µ
SLVS060K − JUNE 1976 − REVISED APRIL 2005
D 3-Terminal Regulators
D Output Current Up To 500 mA
D No External Components
D High Power-Dissipation Capability
D Internal Short-Circuit Current Limiting
D Output Transistor Safe-Area Compensation
µA79M05, µA79M08 . . . KTP PACKAGE
(TOP VIEW)
INPUT
µA79M05 . . . KC (TO-220) PACKAGE
(TOP VIEW)
INPUT
OUTPUT
INPUT
COMMON
OUTPUT
INPUT
COMMON
INPUT
µA79M05 . . . KCS (TO-220) PACKAGE
(TOP VIEW)
OUTPUT
INPUT
COMMON
description/ordering information
This series of fixed-negative-voltage integrated-circuit voltage regulators is designed to complement the
µA78M00 series in a wide range of applications. These applications include on-card regulation for elimination
of noise and distribution problems associated with single-point regulation. Each of these regulators delivers up
to 500 mA of output current. The internal current-limiting and thermal-shutdown features of these regulators
essentially make them immune to overload. In addition to use as fixed-voltage regulators, these devices can
be used with external components to obtain adjustable output voltages and currents, and also as the
power-pass element in precision regulators.
ORDERING INFORMATION
TJ
0°C to 125°C
VO(NOM)
(V)
−5
ORDERABLE
PART NUMBER
PACKAGE†
PowerFLEX (KTP)
Reel of 3000
µA79M05CKTPR
TO-220 (KC)
Tube of 50
µA79M05CKC
TO-220, short shoulder (KCS)
Tube of 20
µA79M05CKCS
TOP-SIDE
MARKING
µA79M05C
µA79M05C
A79M05C
−8
PowerFLEX (KTP)
Reel of 3000
µA79M08CKTPR
µA79M08C
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerFLEX is a trademark of Texas Instruments.
Copyright 2005, Texas Instruments Incorporated
! " #$ % !&
% "! "! '! ! !( !
%% ) *& % " ! + %! ! ! $* $ %!
! + $$ "! ! &
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
µ
SLVS060K − JUNE 1976 − REVISED APRIL 2005
schematic
COMMON
4.5 kΩ
to 6.3 kΩ
1.7 kΩ
to 18 kΩ
OUTPUT
0.1 Ω
0.2 Ω
INPUT
Resistor values shown are nominal.
absolute maximum ratings over virtual junction temperature range (unless otherwise noted)†
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 V
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
package thermal data (see Note 1)
PowerFLEX (KTP)
High K, JESD 51-5
θJC
19°C/W
TO-220 (KC/KCS)
High K, JESD 51-5
17°C/W
PACKAGE
BOARD
θJA
28°C/W
19°C/W
θJP‡
1.4°C/W
3°C/W
NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
‡ For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θJP is defined as the thermal resistance between the die
junction and the bottom of the exposed pad.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
µ
SLVS060K − JUNE 1976 − REVISED APRIL 2005
recommended operating conditions
VI
Input voltage
IO
TJ
Output current
MIN
MAX
µA79M05C
−7
−25
µA79M08C
−10.5
−25
Operating virtual junction temperature
0
UNIT
V
500
mA
125
°C
electrical characteristics at specified virtual junction temperature, VI = −10 V, IO = 350 mA, TJ = 25°C
(unless otherwise noted)
µA79M05C
TEST CONDITIONS†
PARAMETER
Output voltage
VI = −7 V to −25 V,
Input voltage regulation
VI = −7 V to −25 V
VI = −8 V to −18 V
Ripple rejection
VI = −8 V to −18 V,
f = 120 Hz
Output voltage regulation
IO = 5 mA to 500 mA
IO = 5 mA to 350 mA
Temperature coefficient
of output voltage
IO = 5 mA,
Output noise voltage
f = 10 Hz to 100 kHz
IO = 5 mA to 350 mA
IO = 100 mA,
IO = 300 mA
TJ = 0°C to 125°C
TJ = 0°C to 125°C
MIN
TYP
MAX
−4.8
−5
−5.2
−4.75
−5.25
7
50
3
30
54
100
mV
−0.4
mV/°C
125
µV
1.1
Bias current
1
Bias current change
VI = −8 V to −18 V,
IO = 5 mA to 350 mA,
Short-circuit output current
VI = −30 V
mV
dB
60
50
Dropout voltage
V
50
75
TJ = 0°C to 125°C
UNIT
TJ = 0°C to 125°C
TJ = 0°C to 125°C
V
2
mA
0.4
0.4
140
mA
mA
Peak output current
0.65
A
† Pulse-testing techniques maintain TJ as close to TA as possible. Thermal effects must be taken into account separately. All characteristics are
measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
µ
SLVS060K − JUNE 1976 − REVISED APRIL 2005
electrical characteristics at specified virtual junction temperature, VI = −19 V, IO = 350 mA, TJ = 25°C
(unless otherwise noted)
µA79M08C
TEST CONDITIONS†
PARAMETER
Output voltage
VI = −10.5 V to −25 V,
Input voltage regulation
VI = −10.5 V to −25 V
VI = −11 V to −21 V
Ripple rejection
VI = −11.5 V to −21.5 V,
f = 120 Hz
Output voltage regulation
IO = 5 mA to 500 mA
IO = 5 mA to 350 mA
Temperature coefficient
of output voltage
IO = 5 mA,
Output noise voltage
Dropout voltage
IO = 5 mA to 350 mA
IO = 100 mA,
IO = 300 mA
TJ = 0°C to 125°C
TJ = 0°C to 125°C
MIN
TYP
MAX
−7.7
−8
−8.3
−7.6
−8.4
8
80
4
50
V
mV
50
54
dB
59
90
160
mV
60
TJ = 0°C to 125°C
UNIT
−0.6
mV/°C
f = 10 Hz to 100 kHz
200
µV
IO = 5 mA
1.1
Bias current
1
Bias current change
VI = −10.5 V to −25 V,
IO = 5 mA to 350 mA,
Short-circuit output current
VI = −30 V
TJ = 0°C to 125°C
TJ = 0°C to 125°C
V
2
mA
0.4
0.4
140
mA
mA
Peak output current
0.65
A
† Pulse-testing techniques maintain TJ as close to TA as possible. Thermal effects must be taken into account separately. All characteristics are
measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
7704001HA
OBSOLETE
CFP
U
10
TBD
Call TI
Call TI
UA79M05CKC
NRND
TO-220
KC
3
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
UA79M05CKCE3
NRND
TO-220
KC
3
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
UA79M05CKCS
ACTIVE
TO-220
KCS
3
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
UA79M05CKTPR
NRND
PFM
KTP
2
3000
TBD
CU SN
Level-1-220C-UNLIM
UA79M05CKTPRG3
NRND
PFM
KTP
2
3000 Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
UA79M05CKVURG3
ACTIVE
PFM
KVU
3
2500 Green (RoHS &
no Sb/Br)
CU SN
Level-3-260C-168 HR
UA79M05MUB
OBSOLETE
CFP
U
10
TBD
Call TI
Call TI
UA79M06CKTPR
OBSOLETE
PFM
KTP
2
TBD
Call TI
Call TI
UA79M08CKC
OBSOLETE
TO-220
KC
3
TBD
Call TI
Call TI
TBD
UA79M08CKTPR
NRND
PFM
KTP
2
3000
CU SN
Level-1-220C-UNLIM
UA79M08CKTPRG3
NRND
PFM
KTP
2
3000 Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
UA79M08CKVURG3
ACTIVE
PFM
KVU
3
2500 Green (RoHS &
no Sb/Br)
CU SN
Level-3-260C-168 HR
UA79M12CKC
OBSOLETE
TO-220
KC
3
TBD
Call TI
Call TI
UA79M12CKTPR
OBSOLETE
PFM
KTP
2
TBD
Call TI
Call TI
UA79M15CKC
OBSOLETE
TO-220
KC
3
TBD
Call TI
Call TI
UA79M15CKTPR
OBSOLETE
PFM
KTP
2
TBD
Call TI
Call TI
UA79M20CKTPR
OBSOLETE
PFM
KTP
2
TBD
Call TI
Call TI
UA79M24CKTPR
OBSOLETE
PFM
KTP
2
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2006
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPSF001F – JANUARY 1996 – REVISED JANUARY 2002
KTP (R-PSFM-G2)
PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE
0.080 (2,03)
0.070 (1,78)
0.243 (6,17)
0.233 (5,91)
0.228 (5,79)
0.218 (5,54)
0.050 (1,27)
0.040 (1,02)
0.010 (0,25) NOM
0.130 (3,30) NOM
0.215 (5,46)
NOM
0.247 (6,27)
0.237 (6,02)
Thermal Tab
(See Note C)
0.287 (7,29)
0.277 (7,03)
0.381 (9,68)
0.371 (9,42)
0.100 (2,54)
0.090 (2,29)
0.032 (0,81) MAX
Seating Plane
0.090 (2,29)
0.180 (4,57)
0.004 (0,10)
0.005 (0,13)
0.001 (0,02)
0.031 (0,79)
0.025 (0,63)
0.010 (0,25) M
0.010 (0,25) NOM
Gage Plane
0.047 (1,19)
0.037 (0,94)
0.010 (0,25)
2°–ā6°
4073388/M 01/02
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
The center lead is in electrical contact with the thermal tab.
Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
Falls within JEDEC TO-252 variation AC.
PowerFLEX is a trademark of Texas Instruments.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2007, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
