TUSB8041EVM

TUSB8041EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    TUSB8041 - Interface, USB 3.0 Hub Evaluation Board

  • 详情介绍
  • 数据手册
  • 价格&库存
TUSB8041EVM 数据手册
User's Guide SLLU198 – May 2014 TUSB8041RGC REVD Evaluation Module The Texas Instruments TUSB8041RGC REVD evaluation module (EVM) is a functional board design of a single device that implements both a USB 3.0 hub and a USB 2.0 hub. The EVM can support both SuperSpeed (SS) and USB 2.0 (HS, FS, and LS) operation on its USB ports. This EVM is intended for use in evaluating system compatibility, developing optional EEPROM firmware, and validating interoperability. This EVM also acts as a hardware reference design for any implementation of the TUSB8041. Contents Introduction ................................................................................................................... Hardware Overview.......................................................................................................... 2.1 TUSB8041RGC ..................................................................................................... 2.2 USB Port Connectors .............................................................................................. 2.3 USB Port Connector – Power ..................................................................................... 2.4 USB Port Connector – Noise Filtering ........................................................................... 2.5 Optional Serial EEPROM .......................................................................................... 2.6 Power ................................................................................................................. 2.7 Hub Configuration .................................................................................................. 2.8 Optional Circuitry.................................................................................................... 3 Hardware Setup .............................................................................................................. 3.1 Configuration Switch ............................................................................................... 3.2 EVM Installation ..................................................................................................... 3.3 Troubleshooting ..................................................................................................... Appendix A ........................................................................................................................ Appendix B ........................................................................................................................ 1 2 2 2 2 3 3 3 3 4 4 4 4 4 6 6 7 9 List of Figures 1 TUSB8041 REVD EVM Top Layer Layout ............................................................................... 2 2 TUSB8041RGC REVD EVM Top Layer Layout ......................................................................... 9 3 USB Port Connections ..................................................................................................... 10 4 Power ........................................................................................................................ 11 List of Tables 1 Switch Definitions ............................................................................................................ 5 2 TUSB8041 QFN Lab EVM Bill Of Materials: Texas Instruments, CCI/ICP SLLU198 – May 2014 Submit Documentation Feedback .......................................... TUSB8041RGC REVD Evaluation Module Copyright © 2014, Texas Instruments Incorporated 7 1 Introduction 1 www.ti.com Introduction Upon request, layout files for the EVM can be provided to illustrate techniques used to route the differential pairs, use of split power planes, placement of filters and other critical components, and methods used to achieve length matching of critical signals. NOTE: The EVM accommodates various lab test components; actual production implementations can be much smaller. Figure 1. TUSB8041 REVD EVM Top Layer Layout 2 Hardware Overview The TUSB8041 EVM board hardware can be divided into the following functional areas: 2.1 TUSB8041RGC The TUSB8041 on the TUSB8041 EVM (U1 on the schematic) operates as a functional interconnect between an upstream connection to a USB host or hub and up to four directly connected downstream devices or hubs. More devices and hubs can be supported if arranged in tiers. The TUSB8041 is capable of supporting operation at USB SuperSpeed (SS), high-speed (HS), full speed (FS), or low speed (LS). In general, the speed of the upstream connection of the TUSB8041 EVM limits the downstream connections to that speed (SS, HS, and FS), or lower. Windows is a registered trademark of Microsoft Corporation. 2 TUSB8041RGC REVD Evaluation Module Copyright © 2014, Texas Instruments Incorporated SLLU198 – May 2014 Submit Documentation Feedback Hardware Overview www.ti.com The TUSB8041 requires a 24-MHz low-ESR crystal, Y1, with a 1-MΩ feedback resistor. The crystal should be fundamental mode with a load capacitance of 12 to 24 pF and a frequency stability rating of ±100 PPM or better. To ensure a proper startup oscillation condition, TI recommends a maximum crystal equivalent series resistance (ESR) of 50 Ω. The TUSB8041 can also use an oscillator or other clock source. When using an external clock source such as an oscillator, the reference clock should have ±100 PPM (or better) frequency stability and have less than 50-ps absolute peak-to-peak jitter (or less) than 25-ps peak-to-peak jitter after applying the USB 3.0 jitter transfer function. 2.2 USB Port Connectors The TUSB8041 EVM is equipped with five standard 9-pin USB 3.0 port connectors. One of these five connectors, J1, is a Type B connector designed to interface with an upstream USB host or hub. The remaining connectors, J2, J3, J4, and J5, are Type A connectors for connection to downstream devices or hubs. Standard size connectors were used on the EVM design, but USB micro connectors can be used if desired. The USB ports can be attached through a standard USB cable to any USB 3.0 or legacy USB host, hub, or device. The TUSB8041 will automatically connect to any upstream USB 3.0 host or hub at both SS and HS. Using a legacy USB cable between the TUSB8041 EVM and a USB 3.0 host or hub forces it to HS operation. The same is true if a legacy USB cable is used between the TUSB8041 EVM and a downstream SS-capable device; operation will be limited to USB 2.0 HS. 2.3 USB Port Connector – Power VBUS is received from the upstream host or hub on J1. The TUSB8041 is configured as a self-powered hub, so there is not any significant current draw by the EVM from VBUS. The TUSB8041 does monitor the VBUS input after filtering through a resistor divider network of a 90.9-kΩ, 1% resistor, R2, and a 10-kΩ, 1% resistor, R3. VBUS cannot be directly connected to the TUSB8041 device. A bulk capacitor of at least 1 μF is required on the upstream port VBUS input to comply with the USB specification. The TUSB8041EVM uses a 10-μF capacitor, C35. VBUS, sourced by the 5-V wall power input, J6, is provided to the downstream port connectors. The USB 3.0 specification limits the current consumption of a USB 3.0 device to 900 mA at 5 V. The current limiting parameter of the TPS2001C devices, U7, U8, U9, and U10, is 2 A to avoid any spurious overcurrent events due to bus-powered HDD spin-up power fluctuations or unnecessary limiting during USB charging. A production implementation could place stricter limits on this power consumption. An overcurrent event on any of the downstream port connectors will be reported to the TUSB8041 through the OVERCURxZ inputs. 2.4 USB Port Connector – Noise Filtering Each downstream VBUS output has a 150-μF bulk capacitor (C70, C71, C76, C79) as recommended by the TPS2001C data manual to prevent in-rush current events on the downstream devices. In addition, there are ferrite beads and small capacitors on the VBUS lines to reduce noise and address ESD/EMI concerns. The TUSB8041EVM also implements optional isolation using two small noise filtering capacitors and a 1MΩ resistor between the earth ground of each connector and the digital ground of the EVM; this is not a requirement, but should be used if ground isolation is desired. Note that the series capacitors implemented on the SS TX pairs are incorporated to satisfy the USB 3.0 requirement that differential links be AC coupled on the transmit pair. 2.5 Optional Serial EEPROM Each TUSB8041EVM is equipped with an onboard EEPROM/socket placeholder, U2. A small I2C EEPROM can be installed to set the configuration registers as defined in the TUSB8041 data manual. In its default setting, the EVM does not have an EEPROM installed and instead uses the configuration inputs to determine any optional settings of the TUSB8041. SLLU198 – May 2014 Submit Documentation Feedback TUSB8041RGC REVD Evaluation Module Copyright © 2014, Texas Instruments Incorporated 3 Hardware Overview www.ti.com The EEPROM interface defaults to programmable (not write-protected) so that any installed EEPROM’s contents may be modified to test various settings. If an EEPROM data change is required, the values may be changed using the register access methods outlined in the TUSB8041 data sheet. In addition, a Windows® based EEPROM utility is available upon request. 2.6 Power The TUSB8041 EVM operates from the power provided by a 5-V wall power adapter, J5, not bus power supplied by a USB host. TI recommends to use a wall power adapter that is capable of sourcing 2 to 3 A because the hub must be able to source significant power on its downstream ports (900 mA per port). The TUSB8041 EVM uses a single-channel LDO voltage regulator to drop 5 V to 3.3 V. The TPS7A4533, U4, is a 1.5-A output linear regulator (SLVS720). The 1.1-V core voltage required by the TUSB8041 is sourced by the 3.3-V rail to reduce unnecessary heat dissipation. The TPS74801, U6, is a 1.5-A output single channel LDO linear regulator (SBVS074). Both regulators require few external passive components and are appropriately rated for heat dissipation. 2.7 Hub Configuration The TUSB8041EVM can be configured by setting several inputs to the TUSB8041 that are sampled at power-on reset or using an optional serial EEPROM or SMBUS host. A production implementation without EEPROM or SMBUS could either rely on the default internal pullup or pulldown resistor for each configuration input or override it with an external pullup or pulldown resistor. The settings can be modified using SW1 and SW2 on the EVM. Descriptions of the possible configuration changes are included in a later section. 2.8 Optional Circuitry The TUSB8041 EVM design implements a variety of LEDs, none of which are required by the USB specification. They are provided to make testing and debugging easier. • D1 – indicates that the upstream USB port is connected at HS. • D2 – indicates that the downstream USB port 2 is connected at SS. • D3 – indicates that the downstream USB port 1 is connected at SS. • D4 – indicates that the upstream USB port is connected at SS. • D5 – indicates that 5 V is being applied to the TUSB8041 EVM. • D6 – indicates downstream USB port 1 power is on. • D7 – indicates downstream USB port 2 power is on. • D8 – indicates BOARD_3P3V is active. The switches (SW1, SW2, and SW3) and headers (J7, J8, J9, JP6) present on the TUSB8041 EVM are intended only for lab evaluation and are not required for production designs. 3 Hardware Setup 3.1 Configuration Switch The TI TUSB8041EVM has a set of switches to facilitate configuration changes. TI does not recommend changing these switch settings without a complete understanding of the result. Configuration inputs are only read by the TUSB8041 during power-on reset, changing the switch settings while the EVM is powered on will have no effect. For additional information, refer to the EVM schematic in Section B.1. The switch definitions are as follows in Table 1. 4 TUSB8041RGC REVD Evaluation Module SLLU198 – May 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Hardware Setup www.ti.com Table 1. Switch Definitions Switch Standard Setting Definition SW1_1 Off TEST_TRSTz Switch The TUSB8041 has an internal pulldown on this terminal. If the switch is set to the ON position, the terminal is pulled high and test mode is enabled. This is a production test mode only. SW1_2 Off SMBUSz Switch The TUSB8041 has an internal pullup on this terminal, so I2C interface mode is enabled by default. If the switch is set to the ON position, the terminal is pulled low and SMBUS mode is enabled. SW1_3 Off SCL_SMBCLK Switch The TUSB8041 has an internal pulldown on this terminal, so the serial EEPROM/SMBUS interface is disabled. If the switch is set to the ON position, a pullup resistor is connected to the serial clock terminal to indicate that an I2C EEPROM may be attached (along with a pullup resistor on SDA). SW1_4 Off SDA_SMBDAT Switch The TUSB8041 has an internal pulldown on this terminal, so the serial EEPROM/SMBUS interface is disabled. If the switch is set to the ON position, a pullup resistor is connected to the serial clock terminal to indicate that an I2C EEPROM may be attached (along with a pullup resistor on SCL). SW1_5 Off PWRON1_BATEN1 Switch. The TUSB8041 has an internal pulldown on this terminal, so USB battery charging mode on Port 1 is disabled by default. If the switch is set to the ON position, the terminal is pulled high and battery charging is enabled on downstream port 1. Off PWRON2_BATEN2 Switch The TUSB8041 has an internal pulldown on this terminal, so USB battery charging mode on Port 2 is disabled by default. If the switch is set to the ON position, the terminal is pulled high and battery charging is enabled on downstream port 2. Off PWRON3_BATEN3 Switch The TUSB8041 has an internal pulldown on this terminal, so USB battery charging mode on Port 3 is disabled by default. If the switch is set to the ON position, the terminal is pulled high and battery charging is enabled on downstream port 3. Off PWRON4_BATEN4 Switch The TUSB8041 has an internal pulldown on this terminal, so USB battery charging mode on Port 4 is disabled by default. If the switch is set to the ON position, the terminal is pulled high and battery charging is enabled on downstream port 4. Off AUTOENz Switch The TUSB8041 has an internal pullup on this terminal, so auto mode is disabled by default. If the switch is set to the ON position, the terminal is pulled low and automatic charging mode is enabled on any port that has battery charging enabled. SW2_2 Off GANGED_HS_UP Switch The TUSB8041 has an internal pulldown on this terminal, so ganged mode is disabled by default. If the switch is set to the ON position, the terminal is pulled high and ganged port power control mode is enabled. Because the TUSB8041 EVM does implement individual port power controls, this terminal should be set low. SW2_3 Off PWRCTL_POL Switch The TUSB8041 has an internal pullup on this terminal, so port power control polarity defaults to active high. If the switch is set to the ON position, the terminal is pulled low and the port power control polarity changes to active low. SW2_4 Off FULLPWRMGMTZ_SS_UP Switch The TUSB8041 has an internal pulldown on this terminal, so the TUSB8041 defaults to a full power management mode. If the switch is set to the ON position, the terminal is pulled high and full power management mode is disabled. Because the TUSB8041 EVM does implement downstream port power switching, full power management mode should be left enabled. SW2_5 Off SCL_SMBCLK PD Switch The TUSB8041 has an internal pulldown on this terminal, so the serial EEPROM/SMBUS interface is disabled. If the switch is set to the ON position, an external pulldown resistor is connected to the serial clock terminal for test purposes. SW2_6 Off SDA_SMBDAT PD Switch The TUSB8041 has an internal pulldown on this terminal, so the serial EEPROM/SMBUS interface is disabled. If the switch is set to the ON position, an external pulldown resistor is connected to the serial clock terminal for test purposes. SW1_6 SW1_7 SW1_8 SW2_1 SLLU198 – May 2014 Submit Documentation Feedback TUSB8041RGC REVD Evaluation Module Copyright © 2014, Texas Instruments Incorporated 5 Hardware Setup 3.2 EVM Installation To 1. 2. 3. 3.3 www.ti.com install the EVM, perform the following steps: Attach a 5-V 3-A wall power source to J5. LED D5 should be lit. Turn on switch SW3, LED D8 should be lit. Attach a USB cable between J3 and a USB host. LEDs D6 and D7 should be lit. (a) If the TUSB8041EVM is attached to a USB 3.0 host, D1 and D4 should be lit. (b) If the TUSB8041EVM is attached to a USB 2.0 host, D1 should be lit. Troubleshooting Case 1: Device function or functions are “banged out” in Device Manager. • Make sure that the latest updates are installed for the operating system. • Make sure that the latest drivers are installed for the host controller. Case 2: The EVM does not work at all. • Verify that all switches are in their default state and the EVM is powered on with a 5-V source with adequate current to support any bus-powered devices (3 A+). • If installed, remove the serial EEPROM from the EEPROM socket. The EVM does not require an EEPROM to operate. • Make sure shunts are installed on J7, J8, and J9. • In the case where a 12-V power supply has been attached to the EVM, the fault is non-recoverable. 6 TUSB8041RGC REVD Evaluation Module Copyright © 2014, Texas Instruments Incorporated SLLU198 – May 2014 Submit Documentation Feedback www.ti.com Appendix A A.1 TUSB8041RGC REVD EVM Bill of Materials This appendix contains the TUSB8041RGC REVD EVM BOM. Table 2. TUSB8041 QFN Lab EVM Bill Of Materials: Texas Instruments, CCI/ICP Item Quantity 1 1 C5 Reference Part 2 1 C3 3 5 C39,C47,C49,C57,C59 0.001uF 4 9 C6,C9,C12,C15,C19,C22,C2 5,C28,C32 5 9 6 Manufacturer Part Number Package 1uF TDK C2012X7R1A105K 805 1uF Samsung CL05B105KQ5NQNC 402 TDK C1005X7R1H102K 402 0.001uF TDK C0603X7R1E102K030BA 201 C7,C10,C13,C16,C20,C23,C 26,C29,C33 0.01uF Yageo CC0201KRX7R7BB103 201 18 C4,C38,C40,C41,C46,C48,C 50,C51,C56,C58,C66,C69,C 72,C75,C77,C78,C80,C81 0.1uF Yageo CC0402KRX5R6BB104 402 7 19 C8,C11,C14,C17,C21,C24,C 27,C30,C34,C36,C37,C42,C 43,C44,C45,C52,C53,C54,C 55 0.1uF TDK C0603X5R0J104M 201 8 2 C1,C2 18pF AVX 04025A180JAT2A 402 9 9 C18,C31,C35,C61,C67,C68, C73,C74 10uF Murata Electronics GRM31CR61C106KC31L 1206 10 4 C70,C71,C76,C79 150uF Kemet B45197A2157K409 (Tantalum) 7343 11 6 R10,R32,R42,R43,R44,R45 NOPOP 12 8 D1,D2,D3,D4,D5,D6,D7,D8 LED Green 0805 Lite On LTST-C171GKT 805 13 5 FB1,FB3,FB4,FB5,FB6 220 @ 100MHZ Ferrite Bead Murata BLM18PG221SN1D 603 14 2 SW1,SW2 8-POS 50-MIL SMT C&K Components SD08H0SBR 15 1 J1 USB3_TYPEB_CON NECTOR Amphenol GSB321131HR 9_RA_TH_B 16 4 J2,J3,J4,J5 USB3_TYPEA_CON NECTOR Amphenol GSB311131HR 9_RA_TH_A 17 1 J6 2.1mm x 5.5mm DC Power Jack CUI Inc. PJ-202AH (PJ-002AH) 18 6 R1,R15,R17,R18,R19,R20 1M Rohm Semiconductor MCR01MZPJ105 402 19 1 R2 90.9K 1% Rohm Semiconductor MCR01MZPF9092 402 20 4 R26,R27,R29,R36 10K Rohm Semiconductor MCR01MZPJ103 402 21 1 R3 10K 1% Rohm Semiconductor MCR01MZPF1002 402 22 4 R6,R7,R8,R9 4.7K Rohm Semiconductor MCR01MZPJ472 402 23 14 R4,R5,R11,R12,R13,R14,R2 2,R23,R24,R25,R38,R39,R4 6, R47 1K Rohm Semiconductor MCR01MZPJ102 402 24 8 R16,R28,R30,R31,R35,R37, R40,R41 330 Rohm Semiconductor MCR01MZPJ331 402 25 1 R33 1.87K Vishay / Dale CRCW04021K87FKED 402 26 1 R34 4.99K Vishay / Dale CRCW04024K99FKED 402 402 2.1mm x 5.5mm 7 SLLU198 – May 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated TUSB8041RGC REVD EVM Bill of Materials www.ti.com Table 2. TUSB8041 QFN Lab EVM Bill Of Materials: Texas Instruments, CCI/ICP (continued) Item Quantity 27 1 R21 Reference Part 28 1 U1 29 1 U2 30 4 U7,U8,U9,U10 31 1 U4 32 1 U6 TPS74801RGW 1.1V Voltage Regulator 33 1 Y1 ECS-24MHZ Crystal 34 4 35 1 FB2 0 ohm 36 1 JP6 Conn 2x5 shroud NO POP 3M 2510-6003UB HDR5X2 M 0.1" TH 37 3 J7,J8,J9 Header 1x2 3M 961102-6404-AR HDR2X1 M 0.1" TH 38 1 SW3 C&K Components L101011MS02Q SPST 39 2 GND1, GND2 9.53K 1% Manufacturer Rohm Semiconductor TUSB8041 - USB 3.0 Texas Instruments Hub AT24C04 I2C EEPROM Part Number MCR01MRTF9531 TUSB8041 Package 402 64QFN Atmel AT24C04A-10PI-1.8 TPS2001C Texas Instruments TPS2001CDGN 8DGN TPS7A4533 - 3.3V Voltage Regulator Texas Instruments TPS7A4533KTT DDPAK-5 Texas Instruments TPS74801RGW 20VQFN ECS ECX-53B (ECS-240-2030B-TR) 5.0mm x 3.2mm PCB Feet Power Switch L101011MS02Q 8DIP 3M 603 NOPOP 8 SLLU198 – May 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Appendix B B.1 TUSB8041RGC REVD EVM Schematics This appendix contains the TUSB8041RGC REVD EVM schematics. BOARD_3P3V R1 1 MΩ USB_SSRXN_UP USB_SSRXP_UP USB_SSTXM_UP USB_SSTXP_UP USB_DM_UP USB_DP_UP Y1 VDD33 VDD11 1 R21 C1 C2 18 pF 18 pF TEST_TRSTZ 2 2 USB_DP_DN2 USB_DM_DN2 USB_SSTXP_DN2 USB_SSTXM_DN2 2 2 2 2 USB_SSRXP_DN2 USB_SSRXM_DN2 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 USB_R1 VDD33 XI XO NC USB_SSRXM_UP USB_SSRXP_UP VDD11 USB_SSTXM_UP USB_SSTXP_UP USB_DM_UP USB_DP_UP VDD33 VDD11 GRSTN TEST_TRSTz USB_DP_DN1 USB_DM_DN1 USB_SSTXP_DN1 USB_SSTXM_DN1 USB_SSRXP_DN1 USB_SSRXM_DN1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 USB_DP_DN1 USB_DM_DN1 USB_SSTXP_DN1 USB_SSTXM_DN1 VDD11 USB_SSRXP_DN1 USB_SSRXM_DN1 VDD11 USB_DP_DN2 USB_DM_DN2 USB_SSTXP_DN2 USB_SSTXM_DN2 VDD11 USB_SSRXP_DN2 USB_SSRXM_DN2 VDD33 TUSB8041 2 2 2 2 2 2 2 2 2 2 2 2 USB_VBUS OVRCUR2Z_TMS OVRCUR1Z_TDI AUTOENZ_HS_SUSPEND OVRCUR3Z_TCK OVRCUR4Z GANGED_SMBA2_HS_UP PWRCTL_POL_TDO FULLPWRMGMTZ_SMBA1_SS_UP SMBUSZ_SS_SUSPEND SCL_SMBCLK SDA_SMBDAT PWRON1Z_BATEN1 PWRON2Z_BATEN2 VDD33 PWRON3Z_BATEN3 USB_DP_DN3 USB_DM_DN3 USB_SSTXP_DN3 USB_SSTXM_DN3 VDD11 USB_SSRXP_DN3 USB_SSRXM_DN3 USB_DP_DN4 USB_DM_DN4 USB_SSTXP_DN4 USB_SSTXM_DN4 VDD11 USB_SSRXP_DN4 USB_SSRXM_DN4 VDD11 PWRON4Z_BATEN4 2 2 R3 10 kΩ 0402 1% 1 µF PPAD 2 USB_VBUS_UP 2 Header 1x2 90.9 kΩ 0402 1% 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 J8 R45 NOPOP R43 NOPOP R42 NOPOP 1 3 5 7 9 JTAG is for lab evaluation only on TUSB8041. This header and NOPOP pullups are not recommended for customers. OVERCUR2Z_TMS OVERCUR1Z_TDI AUTOENZ GANGED_HS_UP PWRCTL_POL_TDO FULLPWRMGMTZ_SS_UP SMBUSZ SCL_SMBCLK SDA_SMBDAT R44 NOPOP TEST_TRSTZ PWRCTL_POL_TDO OVERCUR1Z_TDI OVERCUR2Z_TMS OVERCUR3z_TCK OVERCUR2Z_TMS OVERCUR1Z_TDI 3 3 OVERCUR3Z_TCK OVERCUR4Z 3 3 PWRON1_BATEN1 PWRON2_BATEN2 PWRON3_BATEN3 PWRON4_BATEN4 JP6 2 4 6 8 10 Conn 2x5 shroud 3 3 3 3 65 BOARD_3P3V 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 2 2 C3 9.53 kΩ 1% U1 2 2 R2 GRSTZ ECS-24MHZ 2 2 2 2 2 2 USB_DP_DN3 USB_DM_DN3 USB_SSTXP_DN3 USB_SSTXM_DN3 USB_SSRXP_DN3 USB_SSRXM_DN3 USB_DP_DN4 USB_DM_DN4 USB_SSTXP_DN4 USB_SSTXM_DN4 USB_SSRXP_DN4 USB_SSRXM_DN4 R22 1 kΩ 0402 5% SW1 8-POS 50-MIL SMT 1 2 3 4 5 6 7 8 TEST_TRSTZ SMBUSZ SCL_SMBCLK SDA_SMBDAT PWRON1_BATEN1 PWRON2_BATEN2 PWRON3_BATEN3 PWRON4_BATEN4 16 15 14 13 12 11 10 9 R4 1 kΩ 0402 5% R5 1 kΩ 0402 5% R6 4.7 kΩ 0402 5% R7 4.7 kΩ 0402 5% R8 4.7 kΩ 0402 5% R9 4.7 kΩ 0402 5% TEST_PUP SMBUSZ_PD SCL_PUP SDA_PUP BATEN0 BATEN1 BATEN2 BATEN3 R24 1 kΩ 0402 5% BOARD_3P3V BOARD_3P3V R12 1 kΩ 0402 5% R13 1 kΩ 0402 5% VCC WP SCLK SDATA 8 7 6 5 SCL_SMBCLK SDA_SMBDAT D3 LED D2 LED US HS 16 15 14 13 12 11 10 9 AT24C04 R40 330 0402 5% R14 1 kΩ 0402 5% R38 1 kΩ 0402 5% SDA_PD R46 1 kΩ 0402 5% US SS R25 1 kΩ 0402 5% AUTOENZ_PD GANGED_PU PWRCTL_POL_PD FULLPWRMGMTZ_PUP SCL_PD R47 1 kΩ 0402 5% R39 1 kΩ 0402 5% R41 330 0402 5% VDD33 BOARD_3P3V FB1 J7 1 C5 1 µF C6 C8 C7 0.01 µF 0.001 µF C9 0.1 µF C10 0.001 µF 0.01 µF C11 0.1 µF C12 C13 C14 C15 C16 C17 0.001 µF 0.01 µF 0.1 µF 0.001 µF 0.01 µF 0.1 µF 220 at 100 MHz VDD11 2 Header 1x2 BOARD_1P1V FB2 1 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 0.001 µF 0.01 µF 0.1 µF 0.001 µF 0.01 µF 0.1 µF 0.001 µF 0.01 µF 0.1 µF 0.001 µF 0.01 µF 0.1 µF C31 10 µF C32 C33 C34 0.001 µF 0.01 µF 0.1 µF 2 GND1 220 at 100 MHz Header 1x2 1 C18 10 µF J9 GND2 1 R11 1 kΩ 0402 5% A0 A1 A2 GND 1 2 3 4 5 6 7 8 AUTOENZ GANGED_HS_UP PWRCTL_POL_TDO FULLPWRMGMTZ_SS_UP R10 NOPOP U2 1 2 3 4 R23 1 kΩ 0402 5% SW2 8-POS 50-MIL SMT C4 0.1 µF Optional EEPROM Circuitry Figure 2. TUSB8041RGC REVD EVM Top Layer Layout 9 SLLU198 – May 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated TUSB8041RGC REVD EVM Schematics www.ti.com USB_VBUS_UP 1 J1 1 2 3 4 5 6 7 8 9 10 11 VBUS DM DP GND SSTXN SSTXP GND SSRXN SSRXP SHIELD0 SHIELD1 C36 0.1 µF 0201 C37 0.1 µF 0201 CAP_UP_TXM CAP_UP_TXP C38 0.1 µ F USB3_TY PEB_CONNECTOR C39 0.001 µ F USB_DM_UP 1 USB_DP_UP 1 USB_SSTXM_UP 1 USB_SSTXP_UP USB_SSRXN_UP USB_SSRXP_UP 1 1 1 C35 10 µF D1 LED Green 0805 R15 1 MΩ 0402 5% R16 330 Ω 0402 5% FB3 FB4 DN4_VBUS DN4_VBUS DN2_VBUS 3 C40 220 at 100 MHz 0.1 µF J2 VBUS DM DP GND SSRXN SSRXP GND SSTXN SSTXP SHIELD0 SHIELD1 1 2 3 4 5 6 7 8 9 10 11 J3 VBUS_DS4 USB_DM_DN4 USB_DP_DN4 C42 0.1 µF 0201 CAP_DN_TXM4 CAP_DN_TXP4 C44 0.1 µF 0201 VBUS DM DP GND SSRXN SSRXP GND SSTXN SSTXP SHIELD0 SHIELD1 1 1 USB_SSRXM_DN4 USB_SSRXP_DN4 USB_SSTXM_DN4 1 1 1 USB_SSTXP_DN4 1 USB3_TY PEA_CONNECTOR 1 2 3 4 5 6 7 8 9 10 11 C47 0.001 µF USB_DM_DN2 USB_DP_DN2 C43 0.1 µF 0201 C45 0.1 µF 0201 CAP_DN_TXM2 CAP_DN_TXP2 R17 1 MΩ 0402 5% C48 0.1 µF C49 0.001 µF 1 1 USB_SSRXM_DN2 USB_SSRXP_DN2 USB_SSTXM_DN2 1 1 1 USB_SSTXP_DN2 1 R18 1 MΩ 0402 5% FB5 FB6 DN1_VBUS DN1_VBUS C50 220 at 100 MHz 0.1 µF J4 VBUS DM DP GND SSRXN SSRXP GND SSTXN SSTXP SHIELD0 SHIELD1 3 VBUS_DS2 USB3_TY PEA_CONNECTOR C46 0.1 µF 1 2 3 4 5 6 7 8 9 10 11 DN2_VBUS C41 220 at 100 MHz 0.1 µF USB_DM_DN1 USB_DP_DN1 C52 0.1 µF 0201 C54 0.1 µF 0201 USB3_TY PEA_CONNECTOR 1 1 USB_SSRXM_DN1 USB_SSRXP_DN1 USB_SSTXM_DN1 1 1 1 USB_SSTXP_DN1 1 VBUS DM DP GND SSRXN SSRXP GND SSTXN SSTXP SHIELD0 SHIELD1 DN3_VBUS 3 C51 220 at 100 MHz 0.1 µF J5 VBUS_DS1 CAP_DN_TXM1 CAP_DN_TXP1 DN3_VBUS 3 1 2 3 4 5 6 7 8 9 10 11 VBUS_DS3 USB_DM_DN3 USB_DP_DN3 C53 0.1 µF 0201 C55 0.1 µF 0201 CAP_DN_TXM3 CAP_DN_TXP3 1 1 USB_SSRXM_DN3 USB_SSRXP_DN3 USB_SSTXM_DN3 1 1 1 USB_SSTXP_DN3 1 USB3_TY PEA_CONNECTOR C56 0.1 µF C57 0.001 µF R19 1 MΩ 0402 5% C58 0.1 µF C59 0.001 µF R20 1 MΩ 0402 5% Figure 3. USB Port Connections 10 SLLU198 – May 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated TUSB8041RGC REVD EVM Schematics www.ti.com DOWNSTREAM PORT POWER SWITCHES BOARD_3P3V BOARD_5V 5-V INPUT BOARD_5V SW3 R26 10 kΩ 0402 5% C66 0.1 µF SILKSCREEN: TIP +5v J6 U7 L101011MS02Q 2 3 1 C82 10 µF S T 2.1 mm x 5.5 mm 1 PWRON1_BATEN1 1 2 3 4 PWRON1_BATEN1 GND IN IN EN OUT OUT OUT FLT PAD 8 7 6 5 DN1_VBUS DN1_VBUS 2 OVERCUR1Z_TDI 1 9 C69 TPS2001C C70 150 µF D5 + 0.1 µF C61 10 µF R30 330 Ω 0402 5% BOARD_3P3V BOARD_5V R27 10 kΩ 0402 5% C75 0.1 µF U8 BOARD_5V 3.3-V REGULATOR 1 BOARD_3P3V PWRON2_BATEN2 1 2 3 4 PWRON2_BATEN2 GND IN IN EN OUT OUT OUT FLT PAD OUT TPS7A4533 3 SENSE 2 OVERCUR2Z_TMS C72 1 C71 150 µF D6 + 4 5 C68 10 µF GND SHDN/ GND IN DN2_VBUS 9 0.1 µF R31 330 Ω 0402 5% D4 LED Green 0805 BOARD_3P3V BOARD_5V 6 1 C67 10 µF DN2_VBUS TPS2001C U4 2 8 7 6 5 R28 330 Ω 0402 5% R29 10 kΩ 0402 5% C78 0.1 µF U9 1 PWRON3_BATEN3 PWRON3_BATEN3 1 2 3 4 GND IN IN EN OUT OUT OUT FLT PAD 8 7 6 5 DN3_VBUS + 0.1 µF R35 330 0402 5% 1P1V_SS BOARD_1P1V R32 NOPOP BOARD_3P3V BOARD_5V 2 3 4 13 14 17 15 TPS74801RGW GND GND BIAS 21 10 OUT1 OUT2 OUT3 OUT4 FB IN1 IN2 IN3 IN4 EN 12 C73 10 µF NC1 NC2 NC3 NC4 NC5 NC6 SS U6 1 C76 150 µF D7 1.1-V REGULATOR 5 6 7 8 11 2 OVERCUR3Z_TCK C77 TPS2001C BOARD_3P3V DN3_VBUS 9 PG 9 R36 10 kΩ 0402 5% C81 1 18 19 20 16 0.1 µF 1P1V_FB R33 1.87 kΩ 0402 5% U10 C74 10 µF 1 PWRON4_BATEN4 PWRON4_BATEN4 R34 4.99 kΩ 0402 5% 1 2 3 4 GND IN IN EN OUT OUT OUT FLT PAD TPS2001C 8 7 6 5 DN4_VBUS DN4_VBUS OVERCUR4Z 2 1 9 C80 0.1 µF + C79 150 µF D8 R37 330 Ω 0402 5% Figure 4. Power 11 SLLU198 – May 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR EVALUATION MODULES Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following: 1. User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a hobbyist environment. All EVMs made available to hobbyist users are FCC certified, as applicable. Hobbyist users acknowledge, agree, and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and indemnity provisions included in this document. 2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. 3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product. 4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI. 5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example, temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. 6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs. 7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM may be returned to TI within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY TI TO USER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. TI SHALL NOT BE LIABLE TO USER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RELATED TO THE HANDLING OR USE OF ANY EVM. 8. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which EVMs might be or are used. TI currently deals with a variety of customers, and therefore TI’s arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services with respect to the handling or use of EVMs. 9. User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling and use of EVMs and, if applicable, compliance in all respects with such laws and regulations. 10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. 11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death, even if EVMs should fail to perform as described or expected. 12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local requirements. Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use EVMs. Agreement to Defend, Indemnify and Hold Harmless. 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If user intends to use EVMs in evaluations of safety critical applications (such as life support), and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold, or loaned to users may or may not be subject to radio frequency regulations in specific countries. 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U.S. Federal Communications Commission Compliance For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at its own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Industry Canada Compliance (English) For EVMs Annotated as IC – INDUSTRY CANADA Compliant: This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs Including Radio Transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs Including Detachable Antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Canada Industry Canada Compliance (French) Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. 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Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. 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TUSB8041EVM
1. 物料型号:型号为STM32F103C8T6,是一款基于ARM Cortex-M3内核的高性能微控制器。

2. 器件简介:STM32F103C8T6是意法半导体生产的32位通用微控制器,广泛应用于工业控制、消费电子等领域。

3. 引脚分配:该芯片共有48个引脚,包括电源引脚、地引脚、I/O引脚等,具体分配需参考数据手册。

4. 参数特性:主频72MHz,内置64KB Flash和20KB RAM,支持多种通信接口,如USART、SPI、I2C等。

5. 功能详解:具备丰富的外设功能,如ADC、DAC、定时器、PWM等。

6. 应用信息:适用于需要较高处理能力和丰富外设接口的应用场景。
TUSB8041EVM 价格&库存

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TUSB8041EVM
    •  国内价格
    • 1+2545.52831

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