TXB0102YZPR

Product Folder Order Now Technical Documents Support & Community Tools & Software Reference Design TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and ±15-kV ESD Protection 1 Features 3 Description • The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA must not exceed VCCB. 1 • • • • • • • Available in the Texas Instruments NanoFree™ Packages 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On B Port (VCCA ≤ VCCB) VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 4-µA Max ICC Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – A Port – 2500-V Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) – B Port – 15-kV Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) 2 Applications • • • • When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device. OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package. Device Information(1) PART NUMBER Handsets Smartphones Tablets Desktop PCs PACKAGE BODY SIZE (NOM) TXB0102DCU VSSOP (8) 2.30 mm × 2.00 mm TXB0102YZP DSBGA (8) 0.90 mm × 1.80 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Typical Operating Circuit VCCB Processor Peripheral 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 6.14 6.15 6.16 6.17 1 1 1 2 3 4 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 5 Electrical Characteristics: TA = 25°C ....................... 6 Electrical Characteristics: TA = –40°C to +85°C (1) (2) ................................................................................... 7 Operating Characteristics.......................................... 8 VCCA = 1.2 V Timing Requirements ........................ 10 VCCA = 1.5 V ± 0.1 V Timing Requirements ........... 10 VCCA = 1.8 V ± 0.15 V Timing Requirements ....... 10 VCCA = 2.5 V ± 0.2 V Timing Requirements ......... 10 VCCA = 3.3 V ± 0.3 V Timing Requirements ......... 11 VCCA = 1.2 V Switching Characteristics ................ 11 VCCA = 1.5 V ± 0.1 V Switching Characteristics ... 13 VCCA = 1.8 V ± 0.15 V Switching Characteristics . 15 VCCA = 2.5 V ± 0.2 V Switching Characteristics ... 17 VCCA = 3.3 V ± 0.3 V Switching Characteristics ... 18 6.18 Typical Characteristics .......................................... 19 7 8 Parameter Measurement Information ................ 20 Detailed Description ............................................ 21 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 21 21 22 23 Application and Implementation ........................ 24 9.1 Application Information............................................ 24 9.2 Typical Application ................................................. 24 10 Power Supply Recommendations ..................... 26 11 Layout................................................................... 26 11.1 Layout Guidelines ................................................. 26 11.2 Layout Example .................................................... 26 12 Device and Documentation Support ................. 27 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 27 27 27 27 27 27 13 Mechanical, Packaging, and Orderable Information ........................................................... 27 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (December 2014) to Revision D Page • Changed format of Pin Functions tables. ............................................................................................................................... 3 • Added Junction temperature, TJ in Absolute Maximum Ratings ............................................................................................ 4 Changes from Revision B (March 2012) to Revision C • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................................................................... 1 Changes from Revision A (January 2011) to Revision B • 2 Page Added notes to pin out graphics............................................................................................................................................. 3 Changes from Original (May 2007) to Revision A • Page Page Added ball labels to the YZP Package. .................................................................................................................................. 3 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 5 Pin Configuration and Functions DCT Or DCU Package 8-Pin VSSOP Top View YZP Package 8-Pin DSBGA Bottom View 8 B1 B2 1 GND 2 7 VCCB VCCA 3 6 OE A2 4 5 A1 A2 VCCA D1 D2 A1 C1 C2 GND B1 B2 OE VCCB B2 A1 A2 B1 A. Pullup resistors are not recommended on TXB0102 I/O pins. B. If pullup resistors are needed for open drain communication, please refer to the TXS0102 or contact TI. C. If pullup or pulldown resistors are needed, the resistor value must be over 50 kΩ. See Effects of External Pullup and Pulldown Resistors on TXS and TXB Devices . D. 50 kΩ is a safe recommended value, if the customer can accept higher Vol or lower VCCOUT, smaller pullup or pulldown resistor is allowed, the draft estimation is VOL = VCCOUT × 4.5k/(4.5k + Rpu) and VOH = VCCOUT × Rdw/(4.5k + Rdw). E. For detailed information, See A Guide to Voltage Translation With TXB-Type Translators. Pin Functions: YZP PIN (1) TYPE (1) DESCRIPTION NO. NAME A1 B2 I/O Input/output B2. Referenced to VCCB. A2 B1 I/O Input/output B1. Referenced to VCCB. B1 GND S Ground B2 VCCB S B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V C1 VCCA S A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V, VCCA ≤ VCCB C2 OE I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA D1 A2 I/O Input/output A2. Referenced to VCCA D2 A1 I/O Input/output A1. Referenced to VCCA I = input, O = output, I/O = input and output, S = power supply Pin Functions: DCT or DCU PIN (1) TYPE (1) NAME NO. B2 1 I/O DESCRIPTION Input/output B2. Referenced to VCCB GND 2 S Ground VCCA 3 S A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V, VCCA ≤ VCCB A2 4 I/O Input/output A2. Referenced to VCCA Input/output A1. Referenced to VCCA A1 5 I/O OE 6 I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA VCCB 7 S B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V B1 8 I/O Input/output B1. Referenced to VCCB I = input, O = output, I/O = input and output, S = power supply Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 3 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VCCA VCCB MIN MAX –0.5 4.6 –0.5 6.5 A port –0.5 4.6 B port –0.5 6.5 A port –0.5 4.6 B port –0.5 6.5 A port –0.5 VCCA + 0.5 B port –0.5 VCCB + 0.5 Supply voltage UNIT V VI Input voltage (2) VO Voltage range applied to any output in the high-impedance or power-off state (2) VO Voltage range applied to any output in the high or low state (2) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA (3) V V V Continuous current through VCCA, VCCB, or GND ±100 mA TJ Junction temperature 150 °C Tstg Storage temperature 150 °C (1) (2) (3) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. 6.2 ESD Ratings Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 V(ESD) (1) (2) Electrostatic Charged device model (CDM), per JEDEC specification JESD22-C101 discharge Machine model (MM), per A115-A (1) (2) 4 PORTS VALUE A Port ±2500 B Port ±1500 A Port ±1500 B Port ±1500 A Port ±200 B Port ±200 UNIT V V V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.3 Recommended Operating Conditions See (1) (2) VCCA VCCA VCCB Supply voltage MIN MAX 1.2 3.6 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI × 0.65 (3) VCCI OE input 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA × 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI × 0.35 (3) OE input 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA × 0.35 0 3.6 1.2 V to 3.6 V 1.65 V to 5.5 V 0 5.5 VIH High-level input voltage VIL Low-level input voltage VO Voltage range applied to any A port output in the high-impedance B port or power-off state Δt/Δv Input transition rise or fall rate TA Operating free-air temperature A port inputs (1) (2) (3) VCCB 1.2 V to 3.6 V B port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40 1.65 V to 1.95 V 40 4.5 V to 5.5 V UNIT V V V V ns/V 30 –40 85 °C The A and B sides of an unused data I/O pair must be held in the same state, that is, both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port. 6.4 Thermal Information TXB0102 THERMAL METRIC (1) DCT (VSSOP) DCU (VSSOP) YZP (VSSOP) 8 PINS 8 PINS 8 PINS UNIT RθJA Junction-to-ambient thermal resistance 168.7 199.1 105.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 111.7 72.4 1.6 °C/W RθJB Junction-to-board thermal resistance 78.1 77.8 10.8 °C/W ψJT Junction-to-top characterization parameter 45.0 6.2 3.1 °C/W ψJB Junction-to-board characterization parameter 77.5 77.4 10.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 5 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 6.5 Electrical Characteristics: TA = 25°C (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA VCCB 1.2 V IOH = –20 µA VOLA IOL = 20 µA VOHB IOH = –20 µA 1.65 V to 5.5 V VOLB IOL = 20 µA 1.65 V to 5.5 V Ioff IOZ OE VI = VCCI or GND A port B port A or B port ICCA 1.2 V 0.3 V ±1 VI or VO = 0 to 3.6 V 0V 0 V to 5.5 V ±1 VI or VO = 0 to 5.5 V 0 V to 3.6 V 0V ±1 OE = GND 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 1.2 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 1.65 V to 5.5 V 3.6 V 0V 0V 5.5 V 1.65 V to 5.5 V 1.65 V to 5.5 V 3.6 V 0V 0V 5.5 V ICCA + ICCB VI = VCCI or GND, IO = 0 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZA 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZB 1.4 V to 3.6 V 1.65 V to 5.5 V 1.2 V to 3.6 V 1.65 V to 5.5 V 6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0 (1) (2) V 1.2 V to 3.6 V 1.2 V OE A port B port 1.2 V to 3.6 V 1.65 V to 5.5 V UNIT V 1.4 V to 3.6 V ICCB Cio MAX 1.4 V to 3.6 V 1.4 V to 3.6 V Ci TYP 1.1 VOHA II MIN µA µA µA 0.06 µA 3.4 µA 3.5 µA 0.05 µA 3.3 µA 2.5 5 11 pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.6 Electrical Characteristics: TA = –40°C to +85°C (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA VCCB MIN MAX 1.2 V UNIT VOHA IOH = –20 µA VOLA IOL = 20 µA VOHB IOH = –20 µA 1.65 V to 5.5 V VOLB IOL = 20 µA 1.65 V to 5.5 V 0.4 V 1.2 V to 3.6 V 1.65 V to 5.5 V ±2 µA II Ioff IOZ 1.4 V to 3.6 V V VCCA – 0.4 1.2 V 1.4 V to 3.6 V 0.4 VCCB – 0.4 V OE VI = VCCI or GND A port VI or VO = 0 to 3.6 V 0V 0 V to 5.5 V ±2 B port VI or VO = 0 to 5.5 V 0 V to 3.6 V 0V ±2 A or B port OE = GND 1.2 V to 3.6 V 1.65 V to 5.5 V ±2 1.2 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 1.65 V to 5.5 V 3 3.6 V 0V 2 0V 5.5 V –2 ICCA 1.2 V 1.65 V to 5.5 V 1.65 V to 5.5 V 5 3.6 V 0V –2 2 ICCB VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 0V 5.5 V ICCA + ICCB VI = VCCI or GND, IO = 0 1.2 V 1.65 V to 5.5 V 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZA 1.4 V to 3.6 V 1.65 V to 5.5 V VI = VCCI or GND, IO = 0, OE = GND 1.2 V 1.65 V to 5.5 V ICCZB 1.4 V to 3.6 V 1.65 V to 5.5 V 5 1.2 V to 3.6 V 1.65 V to 5.5 V 3 Ci Cio (1) (2) OE A port 1.2 V to 3.6 V B port 1.65 V to 5.5 V V 8 3 6 14 µA µA µA µA µA µA µA pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 7 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 6.7 Operating Characteristics TA = 25°C PARAMETER TEST CONDITIONS TYP VCCA = 1.2 V, VCCB = 5 V A port input, B port output CpdA B port input, A port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) A port input, B port output 8 VCCA = 1.8 V, VCCB = 1.8 V 7 VCCA = 2.5 V, VCCB = 2.5 V 7 VCCA = 2.5 V, VCCB = 5 V 8 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 8 VCCA = 1.2 V, VCCB = 5 V 12 VCCA = 1.2 V, VCCB = 1.8 V 11 VCCA = 1.5 V, VCCB = 1.8 V 11 VCCA = 1.8 V, VCCB = 1.8 V 11 VCCA = 2.5 V, VCCB = 2.5 V 11 VCCA = 2.5 V, VCCB = 5 V 11 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 11 38.1 VCCA = 1.2 V, VCCB = 1.8 V 29 VCCA = 1.5 V, VCCB = 1.8 V 29 VCCA = 1.8 V, VCCB = 1.8 V 29 VCCA = 2.5 V, VCCB = 2.5 V 29 VCCA = 2.5 V, VCCB = 5 V 30 VCCA = 1.2 V, VCCB = 5 V B port input, A port output 8 8 VCCA = 1.5 V, VCCB = 1.8 V VCCA = 3.3 V, VCCB = 3.3 V to 5 V CpdB 7.8 VCCA = 1.2 V, VCCB = 1.8 V VCCA = 1.2 V, VCCB = 5 V pF 30 25.4 VCCA = 1.2 V, VCCB = 1.8 V 19 VCCA = 1.5 V, VCCB = 1.8 V 18 VCCA = 1.8 V, VCCB = 1.8 V 18 VCCA = 2.5 V, VCCB = 2.5 V 18 VCCA = 2.5 V, VCCB = 5 V 21 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 21 Submit Documentation Feedback UNIT Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 Operating Characteristics (continued) TA = 25°C PARAMETER TEST CONDITIONS A port input, B port output CpdA B port input, A port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) A port input, B port output CpdB B port input, A port output TYP VCCA = 1.2 V, VCCB = 5 V 0.01 VCCA = 1.2 V, VCCB = 1.8 V 0.01 VCCA = 1.5 V, VCCB = 1.8 V 0.01 VCCA = 1.8 V, VCCB = 1.8 V 0.01 VCCA = 2.5 V, VCCB = 2.5 V 0.01 VCCA = 2.5 V, VCCB = 5 V 0.01 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 0.01 VCCA = 1.2 V, VCCB = 5 V 0.01 VCCA = 1.2 V, VCCB = 1.8 V 0.01 VCCA = 1.5 V, VCCB = 1.8 V 0.01 VCCA = 1.8 V, VCCB = 1.8 V 0.01 VCCA = 2.5 V, VCCB = 2.5 V 0.01 VCCA = 2.5 V, VCCB = 5 V 0.01 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 0.01 VCCA = 1.2 V, VCCB = 5 V 0.01 VCCA = 1.2 V, VCCB = 1.8 V 0.01 VCCA = 1.5 V, VCCB = 1.8 V 0.01 VCCA = 1.8 V, VCCB = 1.8 V 0.01 VCCA = 2.5 V, VCCB = 2.5 V 0.01 VCCA = 2.5 V, VCCB = 5 V 0.01 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 0.02 VCCA = 1.2 V, VCCB = 5 V 0.01 VCCA = 1.2 V, VCCB = 1.8 V 0.01 VCCA = 1.5 V, VCCB = 1.8 V 0.01 VCCA = 1.8 V, VCCB = 1.8 V 0.01 VCCA = 2.5 V, VCCB = 2.5 V 0.01 VCCA = 2.5 V, VCCB = 5 V 0.02 VCCA = 3.3 V, VCCB = 3.3 V to 5 V 0.03 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 UNIT pF 9 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 6.8 VCCA = 1.2 V Timing Requirements TA = 25°C, VCCA = 1.2 V TEST CONDITIONS Data rate tw Pulse duration Data inputs NOM VCCB = 1.8 V 20 VCCB = 2.5 V 20 VCCB = 3.3 V 20 VCCB = 5 V 20 VCCB = 1.8 V 50 VCCB = 2.5 V 50 VCCB = 3.3 V 50 VCCB = 5 V 50 UNIT Mbps ns 6.9 VCCA = 1.5 V ± 0.1 V Timing Requirements over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) TEST CONDITIONS Data rate tw Pulse duration Data inputs MIN MAX VCCB = 1.8 V ± 0.15 V 40 VCCB = 2.5 V ± 0.2 V 40 VCCB = 3.3 V ± 0.3 V 40 VCCB = 5 V ± 0.5 V 40 VCCB = 1.8 V ± 0.15 V 25 VCCB = 2.5 V ± 0.2 V 25 VCCB = 3.3 V ± 0.3 V 25 VCCB = 5 V ± 0.5 V 25 UNIT Mbps ns 6.10 VCCA = 1.8 V ± 0.15 V Timing Requirements over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) TEST CONDITIONS Data rate tw Pulse duration Data inputs MIN MAX VCCB = 1.8 V ± 0.15 V 60 VCCB = 2.5 V ± 0.2 V 60 VCCB = 3.3 V ± 0.3 V 60 VCCB = 5 V ± 0.5 V 60 VCCB = 1.8 V ± 0.15 V 17 VCCB = 2.5 V ± 0.2 V 17 VCCB = 3.3 V ± 0.3 V 17 VCCB = 5 V ± 0.5 V 17 UNIT Mbps ns 6.11 VCCA = 2.5 V ± 0.2 V Timing Requirements over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) TEST CONDITIONS Data rate tw 10 Pulse duration Data inputs MIN MAX VCCB = 2.5 V ± 0.2 V 100 VCCB = 3.3 V ± 0.3 V 100 VCCB = 5 V ± 0.5 V 100 VCCB = 2.5 V ± 0.2 V 10 VCCB = 3.3 V ± 0.3 V 10 VCCB = 5 V ± 0.5 V 10 Submit Documentation Feedback UNIT Mbps ns Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.12 VCCA = 3.3 V ± 0.3 V Timing Requirements over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS Data rate tw Pulse duration Data inputs MIN MAX UNIT VCCB = 3.3 V ± 0.3 V 100 VCCB = 5 V ± 0.5 V 100 VCCB = 3.3 V ± 0.3 V 10 VCCB = 5 V ± 0.5 V 10 Mbps ns 6.13 VCCA = 1.2 V Switching Characteristics TA = 25°C, VCCA = 1.2 V PARAMETER FROM (INPUT) A TO (OUTPUT) B tpd B A TEST CONDITIONS VCCB = 1.8 V 6.9 VCCB = 2.5 V 5.7 VCCB = 3.3 V 5.3 VCCB = 5 V 5.5 VCCB = 1.8 V 7.4 VCCB = 2.5 V 6.4 VCCB = 3.3 V 6 VCCB = 5 V A ten OE B A tdis OE B trA tfA trB A port rise time A port fall times B port rise times TYP UNIT ns 5.8 VCCB = 1.8 V 1 VCCB = 2.5 V 1 VCCB = 3.3 V 1 VCCB = 5 V 1 VCCB = 1.8 V 1 VCCB = 2.5 V 1 VCCB = 3.3 V 1 VCCB = 5 V 1 VCCB = 1.8 V 18 VCCB = 2.5 V 15 VCCB = 3.3 V 14 VCCB = 5 V 14 VCCB = 1.8 V 20 VCCB = 2.5 V 17 VCCB = 3.3 V 16 VCCB = 5 V 16 VCCB = 1.8 V 4.2 VCCB = 2.5 V 4.2 VCCB = 3.3 V 4.2 VCCB = 5 V 4.2 VCCB = 1.8 V 4.2 VCCB = 2.5 V 4.2 VCCB = 3.3 V 4.2 VCCB = 5 V 4.2 VCCB = 1.8 V 2.1 VCCB = 2.5 V 1.5 VCCB = 3.3 V 1.2 VCCB = 5 V 1.1 μs ns ns ns ns Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 11 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com VCCA = 1.2 V Switching Characteristics (continued) TA = 25°C, VCCA = 1.2 V PARAMETER tfB FROM (INPUT) B port fall times tsk(o) Channel-to-channel Max data rate 12 TO (OUTPUT) TEST CONDITIONS TYP VCCB = 1.8 V 2.1 VCCB = 2.5 V 1.5 VCCB = 3.3 V 1.2 VCCB = 5 V 1.1 VCCB = 1.8 V 0.5 VCCB = 2.5 V 0.5 VCCB = 3.3 V 0.5 VCCB = 5 V 1.4 VCCB = 1.8 V 20 VCCB = 2.5 V 20 VCCB = 3.3 V 20 VCCB = 5 V 20 Submit Documentation Feedback UNIT ns ns Mbps Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) A B tpd B A A ten OE B A tdis OE B trA tfA trB tfB tsk(o) A port rise times A port fall times B port rise times B port fall times Channel-to-channel TEST CONDITIONS MIN MAX VCCB = 1.8 V ± 0.15 V 1.4 12.9 VCCB = 2.5 V ± 0.2 V 1.2 10.1 VCCB = 3.3 V ± 0.3 V 1.1 10 VCCB = 5 V ± 0.5 V 0.8 9.9 VCCB = 1.8 V ± 0.15 V 0.9 14.2 VCCB = 2.5 V ± 0.2 V 0.7 12 VCCB = 3.3 V ± 0.3 V 0.4 11.7 VCCB = 5 V ± 0.5 V 0.3 13.7 VCCB = 1.8 V ± 0.15 V 1 VCCB = 2.5 V ± 0.2 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V 1 VCCB = 1.8 V ± 0.15 V 1 VCCB = 2.5 V ± 0.2 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V 1 VCCB = 1.8 V ± 0.15 V 5.9 31 VCCB = 2.5 V ± 0.2 V 5.7 25.9 VCCB = 3.3 V ± 0.3 V 5.6 23 VCCB = 5 V ± 0.5 V 5.7 22.4 VCCB = 1.8 V ± 0.15 V 5.4 30.3 VCCB = 2.5 V ± 0.2 V 4.9 22.8 VCCB = 3.3 V ± 0.3 V 4.8 20 VCCB = 5 V ± 0.5 V 4.9 19.5 VCCB = 1.8 V ± 0.15 V 1.4 5.1 VCCB = 2.5 V ± 0.2 V 1.4 5.1 VCCB = 3.3 V ± 0.3 V 1.4 5.1 VCCB = 5 V ± 0.5 V 1.4 5.1 VCCB = 1.8 V ± 0.15 V 1.4 5.1 VCCB = 2.5 V ± 0.2 V 1.4 5.1 VCCB = 3.3 V ± 0.3 V 1.4 5.1 VCCB = 5 V ± 0.5 V 1.4 5.1 VCCB = 1.8 V ± 0.15 V 0.9 4.5 VCCB = 2.5 V ± 0.2 V 0.6 3.2 VCCB = 3.3 V ± 0.3 V 0.5 2.8 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 1.8 V ± 0.15 V 0.9 4.5 VCCB = 2.5 V ± 0.2 V 0.6 3.2 VCCB = 3.3 V ± 0.3 V 0.5 2.8 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 1.8 V ± 0.15 V 0.5 VCCB = 2.5 V ± 0.2 V 0.5 VCCB = 3.3 V ± 0.3 V 0.5 VCCB = 5 V ± 0.5 V 0.5 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 UNIT ns μs ns ns ns ns ns ns 13 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com VCCA = 1.5 V ± 0.1 V Switching Characteristics (continued) over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER FROM (INPUT) Max data rate 14 TO (OUTPUT) TEST CONDITIONS MIN VCCB = 1.8 V ± 0.15 V 40 VCCB = 2.5 V ± 0.2 V 40 VCCB = 3.3 V ± 0.3 V 40 VCCB = 5 V ± 0.5 V 40 Submit Documentation Feedback MAX UNIT Mbps Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) A B tpd B A TEST CONDITIONS ten OE B A tdis OE B trA tfA trB tfB tsk(o) A port rise times A port fall times B port rise times B port fall times Channel-to-channel MAX VCCB = 1.8 V ± 0.15 V 1.6 11 VCCB = 2.5 V ± 0.2 V 1.4 7.7 VCCB = 3.3 V ± 0.3 V 1.3 6.8 VCCB = 5 V ± 0.5 V 1.2 6.5 VCCB = 1.8 V ± 0.15 V 1.5 12 VCCB = 2.5 V ± 0.2 V 1.3 8.4 1 7.6 0.9 7.1 VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V A MIN VCCB = 1.8 V ± 0.15 V 1 VCCB = 2.5 V ± 0.2 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V 1 VCCB = 1.8 V ± 0.15 V 1 VCCB = 2.5 V ± 0.2 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V 1 VCCB = 1.8 V ± 0.15 V 5.9 31 VCCB = 2.5 V ± 0.2 V 5.1 21.3 VCCB = 3.3 V ± 0.3 V 5 19.3 VCCB = 5 V ± 0.5 V 5 17.4 VCCB = 1.8 V ± 0.15 V 5.4 30.3 VCCB = 2.5 V ± 0.2 V 4.4 20.8 VCCB = 3.3 V ± 0.3 V 4.2 17.9 VCCB = 5 V ± 0.5 V 4.3 16.3 VCCB = 1.8 V ± 0.15 V 1 4.2 VCCB = 2.5 V ± 0.2 V 1.1 4.1 VCCB = 3.3 V ± 0.3 V 1.1 4.1 VCCB = 5 V ± 0.5 V 1.1 4.1 VCCB = 1.8 V ± 0.15 V 1 4.2 VCCB = 2.5 V ± 0.2 V 1.1 4.1 VCCB = 3.3 V ± 0.3 V 1.1 4.1 VCCB = 5 V ± 0.5 V 1.1 4.1 VCCB = 1.8 V ± 0.15 V 0.9 4.5 VCCB = 2.5 V ± 0.2 V 0.6 3.2 VCCB = 3.3 V ± 0.3 V 0.5 2.8 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 1.8 V ± 0.15 V 0.9 4.5 VCCB = 2.5 V ± 0.2 V 0.6 3.2 VCCB = 3.3 V ± 0.3 V 0.5 2.8 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 1.8 V ± 0.15 V 0.5 VCCB = 2.5 V ± 0.2 V 0.5 VCCB = 3.3 V ± 0.3 V 0.5 VCCB = 5 V ± 0.5 V 0.5 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 UNIT ns μs ns ns ns ns ns ns 15 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com VCCA = 1.8 V ± 0.15 V Switching Characteristics (continued) over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER FROM (INPUT) Max data rate 16 TO (OUTPUT) TEST CONDITIONS MIN VCCB = 1.8 V ± 0.15 V 60 VCCB = 2.5 V ± 0.2 V 60 VCCB = 3.3 V ± 0.3 V 60 VCCB = 5 V ± 0.5 V 60 Submit Documentation Feedback MAX UNIT Mbps Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) A B tpd B A A ten OE B TEST CONDITIONS MIN MAX VCCB = 2.5 V ± 0.2 V 1.1 6.3 VCCB = 3.3 V ± 0.3 V 1 5.2 VCCB = 5 V ± 0.5 V 0.9 4.7 VCCB = 2.5 V ± 0.2 V 1.2 6.6 VCCB = 3.3 V ± 0.3 V 1.1 5.1 VCCB = 5 V ± 0.5 V 0.9 4.4 VCCB = 2.5 V ± 0.2 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V 1 VCCB = 2.5 V ± 0.2 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V A tdis OE B trA tfA trB tfB tsk(o) A port rise times A port fall times B port rise times B port fall times Channel-to-channel Max data rate 5.1 21.3 VCCB = 3.3 V ± 0.3 V 4.6 15.2 VCCB = 5 V ± 0.5 V 4.6 13.2 VCCB = 2.5 V ± 0.2 V 4.4 20.8 VCCB = 3.3 V ± 0.3 V 3.8 16 VCCB = 5 V ± 0.5 V 3.9 13.9 VCCB = 2.5 V ± 0.2 V 0.8 3 VCCB = 3.3 V ± 0.3 V 0.8 3 VCCB = 5 V ± 0.5 V 0.8 3 VCCB = 2.5 V ± 0.2 V 0.8 3 VCCB = 3.3 V ± 0.3 V 0.8 3 VCCB = 5 V ± 0.5 V 0.8 3 VCCB = 2.5 V ± 0.2 V 0.7 3 VCCB = 3.3 V ± 0.3 V 0.5 2.8 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 2.5 V ± 0.2 V 0.7 3 VCCB = 3.3 V ± 0.3 V 0.5 2.8 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 2.5 V ± 0.2 V 0.5 VCCB = 3.3 V ± 0.3 V 0.5 VCCB = 5 V ± 0.5 V 0.5 VCCB = 2.5 V ± 0.2 V 100 VCCB = 3.3 V ± 0.3 V 100 VCCB = 5 V ± 0.5 V 100 Submit Documentation Feedback Product Folder Links: TXB0102 ns μs 1 VCCB = 2.5 V ± 0.2 V Copyright © 2007–2017, Texas Instruments Incorporated UNIT ns ns ns ns ns ns Mbps 17 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 6.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) A B tpd B A A ten OE B A tdis OE B trA A port rise times tfA A port fall times trB B port rise times tfB B port fall times tsk(o) Channel-to-channel Max data rate 18 TEST CONDITIONS MIN MAX VCCB = 3.3 V ± 0.3 V 0.9 4.7 VCCB = 5 V ± 0.5 V 0.8 4 1 4.9 0.9 4.5 VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V 1 VCCB = 3.3 V ± 0.3 V 1 VCCB = 5 V ± 0.5 V ns μs 1 VCCB = 3.3 V ± 0.3 V 4.6 15.2 VCCB = 5 V ± 0.5 V 4.3 12.1 VCCB = 3.3 V ± 0.3 V 3.8 16 VCCB = 5 V ± 0.5 V 3.4 13.2 VCCB = 3.3 V ± 0.3 V 0.7 2.5 VCCB = 5 V ± 0.5 V 0.7 2.5 0.7 2.5 VCCB = 3.3 V ± 0.3 V 0.5 2.3 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 3.3 V ± 0.3 V 0.5 2.3 VCCB = 5 V ± 0.5 V 0.4 2.7 VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V VCCB = 3.3 V ± 0.3 V 0.5 VCCB = 5 V ± 0.5 V 0.5 VCCB = 3.3 V ± 0.3 V 100 VCCB = 5 V ± 0.5 V 100 Submit Documentation Feedback UNIT ns ns ns ns ns ns Mbps Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 6.18 Typical Characteristics 6 25°C (Room Temp) -40°C 85°C 5 A Port I/O Capacitance (pF) OE Pin Input Capacitance (pF) 6 4 3 2 1 5 4 3 2 25°C (Room Temp) -40°C 85°C 1 0 0 0 0.5 1 1.5 2 2.5 3 3.5 0 4 VCCA (V) 0.5 1 1.5 D001 VCCB = 3.3 V 2 2.5 VCCA (V) 3 3.5 4 D002 VCCB = 3.3 V Figure 1. Input Capacitance for OE pin (CI) vs Power Supply (VCCA) Figure 2. Capacitance for A Port I/O Pins (CiO) vs Power Supply (VCCA) B Port I/O Capacitance (pF) 12 10 8 6 4 25°C (Room Temp) -40°C 85°C 2 0 0 0.5 1 1.5 2 2.5 3 VCCB (V) 3.5 4 4.5 5 5.5 D003 VCCA = 1.8 V Figure 3. Capacitance for B Port I/O Pins (CiO) vs Power Supply (VCCB) Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 19 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 7 Parameter Measurement Information 2 × VCCO From Output Under Test 15 pF 15 pF 1M Open 50 k LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 50 k From Output Under Test TEST S1 tPZL/tPLZ tPHZ/tPZH 2 × VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 VCCO 0.1 VCCO tr VOH VCCI VCCO/2 tf VOL Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G. VCCI/2 CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W, dv/dt ≥ 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. V CCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuits And Voltage Waveforms 20 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 8 Detailed Description 8.1 Overview The TXB0102 device is a 4-bit directionless voltage-level translator specifically designed for translating logic voltage levels. The A port is able to accept I/O voltages ranging from 1.2 V to 3.6 V, while the B port can accept I/O voltages from 1.65 V to 5.5 V. The device is a buffered architecture with edge rate accelerators (one shots) to improve the overall data rate. This device can only translate push-pull CMOS logic outputs. For open drain signal translation, see TI TXS010X products. 8.2 Functional Block Diagram VccA VccB OE One Shot A1 B1 4 kO One Shot 4 kO One Shot B2 A2 4 kO One Shot 4 kO Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 21 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 8.3 Feature Description 8.3.1 Architecture The TXB0102 architecture (see Figure 5) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a DC state, the output drivers of the TXB0102 can maintain a high or low, but are designed to be weak, so that the drivers can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5 V. VCCA VCCB One Shot T1 4k One Shot T2 A B One Shot T3 4k T4 One Shot Figure 5. Architecture of TXB0102 I/O Cell 8.3.2 Input Driver Requirements Figure 6 shows the typical IIN versus VIN characteristics of the TXB0102. For proper operation, the device driving the data I/Os of the TXB0102 must have drive strength of at least ±2 mA. 22 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 Feature Description (continued) IIN VT/4 kΩ VIN –(VD – VT)/4 kΩ A. VT is the input threshold voltage of the TXB0102 (typically VCCI/2. B. VD is the supply voltage of the external driver. Figure 6. Typical IIN vs VIN Curve 8.3.3 Output Load Considerations TI recommends careful printed-circuit board (PCB) layout practices with short PCB trace lengths to avoid excessive capacitive loading and to assure that proper O.S. triggering takes place. PCB signal trace-lengths must be kept short enough such that the round trip delay of any reflection is less than the one-shot duration. This improves signal integrity by assuring that any reflection sees a low impedance at the driver. The O.S. circuits have been designed to stay on for approximately 10 ns. The maximum capacitance of the lumped load that is driven also depends directly on the one-shot duration. With heavy capacitive loads, the one-shot can time-out before the signal is driven fully to the positive rail. The O.S. duration has been set to best optimize trade-offs between dynamic ICC, load driving capability, and maximum bit-rate considerations. Both PCB trace length and connectors add to the capacitance that the TXB0102 output sees, so TI recommends that this lumped-load capacitance be considered to avoid O.S. retriggering, bus contention, output signal oscillations, or other adverse system-level affects. 8.3.4 Enable and Disable The TXB0102 has an output-enable (OE) input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. 8.3.5 Pullup or Pulldown Resistors on I/O Lines The TXB0102 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0102 have low DC drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 kΩ to assure that they do not contend with the output drivers of the TXB0102. For the same reason, the TXB0102 device must not be used in applications such as I2C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. 8.4 Device Functional Modes The TXB0102 device has two functional modes, enabled and disabled. To disable the device set the OE input low, which places all I/Os in a high impedance state. Setting the OE input high enables the device. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 23 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The TXB0102 is used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open drain signal translation, please refer to TI TXS010X products. Any external pulldown or pullup resistors are recommended larger than 50 kΩ. 9.2 Typical Application 1.8V 3.3V 0.1 µF VccA 0.1 µF VccB OE 1.8V System Controller 3.3V System TXB0102 A1 A2 Data B1 B2 Data GND Figure 7. Typical Operating Circuit 9.2.1 Design Requirements For this design example, use the parameters listed in Table 1 and make sure that VCCA ≤ VCCB. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage range 1.2 V to 3.6 V Output voltage range 1.65 V to 5.5 V 9.2.2 Detailed Design Procedure To begin the design process, determine the following: • Input voltage range – Use the supply voltage of the device that is driving the TXB0102 device to determine the input voltage range. For a valid logic high the value must exceed the VIH of the input port. For a valid logic low the value must be less than the VIL of the input port. • Output voltage range – Use the supply voltage of the device that the TXB0102 device is driving to determine the output voltage range. – TI does not recommend to have the external pullup or pulldown resistors. If mandatory, TI recommends that the value should be larger than 50 kΩ. 24 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com • SCES641D – MAY 2007 – REVISED OCTOBER 2017 An external pulldown or pullup resistor decreases the output VOH and VOL. Use Equation 1 and Equation 2 to draft estimate the VOH and VOL as a result of an external pulldown and pullup resistor. VOH = VCCx × RPD / (RPD + 4.5 kΩ) VOL = VCCx × 4.5 kΩ / (RPU + 4.5 kΩ) (1) where • • • • VCCx is the output port supply voltage on either VCCA or VCCB RPD is the value of the external pulldown resistor RPU is the value of the external pullup resistor 4.5 kΩ is the counting the variation of the serial resistor 4 kΩ in the I/O line. (2) 9.2.3 Application Curve 2 V/div 200 ns/div VCCA = 1.8 V VCCB = 3.3 V Figure 8. Level-Translation of a 2.5-MHz Signal Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 25 TXB0102 SCES641D – MAY 2007 – REVISED OCTOBER 2017 www.ti.com 10 Power Supply Recommendations During operation, assure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. The TXB0102 device has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). The (OE) input circuit is designed so that it is supplied by VCCA and when the (OE) input is low, all outputs are placed in the high-impedance state. To assure the high-impedance state of the outputs during power up or power down, the OE input pin must be tied to GND through a pulldown resistor and must not be enabled until VCCA and VCCB are fully ramped and stable. The minimum value of the pulldown resistor to ground is determined by the current-sourcing capability of the driver. 11 Layout 11.1 Layout Guidelines Follow common PCB layout guidelines to assure reliability of the device. Bypass capacitors must be used on power suppliesand placed as close as possible to the VCCA, VCCB pin, and GND pin. Short trace lengths must be used to avoid excessive loading. PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the oneshot duration, approximately 10 ns, assuring that any reflection encounters low impedance at the source driver. 11.2 Layout Example LEGEND Polygonal Copper Pour VIA to Power Plane VIA to GND Plane (Inner Layer) TXB0102DCTR To Controller To Controller 1 B2 B1 8 0.1 …F 2 Bypass capacitor GND VCCB 7 Bypass capacitor 0.1 …F 3 VCCA OE 6 4 A2 A1 5 Keep OE low until VCCA and VCCB are powered up To System To System Copyright © 2017, Texas Instruments Incorporated Figure 9. TXB0102 Layout Example 26 Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 TXB0102 www.ti.com SCES641D – MAY 2007 – REVISED OCTOBER 2017 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: • Texas Instruments, A Guide to Voltage Translation With TXB-Type Translators Application Report • Texas Instruments, Effects of pullup and pulldown resistors on TXS and TXB devices Application Report • Texas Instruments, Introduction to Logic Application Report • Texas Instruments, A Guide to Voltage Translation With TXS-Type Translators Application Report • Texas Instruments, A Guide to Voltage Translation With TXB-Type Translators Application Report 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks NanoFree, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2007–2017, Texas Instruments Incorporated Product Folder Links: TXB0102 27 PACKAGE OPTION ADDENDUM www.ti.com 1-Jul-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TXB0102DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (FD, NFDQ, NFDR) NZ TXB0102DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFDR TXB0102DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (FD, NFDQ, NFDR) NZ TXB0102DCUTG4 ACTIVE VSSOP DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 NFDR TXB0102YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 (2E, 2E2, 2E7, 2EN ) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of