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TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and
±15-kV ESD Protection
1 Features
3 Description
•
The TXB0102 device is a 2-bit noninverting translator
that uses two separate configurable power-supply
rails. The A port is designed to track VCCA. VCCA
accepts any supply voltage from 1.2 V to 3.6 V. The
B port is designed to track VCCB. VCCB accepts any
supply voltage from 1.65 V to 5.5 V. This allows for
universal low-voltage bidirectional translation between
any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V
voltage nodes. VCCA must not exceed VCCB.
1
•
•
•
•
•
•
•
Available in the Texas Instruments NanoFree™
Packages
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
B Port (VCCA ≤ VCCB)
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
OE Input Circuit Referenced to VCCA
Low Power Consumption, 4-µA Max ICC
Ioff Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 15-kV Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
2 Applications
•
•
•
•
When the output-enable (OE) input is low, all outputs
are placed in the high-impedance state.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs when the device is powered down. This
inhibits current backflow into the device which
prevents damage to the device.
OE must be tied to GND through a pulldown resistor
to assure the high-impedance state during power up
or power down; the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
NanoFree™ technology is a major breakthrough in IC
packaging concepts, using the die as the package.
Device Information(1)
PART NUMBER
Handsets
Smartphones
Tablets
Desktop PCs
PACKAGE
BODY SIZE (NOM)
TXB0102DCU
VSSOP (8)
2.30 mm × 2.00 mm
TXB0102YZP
DSBGA (8)
0.90 mm × 1.80 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Operating Circuit
VCCB
Processor
Peripheral
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
6.15
6.16
6.17
1
1
1
2
3
4
Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 5
Electrical Characteristics: TA = 25°C ....................... 6
Electrical Characteristics: TA = –40°C to +85°C (1) (2)
................................................................................... 7
Operating Characteristics.......................................... 8
VCCA = 1.2 V Timing Requirements ........................ 10
VCCA = 1.5 V ± 0.1 V Timing Requirements ........... 10
VCCA = 1.8 V ± 0.15 V Timing Requirements ....... 10
VCCA = 2.5 V ± 0.2 V Timing Requirements ......... 10
VCCA = 3.3 V ± 0.3 V Timing Requirements ......... 11
VCCA = 1.2 V Switching Characteristics ................ 11
VCCA = 1.5 V ± 0.1 V Switching Characteristics ... 13
VCCA = 1.8 V ± 0.15 V Switching Characteristics . 15
VCCA = 2.5 V ± 0.2 V Switching Characteristics ... 17
VCCA = 3.3 V ± 0.3 V Switching Characteristics ... 18
6.18 Typical Characteristics .......................................... 19
7
8
Parameter Measurement Information ................ 20
Detailed Description ............................................ 21
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
21
21
22
23
Application and Implementation ........................ 24
9.1 Application Information............................................ 24
9.2 Typical Application ................................................. 24
10 Power Supply Recommendations ..................... 26
11 Layout................................................................... 26
11.1 Layout Guidelines ................................................. 26
11.2 Layout Example .................................................... 26
12 Device and Documentation Support ................. 27
12.1
12.2
12.3
12.4
12.5
12.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
27
27
13 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (December 2014) to Revision D
Page
•
Changed format of Pin Functions tables. ............................................................................................................................... 3
•
Added Junction temperature, TJ in Absolute Maximum Ratings ............................................................................................ 4
Changes from Revision B (March 2012) to Revision C
•
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision A (January 2011) to Revision B
•
2
Page
Added notes to pin out graphics............................................................................................................................................. 3
Changes from Original (May 2007) to Revision A
•
Page
Page
Added ball labels to the YZP Package. .................................................................................................................................. 3
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
5 Pin Configuration and Functions
DCT Or DCU Package
8-Pin VSSOP
Top View
YZP Package
8-Pin DSBGA
Bottom View
8 B1
B2 1
GND 2
7 VCCB
VCCA 3
6 OE
A2 4
5 A1
A2
VCCA
D1
D2
A1
C1
C2
GND
B1
B2
OE
VCCB
B2
A1
A2
B1
A.
Pullup resistors are not recommended on TXB0102 I/O pins.
B.
If pullup resistors are needed for open drain communication, please refer to the TXS0102 or contact TI.
C.
If pullup or pulldown resistors are needed, the resistor value must be over 50 kΩ. See Effects of External Pullup and
Pulldown Resistors on TXS and TXB Devices .
D.
50 kΩ is a safe recommended value, if the customer can accept higher Vol or lower VCCOUT, smaller pullup or
pulldown resistor is allowed, the draft estimation is VOL = VCCOUT × 4.5k/(4.5k + Rpu) and VOH = VCCOUT × Rdw/(4.5k
+ Rdw).
E.
For detailed information, See A Guide to Voltage Translation With TXB-Type Translators.
Pin Functions: YZP
PIN
(1)
TYPE (1)
DESCRIPTION
NO.
NAME
A1
B2
I/O
Input/output B2. Referenced to VCCB.
A2
B1
I/O
Input/output B1. Referenced to VCCB.
B1
GND
S
Ground
B2
VCCB
S
B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V
C1
VCCA
S
A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V, VCCA ≤ VCCB
C2
OE
I
3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA
D1
A2
I/O
Input/output A2. Referenced to VCCA
D2
A1
I/O
Input/output A1. Referenced to VCCA
I = input, O = output, I/O = input and output, S = power supply
Pin Functions: DCT or DCU
PIN
(1)
TYPE (1)
NAME
NO.
B2
1
I/O
DESCRIPTION
Input/output B2. Referenced to VCCB
GND
2
S
Ground
VCCA
3
S
A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V, VCCA ≤ VCCB
A2
4
I/O
Input/output A2. Referenced to VCCA
Input/output A1. Referenced to VCCA
A1
5
I/O
OE
6
I
3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA
VCCB
7
S
B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V
B1
8
I/O
Input/output B1. Referenced to VCCB
I = input, O = output, I/O = input and output, S = power supply
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCCA
VCCB
MIN
MAX
–0.5
4.6
–0.5
6.5
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
Supply voltage
UNIT
V
VI
Input voltage (2)
VO
Voltage range applied to any output in the high-impedance or
power-off state (2)
VO
Voltage range applied to any output in the high or low state (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
(3)
V
V
V
Continuous current through VCCA, VCCB, or GND
±100
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
150
°C
(1)
(2)
(3)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
6.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic Charged device model (CDM), per JEDEC specification JESD22-C101
discharge
Machine model (MM), per A115-A
(1)
(2)
4
PORTS
VALUE
A Port
±2500
B Port
±1500
A Port
±1500
B Port
±1500
A Port
±200
B Port
±200
UNIT
V
V
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
6.3 Recommended Operating Conditions
See (1)
(2)
VCCA
VCCA
VCCB
Supply voltage
MIN
MAX
1.2
3.6
1.65
5.5
Data inputs
1.2 V to 3.6 V
1.65 V to 5.5 V
VCCI × 0.65 (3)
VCCI
OE input
1.2 V to 3.6 V
1.65 V to 5.5 V
VCCA × 0.65
5.5
Data inputs
1.2 V to 5.5 V
1.65 V to 5.5 V
0
VCCI × 0.35 (3)
OE input
1.2 V to 3.6 V
1.65 V to 5.5 V
0
VCCA × 0.35
0
3.6
1.2 V to 3.6 V
1.65 V to 5.5 V
0
5.5
VIH
High-level input voltage
VIL
Low-level input voltage
VO
Voltage range applied to any A port
output in the high-impedance
B port
or power-off state
Δt/Δv
Input transition rise or fall
rate
TA
Operating free-air temperature
A port inputs
(1)
(2)
(3)
VCCB
1.2 V to 3.6 V
B port inputs
1.2 V to 3.6 V
1.65 V to 5.5 V
40
1.65 V to 1.95 V
40
4.5 V to 5.5 V
UNIT
V
V
V
V
ns/V
30
–40
85
°C
The A and B sides of an unused data I/O pair must be held in the same state, that is, both at VCCI or both at GND.
VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
VCCI is the supply voltage associated with the input port.
6.4 Thermal Information
TXB0102
THERMAL METRIC (1)
DCT (VSSOP) DCU (VSSOP)
YZP (VSSOP)
8 PINS
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
168.7
199.1
105.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
111.7
72.4
1.6
°C/W
RθJB
Junction-to-board thermal resistance
78.1
77.8
10.8
°C/W
ψJT
Junction-to-top characterization parameter
45.0
6.2
3.1
°C/W
ψJB
Junction-to-board characterization parameter
77.5
77.4
10.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
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6.5 Electrical Characteristics: TA = 25°C
(1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
1.2 V
IOH = –20 µA
VOLA
IOL = 20 µA
VOHB
IOH = –20 µA
1.65 V to 5.5 V
VOLB
IOL = 20 µA
1.65 V to 5.5 V
Ioff
IOZ
OE
VI = VCCI or GND
A port
B port
A or B port
ICCA
1.2 V
0.3
V
±1
VI or VO = 0 to 3.6 V
0V
0 V to 5.5 V
±1
VI or VO = 0 to 5.5 V
0 V to 3.6 V
0V
±1
OE = GND
1.2 V to 3.6 V
1.65 V to 5.5 V
±1
1.2 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0
1.4 V to 3.6 V
1.65 V to 5.5 V
3.6 V
0V
0V
5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
3.6 V
0V
0V
5.5 V
ICCA + ICCB
VI = VCCI or GND,
IO = 0
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZA
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZB
1.4 V to 3.6 V
1.65 V to 5.5 V
1.2 V to 3.6 V
1.65 V to 5.5 V
6
V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0
(1)
(2)
V
1.2 V to 3.6 V
1.2 V
OE
A port
B port
1.2 V to 3.6 V
1.65 V to 5.5 V
UNIT
V
1.4 V to 3.6 V
ICCB
Cio
MAX
1.4 V to 3.6 V
1.4 V to 3.6 V
Ci
TYP
1.1
VOHA
II
MIN
µA
µA
µA
0.06
µA
3.4
µA
3.5
µA
0.05
µA
3.3
µA
2.5
5
11
pF
pF
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
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6.6 Electrical Characteristics: TA = –40°C to +85°C (1)
(2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
MIN
MAX
1.2 V
UNIT
VOHA
IOH = –20 µA
VOLA
IOL = 20 µA
VOHB
IOH = –20 µA
1.65 V to 5.5 V
VOLB
IOL = 20 µA
1.65 V to 5.5 V
0.4
V
1.2 V to 3.6 V
1.65 V to 5.5 V
±2
µA
II
Ioff
IOZ
1.4 V to 3.6 V
V
VCCA – 0.4
1.2 V
1.4 V to 3.6 V
0.4
VCCB – 0.4
V
OE
VI = VCCI or GND
A port
VI or VO = 0 to 3.6 V
0V
0 V to 5.5 V
±2
B port
VI or VO = 0 to 5.5 V
0 V to 3.6 V
0V
±2
A or B port
OE = GND
1.2 V to 3.6 V
1.65 V to 5.5 V
±2
1.2 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0
1.4 V to 3.6 V
1.65 V to 5.5 V
3
3.6 V
0V
2
0V
5.5 V
–2
ICCA
1.2 V
1.65 V to 5.5 V
1.65 V to 5.5 V
5
3.6 V
0V
–2
2
ICCB
VI = VCCI or GND,
IO = 0
1.4 V to 3.6 V
0V
5.5 V
ICCA + ICCB
VI = VCCI or GND,
IO = 0
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZA
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZB
1.4 V to 3.6 V
1.65 V to 5.5 V
5
1.2 V to 3.6 V
1.65 V to 5.5 V
3
Ci
Cio
(1)
(2)
OE
A port
1.2 V to 3.6 V
B port
1.65 V to 5.5 V
V
8
3
6
14
µA
µA
µA
µA
µA
µA
µA
pF
pF
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
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6.7 Operating Characteristics
TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
VCCA = 1.2 V, VCCB = 5 V
A port input, B port output
CpdA
B port input, A port output
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = VCCA
(outputs enabled)
A port input, B port output
8
VCCA = 1.8 V, VCCB = 1.8 V
7
VCCA = 2.5 V, VCCB = 2.5 V
7
VCCA = 2.5 V, VCCB = 5 V
8
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
8
VCCA = 1.2 V, VCCB = 5 V
12
VCCA = 1.2 V, VCCB = 1.8 V
11
VCCA = 1.5 V, VCCB = 1.8 V
11
VCCA = 1.8 V, VCCB = 1.8 V
11
VCCA = 2.5 V, VCCB = 2.5 V
11
VCCA = 2.5 V, VCCB = 5 V
11
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
11
38.1
VCCA = 1.2 V, VCCB = 1.8 V
29
VCCA = 1.5 V, VCCB = 1.8 V
29
VCCA = 1.8 V, VCCB = 1.8 V
29
VCCA = 2.5 V, VCCB = 2.5 V
29
VCCA = 2.5 V, VCCB = 5 V
30
VCCA = 1.2 V, VCCB = 5 V
B port input, A port output
8
8
VCCA = 1.5 V, VCCB = 1.8 V
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
CpdB
7.8
VCCA = 1.2 V, VCCB = 1.8 V
VCCA = 1.2 V, VCCB = 5 V
pF
30
25.4
VCCA = 1.2 V, VCCB = 1.8 V
19
VCCA = 1.5 V, VCCB = 1.8 V
18
VCCA = 1.8 V, VCCB = 1.8 V
18
VCCA = 2.5 V, VCCB = 2.5 V
18
VCCA = 2.5 V, VCCB = 5 V
21
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
21
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Operating Characteristics (continued)
TA = 25°C
PARAMETER
TEST CONDITIONS
A port input, B port output
CpdA
B port input, A port output
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
A port input, B port output
CpdB
B port input, A port output
TYP
VCCA = 1.2 V, VCCB = 5 V
0.01
VCCA = 1.2 V, VCCB = 1.8 V
0.01
VCCA = 1.5 V, VCCB = 1.8 V
0.01
VCCA = 1.8 V, VCCB = 1.8 V
0.01
VCCA = 2.5 V, VCCB = 2.5 V
0.01
VCCA = 2.5 V, VCCB = 5 V
0.01
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
0.01
VCCA = 1.2 V, VCCB = 5 V
0.01
VCCA = 1.2 V, VCCB = 1.8 V
0.01
VCCA = 1.5 V, VCCB = 1.8 V
0.01
VCCA = 1.8 V, VCCB = 1.8 V
0.01
VCCA = 2.5 V, VCCB = 2.5 V
0.01
VCCA = 2.5 V, VCCB = 5 V
0.01
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
0.01
VCCA = 1.2 V, VCCB = 5 V
0.01
VCCA = 1.2 V, VCCB = 1.8 V
0.01
VCCA = 1.5 V, VCCB = 1.8 V
0.01
VCCA = 1.8 V, VCCB = 1.8 V
0.01
VCCA = 2.5 V, VCCB = 2.5 V
0.01
VCCA = 2.5 V, VCCB = 5 V
0.01
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
0.02
VCCA = 1.2 V, VCCB = 5 V
0.01
VCCA = 1.2 V, VCCB = 1.8 V
0.01
VCCA = 1.5 V, VCCB = 1.8 V
0.01
VCCA = 1.8 V, VCCB = 1.8 V
0.01
VCCA = 2.5 V, VCCB = 2.5 V
0.01
VCCA = 2.5 V, VCCB = 5 V
0.02
VCCA = 3.3 V, VCCB = 3.3 V to 5 V
0.03
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Product Folder Links: TXB0102
UNIT
pF
9
TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
www.ti.com
6.8 VCCA = 1.2 V Timing Requirements
TA = 25°C, VCCA = 1.2 V
TEST CONDITIONS
Data rate
tw
Pulse duration
Data inputs
NOM
VCCB = 1.8 V
20
VCCB = 2.5 V
20
VCCB = 3.3 V
20
VCCB = 5 V
20
VCCB = 1.8 V
50
VCCB = 2.5 V
50
VCCB = 3.3 V
50
VCCB = 5 V
50
UNIT
Mbps
ns
6.9 VCCA = 1.5 V ± 0.1 V Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
TEST CONDITIONS
Data rate
tw
Pulse duration
Data inputs
MIN
MAX
VCCB = 1.8 V ± 0.15 V
40
VCCB = 2.5 V ± 0.2 V
40
VCCB = 3.3 V ± 0.3 V
40
VCCB = 5 V ± 0.5 V
40
VCCB = 1.8 V ± 0.15 V
25
VCCB = 2.5 V ± 0.2 V
25
VCCB = 3.3 V ± 0.3 V
25
VCCB = 5 V ± 0.5 V
25
UNIT
Mbps
ns
6.10 VCCA = 1.8 V ± 0.15 V Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
TEST CONDITIONS
Data rate
tw
Pulse duration
Data inputs
MIN
MAX
VCCB = 1.8 V ± 0.15 V
60
VCCB = 2.5 V ± 0.2 V
60
VCCB = 3.3 V ± 0.3 V
60
VCCB = 5 V ± 0.5 V
60
VCCB = 1.8 V ± 0.15 V
17
VCCB = 2.5 V ± 0.2 V
17
VCCB = 3.3 V ± 0.3 V
17
VCCB = 5 V ± 0.5 V
17
UNIT
Mbps
ns
6.11 VCCA = 2.5 V ± 0.2 V Timing Requirements
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
TEST CONDITIONS
Data rate
tw
10
Pulse duration
Data inputs
MIN
MAX
VCCB = 2.5 V ± 0.2 V
100
VCCB = 3.3 V ± 0.3 V
100
VCCB = 5 V ± 0.5 V
100
VCCB = 2.5 V ± 0.2 V
10
VCCB = 3.3 V ± 0.3 V
10
VCCB = 5 V ± 0.5 V
10
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UNIT
Mbps
ns
Copyright © 2007–2017, Texas Instruments Incorporated
Product Folder Links: TXB0102
TXB0102
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
6.12 VCCA = 3.3 V ± 0.3 V Timing Requirements
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
TEST CONDITIONS
Data rate
tw
Pulse duration
Data inputs
MIN
MAX
UNIT
VCCB = 3.3 V ± 0.3 V
100
VCCB = 5 V ± 0.5 V
100
VCCB = 3.3 V ± 0.3 V
10
VCCB = 5 V ± 0.5 V
10
Mbps
ns
6.13 VCCA = 1.2 V Switching Characteristics
TA = 25°C, VCCA = 1.2 V
PARAMETER
FROM
(INPUT)
A
TO
(OUTPUT)
B
tpd
B
A
TEST CONDITIONS
VCCB = 1.8 V
6.9
VCCB = 2.5 V
5.7
VCCB = 3.3 V
5.3
VCCB = 5 V
5.5
VCCB = 1.8 V
7.4
VCCB = 2.5 V
6.4
VCCB = 3.3 V
6
VCCB = 5 V
A
ten
OE
B
A
tdis
OE
B
trA
tfA
trB
A port rise time
A port fall times
B port rise times
TYP
UNIT
ns
5.8
VCCB = 1.8 V
1
VCCB = 2.5 V
1
VCCB = 3.3 V
1
VCCB = 5 V
1
VCCB = 1.8 V
1
VCCB = 2.5 V
1
VCCB = 3.3 V
1
VCCB = 5 V
1
VCCB = 1.8 V
18
VCCB = 2.5 V
15
VCCB = 3.3 V
14
VCCB = 5 V
14
VCCB = 1.8 V
20
VCCB = 2.5 V
17
VCCB = 3.3 V
16
VCCB = 5 V
16
VCCB = 1.8 V
4.2
VCCB = 2.5 V
4.2
VCCB = 3.3 V
4.2
VCCB = 5 V
4.2
VCCB = 1.8 V
4.2
VCCB = 2.5 V
4.2
VCCB = 3.3 V
4.2
VCCB = 5 V
4.2
VCCB = 1.8 V
2.1
VCCB = 2.5 V
1.5
VCCB = 3.3 V
1.2
VCCB = 5 V
1.1
μs
ns
ns
ns
ns
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TXB0102
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VCCA = 1.2 V Switching Characteristics (continued)
TA = 25°C, VCCA = 1.2 V
PARAMETER
tfB
FROM
(INPUT)
B port fall times
tsk(o)
Channel-to-channel
Max data rate
12
TO
(OUTPUT)
TEST CONDITIONS
TYP
VCCB = 1.8 V
2.1
VCCB = 2.5 V
1.5
VCCB = 3.3 V
1.2
VCCB = 5 V
1.1
VCCB = 1.8 V
0.5
VCCB = 2.5 V
0.5
VCCB = 3.3 V
0.5
VCCB = 5 V
1.4
VCCB = 1.8 V
20
VCCB = 2.5 V
20
VCCB = 3.3 V
20
VCCB = 5 V
20
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UNIT
ns
ns
Mbps
Copyright © 2007–2017, Texas Instruments Incorporated
Product Folder Links: TXB0102
TXB0102
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
6.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
B
tpd
B
A
A
ten
OE
B
A
tdis
OE
B
trA
tfA
trB
tfB
tsk(o)
A port rise times
A port fall times
B port rise times
B port fall times
Channel-to-channel
TEST CONDITIONS
MIN
MAX
VCCB = 1.8 V ± 0.15 V
1.4
12.9
VCCB = 2.5 V ± 0.2 V
1.2
10.1
VCCB = 3.3 V ± 0.3 V
1.1
10
VCCB = 5 V ± 0.5 V
0.8
9.9
VCCB = 1.8 V ± 0.15 V
0.9
14.2
VCCB = 2.5 V ± 0.2 V
0.7
12
VCCB = 3.3 V ± 0.3 V
0.4
11.7
VCCB = 5 V ± 0.5 V
0.3
13.7
VCCB = 1.8 V ± 0.15 V
1
VCCB = 2.5 V ± 0.2 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
VCCB = 1.8 V ± 0.15 V
1
VCCB = 2.5 V ± 0.2 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
VCCB = 1.8 V ± 0.15 V
5.9
31
VCCB = 2.5 V ± 0.2 V
5.7
25.9
VCCB = 3.3 V ± 0.3 V
5.6
23
VCCB = 5 V ± 0.5 V
5.7
22.4
VCCB = 1.8 V ± 0.15 V
5.4
30.3
VCCB = 2.5 V ± 0.2 V
4.9
22.8
VCCB = 3.3 V ± 0.3 V
4.8
20
VCCB = 5 V ± 0.5 V
4.9
19.5
VCCB = 1.8 V ± 0.15 V
1.4
5.1
VCCB = 2.5 V ± 0.2 V
1.4
5.1
VCCB = 3.3 V ± 0.3 V
1.4
5.1
VCCB = 5 V ± 0.5 V
1.4
5.1
VCCB = 1.8 V ± 0.15 V
1.4
5.1
VCCB = 2.5 V ± 0.2 V
1.4
5.1
VCCB = 3.3 V ± 0.3 V
1.4
5.1
VCCB = 5 V ± 0.5 V
1.4
5.1
VCCB = 1.8 V ± 0.15 V
0.9
4.5
VCCB = 2.5 V ± 0.2 V
0.6
3.2
VCCB = 3.3 V ± 0.3 V
0.5
2.8
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 1.8 V ± 0.15 V
0.9
4.5
VCCB = 2.5 V ± 0.2 V
0.6
3.2
VCCB = 3.3 V ± 0.3 V
0.5
2.8
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 1.8 V ± 0.15 V
0.5
VCCB = 2.5 V ± 0.2 V
0.5
VCCB = 3.3 V ± 0.3 V
0.5
VCCB = 5 V ± 0.5 V
0.5
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UNIT
ns
μs
ns
ns
ns
ns
ns
ns
13
TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
www.ti.com
VCCA = 1.5 V ± 0.1 V Switching Characteristics (continued)
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
Max data rate
14
TO
(OUTPUT)
TEST CONDITIONS
MIN
VCCB = 1.8 V ± 0.15 V
40
VCCB = 2.5 V ± 0.2 V
40
VCCB = 3.3 V ± 0.3 V
40
VCCB = 5 V ± 0.5 V
40
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MAX
UNIT
Mbps
Copyright © 2007–2017, Texas Instruments Incorporated
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TXB0102
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
6.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
B
tpd
B
A
TEST CONDITIONS
ten
OE
B
A
tdis
OE
B
trA
tfA
trB
tfB
tsk(o)
A port rise times
A port fall times
B port rise times
B port fall times
Channel-to-channel
MAX
VCCB = 1.8 V ± 0.15 V
1.6
11
VCCB = 2.5 V ± 0.2 V
1.4
7.7
VCCB = 3.3 V ± 0.3 V
1.3
6.8
VCCB = 5 V ± 0.5 V
1.2
6.5
VCCB = 1.8 V ± 0.15 V
1.5
12
VCCB = 2.5 V ± 0.2 V
1.3
8.4
1
7.6
0.9
7.1
VCCB = 3.3 V ± 0.3 V
VCCB = 5 V ± 0.5 V
A
MIN
VCCB = 1.8 V ± 0.15 V
1
VCCB = 2.5 V ± 0.2 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
VCCB = 1.8 V ± 0.15 V
1
VCCB = 2.5 V ± 0.2 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
VCCB = 1.8 V ± 0.15 V
5.9
31
VCCB = 2.5 V ± 0.2 V
5.1
21.3
VCCB = 3.3 V ± 0.3 V
5
19.3
VCCB = 5 V ± 0.5 V
5
17.4
VCCB = 1.8 V ± 0.15 V
5.4
30.3
VCCB = 2.5 V ± 0.2 V
4.4
20.8
VCCB = 3.3 V ± 0.3 V
4.2
17.9
VCCB = 5 V ± 0.5 V
4.3
16.3
VCCB = 1.8 V ± 0.15 V
1
4.2
VCCB = 2.5 V ± 0.2 V
1.1
4.1
VCCB = 3.3 V ± 0.3 V
1.1
4.1
VCCB = 5 V ± 0.5 V
1.1
4.1
VCCB = 1.8 V ± 0.15 V
1
4.2
VCCB = 2.5 V ± 0.2 V
1.1
4.1
VCCB = 3.3 V ± 0.3 V
1.1
4.1
VCCB = 5 V ± 0.5 V
1.1
4.1
VCCB = 1.8 V ± 0.15 V
0.9
4.5
VCCB = 2.5 V ± 0.2 V
0.6
3.2
VCCB = 3.3 V ± 0.3 V
0.5
2.8
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 1.8 V ± 0.15 V
0.9
4.5
VCCB = 2.5 V ± 0.2 V
0.6
3.2
VCCB = 3.3 V ± 0.3 V
0.5
2.8
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 1.8 V ± 0.15 V
0.5
VCCB = 2.5 V ± 0.2 V
0.5
VCCB = 3.3 V ± 0.3 V
0.5
VCCB = 5 V ± 0.5 V
0.5
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UNIT
ns
μs
ns
ns
ns
ns
ns
ns
15
TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
www.ti.com
VCCA = 1.8 V ± 0.15 V Switching Characteristics (continued)
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
Max data rate
16
TO
(OUTPUT)
TEST CONDITIONS
MIN
VCCB = 1.8 V ± 0.15 V
60
VCCB = 2.5 V ± 0.2 V
60
VCCB = 3.3 V ± 0.3 V
60
VCCB = 5 V ± 0.5 V
60
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MAX
UNIT
Mbps
Copyright © 2007–2017, Texas Instruments Incorporated
Product Folder Links: TXB0102
TXB0102
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
6.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
B
tpd
B
A
A
ten
OE
B
TEST CONDITIONS
MIN
MAX
VCCB = 2.5 V ± 0.2 V
1.1
6.3
VCCB = 3.3 V ± 0.3 V
1
5.2
VCCB = 5 V ± 0.5 V
0.9
4.7
VCCB = 2.5 V ± 0.2 V
1.2
6.6
VCCB = 3.3 V ± 0.3 V
1.1
5.1
VCCB = 5 V ± 0.5 V
0.9
4.4
VCCB = 2.5 V ± 0.2 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
VCCB = 2.5 V ± 0.2 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
A
tdis
OE
B
trA
tfA
trB
tfB
tsk(o)
A port rise times
A port fall times
B port rise times
B port fall times
Channel-to-channel
Max data rate
5.1
21.3
VCCB = 3.3 V ± 0.3 V
4.6
15.2
VCCB = 5 V ± 0.5 V
4.6
13.2
VCCB = 2.5 V ± 0.2 V
4.4
20.8
VCCB = 3.3 V ± 0.3 V
3.8
16
VCCB = 5 V ± 0.5 V
3.9
13.9
VCCB = 2.5 V ± 0.2 V
0.8
3
VCCB = 3.3 V ± 0.3 V
0.8
3
VCCB = 5 V ± 0.5 V
0.8
3
VCCB = 2.5 V ± 0.2 V
0.8
3
VCCB = 3.3 V ± 0.3 V
0.8
3
VCCB = 5 V ± 0.5 V
0.8
3
VCCB = 2.5 V ± 0.2 V
0.7
3
VCCB = 3.3 V ± 0.3 V
0.5
2.8
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 2.5 V ± 0.2 V
0.7
3
VCCB = 3.3 V ± 0.3 V
0.5
2.8
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 2.5 V ± 0.2 V
0.5
VCCB = 3.3 V ± 0.3 V
0.5
VCCB = 5 V ± 0.5 V
0.5
VCCB = 2.5 V ± 0.2 V
100
VCCB = 3.3 V ± 0.3 V
100
VCCB = 5 V ± 0.5 V
100
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ns
μs
1
VCCB = 2.5 V ± 0.2 V
Copyright © 2007–2017, Texas Instruments Incorporated
UNIT
ns
ns
ns
ns
ns
ns
Mbps
17
TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
www.ti.com
6.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
B
tpd
B
A
A
ten
OE
B
A
tdis
OE
B
trA
A port rise times
tfA
A port fall times
trB
B port rise times
tfB
B port fall times
tsk(o)
Channel-to-channel
Max data rate
18
TEST CONDITIONS
MIN
MAX
VCCB = 3.3 V ± 0.3 V
0.9
4.7
VCCB = 5 V ± 0.5 V
0.8
4
1
4.9
0.9
4.5
VCCB = 3.3 V ± 0.3 V
VCCB = 5 V ± 0.5 V
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
ns
μs
1
VCCB = 3.3 V ± 0.3 V
4.6
15.2
VCCB = 5 V ± 0.5 V
4.3
12.1
VCCB = 3.3 V ± 0.3 V
3.8
16
VCCB = 5 V ± 0.5 V
3.4
13.2
VCCB = 3.3 V ± 0.3 V
0.7
2.5
VCCB = 5 V ± 0.5 V
0.7
2.5
0.7
2.5
VCCB = 3.3 V ± 0.3 V
0.5
2.3
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 3.3 V ± 0.3 V
0.5
2.3
VCCB = 5 V ± 0.5 V
0.4
2.7
VCCB = 3.3 V ± 0.3 V
VCCB = 5 V ± 0.5 V
VCCB = 3.3 V ± 0.3 V
0.5
VCCB = 5 V ± 0.5 V
0.5
VCCB = 3.3 V ± 0.3 V
100
VCCB = 5 V ± 0.5 V
100
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UNIT
ns
ns
ns
ns
ns
ns
Mbps
Copyright © 2007–2017, Texas Instruments Incorporated
Product Folder Links: TXB0102
TXB0102
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
6.18 Typical Characteristics
6
25°C (Room Temp)
-40°C
85°C
5
A Port I/O Capacitance (pF)
OE Pin Input Capacitance (pF)
6
4
3
2
1
5
4
3
2
25°C (Room Temp)
-40°C
85°C
1
0
0
0
0.5
1
1.5
2
2.5
3
3.5
0
4
VCCA (V)
0.5
1
1.5
D001
VCCB = 3.3 V
2
2.5
VCCA (V)
3
3.5
4
D002
VCCB = 3.3 V
Figure 1. Input Capacitance for OE pin (CI) vs Power Supply
(VCCA)
Figure 2. Capacitance for A Port I/O Pins (CiO) vs Power
Supply (VCCA)
B Port I/O Capacitance (pF)
12
10
8
6
4
25°C (Room Temp)
-40°C
85°C
2
0
0
0.5
1
1.5
2
2.5
3
VCCB (V)
3.5
4
4.5
5
5.5
D003
VCCA = 1.8 V
Figure 3. Capacitance for B Port I/O Pins (CiO) vs Power Supply (VCCB)
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TXB0102
SCES641D – MAY 2007 – REVISED OCTOBER 2017
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7 Parameter Measurement Information
2 × VCCO
From Output
Under Test
15 pF
15 pF
1M
Open
50 k
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
S1
50 k
From Output
Under Test
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
tPHL
tw
Output
VCCO/2
0.9
VCCO
0.1
VCCO
tr
VOH
VCCI
VCCO/2
tf
VOL
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A.
B.
C.
D.
E.
F.
G.
VCCI/2
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W, dv/dt ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
VCCI is the VCC associated with the input port.
V CCO is the VCC associated with the output port.
All parameters and waveforms are not applicable to all devices.
Figure 4. Load Circuits And Voltage Waveforms
20
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SCES641D – MAY 2007 – REVISED OCTOBER 2017
8 Detailed Description
8.1 Overview
The TXB0102 device is a 4-bit directionless voltage-level translator specifically designed for translating logic
voltage levels. The A port is able to accept I/O voltages ranging from 1.2 V to 3.6 V, while the B port can accept
I/O voltages from 1.65 V to 5.5 V. The device is a buffered architecture with edge rate accelerators (one shots) to
improve the overall data rate. This device can only translate push-pull CMOS logic outputs. For open drain signal
translation, see TI TXS010X products.
8.2 Functional Block Diagram
VccA
VccB
OE
One
Shot
A1
B1
4 kO
One
Shot
4 kO
One
Shot
B2
A2
4 kO
One
Shot
4 kO
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8.3 Feature Description
8.3.1 Architecture
The TXB0102 architecture (see Figure 5) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a DC state, the output drivers of the TXB0102 can maintain a high or low,
but are designed to be weak, so that the drivers can be overdriven by an external driver when data on the bus
starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports.
During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up
the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for
a short duration, which speeds up the high-to-low transition. The typical output impedance during output
transition is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5 V.
VCCA
VCCB
One
Shot
T1
4k
One
Shot
T2
A
B
One
Shot
T3
4k
T4
One
Shot
Figure 5. Architecture of TXB0102 I/O Cell
8.3.2 Input Driver Requirements
Figure 6 shows the typical IIN versus VIN characteristics of the TXB0102. For proper operation, the device driving
the data I/Os of the TXB0102 must have drive strength of at least ±2 mA.
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Feature Description (continued)
IIN
VT/4 kΩ
VIN
–(VD – VT)/4 kΩ
A. VT is the input threshold voltage of the TXB0102 (typically VCCI/2.
B. VD is the supply voltage of the external driver.
Figure 6. Typical IIN vs VIN Curve
8.3.3 Output Load Considerations
TI recommends careful printed-circuit board (PCB) layout practices with short PCB trace lengths to avoid
excessive capacitive loading and to assure that proper O.S. triggering takes place. PCB signal trace-lengths
must be kept short enough such that the round trip delay of any reflection is less than the one-shot duration. This
improves signal integrity by assuring that any reflection sees a low impedance at the driver. The O.S. circuits
have been designed to stay on for approximately 10 ns. The maximum capacitance of the lumped load that is
driven also depends directly on the one-shot duration. With heavy capacitive loads, the one-shot can time-out
before the signal is driven fully to the positive rail. The O.S. duration has been set to best optimize trade-offs
between dynamic ICC, load driving capability, and maximum bit-rate considerations. Both PCB trace length and
connectors add to the capacitance that the TXB0102 output sees, so TI recommends that this lumped-load
capacitance be considered to avoid O.S. retriggering, bus contention, output signal oscillations, or other adverse
system-level affects.
8.3.4 Enable and Disable
The TXB0102 has an output-enable (OE) input that is used to disable the device by setting OE = low, which
places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE
goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time
the user must allow for the one-shot circuitry to become operational after OE is taken high.
8.3.5 Pullup or Pulldown Resistors on I/O Lines
The TXB0102 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0102 have low
DC drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to assure that they do not contend with the output drivers of the TXB0102.
For the same reason, the TXB0102 device must not be used in applications such as I2C or 1-Wire where an
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI
TXS01xx series of level translators.
8.4 Device Functional Modes
The TXB0102 device has two functional modes, enabled and disabled. To disable the device set the OE input
low, which places all I/Os in a high impedance state. Setting the OE input high enables the device.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TXB0102 is used in level-translation applications for interfacing devices or systems operating at different
interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open drain signal
translation, please refer to TI TXS010X products. Any external pulldown or pullup resistors are recommended
larger than 50 kΩ.
9.2 Typical Application
1.8V
3.3V
0.1 µF
VccA
0.1 µF
VccB
OE
1.8V
System Controller
3.3V
System
TXB0102
A1
A2
Data
B1
B2
Data
GND
Figure 7. Typical Operating Circuit
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 and make sure that VCCA ≤ VCCB.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
1.2 V to 3.6 V
Output voltage range
1.65 V to 5.5 V
9.2.2 Detailed Design Procedure
To begin the design process, determine the following:
• Input voltage range
– Use the supply voltage of the device that is driving the TXB0102 device to determine the input voltage
range. For a valid logic high the value must exceed the VIH of the input port. For a valid logic low the value
must be less than the VIL of the input port.
• Output voltage range
– Use the supply voltage of the device that the TXB0102 device is driving to determine the output voltage
range.
– TI does not recommend to have the external pullup or pulldown resistors. If mandatory, TI recommends
that the value should be larger than 50 kΩ.
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An external pulldown or pullup resistor decreases the output VOH and VOL. Use Equation 1 and Equation 2 to
draft estimate the VOH and VOL as a result of an external pulldown and pullup resistor.
VOH = VCCx × RPD / (RPD + 4.5 kΩ)
VOL = VCCx × 4.5 kΩ / (RPU + 4.5 kΩ)
(1)
where
•
•
•
•
VCCx is the output port supply voltage on either VCCA or VCCB
RPD is the value of the external pulldown resistor
RPU is the value of the external pullup resistor
4.5 kΩ is the counting the variation of the serial resistor 4 kΩ in the I/O line.
(2)
9.2.3 Application Curve
2 V/div
200 ns/div
VCCA = 1.8 V
VCCB = 3.3 V
Figure 8. Level-Translation of a 2.5-MHz Signal
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10 Power Supply Recommendations
During operation, assure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0102 device has circuitry that disables
all output ports when either VCC is switched off (VCCA/B = 0 V). The (OE) input circuit is designed so that it is
supplied by VCCA and when the (OE) input is low, all outputs are placed in the high-impedance state. To assure
the high-impedance state of the outputs during power up or power down, the OE input pin must be tied to GND
through a pulldown resistor and must not be enabled until VCCA and VCCB are fully ramped and stable. The
minimum value of the pulldown resistor to ground is determined by the current-sourcing capability of the driver.
11 Layout
11.1 Layout Guidelines
Follow common PCB layout guidelines to assure reliability of the device.
Bypass capacitors must be used on power suppliesand placed as close as possible to the VCCA, VCCB pin, and
GND pin.
Short trace lengths must be used to avoid excessive loading.
PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the
oneshot duration, approximately 10 ns, assuring that any reflection encounters low impedance at the source
driver.
11.2 Layout Example
LEGEND
Polygonal Copper Pour
VIA to Power Plane
VIA to GND Plane (Inner Layer)
TXB0102DCTR
To Controller
To Controller
1
B2
B1
8
0.1 …F
2
Bypass capacitor
GND
VCCB
7
Bypass capacitor
0.1 …F
3
VCCA
OE
6
4
A2
A1
5
Keep OE low until VCCA and
VCCB are powered up
To System
To System
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Figure 9. TXB0102 Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, A Guide to Voltage Translation With TXB-Type Translators Application Report
• Texas Instruments, Effects of pullup and pulldown resistors on TXS and TXB devices Application Report
• Texas Instruments, Introduction to Logic Application Report
• Texas Instruments, A Guide to Voltage Translation With TXS-Type Translators Application Report
• Texas Instruments, A Guide to Voltage Translation With TXB-Type Translators Application Report
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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6-Feb-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TXB0102DCUR
ACTIVE
VSSOP
DCU
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
(FD, NFDQ, NFDR)
NZ
TXB0102DCURG4
ACTIVE
VSSOP
DCU
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 85
NFDR
TXB0102DCUT
ACTIVE
VSSOP
DCU
8
250
Green (RoHS
& no Sb/Br)
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
(FD, NFDQ, NFDR)
NZ
TXB0102DCUTG4
ACTIVE
VSSOP
DCU
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 85
NFDR
TXB0102YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(2E, 2E2, 2E7, 2EN
)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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