interface User’s Guide February 2016 TUSB542 Evaluation Module ABSTRACT This is the user guide for the evaluation module (EVM) of the TUSB542. The purpose of this user guide is to facilitate an easy evaluation process of the TUSB542 USB 3.0 SuperSpeed Re-Driver. The contents of this user’s guide are meant to provide an overview of the TUSB542, which includes highlighting its key features, operating conditions, and how to setup this EVM for use in a system level evaluation. The construction of the TUSB542 EVM also serves as a reference design that can be easily modified for any intended application. Target applications include Cell Phones, Computers, Docking Stations and TVs. Schematic and layout information is included at the end of this manual. 1 TUSB542EVM www.ti.com HPA/High-Speed Interface Contents Introduction .......................................................................................................................................... 3 TUSB542 EVM Kit Contents............................................................................................................. 4 Description of EVM Board................................................................................................................. 4 Selecting Equalization and De-emphasis Levels for TUSB542 .................................................. 6 Monitoring the device current ........................................................................................................... 6 PCB Construction .............................................................................................................................. 7 TUSB542 EVM Board Schematics .............................................................................................. 7 TUSB542 EVM Board Layout .....................................................................................................10 TUSB542 EVM Material Listing ..................................................................................................16 Tables Table 1. – TUSB542 EVM Jumper / Switch Description and Settings ................................................... 5 Table 2. – TUSB542 Equalization and De-emphasis Selection Table .................................................... 6 Table 3. – TUSB542 EVM Bill of Materials ..........................................................................................17 Figures Figure 1. TUSB542EVM Typical System Setup ...................................................................................... 3 Figure 2. – TUSB542 EVM [Top Side] .................................................................................................... 4 Figure 3. – TUSB542 EVM Schematic [High Speed Pins / Config] ......................................................... 7 Figure 4. – TUSB211, TUSB321 ............................................................................................................. 8 Figure 5. – Power .................................................................................................................................. 9 Figure 6. – TUSB542 EVM Layout Layer 1 [Top] .................................................................................10 Figure 7. – TUSB542 EVM Layout Layer 2 [GND] ................................................................................11 Figure 8. – TUSB542 EVM Layout Layer 3 [Power] .............................................................................12 Figure 9. – TUSB542 EVM Layout Layer 4 [Power/Signal] ..................................................................13 Figure 10. – TUSB542 EVM Layout Layer 5 [GND] ..............................................................................14 Figure 11. – TUSB542 EVM Layout Layer 6 [Bottom] .........................................................................15 2 TUSB542EVM www.ti.com HPA/High-Speed Interface Introduction The TUSB542 is a dual channel USB 3.0 SuperSpeed re-driver supporting systems with Type-C connectors. The device complies with USB 3.1 spec revision 1.0 (Gen I), supporting electrical idle condition and low frequency periodic signals (LFPS) for USB power management modes. The device offers programmable equalization a n d t r a n s m i t t e r d e - e m p h a s i s that extends the interconnect distance between two devices. Also, the device supports low power modes when unplugged. The device can also function in USB compliance mode to test the transmitter for compliance to voltage and timing specifications per USB compliance specs. This EVM was designed to be used as a medium connection between a USB host and a USB device via Type-C connector. The interface to the EVM consists of a USB 3.0 Type C Receptacle and a USB 3.0 Type B Receptacle. Therefore, in order to connect the EVM to your system set up, you will most likely need 1 USB 3.0 Standard Type AB cable and 1 USB Type-C to Type-A adapter(Or Cable). Your test setup should look similar to the figure below: Figure 1. TUSB542EVM Typical System Setup 3 TUSB542EVM www.ti.com HPA/High-Speed Interface TUSB542 EVM Kit Contents This EVM kit should contain the following items: • TUSB542 EVM board • TUSB542EVM User’s Manual Description of EVM Board The TUSB542 EVM is designed to provide easy evaluation of the TUSB542 device. It is also meant to serve as a reference design to show a practical example of how to use the device in a mass-production system. Figure 2 highlights the jumpers and switch installed on this EVM and Table 1 highlights their functionality and configuration. Figure 2. – TUSB542 EVM [Top Side] 4 TUSB542EVM www.ti.com Switch/Jumpers HPA/High-Speed Interface Functionality and Configuration SW1 CNFG_A1 1 = Pull-Down 2 = NC 3 = Pull-Up SW2 CNFG_A2 1 = Pull-Down 2 = NC 3 = Pull-Up SW3 CNFG_B1 1 = Pull-Down 2 = NC 3 = Pull-Up SW4 CNFG_B2 1 = Pull-Down 2 = NC 3 = Pull-Up SW5 SEL 1 = Pull-Down 2 = NC (Internal Pull-Up) 3 = Pull-Up J1 1.8V VCC J1-1 = Regulator Output J1-2 = TUSB542 1.8V Vcc J2 GND J2-1 = GND J2-2 = GND J3 Type-B VBUS J3-1 = Type B Connector VBUS J3-2 = Regulator Input (VBUS_B) J4 GND J4-1 = GND J4-2 = GND J5 SEL J5-1 = SEL J5-2 = GND J6 Type-C VBUS J6-1 = Type-C Connector VBUS J6-2 = TPS25910 5V Output (VBUS) J7 GND J7-1 = GND J7-2 = GND Table 1. – TUSB542 EVM Jumper / Switch Description and Settings 5 TUSB542EVM www.ti.com HPA/High-Speed Interface Selecting Equalization and De-emphasis Levels for TUSB542 The equalization, de-emphasis and output swing levels of each channel are configured via the CNFG_A1, CNFG_A2, CNFG_B1 and CNFG_B2 pin states. Table 2 lists all possible EQ, DE and OS levels that can be achieved with the TUSB542: Ch1 (AP-Redriver) CNFG_A1 Low Float High DE_AP OS_AP EQ_AP CNFG_B1 (dB) (V) (dB) Low 3.5 1.1 3 Float 3.5 0.9 3 High 0 1.1 3 Low 0 0.9 3 Float 3.5 1.1 0 High 3.5 0.9 0 Low 0 1.1 0 Float 0 0.9 0 High 6 1.1 6 Ch2 (Redriver-Conn) CNFG_A2 Low Float High DE_Conn OS_Conn EQ_Conn CNFG_B2 (dB) (V) (dB) Low 6 1.1 0 Float 3.5 1.1 0 High 3.5 0.9 0 Low 6 0.9 0 Float 3.5 1.1 6 High 3.5 0.9 6 Low 6 1.1 6 Float 6 0.9 6 High 6 1.1 9 Table 2. – TUSB542 Equalization and De-emphasis Selection Table Monitoring the device current The TUSB542 EVM includes the option of monitoring the current draw of the device. In order to enable this feature, the following steps must be taken: 1. Un-install the shunt located at JMP1 and remove R43. 2. Obtain a power supply with the ability to display its current draw (or connect a current meter in series to the power supply) 3. Connect to 1.8V of external power source to VCC_18V (J1-2) and GND of the external supply to a convenient GND location on the EVM (J2-2). 4. Turn on your power supply and observe the measured current on your power supply display (or current meter) 6 TUSB542EVM www.ti.com HPA/High-Speed Interface PCB Construction This section discusses the construction of the EVM boards. It includes the board schematics and layout files to show how the board was built. TUSB542 EVM Board Schematics VCC_18 VCC_18 R9 10k R1 10k SW5 3 1 R10 10k 3 2 1 VCC_18 2 SEL 1 R2 10k Switch CJS-1201 R3 10k SW1 3 3 1 VCC_18 2 2 CNFG_A1 3 1 R4 10k Switch CJS-1201 R5 10k SW2 3 1 2 VCC_18 2 CNFG_A2 1 R6 10k Switch CJS-1201 R7 10k SW3 3 3 1 2 SW4 3 2 CNFG_B1 1 R8 10k Switch CJS-1201 3 1 2 2 CNFG_B2 Switch CJS-1201 N o t e : SW5 SEL Default position 2 (NC) Internal pull-up in TUSB321 default T x_Con2+_conn VBUS_B 7 5 T x_AP-_Conn 6 T x_AP+_Conn C1 C2 USB3.0 Ty pe B Receptacle 0.1uF 16 SEL SEL T x_AP- 17 T x_AP+ 18 0.1uF Rx_AP+ Rx_Con_2+ Tx_Con2+ Tx_Con2- 11 12 SEL Rx_Con_2Tx_Con_1- Tx_AP- Tx_AP+ CNFG_B2 CC1 CC2 U1 TUSB542RWQ - Ironwood Socket CNFG_B2 Rx_AP- Tx_Con_2- 15 Tx_Con_2+ 13 14 Rx_AP+ CNFG_B2 CNFG_B1 SS_TX_P Rx_AP- 9 P2 A4 A9 B4 B9 0.1uF Rx_Con_1- SS_TX_N 8 Rx_Con_1+ Shield2 4 Tx_Con_1+ VDD18 9 SSRXP2 8 T x_Con1- 6 T x_Con1+ 5 C4 SSRXN2 0.1uF C3 7 CNFG_A1 CNFG_B1 USB2_DM USB2_DP SSTXP1 SSTXN1 0.1uF VCC_18 C7 C8 C9 0.01uF 0.1uF 0.1uF CNFG_B1 SSRXN1 SSRXP1 CC1 CC2 A5 B5 A8 B8 SSTXP1 SSTXN1 SSRXP2 SSRXN2 S E L H = Type-C Position 1 L = Type C Position 2 3 11 Shield1 GND_DRAIN USB2_DP CNFG_A2 CNFG_A2 CNFG_A2 SS_RX_P 10 USB2_DM USB2_DP CNFG_A1 SS_RX_N USB2_DM 3 PAD_GND GND 2 VBUS_C SSTXN2 C6 0.1uF 1 USB2_DP 0 19 VBUS USB2_DM R45 1 C5 CNFG_A1 P1 SSTXP2 T x_Con2-_conn J3 HDR2X1 M .1 10 2 GND 4 1 G N D J4-2 Rx_Con1- VBUS_B J 4 - 1 2 V B U S J3-2 J4 HDR2X1 M .1 2 Rx_Con1+ J 3 - 1 1 N o t e : Place C7, C8 and C9 underneath U1 as close to pin 5 as possible. Figure 3. – TUSB542 EVM Schematic [High Speed Pins / Config] SSTXP2 SSTXN2 SSRXP1 SSRXN1 USB2_DM USB2_DP A7 A6 B6 B7 A2 A3 A11 A10 B2 B3 B11 B10 A1 A12 B1 B12 VBUS VBUS VBUS VBUS CC1 CC2 SBU1 SBU2 DN1 DP1 DP2 DN2 SSTXP1 SSTXN1 SSRXP2 SSRXN2 SSTXP2 SSTXN2 SSRXP1 SSRXN1 GND GND GND GND CHASSIS CHASSIS CHASSIS CHASSIS JAE DX07S024JJ2 C1 C2 C3 C4 www.ti.com HPA/High-Speed Interface VBUS_C USB2_DP N o t e : Device Connected LED 7 OUT1 OUT1 8 OUT2 ID OUT2 R44 1.6k Q1 3 Source Drain Gate 9 C24 0.1uF 2 1 CSD25484 PMOS Port CURR_Mode 3 4 5 VCONN_FAULT# D8 Green U2 TUSB321_GPIO CURRENT_MODE USB2_DP U S B 2 _ D P M o d e : 10K: 3.0A Current 500K: 1.5A Current NC: Default Current CC2 CC1 2 CC1 CC1 1 CC2 CC2 VDD a n d C u r r e n t 12 U S B 2 _ D M signals underneath U6. 6 5 4 TUSB211RWB 3 R o u t e 200k PORT 7 USB2_DM R17 200k DIR D2P USB2_DM R18 200k R12 10k 4.7k 11 D2M 8 R42 6 10 11 9 ENA_HS GND R14 499 EQ D1P RSTN 2 VCC USB2_DP VREG USB2_DP D1M CD 1 TEST USB2_DM USB2_DM 12 0.1uF VBUS_DET VBUS_C VBUS_DET 200k 900k VCONN_FAULT# C25 U6 R15 R16 R11 0.1uF GND C23 10 3.3V VBUS_B VBUS_B 321_ID 321_ID J5 2 1 HDR2X1 M .1 S E L J5-1 J5-2 Figure 4. – TUSB211, TUSB321 SEL GND SEL SEL D I R H = Type-C Position 2 L = Type C Position 1 N o t e : CC1 & CC2 swapped as DIR and SEL are opposite for TUSB542 and TUSB321 www.ti.com HPA/High-Speed Interface VBUS_B VBUS_B R46 R23 NoPop 0 U5 J6 HDR2X1 M .1 1 2 1 16 15 10 11 12 14 13 9 321_ID 321_ID 1 D9 2 RB161M-20TR 2 J7 HDR2X1 M .1 G N D J7-2 GND V C C _ 1 . 8 V J1-1 J1-2 0 R43 VBUS_B U3 1 2 C12 10uF C13 10uF 3 C14 1uF VIN VOUT 5 J1 1 N/C 4 1 IN IN IN GATE GND GND GND ILIM 1 2 3 4 5 6 8 7 C21 47uF R26 29.4K TPS25910RSA 2 C11 C10 1uF 0.1uF VBUS_B 3.3V HDR2X1 M .1 LP5907MFX-1.8NOPB U7 4 J 2 - 1 N o t e : Place C12, C13 & C14 close to Connector P1. G N D J2-2 VBUS_C GND VBUS_B 3 IN OUT EN GND LP5907X2SON C15 10uF C16 10uF C18 1uF C17 1uF N o t e : N o t e : Place C15, C16 & C17 close to Connector P2. C22 47nF VCC_18 HDR2X1 M .1 J2 2 GND EN LP5907 1.8V VCC_18 EN# FLT# OUT OUT OUT GND GND GND 17 J 7 - 1 R24 10k C19 0.1uF C20 0.1uF Place C18, C19 & C20 underneath device U2 close to pin 12. Figure 5. – Power PAD VBUS_C R41 0 TPS_VBUS VBUS_C 5 J6-1 J6-2 PWPD V B U S _ C 1 2 C26 C27 1uF 1uF www.ti.com HPA/High-Speed Interface TUSB542 EVM Board Layout This EVM was designed to show the implementation on a 6-layer board. Figure 6. – TUSB542 EVM Layout Layer 1 [Top] 10 TUSB542EVM www.ti.com HPA/High-Speed Interface Figure 7. – TUSB542 EVM Layout Layer 2 [GND] 11 TUSB542EVM www.ti.com HPA/High-Speed Interface Figure 8. – TUSB542 EVM Layout Layer 3 [Power] 12 TUSB542EVM www.ti.com HPA/High-Speed Interface Figure 9. – TUSB542 EVM Layout Layer 4 [Power/Signal] 13 TUSB542EVM www.ti.com HPA/High-Speed Interface Figure 10. – TUSB542 EVM Layout Layer 5 [GND] 14 TUSB542EVM www.ti.com HPA/High-Speed Interface Figure 11. – TUSB542 EVM Layout Layer 6 [Bottom] 15 TUSB542EVM www.ti.com HPA/High-Speed Interface TUSB542 EVM Material Listing Below is a table of the complete BOM for the TUSB542 EVM. Reference Value Qty 1 14 C1,C2,C3,C4,C5,C6,C8,C9,C10, C19,C20,C23,C24,C25 0.1uF Capacitor TDK 2 1 C7 0.01uF Capacitor TDK 3 6 C11,C14,C17,C18,C26,C27 1uF Capacitor TDK 4 5 4 1 C12,C13,C15,C16 C21 10uF 47uF Capacitor Capacitor TDK TDK 6 1 C22 47nF Capacitor TDK 7 1 D8 LED LITE-ON C1005X7R1C473K050BC LTST-C170KGKT 8 1 D9 Schottky Rohm Semiconductor RB161M-20TR 9 7 J1,J2,J3,J4,J5,J6,J7 2-Pin Header Sullins Connector Solutions S1012E-02 10 1 P1 Wurth Electronics 11 1 P2 USB3 Type B Receptacle Type C USB Connector 12 Q1 PMOS FET Texas Instruments 13 12 10K Resistor Panasonic Electronic Components 14 15 16 17 18 1 1 1 4 1 900K 499 4.7K 200k 10K (No Pop) Resistor Resistor Resistor Resistor Resistor Panasonic Electronic Components Panasonic Electronic Components Panasonic Electronic Components Panasonic Electronic Components HDR2x1 M .1 Part Description Manufacturer Manufacturer Part Number Item C0603X7S1A104M030BC C0603X5R1A103K030BA C1005X5R1A105K050BB C1608X5R0J106M080AB C3216X6S0J476M160AB 692221030100 JAE DX07S024JJ3R1300 R1,R2,R3,R4,R5,R6,R7,R8, R9,R10,R12,R24 R11 R14 R15 R16,R17,R18,R42 R23 CSD25484F4T ERJ-2GEJ103X ERJ-2RKF9093X ERJ-2RKF4990X ERJ-2GEJ472X ERJ-2RKF2003X www.ti.com 19 20 21 22 23 24 25 26 27 1 4 1 5 1 1 1 1 1 R26 R41,R43,R45,R46 R44 SW1,SW2,SW3,SW4,SW5 U1 U2 U3 U5 U6 28 1 U7 HPA/High-Speed Interface 29.4K 0 1.6k Resistor Resistor Resistor Switch USB3 Switch / Redriver CC Controller 1.8V LDO Power Switch USB 2.0 Redriver Panasonic Electronic Components Panasonic Electronic Components Panasonic Electronic Components Copal Electronics Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments ERJ-2RKF2942X ERJ-6GEY0R00V ERJ-1GEF1601C CJS-1201TA TUSB542RWQ TUSB321 LP5907MFX-1.8NOPB TPS25910RSA TUSB211RWB 3.3V LDO Texas Instruments LP5907SNX-3.3/NOPB Table 3. – TUSB542 EVM Bill of Materials STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. 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