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TWL6032
SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014
TWL6032 Fully Integrated Power Management with Power Path and Battery Charger
1 Device Overview
1.1
Features
1
• Five Highly Efficient Buck Converters
– One 3 MHz, 0.6 to 2.1 V at 5.0 A, DVS-Capable
– One 6 MHz, 0.6 to 2.1 V at 2.5 A, DVS-Capable
– Three 6 MHz, 0.6 to 2.1 V at 1.1 A, One Is DVSCapable
– Extended Mode for Higher Output Voltages
• 11 General-Purpose Low-Dropout Voltage
Regulators (LDOs)
– Six 1.0 to 3.3 V at 0.2 A With Battery or
Preregulated Supply:
• One Can be Used as Vibrator Driver
• One 1.0 to 3.3 V at 50 mA With Battery or
Preregulated Supply
• One Low-Noise 1.0 to 3.3 V at 50 mA With
Battery or Preregulated Supply
• One 3.3 V at 100 mA USB LDO
• Two LDOs for TWL6032 Internal Use
• USB OTG Module:
– ID Detection, Accessory Charger Adapter (ACA)
Support
– Accessory Detection Protocol (ADP) Support
• Backup Battery Charger
• 12-Bit Sigma-Delta Analog-to-Digital Converter
(ADC) With 19 Input Channels:
– Seven External Input Channels
• 13-Bit Coulomb Counter With Four Programmable
Integration Periods
• Low-Power Consumption:
– 8 µA in BACKUP State
– 20 µA in WAIT-ON State
– 110 µA in SLEEP State, With Two DC-DC
Converters Active
• Real-Time Clock (RTC) With Timer and Alarm
Wake-Up:
– Three Buffered 32-kHz Outputs
• SIM and SD/MMC Card Detections
• Two Digital PWM Outputs
• Thermal Monitoring:
– High-Temperature Warning
– Thermal Shutdown
• Control:
– Configurable Power-Up and Power-Down
Sequences (OTP Memory)
– Configurable Sequences Between SLEEP and
ACTIVE States (OTP Memory)
– Three Digital Output Signals that can be
Included in the Startup Sequence to Control
External Devices
– Two Inter-Integrated Circuit (I2C) Interfaces
– All Resources Configurable by I2C
• System Voltage Regulator and Battery Charger
With Power Path From USB:
– Input Current Limit to Comply With USB
Standard
– 3-MHz Switched-Mode Regulator With
Integrated Power FET for up to 2.0-A Current
– Dedicated Control Loop for Battery Current and
Voltage
– External Low-Ohmic FET for Power Path and
Battery Charging
– Boost Mode Operation for USB OTG
– Supplement Mode to Deliver Current From
Battery During Power Path Operation
– Charger for Single-Cell Li-Ion and Li-Polymer
Battery Packs
– Safety Timer and Reset Control
– Thermal Protection
– Input/Output Overvoltage Protection
– Charging Indicator LED Driver
– Compliant With:
• USB 2.0
• OTG and EH 2.0
• USB Battery Charging 1.2
• YD/T 1591-2006
• Japanese Battery Charging Guidelines
(JEITA)
• Battery Voltage Range From 2.5 to 5.5 V
• Package 5.21-mm × 5.36-mm 155-Pin WCSP
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains
PRODUCTION DATA.
TWL6032
SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014
1.2
•
•
•
Applications
Mobile Phones and Smart Phones
Tablets
Gaming Handsets
1.3
www.ti.com
•
•
•
Portable Media Players
Portable Navigation Systems
Handheld Devices
Description
The TWL6032 device is an integrated power-management integrated circuit (PMIC) for applications
powered by a rechargeable battery. The device provides five configurable step-down converters with a
current capability of up to 5.0 A for memory, processor core, I/O, auxiliary, preregulation for LDOs, and so
forth. The device also contains nine LDO regulators for external use that can be supplied from a battery or
a preregulated supply. The power-up and power-down controller is configurable and can support any
power-up or power-down sequence (programmed in OTP memory). The RTC provides three 32-kHz clock
outputs: seconds, minutes, hours, day, month, and year information; as well as alarm wakeup and timer.
The TWL6032 device supports 32-kHz clock generation based on a crystal oscillator.
The device integrates a switched-mode system supply regulator from a USB connector. The switchedmode regulator includes power paths from the USB and battery with supplemental mode for immediate
startup, even with an empty battery. The battery switch uses an external low-ohmic PMOS transistor
allowing minimal serial resistance during fast charging and when operating from battery. The device can
also be used without the external PMOS transistor; in this case, the battery is always tied to the system
supply and the switched-mode regulator is used for battery charging.
The TWL6032 device is available in a 155-pin WCSP package, 5.21 mm × 5.36 mm with a 0.4-mm ball
pitch.
Figure 1-1 shows the TWL6032 device block diagram.
Table 1-1. Device Information (1)
PACKAGE
BODY SIZE
TWL6032A1Bx
PART NUMBER
YFF (155)
5.21 mm × 5.36 mm
TWL6032A2Bx
YFF (155)
5.21 mm × 5.36 mm
(1)
2
For more information, see Section 3, Mechanical Packaging and Orderable Information.
Device Overview
Copyright © 2011–2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TWL6032
TWL6032
www.ti.com
Functional Block Diagram
VSYS
VSYS
C23
C18
C1
C24
C2
VSYS
VSYS
I/O voltage
1.4
SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014
C3
C44
BOOT1
VANA
BOOT2
System
voltage
monitoring
VRTC
RPWRON
PWRON
External
power request
BACKUP
BOOT0
Boot mode
selection
SMPS1
Test
and
program
Control
inputs
PREQ2
PREQ3
SMPS5
PREQ1
MSECURE
NRESWARM
CTLI2C_SCL
CTLI2C_SDA
SMPS3
DVSI2C_SCL
DVSI2C_SDA
NRESPWRON
INT
BATREMOVAL
SMPS4
REGEN1
REGEN2
SYSEN
PWM1
PWM2
SMPS2
OSC32KIN
OSC32KOUT
OSC32KCAP
CLK32KAO
CLK32KG
CLK32KAUDIO
Switched
mode
system
supply
regulator
GPADC_IN0
GPADC_IN1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_IN5
GPADC_IN6
GPADC_VREF
GPADC_START
Linear charger
and
supplement
mode
and
Coulomb
counter
MMC
Detectors
USB ACA
SIM
ID
IREF
Reference
and
bias
VBG
REFGND
Charger
control
PBKG
GND_ANA
Grounds
GND_DIG_VIO
GND_DIG_VRTC
LED
indicator
LDOUSB
LDOUSB
LDO7
LDO7
LDO7_IN
LDO6
LDO6
LDO6_IN
LDO5
LDO5
LDO5_IN
LDO4
LDO4
LDO4_IN
LDO3
LDO2
LDO3
LDO3_IN
LDO1
LDO2
LDO2_IN
LDOLN
LDO1
LDO1_IN
LDOLN_IN
LDOLN
Figure 1-1. TWL6032 Device Block Diagram
For the complete TWL6032 data sheet (SWCS057), contact your TI sales representative.
Device Overview
Copyright © 2011–2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TWL6032
3
TWL6032
SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2012) to Revision B
•
4
Changed document to standard TI format.
Page
.......................................................................................
Revision History
1
Copyright © 2011–2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TWL6032
TWL6032
www.ti.com
SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014
3 Mechanical Packaging and Orderable Information
3.1
Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Product Folder Links: TWL6032
5
PACKAGE OPTION ADDENDUM
www.ti.com
23-Feb-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TWL6032A1B4YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A1B4
TWL6032A1B4YFFT
ACTIVE
DSBGA
YFF
155
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A1B4
TWL6032A1B6YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A1B6
TWL6032A2B0YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B0
TWL6032A2B0YFFT
ACTIVE
DSBGA
YFF
155
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B0
TWL6032A2B4YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B4
TWL6032A2B4YFFT
ACTIVE
DSBGA
YFF
155
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B4
TWL6032A2B6YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B6
TWL6032A2B7YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B7
TWL6032A2B7YFFT
ACTIVE
DSBGA
YFF
155
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B7
TWL6032A2B8YFFR
ACTIVE
DSBGA
YFF
155
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B8
TWL6032A2B8YFFT
ACTIVE
DSBGA
YFF
155
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2B8
TWL6032A2BEYFFT
ACTIVE
DSBGA
YFF
155
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TWL6032
A2BE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Feb-2016
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TWL6032A1B4YFFR
DSBGA
YFF
155
3000
330.0
12.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A1B4YFFT
DSBGA
YFF
155
250
180.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A1B6YFFR
DSBGA
YFF
155
3000
330.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B0YFFR
DSBGA
YFF
155
3000
330.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B0YFFT
DSBGA
YFF
155
250
180.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B4YFFR
DSBGA
YFF
155
3000
330.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B4YFFT
DSBGA
YFF
155
250
180.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B6YFFR
DSBGA
YFF
155
3000
330.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B7YFFR
DSBGA
YFF
155
3000
330.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B7YFFT
DSBGA
YFF
155
250
180.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B8YFFR
DSBGA
YFF
155
3000
330.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2B8YFFT
DSBGA
YFF
155
250
180.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
TWL6032A2BEYFFT
DSBGA
YFF
155
250
180.0
12.4
5.35
5.49
0.86
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TWL6032A1B4YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A1B4YFFT
DSBGA
YFF
155
250
182.0
182.0
20.0
TWL6032A1B6YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A2B0YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A2B0YFFT
DSBGA
YFF
155
250
182.0
182.0
20.0
TWL6032A2B4YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A2B4YFFT
DSBGA
YFF
155
250
182.0
182.0
20.0
TWL6032A2B6YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A2B7YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A2B7YFFT
DSBGA
YFF
155
250
182.0
182.0
20.0
TWL6032A2B8YFFR
DSBGA
YFF
155
3000
367.0
367.0
35.0
TWL6032A2B8YFFT
DSBGA
YFF
155
250
182.0
182.0
20.0
TWL6032A2BEYFFT
DSBGA
YFF
155
250
182.0
182.0
20.0
Pack Materials-Page 2
D: Max = 5.394 mm, Min =5.334 mm
E: Max = 5.244 mm, Min =5.184 mm
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