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TXS0102-Q1
SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
TXS0102-Q1 2-Bit Bidirectional Voltage-Level Translator
for Open-Drain and Push-Pull Applications
1 Features
3 Description
•
•
The TXS0102-Q1 device connects an incompatible
logic communication from chip-to-chip due to voltage
mismatch. This auto-direction translator can be
conveniently used to bridge the gap without the need
of direction control from the host. Each channel can
be mixed and matched with different output types
(open-drain or push-pull) and mixed data flows
(transmit or receive) without intervention from the
host. This 4-bit noninverting translator uses two
separate configurable power-supply rails. The A and
B ports are designed to track VCCA and VCCB
respectively. The VCCB pin accepts any supply
voltage from 2.3 V to 5.5 V while the VCCA pin
accepts any supply voltage from 1.65 V to 3.6 V such
that VCCA is less than or equal to VCCB. This tracking
allows for low-voltage bidirectional translation
between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V
voltage nodes.
1
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C5
ESD Protection per JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 750-V Charged-Device Model (C101)
– B Port
– 8-kV Human-Body Model (A114-B)
– 750-V Charged-Device Model (C101)
No Direction-Control Signal Required
Maximum Data Rates
– 24 Mbps Maximum (Push Pull)
– 2 Mbps (Open Drain)
Available in the Texas Instruments NanoFree™
Package
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B
port (VCCA ≤ VCCB)
No Power-Supply Sequencing Required—VCCA or
VCCB can be Ramped First
2 Applications
•
•
•
•
Automotive Infotainment
Advance Driver-Assistance Systems (ADAS)
Isolates and Level-Translates Between Main
Processor and Peripheral Modules
I2C or 1-Wire Voltage-Level Translation
When the output-enable (OE) input is low, all outputs
are placed in the high-impedance state.
The TXS0102-Q1 device is designed so that the OE
input circuit is supplied by VCCA.
To assure the high-impedance state during power up
or power down, the OE pin must be tied to the GND
pin through a pulldown resistor; the minimum value of
the resistor is determined by the current-sourcing
capability of the driver.
Device Information(1)
PART NUMBER
TXS0102-Q1
PACKAGE
VSSOP (8)
BODY SIZE (NOM)
2.30 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of this data sheet.
Transfer Characteristics of an N-Channel
Transistor
3.2
VG = 4.3 V
VG = 3.5 V
VG = 2.8 V
VG = 2.5 V
VG = 2.2 V
Output Voltage (V)
2.8
2.4
2
1.6
1.2
0.8
0.4
0
0
1
2
3
Input Voltage (V)
4
5
D004
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TXS0102-Q1
SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
Absolute Maximum Ratings ...................................... 3
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics........................................... 5
Timing Requirements — VCCA = 1.8 V ± 0.15 V....... 5
Timing Requirements — VCCA = 2.5 V ± 0.2 V ........ 6
Timing Requirements — VCCA = 3.3 V ± 0.3 V......... 6
Switching Characteristics — VCCA = 1.8 V ± 0.15 V. 6
Switching Characteristics — VCCA = 2.5 V ± 0.2 V. 8
Switching Characteristics — VCCA = 3.3 V ± 0.3
V............................................................................... 10
6.12 Typical Characteristics .......................................... 11
7
Parameter Measurement Information ................ 12
7.1 Load Circuits ........................................................... 12
7.2 Voltage Waveforms................................................. 13
8
Detailed Description ............................................ 14
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
14
14
15
15
Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application .................................................. 16
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
11.2 Layout Example .................................................... 18
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
12.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2014) to Revision A
Page
•
Changed Handling Ratings table to ESD Ratings table ......................................................................................................... 4
•
Changed Functional Block Diagram with new figure............................................................................................................ 14
•
Changed TXS0102-Q1 Layout Example with new figure ..................................................................................................... 18
•
Added Documentation Support, Receiving Notification of Documentation Updates and Community Resources .............. 19
2
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SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
5 Pin Configuration and Functions
DCU Package
8-Pin VSSOP
Top View
B2
1
8
B1
GND
2
7
VCCB
VCCA
3
6
OE
A2
4
5
A1
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
A1
5
I/O
Input-output 1 for the A port. This pin is referenced to VCCA.
A2
4
I/O
Input-output 2 for the A port. This pin is referenced to VCCA.
B1
8
I/O
Input-output 1 for the B port. This pin is referenced to VCCB.
B2
1
I/O
Input-output 2 for the B port. This pin is referenced to VCCB.
GND
2
—
Ground
OE
6
I
VCCA
3
—
A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB.
VCCB
7
—
B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V.
Tri-state output-mode enable. Pull the OE pin low to place all outputs in tri-state mode. This pin is
referenced to VCCA.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Input-output pin voltage, VIO (2)
(1)
MIN
MAX
VCCA
–0.5
4.6
VCCB
–0.5
6.5
A1, A2
A port
–0.5
4.6
B1, B2
B port
–0.5
6.5
Voltage range applied to any output in the highimpedance or power-off state (2)
A port
–0.5
4.6
B port
–0.5
6.5
Voltage range applied to any output in the high
or low state (2) (3)
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
Output voltage, VO
UNIT
V
V
V
V
Input clamp current, IIK
VI < 0
–50
mA
Output clamp current, IOK
VO < 0
–50
mA
Continuous output current, IO
±50
mA
Continuous current through each VCCA, VCCB, or GND
±100
mA
150
°C
150
°C
Tstg
Storage temperature
TJ
Junction temperature
(1)
(2)
(3)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
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3
TXS0102-Q1
SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
www.ti.com
6.2 ESD Ratings
VALUE
Human body model (HBM), per AEC Q100-002 (1)
Electrostatic
discharge
V(ESD)
Charged device model (CDM), per AEC Q100-011
A Port
±2500
B Port
8000
A Port
±750
B Port
(1)
UNIT
V
V
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCCA
Supply voltage (1)
VCCA
1.65
3.6
VCCB
Supply voltage (1)
2.3
5.5
VIH(Ax)
High-level input voltage
A-port I/Os
VCCA – 0.2
VCCA
VCCA – 0.4
VCCA
VIH(Bx)
High-level input voltage
B-port I/Os
VCCB – 0.4
VCCB
VIH(OE)
High-level input voltage
OE input
VCCA × 0.65
5.5
VIL(Ax)
Low-level input voltage
A-port I/Os
0
0.15
VIL(Bx)
Low-level input voltage
B-port I/Os
VIL(OE)
Low-level input voltage
OE input
Δt/Δv(Ax)
Input transition rise or fall rate
A-port I/Os,
push-pull driving
Δt/Δv(Bx)
Input transition rise or fall rate
B-port I/Os,
push-pull driving
Δt/Δv(OE)
Input transition rise or fall rate
OE input
TA
Operating free-air temperature
(1)
1.65 to 1.95 V
2.3 to 3.6 V
VCCB
2.3 to 5.5 V
1.65 to 3.6 V
2.3 to 5.5 V
1.65 to 3.6 V
2.3 to 5.5 V
UNIT
V
0
0.15
0
VCCA × 0.35
V
V
10
1.65 to 3.6 V
2.3 to 5.5 V
10
ns/V
10
–40
125
°C
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
6.4 Thermal Information
over operating free-air temperature range (unless otherwise noted)
TXS0102-Q1
THERMAL METRIC (1)
DCU (VSSOP)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
199.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
72.4
°C/W
RθJB
Junction-to-board thermal resistance
77.8
°C/W
ψJT
Junction-to-top characterization parameter
6.2
°C/W
ψJB
Junction-to-board characterization parameter
77.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCA
(1)
VCCB
MIN
TYP
MAX
VOH(Ax)
High-level output voltage,
A port
IOH = –20 µA,
VI(Bx) ≥ VCCB – 0.4 V
TA = –40°C
to +125°C
VCCA ×
0.67
1.65 to 3.6 V
2.3 to 5.5 V
VOL(Ax)
Low-level output voltage,
A port
IOL = 1 mA,
VI(Bx) ≤ 0.15 V
TA = –40°C
to +125°C
1.65 to 3.6 V
2.3 to 5.5 V
VOH(Bx)
High-level output voltage,
B port
IOH = –20 µA,
VI(Ax) ≥ VCCA – 0.2 V
TA = –40°C
to +125°C
1.65 to 3.6 V
2.3 to 5.5 V
VOL(Bx)
Low-level output voltage,
B port
IOL = 1 mA,
VI(Ax) ≤ 0.15 V
TA = –40°C
to +125°C
1.65 to 3.6 V
2.3 to 5.5 V
II(OE)
Input current
VI = VCCI or GND
1.65 to 3.6 V
2.3 to 5.5 V
0V
0 to 5.5 V
I OFF
Power-off
leakage
current
0 to 3.6 V
0V
1.65 to 3.6 V
2.3 to 5.5 V
1.65 to VCCB
2.3 to 5.5 V
3.6 V
0
2.2
0
5.5 V
–1
1.65 to VCCB
2.3 to 5.5 V
21
3.6 V
0
–1
0
5.5 V
1
1.65 to VCCB
2.3 to 5.5 V
25
3.3 V
3.3 V
V
0.4
VCCB ×
0.67
A port
B port
TA = –40°C
to +125°C
0.4
TA = –40°C to +125°C
TA = –40°C to +125°C
Off-state
A or B
output current port
OE = VIL
TA = –40°C
to +125°C
ICCA
Supply current, A port
VI = VO = Open,
IO = 0
TA = –40°C
to +125°C
ICCB
Supply current, B port
ICCA+ICC
B
CI(OE)
CIO(Ax)
OE
A port
Input-output
capacitance
CIO(Bx)
(1)
VI = VO = Open,
IO = 0
B port
±1
±2
±1
±2
TA = –40°C
to +125°C
µA
µA
µA
±1
TA = –40°C
to +125°C
Supply current, A port plus VI = VO = Open,
B port supply current
IO = 0
Input
capacitance
±2
TA = 25°C
IOZ
V
±1
TA = 25°C
TA = 25°C
V
V
TA = 25°C
OE
UNIT
TA = 25°C
TA = –40°C to +125°C
±2
µA
4
2.5
µA
µA
pF
3.5
TA = 25°C
µA
5
TA = –40°C to +125°C
3.3 V
TA = 25°C
6.5
3.3 V
pF
12
TA = –40°C to +125°C
7.5
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
6.6 Timing Requirements — VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
MIN
Push-pull driving
Data rate
Open-drain driving
18
VCCB = 3.3 V ± 0.3 V
21
VCCB = 5 V ± 0.5 V
23
VCCB = 2.5 V ± 0.2 V
2
VCCB = 3.3 V ± 0.3 V
2
VCCB = 5 V ± 0.5 V
Push-pull driving
tw
Pulse duration
See Figure 7
Data inputs
Open-drain driving
MAX
VCCB = 2.5 V ± 0.2 V
55
VCCB = 3.3 V ± 0.3 V
47
VCCB = 5 V ± 0.5 V
43
VCCB = 2.5 V ± 0.2 V
500
VCCB = 3.3 V ± 0.3 V
500
VCCB = 5 V ± 0.5 V
500
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Mbps
2
VCCB = 2.5 V ± 0.2 V
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UNIT
ns
5
TXS0102-Q1
SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
www.ti.com
6.7 Timing Requirements — VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
MIN
Push-pull driving
Data rate
Open-drain driving
MAX
VCCB = 2.5 V ± 0.2 V
20
VCCB = 3.3 V ± 0.3 V
22
VCCB = 5 V ± 0.5 V
24
VCCB = 2.5 V ± 0.2 V
2
VCCB = 3.3 V ± 0.3 V
2
VCCB = 5 V ± 0.5 V
Push-pull driving
tw
Pulse duration
See Figure 7
Data inputs
Open-drain driving
UNIT
Mbps
2
VCCB = 2.5 V ± 0.2 V
50
VCCB = 3.3 V ± 0.3 V
45
VCCB = 5 V ± 0.5 V
41
VCCB = 2.5 V ± 0.2 V
500
VCCB = 3.3 V ± 0.3 V
500
VCCB = 5 V ± 0.5 V
500
ns
6.8 Timing Requirements — VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
MIN
Push-pull driving
Data rate
Open-drain driving
Pulse duration
See Figure 7
VCCB = 3.3 V ± 0.3 V
22
VCCB = 5 V ± 0.5 V
24
VCCB = 3.3 V ± 0.3 V
2
VCCB = 5 V ± 0.5 V
VCCB = 3.3 V ± 0.3 V
Push-pull driving
tw
MAX
Data inputs
Open-drain driving
UNIT
Mbps
2
45
VCCB = 5 V ± 0.5 V
41
VCCB = 3.3 V ± 0.3 V
500
VCCB = 5 V ± 0.5 V
500
ns
6.9 Switching Characteristics — VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Push-pull driving
tPHL(A-B)
Propagation delay time
(high to low)
See Figure 8
From A (input) to B (output)
Open-drain driving
Push-pull driving
tPHL(B-A)
Propagation delay time
(high to low)
See Figure 8
From B (input) to A (output)
Open-drain driving
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MAX
5.3
VCCB = 3.3 V ± 0.3 V
5.4
VCCB = 5 V ± 0.5 V
6.8
VCCB = 2.5 V ± 0.2 V
8.8
VCCB = 3.3 V ± 0.3 V
9.6
VCCB = 5 V ± 0.5 V
10
VCCB = 2.5 V ± 0.2 V
4.4
VCCB = 3.3 V ± 0.3 V
4.5
VCCB = 5 V ± 0.5 V
4.7
VCCB = 2.5 V ± 0.2 V
5.3
VCCB = 3.3 V ± 0.3 V
4.4
VCCB = 5 V ± 0.5 V
6
MIN
VCCB = 2.5 V ± 0.2 V
UNIT
ns
4
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Switching Characteristics — VCCA = 1.8 V ± 0.15 V (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Push-pull driving
tPLH(A-B)
Propagation delay time
(low to high)
See Figure 8
From A (input) to B (output)
Open-drain driving
Push-pull driving
tPLH(B-A)
Propagation delay time
(low to high)
See Figure 8
From B (input) to A (output)
Open-drain driving
MIN
6.8
VCCB = 3.3 V ± 0.3 V
7.1
VCCB = 5 V ± 0.5 V
7.5
VCCB = 2.5 V ± 0.2 V
50
VCCB = 3.3 V ± 0.3 V
40
VCCB = 5 V ± 0.5 V
33
VCCB = 2.5 V ± 0.2 V
5.3
VCCB = 3.3 V ± 0.3 V
4.5
VCCB = 5 V ± 0.5 V
0.5
VCCB = 2.5 V ± 0.2 V
36
VCCB = 3.3 V ± 0.3 V
26
VCCB = 5 V ± 0.5 V
ten(OE-A)
ten(OE-B)
tdis(OE-A)
tdis(OE-B)
Enable time
Disable time
From OE (input) to A
or B (output)
From OE (input) to A
or B (output)
200
VCCB = 3.3 V ± 0.3 V
250
VCCB = 5 V ± 0.5 V
275
VCCB = 2.5 V ± 0.2 V
200
VCCB = 3.3 V ± 0.3 V
200
VCCB = 5 V ± 0.5 V
200
Open-drain driving
Push-pull driving
tr(Bx)
VCCB = 2.5 V ± 0.2 V
9.5
VCCB = 3.3 V ± 0.3 V
9.3
VCCB = 5 V ± 0.5 V
Rise time, A port
Open-drain driving
38
165
VCCB = 3.3 V ± 0.3 V
30
132
VCCB = 5 V ± 0.5 V
22
Push-pull driving
10.8
VCCB = 3.3 V ± 0.3 V
9.1
Fall time, A port
Open-drain driving
Push-pull driving
tf(Bx)
Fall time, B port
Open-drain driving
tsk
Channel-to-channel skew
7.6
VCCB = 2.5 V ± 0.2 V
34
145
VCCB = 3.3 V ± 0.3 V
23
106
VCCB = 5 V ± 0.5 V
10
VCCB = 3.3 V ± 0.3 V
ns
ns
ns
58
6
VCCB = 5 V ± 0.5 V
13.3
VCCB = 2.5 V ± 0.2 V
6.9
VCCB = 3.3 V ± 0.3 V
6.4
VCCB = 5 V ± 0.5 V
6.1
VCCB = 2.5 V ± 0.2 V
13.8
VCCB = 3.3 V ± 0.3 V
16.2
VCCB = 5 V ± 0.5 V
16.2
VCCB = 2.5 V ± 0.2 V
13.8
VCCB = 3.3 V ± 0.3 V
16.2
VCCB = 5 V ± 0.5 V
16.2
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
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ns
5.9
VCCB = 2.5 V ± 0.2 V
Copyright © 2014–2017, Texas Instruments Incorporated
ns
95
VCCB = 2.5 V ± 0.2 V
VCCB = 2.5 V ± 0.2 V
tf(Ax)
7.6
VCCB = 2.5 V ± 0.2 V
VCCB = 5 V ± 0.5 V
Rise time, B port
UNIT
20
VCCB = 2.5 V ± 0.2 V
Push-pull driving
tr(Ax)
MAX
VCCB = 2.5 V ± 0.2 V
ns
ns
7
TXS0102-Q1
SCES854A – MAY 2014 – REVISED SEPTEMBER 2017
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Switching Characteristics — VCCA = 1.8 V ± 0.15 V (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Push-pull driving
Maximum data rate
Open-drain driving
MIN
VCCB = 2.5 V ± 0.2 V
18
VCCB = 3.3 V ± 0.3 V
21
VCCB = 5 V ± 0.5 V
23
VCCB = 2.5 V ± 0.2 V
2
VCCB = 3.3 V ± 0.3 V
2
VCCB = 5 V ± 0.5 V
2
MAX
UNIT
Mbps
6.10 Switching Characteristics — VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Push-pull driving
tPHL(A-B)
Propagation delay time
(high to low)
See Figure 8
From A (input) to B (output)
Open-drain driving
MIN
3.2
VCCB = 3.3 V ± 0.3 V
3.7
VCCB = 5 V ± 0.5 V
3.8
VCCB = 2.5 V ± 0.2 V
6.3
VCCB = 3.3 V ± 0.3 V
Push-pull driving
tPHL(B-A)
From B (input) to A (output)
Open-drain driving
5.8
VCCB = 2.5 V ± 0.2 V
3
VCCB = 3.3 V ± 0.3 V
3.6
VCCB = 5 V ± 0.5 V
4.3
VCCB = 2.5 V ± 0.2 V
4.7
VCCB = 3.3 V ± 0.3 V
4.2
VCCB = 5 V ± 0.5 V
Push-pull driving
tPLH(A-B)
Propagation delay time
(low to high)
See Figure 8
From A (input) to B (output)
Open-drain driving
Push-pull driving
tPLH(B-A)
Propagation delay time
(low to high)
See Figure 8
Open-drain driving
3.5
VCCB = 3.3 V ± 0.3 V
4.1
VCCB = 5 V ± 0.5 V
4.4
VCCB = 2.5 V ± 0.2 V
3.5
VCCB = 3.3 V ± 0.3 V
4.1
VCCB = 5 V ± 0.5 V
4.4
VCCB = 2.5 V ± 0.2 V
2.5
VCCB = 3.3 V ± 0.3 V
1.6
tdis(OE-A)
tdis(OE-B)
Enable time
Disable time
From OE (input) to A or B (output)
From OE (input) to A or B (output)
2.5
VCCB = 3.3 V ± 0.3 V
1.6
tr(Ax)
200
VCCB = 3.3 V ± 0.3 V
200
VCCB = 5 V ± 0.5 V
250
VCCB = 2.5 V ± 0.2 V
200
VCCB = 3.3 V ± 0.3 V
200
VCCB = 5 V ± 0.5 V
200
VCCB = 2.5 V ± 0.2 V
7.4
VCCB = 3.3 V ± 0.3 V
6.6
VCCB = 5 V ± 0.5 V
Rise time, A port
Open-drain driving
8
1
VCCB = 2.5 V ± 0.2 V
Push-pull driving
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ns
1
VCCB = 2.5 V ± 0.2 V
VCCB = 5 V ± 0.5 V
ten(OE-A)
ten(OE-B)
ns
4
VCCB = 2.5 V ± 0.2 V
VCCB = 5 V ± 0.5 V
From B (input) to A (output)
UNIT
6
VCCB = 5 V ± 0.5 V
Propagation delay time
(high to low)
See Figure 8
MAX
VCCB = 2.5 V ± 0.2 V
5.6
VCCB = 2.5 V ± 0.2 V
34
149
VCCB = 3.3 V ± 0.3 V
28
121
VCCB = 5 V ± 0.5 V
24
89
ns
ns
ns
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Switching Characteristics — VCCA = 2.5 V ± 0.2 V (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Push-pull driving
tr(Bx)
Rise time, B port
Push-pull driving
Fall time, A port
Open-drain driving
Push-pull driving
tf(Bx)
Fall time, B port
Open-drain driving
tsk
Channel-to-channel skew
MAX
8.3
VCCB = 3.3 V ± 0.3 V
7.2
VCCB = 5 V ± 0.5 V
Open-drain driving
tf(Ax)
MIN
VCCB = 2.5 V ± 0.2 V
6.1
VCCB = 2.5 V ± 0.2 V
35
151
VCCB = 3.3 V ± 0.3 V
24
112
VCCB = 5 V ± 0.5 V
12
5.7
VCCB = 3.3 V ± 0.3 V
5.5
VCCB = 5 V ± 0.5 V
5.3
VCCB = 2.5 V ± 0.2 V
6.9
VCCB = 3.3 V ± 0.3 V
6.2
VCCB = 5 V ± 0.5 V
5.8
VCCB = 2.5 V ± 0.2 V
7.8
VCCB = 3.3 V ± 0.3 V
6.7
VCCB = 5 V ± 0.5 V
6.6
VCCB = 2.5 V ± 0.2 V
8.8
VCCB = 3.3 V ± 0.3 V
9.4
VCCB = 5 V ± 0.5 V
10.4
1
VCCB = 3.3 V ± 0.3 V
1
VCCB = 5 V ± 0.5 V
1
Maximum data rate
Open-drain driving
VCCB = 2.5 V ± 0.2 V
20
VCCB = 3.3 V ± 0.3 V
22
VCCB = 5 V ± 0.5 V
24
VCCB = 2.5 V ± 0.2 V
2
VCCB = 3.3 V ± 0.3 V
2
VCCB = 5 V ± 0.5 V
2
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ns
64
VCCB = 2.5 V ± 0.2 V
VCCB = 2.5 V ± 0.2 V
Push-pull driving
UNIT
ns
ns
ns
Mbps
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6.11 Switching Characteristics — VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
tPHL(A-B)
tPHL(B-A)
tPLH(A-B)
tPLH(B-A)
ten(OE-A)
ten(OE-B)
Propagation delay time
(high to low)
See Figure 8
Propagation delay time
(high to low)
See Figure 8
Propagation delay time
(low to high)
See Figure 8
Propagation delay time
(low to high)
See Figure 8
TEST CONDITIONS
Push-pull driving
From A (input) to B (output)
Open-drain driving
Push-pull driving
From B (input) to A (output)
Open-drain driving
Push-pull driving
From A (input) to B (output)
Open-drain driving
Push-pull driving
From B (input) to A (output)
Open-drain driving
Enable time
From OE (input) to A or B (output)
tdis(OE-A)
Disable time
tdis(OE-B)
From OE (input) to A or B (output)
2.5
VCCB = 5 V ± 0.5 V
3.3
VCCB = 3.3 V ± 0.3 V
2.5
VCCB = 5 V ± 0.5 V
3.3
VCCB = 3.3 V ± 0.3 V
4.2
VCCB = 5 V ± 0.5 V
4.4
VCCB = 3.3 V ± 0.3 V
4.2
VCCB = 5 V ± 0.5 V
4.4
VCCB = 3.3 V ± 0.3 V
2.5
VCCB = 5 V ± 0.5 V
2.6
VCCB = 3.3 V ± 0.3 V
2.5
VCCB = 5 V ± 0.5 V
200
Rise time, B port
Fall time, A port
Push-pull driving
Fall time, B port
Open-drain driving
VCCB = 3.3 V ± 0.3 V
4.8
VCCB = 3.3 V ± 0.3 V
25
VCCB = 5 V ± 0.5 V
19
VCCB = 3.3 V ± 0.3 V
116
VCCB = 5 V ± 0.5 V
7.4
VCCB = 3.3 V ± 0.3 V
26
VCCB = 5 V ± 0.5 V
14
VCCB = 3.3 V ± 0.3 V
116
ns
ns
ns
72
5.4
VCCB = 5 V ± 0.5 V
5
VCCB = 3.3 V ± 0.3 V
6.1
VCCB = 5 V ± 0.5 V
5.7
VCCB = 3.3 V ± 0.3 V
7.4
VCCB = 5 V ± 0.5 V
7.6
VCCB = 3.3 V ± 0.3 V
7.6
VCCB = 5 V ± 0.5 V
8.3
1
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ns
85
1
Open-drain driving
ns
6.4
VCCB = 5 V ± 0.5 V
Maximum data rate
ns
5.6
VCCB = 5 V ± 0.5 V
VCCB = 3.3 V ± 0.3 V
Push-pull driving
UNIT
2.6
200
Open-drain driving
10
4.6
VCCB = 3.3 V ± 0.3 V
VCCB = 5 V ± 0.5 V
Rise time, A port
Channel-to-channel skew
4.2
VCCB = 5 V ± 0.5 V
VCCB = 3.3 V ± 0.3 V
Push-pull driving
tsk
3.1
VCCB = 3.3 V ± 0.3 V
250
Open-drain driving
tf(Bx)
VCCB = 5 V ± 0.5 V
VCCB = 5 V ± 0.5 V
Push-pull driving
tf(Ax)
2.4
200
Open-drain driving
tr(Bx)
MAX
VCCB = 3.3 V ± 0.3 V
Push-pull driving
tr(Ax)
MIN
VCCB = 3.3 V ± 0.3 V
VCCB = 3.3 V ± 0.3 V
22
VCCB = 5 V ± 0.5 V
24
VCCB = 3.3 V ± 0.3 V
2
VCCB = 5 V ± 0.5 V
2
ns
ns
ns
Mbps
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700
700
600
600
Low-Level Output Voltage (mV)
Low-Level Output Voltage (mV)
6.12 Typical Characteristics
500
400
300
200
VCCB = 2.7 V
VCCB = 3.3 V
VCCB = 5 V
100
500
400
300
200
100
VCCB = 3.3 V
VCCB = 5 V
0
0
0
2
VCCA = 1.8 V
4
6
8
10
12
Low-Level Current (mA)
14
16
0
2
4
D001
VIL(A) = 150 mV
6
8
10
12
Low-Level Current (mA)
VCCA = 2.7 V
Figure 1. Low-Level Output Voltage (VOL(Bx))
vs Low-Level Current (IOL(Bx))
14
16
D003
VIL(A) = 150 mV
Figure 2. Low-Level Output Voltage (VOL(Bx))
vs Low-Level Current (IOL(Bx))
Low-Level Output Voltage (mV)
700
600
500
400
300
200
100
VCCB = 3.3 V
0
0
2
4
6
8
10
12
Low-Level Current (mA)
VCCA = 3.3 V
14
16
D002
VIL(A) = 150 mV
Figure 3. Low-Level Output Voltage (VOL(Bx)) vs Low-Level Current (IOL(Bx))
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7 Parameter Measurement Information
7.1 Load Circuits
VCCI
VCCI
VCCO
TXS0102-Q1
IN
VCCO
TXS0102-Q1
OUT
IN
15 pF
OUT
1M
15 pF
Figure 4. Data Rate, Pulse Duration, Propagation
Delay, Output Rise-Time and Fall-Time
Measurement Using a Push-Pull Driver
1M
Figure 5. Data Rate, Pulse Duration, Propagation
Delay, Output Rise-Time and Fall-Time
Measurement Using an Open-Drain Driver
2 × VCCO
S1
50 k
From output
under test
15 pF
Open
50 k
TEST
S1
tPZL / tPLZ
(tdis)
2 × VCCO
tPHZ / tPZH
(ten)
Open
Figure 6. Load Circuit for Enable-Time and Disable-Time Measurement
1.
2.
3.
4.
12
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
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7.2 Voltage Waveforms
tw
VCCI
Input
VCCI
VCCI / 2
VCCI / 2
0V
Input
VCCI / 2
VCCI / 2
tPLH
0V
tPHL
VCCO / 2
Output
0.1 × VCCO
tr
Figure 7. Pulse Duration
0.9 × VCCO
VOH
VCCO / 2
VOL
tf
Figure 8. Propagation Delay Times
VCCA
VCCA / 2
OE input
VCCA / 2
0V
tPLZ
tPZL
VOH
Output
Waveform 1
S1 at 2 × VCCO
VCCO / 2
VOH × 0.1
(see Note 2)
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note 2)
VOL
VOH × 0.9
VOH
VCCO / 2
0V
Figure 9. Enable and Disable Times
1. CL includes probe and jig capacitance.
2. Waveform 1 in Figure 9 is for an output with internal such that the output is high, except when OE is high
(see Figure 6). Waveform 2 in Figure 9 is for an output with conditions such that the output is low, except
when OE is high.
3. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
dv/dt ≥ 1 V/ns.
4. The outputs are measured one at a time, with one transition per measurement.
5. tPLZ and tPHZ are the same as tdis.
6. tPZL and tPZH are the same as ten.
7. tPLH and tPHL are the same as tpd.
8. VCCI is the VCC associated with the input port.
9. VCCO is the VCC associated with the output port.
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8 Detailed Description
8.1 Overview
The TXS0102-Q1 device is a directionless voltage-level translator specifically designed for translating logic
voltage levels. The A port is able to accept I/O voltages ranging from 1.65 V to 3.6 V, while the B port can accept
I/O voltages from 2.3 V to 5.5 V. The device is a pass gate architecture with edge rate accelerators (one shots)
to improve the overall data rate. 10-kΩ pullup resistors, commonly used in open drain applications, have been
conveniently integrated so that an external resistor is not needed. While this device is designed for open drain
applications, the device can also translate push-pull CMOS logic outputs.
8.2 Functional Block Diagram
14
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8.3 Feature Description
8.3.1 Architecture
The TXS0102-Q1 architecture (see Figure 10) does not require a direction-control signal in order to control the
direction of data flow from A to B or from B to A.
VCCB
VCCA
T1
One-shot
One-shot
10 kΩ
T2
10 kΩ
Gate Bias
A
B
Figure 10. Architecture of a TXS01xx Cell
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot
turns on the PMOS transistors (T1, T2) for a short duration which speeds up the low-to-high transition.
8.3.2 Input Driver Requirements
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of
the TXS0102-Q1 device. Similarly, the tPHL and maximum data rates also depend on the output impedance of the
external driver. The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output
impedance of the external driver is less than 50 Ω.
8.3.3 Power Up
During operation, assure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
8.3.4 Enable and Disable
The TXS0102-Q1 device has an OE input that disables the device by setting OE low, which places all I/Os in the
high-impedance state. The disable time (tdis) indicates the delay between the time when the OE pin goes low and
when the outputs actually enter the high-impedance state. The enable time (ten) indicates the amount of time the
user must allow for the one-shot circuitry to become operational after the OE pin is taken high.
8.3.5 Pullup and Pulldown Resistors on I/O Lines
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).
8.4 Device Functional Modes
The TXS0102-Q1 device has two functional modes, enabled and disabled. To disable the device set the OE
input low, which places all I/Os in a high impedance state. Setting the OE input high will enable the device.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TXS0102-Q1 device can be used in level-translation applications for interfacing devices or systems
operating at different interface voltages with one another. The TXS0102-Q1 device is ideal for use in applications
where an open-drain driver is connected to the data I/Os.
9.2 Typical Application
1.8 V
3.3 V
0.1 µF
0.1 µF
VCCA
OE VCCB
1.8-V
System
Controller
3.3-V
System
TXS0102-Q1
A1
A2
Data
B1
B2
Data
GND
Figure 11. Application Schematic
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
1.65 to 3.6 V
Output voltage range
2.3 to 5.5 V
9.2.2 Detailed Design Procedure
To begin the design process, determine the following:
•
•
16
Input voltage range
– Use the supply voltage of the device that is driving the TXS0102-Q1 device to determine the input voltage
range. For a valid logic high the value must exceed the VIH of the input port. For a valid logic low the value
must be less than the VIL of the input port.
Output voltage range
– Use the supply voltage of the device that the TXS0102-Q1 device is driving to determine the output
voltage range.
– The TXS0102-Q1 device has 10-kΩ internal pullup resistors. External pullup resistors can be added to
reduce the total RC of a signal trace if necessary.
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•
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An external pull down resistor decreases the output VOH and VOL. Use Equation 1 to calculate the VOH as a
result of an external pull down resistor.
VOH = VCCx × RPD / (RPD + 10 kΩ)
where
•
•
VCCx is the supply voltage on either VCCA or VCCB
RPD is the value of the external pull down resistor
(1)
9.2.3 Application Curve
2 V/div
5V
2V
10 ns/div
VCCA = 1.8 V
VCCB = 5 V
Figure 12. Level-Translation of a 2.5-MHz Signal
10 Power Supply Recommendations
The TXS0102-Q1 device uses two separate configurable power-supply rails, VCCA and VCCB. VCCB accepts any
supply voltage from 2.3 V to 5.5 V and VCCA accepts any supply voltage from 1.65 V to 3.6 V as long as VCCA is
less than or equal to VCCB. The A port and B port are designed to track VCCA and VCCB respectively allowing for
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
The TXS0102-Q1 device does not require power sequencing between VCCA and VCCB during power-up so the
power-supply rails can be ramped in any order. A VCCA value greater than or equal to VCCB (VCCA ≥ VCCB) does
not damage the device, but during operation, VCCA must be less than or equal to VCCB (VCCA ≤ VCCB) at all times.
The output-enable (OE) input circuit is designed so that it is supplied by VCCA and when the (OE) input is low, all
outputs are placed in the high-impedance state. To assure the high-impedance state of the outputs during power
up or power down, the OE input pin must be tied to GND through a pulldown resistor and must not be enabled
until VCCA and VCCB are fully ramped and stable. The minimum value of the pulldown resistor to ground is
determined by the current-sourcing capability of the driver.
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11 Layout
11.1 Layout Guidelines
To
•
•
•
•
assure reliability of the device, following common printed-circuit board layout guidelines is recommended.
Bypass capacitors should be used on power supplies.
Short trace lengths should be used to avoid excessive loading.
PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than
the one shot duration, approximately 30 ns, assuring that any reflection encounters low impedance at the
source driver.
To help adjust rise and fall times of signals depending on system requirements, place pads on the signal
paths for loading capacitors or pullup resistors.
11.2 Layout Example
LEGEND
Polygonal Copper Pour
VIA to Power Plane
VIA to GND Plane (Inner Layer)
To Controller
To System
1
B1
8
GND
VCCB
7
3
VCCA
OE
6
4
A2
A1
5
2
Bypass capacitor
B2
Bypass capacitor
0.1uF
To Controller
Keep OE low until VCCA and
VCCB are powered up
To System
Figure 13. TXS0102-Q1 Layout Example
18
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Introduction to Logic
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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21-Apr-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TXS0102QDCURQ1
ACTIVE
VSSOP
DCU
8
3000
RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
NG3R
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
