TXS0202YZPR

TXS0202 SCES711A – JUNE 2011 – REVISED JUNE 2011 www.ti.com A Inter Chip-USB Voltage Level Translator Check for Samples: TXS0202 FEATURES 1 • • • 1 No Direction Control Signal Required VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V Meets All Requirements of the IC-USB Standard Small Packages: WCSP Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Ioff Supports Partial-Power-Down Mode Operation ESD Performance – A port (Host-Side) – 2000-V Human-Body Model – 100-V Machine Model – 500-V Charged-Device Model – B port (Peripheral-Side) – >4kV HBM • • • • 2 A B C D Table 1. YZP TERMINAL ASSIGNMENTS (Top Through View) 1 2 A D+(B) D–(B) B GND VCCB C VCCA OE D D+(A) D–(A) DESCRIPTION The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. ORDERING INFORMATION (1) TA –40°C to 85°C (1) (2) (3) PACKAGE WSCP – YZP (2) Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TXS0202YZPR _ _ _ 7PS _ (3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TXS0202 SCES711A – JUNE 2011 – REVISED JUNE 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TYPICAL APPLICATION BLOCK DIAGRAM 1.8 V 3V D+ Application Processor D– VCCA VCCB D+(A) D+(B) D–(A) D–(B) OE D+ D– MM SIM Card GND TXS0202 PIN FUNCTIONS PIN DESCRIPTION WSCP (YFP) BALL NO. NAME A1 D+(B) USB data signal connected to peripheral A2 D–(B) USB data signal connected to peripheral B1 GND Ground B2 VCCB B-side supply voltage (1.65 V to 3.6 V) C1 VCCA A-side supply voltage (1.65 V to 3.6 V) C2 OE D1 D+(A) USB data signal connected to host D2 D–(A) USB data signal connected to host Output enable input control FUNCTIONAL TABLE 2 CONTROL INPUT OUTPUT CIRCUIT OE B PORT L Hi-Z H Enabled OPERATION Isolation Bi-directional communications between host and peripheral Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TXS0202 TXS0202 SCES711A – JUNE 2011 – REVISED JUNE 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT –0.5 4.6 V VCCA VCCB Supply voltage rang VI Input voltage range A port, B port, control inputs –0.5 VCCx + 0.5 V VO Voltage range applied to any output in the high-impedance or power-off state A port, B port –0.5 VCCx + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA ICC IGND Continuous current through VCCA, VCCB, or GND ±100 mA Tstg Storage temperature range 150 °C (1) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TXS0202 THERMAL METRIC (1) YZP UNITS 8 PINS θJA (1) Junction-to-ambient thermal resistance °C/W 102 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS VCCA, VCCB Supply voltage A port I/Os VIH High-level input voltage Low-level input voltage Δt/Δv Input transition rise or fall rate TA Operating free-air temperature MAX 3.6 VCCA – 0.2 VCCA VCCB – 0.2 VCCB VCCA × 0.65 3.6 A port I/Os 0 0.15 B port I/Os 0 0.15 OE 0 VCCA × 0.35 B port I/Os OE VIL MIN 1.65 –40 Product Folder Link(s): TXS0202 V V V 10 ns/V 85 °C Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated UNIT 3 TXS0202 SCES711A – JUNE 2011 – REVISED JUNE 2011 www.ti.com D+ 150K 150K 150K 150K Peripheral D- Host D+ 150K 150K 150K 150K 150K 150K 150K Host 3K 600K D- Peripheral 150K 150K 600K L Host 150K 150K 600K 600K D150K 150K High-Z 3K Peripheral 150K 150K 150K 2. Attach Mode 1. Power Up D+ 3K 150K D+ 150K 3K/600K Host 600K 3K/600K D- Peripheral High-Z 3. Acknowledge Mode 150K 4. Ready Mode Figure 1. Block Diagram Showing Different Modes in the TXS0202 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TXS0202 TXS0202 SCES711A – JUNE 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS PARAMETER VOH(D–) (D– A or B port) VOL(D–) (D– A or B port) TEST CONDITIONS VOL(D+) (D– A or B port) VCCBx TA = –40°C to 85°C MIN MAX 1.65 V VCCO × 0.67 2.3 V 2.3 V VCCO × 0.67 3.3 V 3.3 V VCCO × 0.67 IOL = 220 μA, VIx ≤ 0.15 V 1.65 V 1.65 V 0.45 IOL = 180 μA, VIx ≤ 0.15 V 2.3 V 2.3 V 0.55 3.3 V 3.3 V 1.65 V IOH = –20 μA, VIx ≥ VCCx – 0.2 V VCCO × 0.67 2.3 V 2.3 V VCCO × 0.67 3.3 V 3.3 V VCCO × 0.67 IOL = 220 μA, VIx ≤ 0.15 V 1.65 V 1.65 V 0.45 IOL = 300 μA, VIx ≤ 0.15 V 2.3 V 2.3 V 0.55 IOL = 620 μA, VIx ≤ 0.15 V 3.3 V 3.3 V 0.7 D–/D+ A or B port, OE = OPEN 1.65 V to 3.6 V 1.65 V to 3.6 V IBOFF, D+, D– B port 1.65 V to 3.6 V 0V 0V 1.65 V to 3.6 V 1.65 V to 3.6 V 1.65 V to 3.6 V VI = VO = Open, OE = High V ±2 ±2 ±2 ±2 12 3.6 V 0V 2.3 12 0V 3.6 V 0.026 –1 1.65 V to 3.6 V 2.7 24 3.6 V 0V 0.031 –12 0V 3.6 V 2.7 24 Ci OE 3.6 V 3.6 V 2.5 3.5 7 7.5 9.5 10 3.6 V 3.6 V Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TXS0202 μA ±2 2.2 1.65 V to 3.6 V B port V ±2 VI = VO = Open, OE = High Cio V 0.7 ICCB A port UNIT V 1.65 V IAOFF, D+, D– A port ICCA TYP 1.65 V OE II TA = 25°C IOH = –20 μA, VIx ≥ VCCx – 0.2 V IOL = 220 μA, VIx ≤ 0.15 V VOH(D+) (D+ A or B port) VCCA μA μA pF pF 5 TXS0202 SCES711A – JUNE 2011 – REVISED JUNE 2011 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) FROM (INPUT) TO (OUTPUT) VCCB = 1.8 V ± 0.15 V VCCB = 3.3 V ± 0.3 V TYP TYP A B 5 5 B A 5 5 A port rise times 2 2 ns tfA A port fall times 2 2 ns trB B port rise times 2 2 ns tfB B port fall times 2 2 ns Channel-to-channel 0.5 0.5 ns 15 15 Mbps PARAMETER tpd trA tsk(o) Max data rate UNIT ns PARAMETER MEASUREMENT INFORMATION VCCI VCCI VCCO Input VCCI/2 VCCI/2 0V DUT IN t PLH t PHL OUT 18 pF Output VCCO/2 0.9 VCCO 0.1 VCCO tr DATA RATE, SKEW, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT VOH VCCO/2 VOL tf VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. CL includes probe and jig capacitance. B. The outputs are measured one at a time, with one transition per measurement. C. tPLH and tPHL are the same as tpd. 6 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TXS0202 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TXS0202YZPR ACTIVE DSBGA YZP 8 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 7P (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of