TWL6041BYFFR

Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TWL6041 SWCS058D – AUGUST 2010 – REVISED AUGUST 2014 TWL6041 8-Channel Low-Power Audio Codec for Portable Applications 1 Device Overview 1.1 Features 1 • Four Audio Digital-to-Analog Converter (DAC) Channels • Stereo Capless Headphone Drivers – Up to 104-dB DR – Power Tune for Performance and Power Consumption Tradeoff • Stereo 8 Ω, 1.5 W per Channel Speaker Drivers also with 4-Ω Support Capability • Differential Earpiece Driver • Stereo Line-Out • Two Audio Analog-to-Digital Converter (ADC) Channels – 96-dBA SNR • Four Audio Inputs: – Three Differential Microphone Inputs – Stereo Line-In and FM Input • Two Vibrator and Haptics Feedback Channels – Differential H-bridge Drivers • Two Low-Noise Analog Microphone Bias Outputs • Two Digital Microphone Bias Outputs 1.2 • • Applications Mobile and Smart Phones MP3 Players 1.3 • Analog Low-Power Loop from Line-in to Headphone and Speaker Outputs • Dual Phase-Locked Loops (PLLs) for Flexible Clock Support: – 32-kHz Sleep Clock Input for System LowPower Playback Mode – 12-, 19.2-, 26-, and 38.4-MHz System Clock Input • Accessory Plug and Unplug Detection, Accessory Button Press Detection • Integrated Power Supplies: – Negative Charge Pump for Capless Headphone Driver – Two Low Dropout Voltage Regulators (LDOs) for High Power Supply Rejection Ration (PSRR) 2 • I C Control • Thermal Protection: – Host Interrupt • Power Supplies: – Analog: 2.1 V – Digital I/O: 1.8 V – Battery: 2.3 V–5.5 V • Package 3.8-mm × 3.8-mm 81-Pin WCSP • Handheld Devices Description The TWL6041 is an audio codec with a high level of integration providing analog audio codec functions for portable applications, as shown in Figure 1-1. The device contains multiple audio analog inputs and outputs, as well as microphone biases and accessory detection. The device is connected to the OMAP™ 4 host processor through a proprietary PDM interface for audio data communication enabling partitioning with optimized power consumption and performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL). The OMAP4 device provides the TWL6041 device with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3 are connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL, HFR), and earpiece (EAR) or stereo line outputs (AUXL, AUXR). The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable more than 100 hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input and DAC path high-performance (HP) mode. Class-AB headphone drivers provide a 1-Vrms output and are ground centered for capless connection to a headphone, thus enabling system size and cost reduction. The earpiece driver is a differential class-AB driver with 2-Vrms capability to a typical 32-Ω load or 1.4-Vrms to a typical 16-Ω load. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TWL6041 SWCS058D – AUGUST 2010 – REVISED AUGUST 2014 www.ti.com Stereo speaker path has filterless class-D outputs with 1.5-W capability per channel. Additionally, the 4-Ω load is supported. For output-power maximization, supply connection to an external boost is supported. Speaker drivers also support hearing aid coil loads. For vibrator and haptic feedback support, the TWL6041 device has two PWM channels with independent input signals from DL4 or I2C. Vibra drivers are differential H-bridge outputs, enabling fast acceleration and deceleration of vibra motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage can be connected to line outputs. The TWL6041 supports three differential microphone inputs (MMIC, HMIC, and SMIC) and a stereo lineinput (AFML, AFMR) multiplexed to two parallel ADCs. The PDM output from the ADCs is transmitted to the OMAP4 processor through UL0 and UL1. AFML, AFMR inputs can also be looped to analog outputs (LB0, LB1). Two LDOs provide a voltage of 2.1 V to bias analog microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to two microphones on one bias. Two LDOs provide a voltage of 1.8 V to 1.85 V to bias digital microphones (DBIAS1 and DBIAS2). One bias generator can bias several digital microphones at the same time, with a total maximum output current of 10 mA. The TWL6041 device has an integrated negative charge pump and two LDOs (HS LDO and LS LDO) for high PSRR. The only external supply needed is 2.1 V, which is available from the 2.1-V DC-DC of TWL6030/6032 power-management IC (PMIC) in the OMAP4 system. By powering audio from low-noise 2.1-V DC-DC of low power consumption, high dynamic range and high output swing at the headset output are achieved. All other supply inputs can be directly connected to battery or system 1.8-V I/O. Two integrated PLLs enable operation from a 12-, 19.2-, 26-, and 38.4-MHz system clock (MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s audio data rate for all channels, and the host processor uses sample-rate converters to interface with different sample rates (for example, 44.1 kHz). In the specific case of low-power audio playback, the TWL6041 supports the 44.1-kS/s and 48-kS/s rates. Transitions between sample rates or input clocks are seamless. Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle properties can be programmed according to system requirements. The TWL6041BSRS, when connected to OMAP4 and OMAP5 platform, includes SRS Audio Effects, SRS pre-processing solutions and SRS TruMedia as standard feature for Android™ ICS. Table 1-1. Device Information (1) PART NUMBER TWL6041B (1) 2 PACKAGE BODY SIZE (NOM) YFF (81) 3.56 mm × 3.56 mm For more information, see Section 3, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6041 TWL6041 www.ti.com 1.4 SWCS058D – AUGUST 2010 – REVISED AUGUST 2014 Functional Block Diagram Figure 1-1 shows a simplified block diagram of the device. HBIAS HMBIAS MBIAS DBIAS1 MMICN ADCL 1 GNDMIC MMICP MicAmpL AAFL VDDMBIAS HMICP HMICN 0:30 dB MMBIAS UpLink VSSUL MicAmpR AAFR DMBIAS1 1 ADCR SMICP SMICN DBIAS2 DMBIAS2 0:30 dB LineInAmpR UL0 UL1 DL0 PDMDN PDMUP PDMCLK PDMCLKLB PDMFRAME PDM Interface SCL LineInAmpL DL1 DL2 LB0 AFML –18:24 dB DL4 VDDVIO SDA AFMR DL3 GNDDIGIO GPO LB1 EarDrv EARP Interface EARN –24:6 dB HSLDrv 2 I C Registers VDDEAR HSL PBKG 1 HSDACL –30:0 dB VDDV2V1 HSRDrv VDDULLDO HS LDO VSSEARLDO LS LDO VDDHS VSSHS GNDHS HSR 1 HSDACR –30:0 dB GNDLDO AUXLN CFLYP GNDNCP CFLYN VSSDL AUXLP VDDREGNCP Negative Charge Pump AUXRP DownLink AUXRN PGAL NCPOUT HFLDrv VDDHFL HFLP VDDRF REF REFP REFN Power 1 Reference Temp Sense HFLN HFDACL GNDHFL –52:6 dB PGAR GNDREF HFRDrv VDDHFR HFRP PLUGDET ACCONN Accessory Connector Detection 1 MCLK 1 PCM 8 8 HP PLL PCM to PWM 8 CLK32K VSSPLL GNDHFR –52:6 dB PDM to VDDDLPLL HFRN HFDACR VIBLDrv VIBLP 1 VIBLN 1 GNDVIB LP PLL Clock System 8 8 Osc 8 PCM to PWM VIBRDrv VDDVIB VIBRP 1 VIBRN 1 SWCS056-001 Figure 1-1. Simplified Block Diagram Device Overview Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6041 3 TWL6041 SWCS058D – AUGUST 2010 – REVISED AUGUST 2014 www.ti.com For the complete TWL60xx data sheet (SWCS056), contact your TI sales representative. 4 Device Overview Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6041 TWL6041 www.ti.com SWCS058D – AUGUST 2010 – REVISED AUGUST 2014 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (June 2012) to Revision D • Changed document to standard TI format Page ........................................................................................ Revision History Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TWL6041 1 5 TWL6041 SWCS058D – AUGUST 2010 – REVISED AUGUST 2014 www.ti.com 3 Mechanical Packaging and Orderable Information 3.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 6 Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: TWL6041 Copyright © 2010–2014, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TWL6041BYFFR ACTIVE DSBGA YFF 81 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6041B TWL6041BYFFT ACTIVE DSBGA YFF 81 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6041B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of