TWL6032A2B4YFFT

Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TWL6032 SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014 TWL6032 Fully Integrated Power Management with Power Path and Battery Charger 1 Device Overview 1.1 Features 1 • Five Highly Efficient Buck Converters – One 3 MHz, 0.6 to 2.1 V at 5.0 A, DVS-Capable – One 6 MHz, 0.6 to 2.1 V at 2.5 A, DVS-Capable – Three 6 MHz, 0.6 to 2.1 V at 1.1 A, One Is DVSCapable – Extended Mode for Higher Output Voltages • 11 General-Purpose Low-Dropout Voltage Regulators (LDOs) – Six 1.0 to 3.3 V at 0.2 A With Battery or Preregulated Supply: • One Can be Used as Vibrator Driver • One 1.0 to 3.3 V at 50 mA With Battery or Preregulated Supply • One Low-Noise 1.0 to 3.3 V at 50 mA With Battery or Preregulated Supply • One 3.3 V at 100 mA USB LDO • Two LDOs for TWL6032 Internal Use • USB OTG Module: – ID Detection, Accessory Charger Adapter (ACA) Support – Accessory Detection Protocol (ADP) Support • Backup Battery Charger • 12-Bit Sigma-Delta Analog-to-Digital Converter (ADC) With 19 Input Channels: – Seven External Input Channels • 13-Bit Coulomb Counter With Four Programmable Integration Periods • Low-Power Consumption: – 8 µA in BACKUP State – 20 µA in WAIT-ON State – 110 µA in SLEEP State, With Two DC-DC Converters Active • Real-Time Clock (RTC) With Timer and Alarm Wake-Up: – Three Buffered 32-kHz Outputs • SIM and SD/MMC Card Detections • Two Digital PWM Outputs • Thermal Monitoring: – High-Temperature Warning – Thermal Shutdown • Control: – Configurable Power-Up and Power-Down Sequences (OTP Memory) – Configurable Sequences Between SLEEP and ACTIVE States (OTP Memory) – Three Digital Output Signals that can be Included in the Startup Sequence to Control External Devices – Two Inter-Integrated Circuit (I2C) Interfaces – All Resources Configurable by I2C • System Voltage Regulator and Battery Charger With Power Path From USB: – Input Current Limit to Comply With USB Standard – 3-MHz Switched-Mode Regulator With Integrated Power FET for up to 2.0-A Current – Dedicated Control Loop for Battery Current and Voltage – External Low-Ohmic FET for Power Path and Battery Charging – Boost Mode Operation for USB OTG – Supplement Mode to Deliver Current From Battery During Power Path Operation – Charger for Single-Cell Li-Ion and Li-Polymer Battery Packs – Safety Timer and Reset Control – Thermal Protection – Input/Output Overvoltage Protection – Charging Indicator LED Driver – Compliant With: • USB 2.0 • OTG and EH 2.0 • USB Battery Charging 1.2 • YD/T 1591-2006 • Japanese Battery Charging Guidelines (JEITA) • Battery Voltage Range From 2.5 to 5.5 V • Package 5.21-mm × 5.36-mm 155-Pin WCSP 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. TWL6032 SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014 1.2 • • • Applications Mobile Phones and Smart Phones Tablets Gaming Handsets 1.3 www.ti.com • • • Portable Media Players Portable Navigation Systems Handheld Devices Description The TWL6032 device is an integrated power-management integrated circuit (PMIC) for applications powered by a rechargeable battery. The device provides five configurable step-down converters with a current capability of up to 5.0 A for memory, processor core, I/O, auxiliary, preregulation for LDOs, and so forth. The device also contains nine LDO regulators for external use that can be supplied from a battery or a preregulated supply. The power-up and power-down controller is configurable and can support any power-up or power-down sequence (programmed in OTP memory). The RTC provides three 32-kHz clock outputs: seconds, minutes, hours, day, month, and year information; as well as alarm wakeup and timer. The TWL6032 device supports 32-kHz clock generation based on a crystal oscillator. The device integrates a switched-mode system supply regulator from a USB connector. The switchedmode regulator includes power paths from the USB and battery with supplemental mode for immediate startup, even with an empty battery. The battery switch uses an external low-ohmic PMOS transistor allowing minimal serial resistance during fast charging and when operating from battery. The device can also be used without the external PMOS transistor; in this case, the battery is always tied to the system supply and the switched-mode regulator is used for battery charging. The TWL6032 device is available in a 155-pin WCSP package, 5.21 mm × 5.36 mm with a 0.4-mm ball pitch. Figure 1-1 shows the TWL6032 device block diagram. Table 1-1. Device Information (1) PACKAGE BODY SIZE TWL6032A1Bx PART NUMBER YFF (155) 5.21 mm × 5.36 mm TWL6032A2Bx YFF (155) 5.21 mm × 5.36 mm (1) 2 For more information, see Section 3, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6032 TWL6032 www.ti.com Functional Block Diagram VSYS VSYS C23 C18 C1 C24 C2 VSYS VSYS I/O voltage 1.4 SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014 C3 C44 BOOT1 VANA BOOT2 System voltage monitoring VRTC RPWRON PWRON External power request BACKUP BOOT0 Boot mode selection SMPS1 Test and program Control inputs PREQ2 PREQ3 SMPS5 PREQ1 MSECURE NRESWARM CTLI2C_SCL CTLI2C_SDA SMPS3 DVSI2C_SCL DVSI2C_SDA NRESPWRON INT BATREMOVAL SMPS4 REGEN1 REGEN2 SYSEN PWM1 PWM2 SMPS2 OSC32KIN OSC32KOUT OSC32KCAP CLK32KAO CLK32KG CLK32KAUDIO Switched mode system supply regulator GPADC_IN0 GPADC_IN1 GPADC_IN2 GPADC_IN3 GPADC_IN4 GPADC_IN5 GPADC_IN6 GPADC_VREF GPADC_START Linear charger and supplement mode and Coulomb counter MMC Detectors USB ACA SIM ID IREF Reference and bias VBG REFGND Charger control PBKG GND_ANA Grounds GND_DIG_VIO GND_DIG_VRTC LED indicator LDOUSB LDOUSB LDO7 LDO7 LDO7_IN LDO6 LDO6 LDO6_IN LDO5 LDO5 LDO5_IN LDO4 LDO4 LDO4_IN LDO3 LDO2 LDO3 LDO3_IN LDO1 LDO2 LDO2_IN LDOLN LDO1 LDO1_IN LDOLN_IN LDOLN Figure 1-1. TWL6032 Device Block Diagram For the complete TWL6032 data sheet (SWCS057), contact your TI sales representative. Device Overview Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6032 3 TWL6032 SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014 www.ti.com 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (September 2012) to Revision B • 4 Changed document to standard TI format. Page ....................................................................................... Revision History 1 Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6032 TWL6032 www.ti.com SWCS076B – DECEMBER 2011 – REVISED AUGUST 2014 3 Mechanical Packaging and Orderable Information 3.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2011–2014, Texas Instruments Incorporated Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: TWL6032 5 PACKAGE OPTION ADDENDUM www.ti.com 23-Feb-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TWL6032A1B4YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A1B4 TWL6032A1B4YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A1B4 TWL6032A1B6YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A1B6 TWL6032A2B0YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B0 TWL6032A2B0YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B0 TWL6032A2B4YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B4 TWL6032A2B4YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B4 TWL6032A2B6YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B6 TWL6032A2B7YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B7 TWL6032A2B7YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B7 TWL6032A2B8YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B8 TWL6032A2B8YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B8 TWL6032A2BEYFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2BE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Feb-2016 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TWL6032A1B4YFFR DSBGA YFF 155 3000 330.0 12.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A1B4YFFT DSBGA YFF 155 250 180.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A1B6YFFR DSBGA YFF 155 3000 330.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B0YFFR DSBGA YFF 155 3000 330.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B0YFFT DSBGA YFF 155 250 180.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B4YFFR DSBGA YFF 155 3000 330.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B4YFFT DSBGA YFF 155 250 180.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B6YFFR DSBGA YFF 155 3000 330.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B7YFFR DSBGA YFF 155 3000 330.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B7YFFT DSBGA YFF 155 250 180.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B8YFFR DSBGA YFF 155 3000 330.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2B8YFFT DSBGA YFF 155 250 180.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 TWL6032A2BEYFFT DSBGA YFF 155 250 180.0 12.4 5.35 5.49 0.86 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TWL6032A1B4YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A1B4YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A1B6YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B0YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B0YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2B4YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B4YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2B6YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B7YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B7YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2B8YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B8YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2BEYFFT DSBGA YFF 155 250 182.0 182.0 20.0 Pack Materials-Page 2 D: Max = 5.394 mm, Min =5.334 mm E: Max = 5.244 mm, Min =5.184 mm IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. 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