TX7316ZCX

Product Folder Order Now Support & Community Tools & Software Technical Documents TX7316 SLOSE35B – MARCH 2019 – REVISED JULY 2019 TX7316 Three-Level, 16-Channel or Five-Level, 8-Channel Transmitter With 2.4-A Pulser, T/R Switch, and Integrated Transmit Beamformer 1 Features • 1 • • • • Transmitter supports: – 16-channel 3-level or 8-channel 5-level pulser and active transmit/receive (T/R) switch – Very low power on-chip beamforming mode (5level mode): – In receive-only mode: 17 mW – In transmit-receive mode: 598 mW – In CW mode (0.6-A mode): 1.97 W – In global power-down mode: 4.3 mW 3-level, 5-level pulser: – Maximum output voltage: ±100 V – Minimum output voltage: ±1 V – Maximum output current: 2.4 A to 0.6 A – Maximum clamp current: 1 A to 0.25 A (in 3level mode) – Maximum clamp current: 2 A to 0.5 A (in 5level mode) – Second harmonic of –45 dBc at 5 MHz – CW mode jitter: 100 fs measured from 100 Hz to 20 kHz – CW mode close-in phase noise: –154 dBc/Hz at 1 kHz offset for 5 MHz signal – Supports 4.8-A mode in 5-level mode – –3-dB Bandwidth with 1-kΩ || 240-pF load – 20 MHz (For ±100-V supply in 2.4-A mode) – 36 MHz (For ±100-V supply in 4.8-A mode) – 25 MHz (For ±70-V supply in 2.4-A mode) Active transmit/receive (T/R) switch with: – ON/OFF control signal – Turnon resistance of 12 Ω – Bandwidth: 50 MHz – HD2: -50 dBc – Turnon time: 0.5 μs – Turnoff time: 1.75 μs – Transient glitch: 50 mVPP Off-chip beam former with: – Jitter cleaning using synchronization feature – Maximum synchronization clock frequency: 200 MHz On-chip beam former with: – Delay resolution: one beamformer clock period, minimum 5 ns • • • • – Maximum delay: 213 beamformer clock period – Maximum beamformer clock speed: 200 MHz – On-chip RAM to store – 16 Delay profiles – 48/28 pattern-profiles for 3- or 5-level mode High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface Automatic thermal shutdown No specific power sequencing requirement in 3level mode Small package: NFBGA-216 (15 mm × 10 mm) with 0.8-mm pitch 2 Applications • • • Ultrasound imaging system Piezoelectric driver In-probe ultrasound imaging 3 Description The TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits (PULS), 16 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies. Device Information(1) PART NUMBER TX7316 PACKAGE(1) BODY SIZE (NOM) NFBGA (216) 15.0 mm × 10.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Block Diagram Pulser + T/R Switch (PULS) GROUP A RX_A1 Thermal Shutdown Floating Supply Pulser + T/R Switch (PULS) GROUP B RX_B1 OUT_A1 OUT_B1 On-chip and Off-chip Transmit Beamforming RX_A8 T/R Switch T/R Switch Delay Profile OUT_A8 Pattern Profile RX_B8 OUT_B8 High speed SPI Interface 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TX7316 SLOSE35B – MARCH 2019 – REVISED JULY 2019 www.ti.com 4 Revision History Changes from Revision A (March 2019) to Revision B Page • Changed Feature: In CW mode: 2.98 W To: In CW mode (0.6-A mode): 1.97 W................................................................. 1 • Changed Feature: Second harmonic of –40 dBc at 5 MHz To: Second harmonic of –45 dBc at 5 MHz .............................. 1 • Added Feature: 36 MHz (For ±100-V supply in 4.8-A mode)................................................................................................. 1 • Changed Feature: Turnoff time: 1.6 μs To: Turnoff time: 1.75 μs. ......................................................................................... 1 Changes from Original (May 2019) to Revision A Page • Changed the document status From: Advanced Information To: Production data ................................................................ 1 • Changed from Pulsar to Pulser across the document............................................................................................................ 1 • Changed the values of CW and global power-down modes .................................................................................................. 1 • Changed the supply voltage value in –3-dB Bandwidth with 1-kΩ || 240-pF load feature. .................................................... 1 2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TX7316 TX7316 www.ti.com SLOSE35B – MARCH 2019 – REVISED JULY 2019 5 Description (continued) The TX7316 (referred to as device in this data sheet) has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 8 outputs for 5-level mode and 16 outputs for 3-level mode. The maximum output current is configurable from 2.4 A to 0.6 A. A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 12-Ω impedance in the ON state. Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7316 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation. In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal. In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 48/28 pattern profiles for 3/5-level mode can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device. TX7316 is available in a 15-mm × 10-mm 216-pin NFBGA package (ZCX package) and is specified for operation from 0°C to 70°C. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TX7316 3 TX7316 SLOSE35B – MARCH 2019 – REVISED JULY 2019 www.ti.com 6 Device and Documentation Support 6.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 6.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 6.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TX7316 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TX7316ZCX ACTIVE NFBGA ZCX 216 136 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 TX7316 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of