TXB0101DCKR

Product Folder Order Now Support & Community Tools & Software Technical Documents TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 TXB0101 1-Bit Bidirectional Level-Shifting and Voltage Translator With Auto Direction-Sensing and ±15-kV ESD Protection 1 Features 3 Description • This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. 1 • • • • • • • Available in the Texas Instruments NanoFree™ Package 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB) VCC Isolation Feature – If Either VCC Input is at GND, All Outputs are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 5 μA Maximum ICC Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – A Port – 2000 V Human Body Model (A114-B) – 250 V Machine Model (A115-A) – 1500 V Charged-Device Model (C101) – B Port – 15 kV Human Body Model (A114-B) – 250 V Machine Model (A115-A) – 1500 V Charged-Device Model (C101) When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Device Information(1) 2 Applications • • • • PART NUMBER Handsets Smartphones Tablets Desktop PCs PACKAGE BODY SIZE (NOM) TXB0101DBV SOT-23 (6) 2.90 mm × 1.60 mm TXB0101DCK SC70 (6) 2.00 mm × 1.25 mm TXB0101DRL SOT (6) 1.60 mm × 1.20 mm TXB0101YZP DSBGA (6) 1.1 mm × 1.20 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Operating Circuit 1.8 V 3.3 V 1.8-V System Controller VCCA VCCB OE 3.3-V System TXB0101 Data GND A B GND Data GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specification........................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 6.14 6.15 6.16 1 1 1 2 3 4 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 5 Electrical Characteristics .......................................... 5 Timing Requirements, VCCA = 1.2 V ........................ 6 Timing Requirements, VCCA = 1.5 V ± 0.1 V ........... 6 Timing Requirements, VCCA = 1.8 V ± 0.15 V ......... 6 Timing Requirements, VCCA = 2.5 V ± 0.2 V ........... 6 Timing Requirements, VCCA = 3.3 V ± 0.3 V ......... 6 Switching Characteristics, VCCA = 1.2 V ................ 7 Switching Characteristics, VCCA = 1.5 V ± 0.1 V ... 7 Switching Characteristics, VCCA = 1.8 V ± 0.15 V . 7 Switching Characteristics, VCCA = 2.5 V ± 0.2 V ... 8 Switching Characteristics, VCCA = 3.3 V ± 0.3 V ... 8 Operating Characteristics........................................ 8 6.17 Typical Characteristics ............................................ 9 7 8 Parameter Measurement Information ................ 10 Detailed Description ............................................ 11 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 12 Application and Implementation ........................ 13 9.1 Application Information............................................ 13 9.2 Typical Application ................................................. 13 10 Power Supply Recommendations ..................... 16 11 Layout................................................................... 16 11.1 Layout Guidelines ................................................. 16 11.2 Layout Example .................................................... 16 12 Device and Documentation Support ................. 17 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 17 13 Mechanical, Packaging, and Orderable Information ........................................................... 17 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (June 2015) to Revision D Page • Added Absolute maximum junction temperature, TJ in Absolute Maximum Ratings ............................................................ 4 • Added TXB0101 Port A and Port B specifications in ESD Ratings table............................................................................... 4 • Added Receiving Notification of Documentation Updates section ....................................................................................... 17 Changes from Revision B (May 2012) to Revision C Page • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 • Removed Ordering Information table .................................................................................................................................... 1 Changes from Revision A (November 2008) to Revision B • 2 Page Added notes to pin out graphics............................................................................................................................................. 3 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 5 Pin Configuration and Functions DBV Package 6-Pin SOT-23 Top View DCK Package 6-Pin SC70 Top View VCCA 1 6 VCCB GND 2 5 OE A 3 VCCA 1 6 VCCB GND 2 5 OE A 3 4 B B 4 DRL Package 6-Pin SOT Top View VCCA 1 6 VCCB GND 2 5 OE A 3 4 B YZP Package 6-Ball DSBGA Bottom View A C1 3 4 C2 B GND VCCA B1 2 5 B2 A1 1 6 OE VCCB A2 A. See mechanical drawings for dimensions. B. Pullup resistors are not required on both sides for Logic I/O. C. If pullup or pulldown resistors are needed, the resistor value must be over 50 kΩ. D. 50 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pullup or pulldown resistor is allowed, the draft estimation is Vol = Vccout × 4.5 k / (4.5 k + Rpu) and Voh = Vccout × Rdw / (4.5 k + Rdw). E. If pull up resistors are needed, please refer to the TXS0101 or contact TI. F. For detailed information, please refer to application note SCEA043. Pin Functions PIN NO. NAME TYPE DESCRIPTION 1 VCCA — A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB 2 GND — Ground 3 A I/O Input/output A. Referenced to VCCA. 4 B I/O Input/output B. Referenced to VCCB. 5 OE I 6 VCCB — 3-state output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 3 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com 6 Specification 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX VCCA Supply voltage –0.5 4.6 VCCB Supply voltage –0.5 6.5 VI Input voltage (2) –0.5 6.5 V VO Voltage applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V VO Voltage applied to any output in the high or low state (2) A port –0.5 VCCA + 0.5 B port –0.5 VCCB + 0.5 IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA Continuous current through VCCA, VCCB, or GND ±100 mA TJMAX Absolute maximum junction temperature 150 °C Tstg Storage temperature 150 °C (1) (2) (3) (3) –65 UNIT V V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative Voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. 6.2 ESD Ratings VALUE UNIT TXB0101 Port A V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±1500 V TXB0101 Port B Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) V(ESD) (1) (2) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±15 kV ±1500 V JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions See (1) (2) . VCCA VCCA VCCB Supply voltage VIH High-level input voltage VIL Low-level input voltage Δt/Δv Input transition rise or fall rate TA (1) (2) (3) 4 VCCB MIN MAX 1.2 3.6 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI × 0.65 (3) VCCI OE 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA × 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI × 0.35 (3) OE 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA × 0.35 A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40 B-port inputs 1.2 V to 3.6 V 1.65 V to 3.6 V 40 4.5 V to 5.5 V 30 Operating free-air temperature –40 85 UNIT V V V ns/V °C The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 6.4 Thermal Information TXB0101 THERMAL METRIC RθJA (1) DCK (SC70) DRL (SOT) YZP (DSBGA) 6 PINS 6 PINS 6 PINS 6 PINS UNIT 192.3 266.9 204.2 105.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 164.8 80.4 76.4 1.6 °C/W RθJB Junction-to-board thermal resistance 38.6 99.1 38.7 10.8 °C/W ψJT Junction-to-top characterization parameter 43.7 1.5 3.4 3.1 °C/W ψJB Junction-to-board characterization parameter 38.1 98.3 38.5 10.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W (1) Junction-to-ambient thermal resistance DBV (SOT23) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) (1) (2) PARAMETER TEST CONDITIONS VCCA VCCB VOLA IOL = 20 μA VOHB IOH = –20 μA 1.65 V to 5.5 V VOLB IOL = 20 μA 1.65 V to 5.5 V Ioff IOZ TYP –40°C to 85°C MAX MIN TYP MAX 1.1 IOH = –20 μA OE MIN 1.2 V VOHA II TA = 25°C 1.4 V to 3.6 V V VCCA – 0.4 1.2 V 0.9 1.4 V to 3.6 V 0.4 VCCB – 0.4 V V μA 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 0V 0 V to 5.5 V ±1 ±2 B port 0 V to 3.6 V 0V ±1 ±2 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V 3 3.6 V 0V 2 OE = GND VI = VCCI or GND, IO = 0 ICCA 0V 5.5 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 1.65 V to 5.5 V 5 3.6 V 0V –2 0V 5.5 V ICCA + ICCB VI = VCCI or GND, IO = 0 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZA 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZB 1.4 V to 3.6 V 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V Ci Cio (1) (2) OE A port B port μA μA 0.06 1.2 V ICCB V 0.4 A port A or B port UNIT μA –2 3.4 μA 2 3.5 8 μA 0.05 3 μA 3.3 5 2.5 3 5 6 11 13 μA pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 5 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com 6.6 Timing Requirements, VCCA = 1.2 V TA = 25°C, VCCA = 1.2 V VCCB = 1.8 V Data rate tw Pulse duration Data inputs VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V UNIT TYP TYP TYP TYP 20 20 20 20 Mbps 50 50 50 50 ns 6.7 Timing Requirements, VCCA = 1.5 V ± 0.1 V over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Data rate tw Pulse duration VCCB = 2.5 V ± 0.2 V MAX MIN MAX 40 Data inputs VCCB = 3.3 V ± 0.3 V MIN MAX 40 25 VCCB = 5 V ± 0.5 V MIN 40 25 40 25 UNIT MAX 25 Mbps ns 6.8 Timing Requirements, VCCA = 1.8 V ± 0.15 V over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Data rate tw Pulse duration VCCB = 2.5 V ± 0.2 V MAX MIN MAX 60 Data inputs 17 VCCB = 3.3 V ± 0.3 V MIN VCCB = 5 V ± 0.5 V MAX 60 MIN 60 17 60 17 UNIT MAX 17 Mbps ns 6.9 Timing Requirements, VCCA = 2.5 V ± 0.2 V over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN Data rate tw Pulse duration VCCB = 3.3 V ± 0.3 V MAX MIN MAX 100 Data inputs VCCB = 5 V ± 0.5 V MIN 100 10 100 10 UNIT MAX 10 Mbps ns 6.10 Timing Requirements, VCCA = 3.3 V ± 0.3 V over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) VCCB = 3.3 V ± 0.3 V MIN Data rate tw 6 Pulse duration VCCB = 5 V ± 0.5 V MAX MIN 100 Data inputs Submit Documentation Feedback 10 UNIT MAX 100 10 Mbps ns Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 6.11 Switching Characteristics, VCCA = 1.2 V TA = 25°C, VCCA = 1.2 V PARAMETER FROM (INPUT) TO (OUTPUT) A B VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V UNIT TYP TYP TYP TYP B 6.9 5.7 5.3 5.5 A 7.4 6.4 6 5.8 A 1 1 1 1 B 1 1 1 1 A 18 15 14 14 B 20 17 16 16 trA, tfA A-port rise and fall times 4.2 4.2 4.2 4.2 trB, tfB B-port rise and fall times 2.1 1.5 1.2 1.1 ns 20 20 20 20 Mbps tpd ten OE tdis OE Max data rate ns μs ns ns 6.12 Switching Characteristics, VCCA = 1.5 V ± 0.1 V over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN B 1.4 12.9 1.2 10.1 A 0.9 14.2 0.7 12 VCCB = 5 V ± 0.5 V UNIT MAX MIN MAX 1.1 10 0.8 9.9 0.4 11.7 0.3 13.7 A 1 1 1 1 B 1 1 1 1 ns μs A 5.9 31 5.7 25.9 5.6 23 5.7 22.4 B 5.4 30.3 4.9 22.8 4.8 20 4.9 19.5 trA, tfA A-port rise and fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns trB, tfB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns Max data rate 40 40 40 40 ns Mbps 6.13 Switching Characteristics, VCCA = 1.8 V ± 0.15 V over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5 A 1.5 12 1.3 8.4 1 7.6 0.9 7.1 A 1 1 1 1 B 1 1 1 1 A 5.9 31 5.1 21.3 5 19.3 5 17.4 B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3 trA, tfA A-port rise and fall times 1 4.2 1.1 4.1 1.1 4.1 1.1 4.1 trB, tfB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 Max data rate 60 60 60 60 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 ns μs ns ns ns Mbps 7 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com 6.14 Switching Characteristics, VCCA = 2.5 V ± 0.2 V over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX B 1.1 A 1.2 VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX 6.3 1 5.2 0.9 4.7 6.6 1.1 5.1 0.9 4.4 A 1 1 1 B 1 1 1 A 5.1 21.3 4.6 15.2 4.6 13.2 B 4.4 20.8 3.8 16 3.9 13.9 trA, tfA A-port rise and fall times 0.8 3 0.8 3 0.8 3 trB, tfB B-port rise and fall times 0.7 3 0.5 2.8 0.4 2.7 Max data rate 100 100 ns μs ns ns ns 100 Mbps 6.15 Switching Characteristics, VCCA = 3.3 V ± 0.3 V over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX B 0.9 4.7 0.8 4 A 1 4.9 0.9 4.5 A 1 1 B 1 1 A 4.6 15.2 4.3 12.1 B 3.8 16 3.4 13.2 ns μs ns trA, tfA A-port rise and fall times 0.7 2.5 0.7 2.5 ns trB, tfB B-port rise and fall times 0.5 2.3 0.4 2.7 ns Max data rate 100 100 Mbps 6.16 Operating Characteristics TA = 25°C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.3 V to 5V VCCB PARAMETER TEST CONDITIONS 5V CpdA CpdB CpdA CpdB 8 A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) 1.8 V 1.8 V 1.8 V UNIT TYP TYP TYP TYP TYP TYP 7.8 8 8 7 7 8 TYP 8 12 11 11 11 11 11 11 38.1 28 29 29 29 29 30 25.4 18 17 17 18 20 21 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.02 0.01 0.01 0.01 0.01 0.01 0.01 0.03 Submit Documentation Feedback pF pF Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 6.17 Typical Characteristics 6 25°C (Room Temp) -40°C 85°C 5 A Port I/O Capacitance (pF) OE Pin Input Capacitance (pF) 6 4 3 2 1 5 4 3 2 25°C (Room Temp) -40°C 85°C 1 0 0 0 0.5 1 1.5 2 2.5 3 3.5 0 4 VCCA (V) 0.5 1 1.5 D001 VCCB = 3.3 V 2 2.5 VCCA (V) 3 3.5 4 D002 VCCB = 3.3 V Figure 1. Input Capacitance for OE pin (CI) vs Power Supply (VCCA) Figure 2. Capacitance for A Port I/O Pins (CiO) vs Power Supply (VCCA) B Port I/O Capacitance (pF) 12 10 8 6 4 25°C (Room Temp) -40°C 85°C 2 0 0 0.5 1 1.5 2 2.5 3 VCCB (V) 3.5 4 4.5 5 5.5 D003 VCCA = 1.8 V Figure 3. Capacitance for B Port I/O Pins (CiO) vs Power Supply (VCCB) Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 9 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com 7 Parameter Measurement Information 2 × VCCO From Output Under Test 50 kΩ From Output Under Test 15 pF 15 pF 1 MΩ Open 50 kΩ LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 TEST S1 tPZL/tPLZ tPHZ/tPZH 2 × VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 VCCO 0.1 VCCO tr VOH VCCI VCCO/2 tf VOL Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G. VCCI/2 CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W, dv/dt ≥ 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. V CCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuits and Voltage Waveforms 10 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 8 Detailed Description 8.1 Overview The TXB0101 device is a 1-bit directionless level-shifting and voltage translator specifically designed for translating logic voltage levels. The A port accepts I/O voltages ranging from 1.2 V to 3.6 V, while the B port is able to accept I/O voltages from 1.65 V to 5.5 V. The device is a buffered architecture with edge rate accelerators (one-shots) to improve the overall data rate. This device can only translate push-pull CMOS logic outputs. If for open-drain signal translation, see TI TXS010X products. 8.2 Functional Block Diagram VCCA VCCB OE One-Shot 4 NŸ A B One-Shot 4 NŸ 8.3 Feature Description 8.3.1 Architecture The TXB0101 architecture (see Figure 5) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a DC state, the output drivers of the TXB0101 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one-shots detect rising or falling edges on the A or B ports. During a rising edge, the one-shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one-shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V, and 40 Ω at VCCO = 3.3 V to 5 V. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 11 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com Feature Description (continued) VCCA VCCB One Shot T1 4k One Shot T2 A B One Shot T3 4k T4 One Shot Figure 5. Architecture of TXB0101 I/O Cell 8.3.2 Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. The TXB0101 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V) and are placed in high-impedance state. 8.3.3 Enable and Disable The TXB0101 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs are actually disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. 8.3.4 Pullup or Pulldown Resistors on I/O Lines The TXB0101 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0101 have lowDC drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0101. For the same reason, the TXB0101 should not be used in applications such as I2C or 1-Wire where an opendrain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS010X series of level translators. 8.4 Device Functional Modes The TXB0101 device has two functional modes, enabled and disabled. To disable the device set the OE input low, which places all I/Os in a high-impedance state. Setting the OE input high will enable the device. 12 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The TXB0101 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open-drain signal translation, see TI TXS010X products. Any external pulldown or pullup resistors are recommended larger than 50 kΩ. 9.2 Typical Application 1.8 V 3.3 V 1.8-V System Controller VCCA VCCB OE 3.3-V System TXB0101 Data A GND B Data GND GND Figure 6. Typical Application Circuit 9.2.1 Design Requirements For this design example, use the parameters listed in Table 1. And make sure that VCCA ≤ VCCB. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage range 1.2 V to 3.6 V Output voltage range 1.65 V to 5.5 V Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 13 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com 9.2.1.1 Input Driver Requirements Typical IIN vs VIN characteristics of the TXB0101 are shown in Figure 7. For proper operation, the device driving the data I/Os of the TXB0101 must have drive strength of at least ±2 mA. IIN VT/4 kΩ VIN –(VD – VT)/4 kΩ A. VT is the input threshold voltage of the TXB0101 (typically VCCI/2. B. VD is the supply voltage of the external driver. Figure 7. Typical IIN vs VIN Curve 9.2.2 Detailed Design Procedure To begin the design process, determine the following: • Input voltage range – Use the supply voltage of the device that is driving the TXB0101 device to determine the input voltage range. For a valid logic HIGH the value must exceed the VIH of the input port. For a valid logic LOW the value must be less than the VIL of the input port. • Output voltage range – Use the supply voltage of the device that the TXB0101 device is driving to determine the output voltage range. – External pullup or pulldown resistors are not recommended. If mandatory, TI recommends the value should be larger than 50 kΩ. • An external pulldown or pullup resistor decreases the output VOH and VOL. Use Equation 1 and Equation 2 to draft estimate the VOH and VOL as a result of an external pulldown and pullup resistor. VOH = VCCx × RPD / (RPD + 4.5 kΩ) VOL = VCCx × 4.5 kΩ / (RPU + 4.5 kΩ) (1) where • • • • 14 VCCx is the output port supply voltage on either VCCA or VCCB RPD is the value of the external pulldown resistor RPU is the value of the external pullup resistor 4.5 kΩ is the counting the variation of the serial resistor 4 kΩ in the I/O line. Submit Documentation Feedback (2) Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 9.2.3 Application Curve 2 V/div 200 ns/div VCCA = 1.8 V (waveform captured at pin 3) VCCB = 3.3 V (Waveform captured at pin 4) Figure 8. Level-Translation of a 2.5-MHz Signal Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 15 TXB0101 SCES639D – JANUARY 2007 – REVISED MARCH 2017 www.ti.com 10 Power Supply Recommendations During operation, ensure that VCCA ≤ VCCB at all times. During power up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. The TXB0101 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). The output-enable (OE) input circuit is designed so that it is supplied by VCCA and when the (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state of the outputs during power up or power down, the OE input pin must be tied to GND through a pulldown resistor and must not be enabled until VCCA and VCCB are fully ramped and stable. The minimum value of the pulldown resistor to ground is determined by the current-sourcing capability of the driver 11 Layout 11.1 Layout Guidelines To ensure reliability of the device, following common printed-circuit board layout guidelines is recommended. • Bypass capacitors should be used on power supplies. And should be placed as close as possible to the VCCA, VCCB pin and GND pin. • Short trace lengths should be used to avoid excessive loading. • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 10 ns, ensuring that any reflection encounters low impedance at the source driver. 11.2 Layout Example LEGEND Polygonal Copper Pour VIA to Power Plane VIA to GND Plane (Inner Layer) Bypass Capacitor Bypass Capacitor 1 VCCB VCCA 6 Keep OE low until VCCA and VCCB are powered up GND 3 A TXB0101 OE 5 B 4 VCCA To/From Controller/System 2 To/From Controller/System Figure 9. Layout Example Recommendation 16 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 TXB0101 www.ti.com SCES639D – JANUARY 2007 – REVISED MARCH 2017 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks NanoFree, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0101 17 PACKAGE OPTION ADDENDUM www.ti.com 30-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TXB0101DBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (NFCF, NFCR) TXB0101DBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (NFCF, NFCR) TXB0101DBVTG4 ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (NFCF, NFCR) TXB0101DCKR ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 27O TXB0101DCKRG4 ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 27O TXB0101DCKT ACTIVE SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM TXB0101DCKTG4 ACTIVE SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 27O TXB0101DRLR ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 27R TXB0101DRLT ACTIVE SOT-5X3 DRL 6 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 27R TXB0101YZPR ACTIVE DSBGA YZP 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 27N 27O (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of