UC1825BEVM-CVAL

UC1825BEVM-CVAL

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    UC1825B-SP - DC/DC,步降 1,隔离 输出评估板

  • 数据手册
  • 价格&库存
UC1825BEVM-CVAL 数据手册
User's Guide SLUUBZ0 – March 2019 UC1825B-SP evaluation module (EVM) The UC1825BEVM-CVAL is the evaluation module (EVM) for the UC1825B-SP and provides a platform to electrically evaluate its features. This user’s guide provides details about the EVM, its configuration, schematics, and BOM. 1 2 3 4 5 Contents Introduction ................................................................................................................... 3 System Design Theory ...................................................................................................... 4 Test Setup and Results ..................................................................................................... 8 Board Layout ................................................................................................................ 23 Schematics and Bill of Materials ......................................................................................... 30 List of Figures 1 Test Setup .................................................................................................................... 8 2 Efficiency vs Output Current .............................................................................................. 10 3 Load Regulation vs Output Current ...................................................................................... 11 4 Frequency Response of 22 VIN ........................................................................................... 12 5 Frequency Response of 48 VIN ........................................................................................... 13 6 Thermal Characteristics With 22 VIN ..................................................................................... 13 7 Thermal Characteristics With 48 VIN ..................................................................................... 14 8 Output Voltage Ripple With 22 VIN ....................................................................................... 15 9 Output Voltage Ripple With 48 VIN ....................................................................................... 15 10 Partial Step Down Transient With 22 VIN ................................................................................ 16 11 Full Step Down Transient With 22 VIN ................................................................................... 16 12 Full Step Up Transient With 22 VIN....................................................................................... 17 13 Partial Step Down Transient With 48 VIN ................................................................................ 17 14 Full Step Down Transient With 48 VIN ................................................................................... 18 15 Full Step Up Transient With 48 VIN....................................................................................... 18 16 No Load Startup With 22 VIN .............................................................................................. 19 17 Full Load Startup With 22 VIN ............................................................................................. 19 18 No Load Startup With 48 VIN .............................................................................................. 20 19 Full Load Startup With 48 VIN ............................................................................................. 20 20 Full Load Shutdown With 22 VIN .......................................................................................... 21 21 Full Load Shutdown With 48 VIN .......................................................................................... 21 22 Voltage Stress Across Main Switching MOSFETS Q1 and Q2 ...................................................... 22 23 Voltage Stress Across Output Diode .................................................................................... 22 24 Top Overlay ................................................................................................................. 23 25 Top Solder 26 27 28 29 30 .................................................................................................................. Top Layer ................................................................................................................... Signal Layer 1 .............................................................................................................. Signal Layer 2 .............................................................................................................. Bottom Layer................................................................................................................ Bottom Solder............................................................................................................... SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 24 24 25 25 26 26 1 www.ti.com 31 Bottom Overlay ............................................................................................................. 27 32 Drill Drawing ................................................................................................................ 28 33 Board Dimensions.......................................................................................................... 29 34 UC1825BEVM-CVAL Schematic 01 ..................................................................................... 30 35 UC1825BEVM-CVAL Schematic 02 ..................................................................................... 31 List of Tables 1 Test Parameters ............................................................................................................. 8 2 48 VIN Efficiency Raw Data................................................................................................ 10 3 22 VIN Efficiency Raw Data................................................................................................ 10 4 48 VIN Load Regulation Raw Data 5 22 VIN Load Regulation Raw Data 6 7 8 9 10 ....................................................................................... ....................................................................................... Frequency Response Characteristics of 22 VIN ........................................................................ Frequency Response Characteristics of 48 VIN ........................................................................ Notable Thermal Values for 22 VIN ....................................................................................... Notable Thermal Values for 48 VIN ....................................................................................... Bill of Materials ............................................................................................................. 11 11 12 13 14 14 33 Trademarks All trademarks are the property of their respective owners. 2 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Introduction www.ti.com 1 Introduction The UC1825BEVM-CVAL uses the UC1825B-SP to supply power using a push-pull topology. The UC1825B-SP supplies both outputs necessary for a push pull topology using its two outputs in a radiation improved package. Both low side MOSFETs are switched using the UC1825B-SP's integrated drivers. If isolation gate drive transformers are used, the UC1825B-SP could be used to supply output signals for both half bridge and full bridge applications. The UC1825B-SP has the soft start function integrated for decreased external components. 1.1 Features • • • • 1.2 Applications • • • 1.3 Pulse-by-pulse current limiting using UC1825B-SP Dual output PWM control using UC1825B-SP Low start-up current of 1.1 mA Dedicated soft-start pin Space satellite isolated power supplies Radiation hardened applications Space satellite payloads Description CAUTION Do not touch! Surface of EVM gets hot. Contact may cause burns. The UC1825BEVM-CVAL uses the UC1825B-SP as a dual output controller that has integrated drivers for a push-pull topology. The push-pull topology was selected to avoid having to use external high side drivers and take advantage of the low output noise the topology allows for. The UC1825B-SP originally supported voltage mode topologies, but with minimal external components can support current mode topologies as well. The RAMP pin is used for the input current sense and the ILIM pin is used as the current limit pin. External components are needed to ensure slope compensation is implemented. The soft start pin is critical for many designs and is shown in the EVM using the UC1825B-SP's integrated soft start pin. SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 3 System Design Theory 2 System Design Theory 2.1 Switching Frequency www.ti.com Choosing a switching frequency has a trade off between efficiency and bandwidth. Higher switching frequencies will have larger bandwidth, but a lower efficiency than lower switching frequencies. A switching frequency of 215 kHz was chosen as a trade off between bandwidth and efficiency. Using equations provided by the data sheet for the UC1825B-SP, RT and CT were chosen to be 10 kΩ and 680 pF, respectively. The equation from the data sheet to calculate the switching frequency using these values is shown in Equation 1. (1) (2) 2.2 Transformer The transformer of the design consists of two major values, turns ratio and primary side inductance. There is no minimum limit to the turns ratio of the transformer, only a maximum limit. The following equation will give the turns ratio as a function of duty cycle which if the maximum duty cycle of the converter is used will give you a maximum turns ratio. The UC1825B-SP design targeted a duty cycle of 30%. Since this design is for a dual output device the duty cycle must stay below 50%. If both outputs were running above 50% duty cycle they would have to overlap which is not possible for the topology. The equation of the turns ratio of the transformer is Equation 3. (3) (4) Often the turns ratio will slightly change in design due to how the transformer is manufactured. For the UC1825B-SP design a turns ratio of 2.2 was used. Another turns ratio that is important is the turns ratio of the auxiliary winding. The auxiliary winding is found by figuring out what positive voltage is needed from the auxiliary winding. Selecting this voltage lets one pick the turns ratio from the secondary to the auxiliary winding, which in turn allows for the turns ratio from primary to auxiliary to be found. The equation for the turns ratio is Equation 5. (5) (6) An auxiliary winding of 1.5 was used for the UC1825B-SP design. The primary inductance of the transformer is found from picking an appropriate magnetizing current. The magnetizing current of the transformer is the amount of current drawn through the windings of the transformer when the output is open circuited. Decreasing the magnetizing current will increase the inductance of the transformer, perhaps to unreasonable values. Increasing the magnetizing current will cause efficiency to decrease. It is desirable to keep the magnetizing current low, thus 6% was picked for the design value. The equation for the auxiliary winding turns ratio is Equation 7. (7) (8) There are quite a few physical limitations when making transformers that will affect the inductance value. For the UC1825B-SP design a primary inductance of 120 µH was used. The output inductor was then picked based on the output inductor ripple current with Equation 9. (9) (10) 4 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated System Design Theory www.ti.com In the final design, a 2.2 μH inductor was used. The peak and primary currents of the transformer are also generally useful for figuring out the physical structure of the transformer, so equations are listed below. Note these equations are only true for continuous conduction mode. Peak currents are higher at the maximum input voltage while the RMS current is highest at the minimum input voltage. These are also idea values and do not take into account efficiency. Final designs needs to be optimized depending on the specific application requirements. See the following equations for this design: (11) (12) (13) (14) (15) (16) (17) (18) (19) (20) (21) (22) (23) (24) (25) (26) (27) (28) 2.3 RCD and Diode Clamp For the UC1825BEVM-CVAL a resistor and capacitor in combination with a diode was used to clamp the voltage of the switch node. The resistor and capacitor is generally a value that is found through testing, but starting values can be obtained. To figure out the resistor and capacitor needed for the RCD clamp, one must first decide how much the node is allowed to overshoot. The equation for finding the voltage of the clamp is Equation 29. (29) Note that Kclamp is recommended to be 1.5 as this will allow for only around 50% overshoot. Knowing the parasitic inductance of the transformer and how much the RCD clamp voltage is allowed to change over the switching cycle, can allow one to figuring out starting values for the resistor and capacitor using Equation 30 and Equation 31. (30) (31) SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 5 System Design Theory www.ti.com A starting value of 10% is generally used for ΔVclamp. 2.4 Output Diode The voltage stress by the converter on the diode can be found with Equation 32. (32) (33) Note that any diode picked should have a voltage rating of well above this value as it does not include parasitic spikes in the equation. The UC1825-SP diode was picked to have a voltage rating of 60 V. 2.5 Main Switching MOSFETs Each switch applies the input voltage across the transformer and the voltage is then divided down by the turns ratio and applied to the secondary side. Since the magnitude of the voltage across the windings is the input voltage, when the switch is off the primary switching MOSFETs will see twice the input voltage as the voltage stress plus some amount of ringing. This means the MOSFETs chosen for a push-pull topology should have a voltage rating of about 2.5 to 3 times higher than the input voltage. 2.6 Output Filter and Capacitance For most designs, a ripple voltage is picked and the output capacitance is figured out from that value. The output capacitance value needs to be able to withstand a full output current step as well as keep the voltage ripple of the output low. The UC1825B-SP design started similar to that using the equations for voltage ripple and load step with Equation 34 and Equation 36. (34) (35) (36) (37) A value of around 1145 µF was chosen to keep output voltage ripple low. Note that the output voltage ripple in the design was further decreased by adding an output filter and by adding an inductor after a small portion of the output capacitance. This was done in order to keep output voltage ripple as low as possible. Six ceramic capacitors were picked to be placed before the output filter and then the large tantalum capacitors with some small ceramics were added to be part of the output filter. The initial ceramics will help with the initial current ripple, but have a very large output voltage ripple. This voltage ripple will be attenuated by the inductor and capacitor combination placed between the ceramic capacitors and the output. The equations below allow for finding the amount of attenuation that will come from a specific output filter inductance. An inductance of 500 nH was chosen to attenuate the output voltage ripple. The value was chosen to put the resonant frequency pole well before the switching frequency of the design as well as the zero from the ESR of the bulk capacitors to provide more attenuation. (38) (39) (40) (41) (42) (43) Sometimes the output filter can cause peaking at high frequencies, this can be damped by adding a resistor in parallel with the inductor which will decrease efficiency. For the UC1825B-SP design 0.5 Ω was used as a very conservative value. The resistance needed to damp the peaking can be calculated using the following equations: 6 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated System Design Theory www.ti.com (44) (45) (46) (47) 2.7 Compensation Type IIB compensation was picked for the topology, adding a pole and a zero to the frequency response. The location of where the pole and zero should be placed will depend on the desired crossover frequency and the ESR zero of the output capacitors. The zero in compensation should be placed at least a decade before the crossover frequency for the maximum phase boost. Note that compensation values were picked with a crossover frequency of 5 kHz in mind for this design. The pole from the compensation should be placed at the zero created by the ESR of the output capacitor. (48) (49) (50) The zero from compensation was placed well before the 500-Hz mark which is appropriate. The pole from compensation was optimized while the circuit was tested and thus it was found that placing the pole a little bit earlier smoothed out the frequency response. 2.8 Sense Resistor The sense resistor is used to sense the ripple current from the transformer as well as shutdown the switching cycle if the peak current of the converter is over the current limit set. The voltage threshold of the CS pin is around 1 V and the shutdown current should be above the max current you expect. What the max current limit will be will depend on the specific design. The equation used to find the max current limit is Equation 51. (51) (52) SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 7 Test Setup and Results www.ti.com 3 Test Setup and Results 3.1 Test Setup 5V LOUT Lp LFILTER Feedback Network Ls RFBU 10 V VBUS Vo CoCERM 48 - 22 V VCC/VC CoBULK OUTA Output OUTB Compensation Network RFBL VREF CHF EAOUT RCOMP Ro CCOMP Slope Compensation UC1825B-SP CT INV CCT SS RT RRAMP CSS RT ILIM/RAMP GND RCSF RCS Current Sense Filter CCSF Figure 1. Test Setup WARNING The UC1825BEVM-CVAL (EVM) is intended only for the developer’s evaluation of the UC1825B-SP Current Mode PWM Controller device. This EVM is not designed nor intended to simulate actual end product or subassembly applications involving high voltages often found in isolated topologies exceeding the specified electrical circuit ratings for UC1825BEVM-CVAL. To minimize potential risk of personal injury, death, or damage to the EVM itself, application of any differential voltages applied between the electrical grounds of each input and output side of the evaluation module is strictly prohibited. All tests were done with 10 VIN on the UC1825B-SP unless otherwise specified. Table 1. Test Parameters 8 PARAMETER SPECIFICATIONS Input Power Supply 22 to 48 VDC Output Voltage 5 VDC Output Current 0 to 10 A Output Current Pre-load 0.5 mA Operating Temperature 25°C Switching Frequency of UC1825B-SP 215 kHz Peak Input Current Limit 7A UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com Table 1. Test Parameters (continued) PARAMETER SPECIFICATIONS Bandwidth ~5 kHz Phase Margin ~80° SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 9 Test Setup and Results 3.2 www.ti.com Test Results 3.2.1 Efficiency 90% 85% 80% 75% 70% 65% 60% Efficiency 55% 50% 45% 40% 35% 30% 25% 20% 15% 10% 48 Vin 22 Vin 5% 0 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Output Current (A) 6.5 7 7.5 8 8.5 9 9.5 10 D001 Figure 2. Efficiency vs Output Current Please note that the test for Figure 2 was done such that the effect of the UC1825B-SP is not included in the efficiency measurement. The efficiency numbers are for the push-pull converter without the UC1825BSP included. Table 2. 48 VIN Efficiency Raw Data VIN IIN VOUT IOUT PIN POUT Efficiency 48.5 1.24 4.93 9.98 59.9 49.2 0.821 48.6 1.11 4.93 8.99 53.9 44.3 0.823 48.6 0.99 4.93 7.99 47.9 39.4 0.822 48.6 0.87 4.93 7.01 42.2 34.6 0.820 48.6 0.75 4.93 5.99 36.2 29.6 0.817 48.6 0.62 4.93 5.02 30.2 24.7 0.820 48.6 0.51 4.93 4.01 24.6 19.8 0.805 48.6 0.38 4.93 3.01 18.4 14.9 0.807 48.6 0.27 4.93 2.01 13.0 9.9 0.765 48.6 0.15 4.94 1.01 7.3 5.0 0.684 48.6 0.00 4.94 0.00 0.0 0.0 0.000 Table 3. 22 VIN Efficiency Raw Data 10 VIN IIN VOUT IOUT PIN POUT Efficiency 22.12 2.69 4.93 9.98 59.4 49.2 0.83 22.14 2.40 4.93 9.01 53.1 44.4 0.84 22.16 2.11 4.93 7.99 46.7 39.4 0.84 22.17 1.84 4.93 7.01 40.8 34.6 0.85 22.19 1.57 4.93 6.01 34.8 29.6 0.85 22.21 1.30 4.93 5.01 28.9 24.7 0.86 22.23 1.04 4.93 4.01 23.1 19.8 0.86 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com Table 3. 22 VIN Efficiency Raw Data (continued) 3.2.2 VIN IIN VOUT IOUT PIN POUT Efficiency 22.25 0.78 4.93 3.01 17.3 14.9 0.86 22.26 0.52 4.93 2.01 11.6 9.9 0.86 22.28 0.27 4.94 1.01 6.1 5.0 0.82 22.30 0.00 4.94 0.00 0.0 0.0 0.00 Load Regulation 4.9355 22 Vin 48 Vin 4.935 Output Voltage (V) 4.9345 4.934 4.9335 4.933 4.9325 4.932 4.9315 0 1 2 3 4 5 Output Current (A) 6 7 8 9 10 D002 Figure 3. Load Regulation vs Output Current The test for Figure 3 was done at different input voltages shown by the separate curves and taken over output current. Table 4. 48 VIN Load Regulation Raw Data VOUT IOUT 4.9327 9.98 4.9329 8.99 4.9331 7.99 4.9333 7.01 4.9336 5.99 4.9339 5.02 4.9342 4.01 4.9345 3.01 4.9349 2.01 4.935 1.01 4.9353 0.00 Table 5. 22 VIN Load Regulation Raw Data VOUT IOUT 4.9317 9.98 4.9317 9.01 SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 11 Test Setup and Results www.ti.com Table 5. 22 VIN Load Regulation Raw Data (continued) 3.2.3 VOUT IOUT 4.9319 7.99 4.9325 7.01 4.933 6.01 4.9334 5.014 4.9342 4.013 4.9345 3.013 4.9348 2.012 4.9353 1.011 4.9355 0 Frequency Response Figure 4. Frequency Response of 22 VIN Frequency response in Figure 4 was measured with 22 V on the input and with an output current of 10 A. Table 6. Frequency Response Characteristics of 22 VIN 12 PARAMETER VALUE Crossover Frequency 5.35 kHz Phase Margin 82.44° Phase Crossover 47.23 kHz Gain Margin –11.82 dB UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com Figure 5. Frequency Response of 48 VIN Frequency response in Figure 5 was measured with 48 V on the input and with an output current of 10 A. Table 7. Frequency Response Characteristics of 48 VIN 3.2.4 PARAMETER VALUE Crossover Frequency 5.06 kHz Phase Margin 80.33° Phase Crossover 43.53 kHz Gain Margin –15.60 dB Thermal Characteristics Figure 6. Thermal Characteristics With 22 VIN SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 13 Test Setup and Results www.ti.com Table 8. Notable Thermal Values for 22 VIN AREA TEMPERATURE Output Diode (D10 and D11) 62.0°C Resistor Snubber (R23 and R26) 59.7°C Output Filter Inductor (L1) 57.8°C Main Switching MOSFET (Q1 and Q2) 61.7°C Sense Resistors (R16 and R17) 82.0°C Transformer (T1) 80.0°C Thermal picture in Figure 6 was done with 22 V on the input and 10-A output for 20 minutes. Figure 7. Thermal Characteristics With 48 VIN Thermal picture in Figure 7 was done with 48 V on the input and 10-A output for 20 minutes. Table 9. Notable Thermal Values for 48 VIN 14 AREA TEMPERATURE Output Diode (D10 and D11) 87.9°C Resistor Snubber (R23 and R26) 83.1°C Output Filter Inductor (L1) 61.4°C Main Switching MOSFET (Q1 and Q2) 56.5°C Sense Resistors (R16 and R17) 56.7°C Transformer (T1) 91.9°C UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com 3.2.5 Output Voltage Ripple Figure 8. Output Voltage Ripple With 22 VIN Output voltage ripple test in Figure 8 was done with 22-V input and 10 A of output current. Figure 9. Output Voltage Ripple With 48 VIN Output voltage ripple test in Figure 9 was done with 48-V input and 10 A of output current. SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 15 Test Setup and Results 3.2.6 www.ti.com Transients Figure 10. Partial Step Down Transient With 22 VIN Partial step down transient in Figure 10 was done with 22-V input and current was stepped from 10 A to 0.16 A. Figure 11. Full Step Down Transient With 22 VIN Full step down transient in Figure 11 was done with 22-V input and current was stepped from 10 A to 0 A. 16 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com Figure 12. Full Step Up Transient With 22 VIN Step up transient in Figure 12 was done with 22-V input and current was stepped from 0 A to 10 A. Figure 13. Partial Step Down Transient With 48 VIN Partial step down transient in Figure 13 was done with 48-V input and current was stepped from 10 A to 0.16 A. SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 17 Test Setup and Results www.ti.com Figure 14. Full Step Down Transient With 48 VIN Full step down transient in Figure 14 was done with 48-V input and current was stepped from 10 A to 0 A. Figure 15. Full Step Up Transient With 48 VIN Full step up transient in Figure 15 was done with 48-V input and current was stepped from 0 A to 10 A. 18 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com 3.2.7 Startup Figure 16. No Load Startup With 22 VIN No load startup in Figure 16 was done with 22 V on the input and a 0-A output. Note that the output overshoot does eventually drop down to the regulated 5 V. Figure 17. Full Load Startup With 22 VIN Full load startup in Figure 17 was done with 22 V on the input and a 10-A output. SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 19 Test Setup and Results www.ti.com Figure 18. No Load Startup With 48 VIN No load startup in Figure 18 was done with 48 V on the input and a 0-A output. Note that the output overshoot does eventually drop down to the regulated 5 V. Figure 19. Full Load Startup With 48 VIN Full load startup in Figure 19 was done with 48 V on the input and a 10-A output. 20 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Test Setup and Results www.ti.com 3.2.8 Shutdown Figure 20. Full Load Shutdown With 22 VIN Full load shutdown in Figure 20 was done with 22 V on the input and a 10-A load on the output. Figure 21. Full Load Shutdown With 48 VIN Full load shutdown in Figure 21 was done with 48 V on the input and a 10-A load on the output. SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 21 Test Setup and Results 3.2.9 www.ti.com Component Stress Figure 22. Voltage Stress Across Main Switching MOSFETS Q1 and Q2 The test in Figure 22 was done with 48 V on the input and a 10-A output load. Figure 23. Voltage Stress Across Output Diode The test in Figure 23 was done with 48 V on the input and a 10-A output load. 22 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Board Layout www.ti.com 4 Board Layout Care was taken in the layout to ensure that high current path lengths were minimized as well as providing multiple layers for high current input/outputs. Signals were kept to the top layer, except when it was necessary to use the bottom layer. Internal layers were used for creating large planes for input/output current as well as the switch nodes of the topology. Areas that dissipate large amounts of power such as the RCD clamp and the sense resistors were placed on large copper planes in order to allow the thermal properties of the parts to keep the temperature down as much as possible. Care was also taken to have the high switching current path short. The switching current path starts at the input capacitors, through the transformer into the MOSFETs, and then finally through the sense resistors and back into the input capacitors. On the secondary side the high switching current path is from the ground of the output capacitors, through the transformer, and then to the output. Figure 24. Top Overlay SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 23 Board Layout www.ti.com Figure 25. Top Solder Figure 26. Top Layer 24 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Board Layout www.ti.com Figure 27. Signal Layer 1 Figure 28. Signal Layer 2 SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 25 Board Layout www.ti.com Figure 29. Bottom Layer Figure 30. Bottom Solder 26 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Board Layout www.ti.com Figure 31. Bottom Overlay SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 27 Board Layout www.ti.com Figure 32. Drill Drawing 28 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Board Layout www.ti.com Figure 33. Board Dimensions SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 29 Schematics and Bill of Materials 5 www.ti.com Schematics and Bill of Materials This section presents the UC1825BEVM-CVAL schematics and bill of materials. 5.1 Schematics The following figures show the UC1825BEVM-CVAL schematic. C31 R23 3.00 500V 4700pF D10 Switch Node2 1 2 R24 3 0.5 L1 VS-40CPQ060PBF Vout TP9 L2 J6 TP10 C32 50V 0.1uF 2.2uH C33 100V 4.7uF C34 100V 4.7uF C35 100V 4.7uF C36 100V 4.7uF C37 100V 2200pF DNP 500nH C43 100V 2200pF C44 50V 0.1uF C45 100V 4.7uF C46 16V 22uF C38 10V 220uF C39 10V 220uF C40 10V 220uF C41 10V 220uF C42 10V 220uF 634-10ABPE R25 10.0k D13 J5 Vo 1 J7 6V 1 2 3 4 2 3 4 5 H9 Vout C47 R26 PGND Vo 3.00 500V 4700pF PGND J8 DNP D11 Switch Node1 GND 1 2 PGND 3 Vout VS-40CPQ060PBF H10 R41 0 Vout TP11 R27 DNP 49.9 634-10ABPE 9 5 4 Driver A Driver B Status13 TP15 D12 360 2 1 VREF DRIVERA DRIVERB STATUS 3 6 NC NC 7 GND NI INV 10 11 COMP 12 EXTCLK 2 CT RT 1 8 +VIN 30.0k C51 14 10.0k R33 TP14 R29 40.2k C50 INV DNP 25V 2700pF R35 17.2k R32 2.05k R34 0 R37 R38 DNP 0 PGND R30 2.00k PGND 0.1uF 50V 100pF PGND 5962-8944101VCA C52 0.1uF C48 16V 0.22uF C49 R31 Green TP16 5002 TP12 U2 TP13 R36 R28 49.9 0 R42 0 Vout PGND C53 16V 2.2uF GND PGND PGND PGND TP17 TP18 PGND Figure 34. UC1825BEVM-CVAL Schematic 01 30 UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Schematics and Bill of Materials www.ti.com 1 Vin T1 13 14 Switch Node2 TP1 J1 3 2 DNP C1 100V 270uF J2 C2 100V 270uF 4 3 2 1 C3 100V 4.7uF C4 100V 4.7uF C5 100V 4.7uF C6 100V 4.7uF C7 100V 4.7uF C8 100V 4.7uF C9 100V 4.7uF R1 100k C11 C10 100V 100V .039uF 4.7nF R2 100k 11 12 C12 330pF D1 4 6 GND INV ILIM C15 1.46/(10k*680pF) = 215 kHz R6 10.0k CT C16 RAMP 0.68nF 13 VC 2 1 NI INV 8 Soft Start E/AOUT 3 Clock 4 ILIM/SD 5 RT GND 10 6 CT Pwr Gnd 12 7 Ramp EP 17 D4 D5 Vref C13 50V 2200pF C14 25V 0.47uF GND GND R5 Out A D6 R11 50V 2200pF C20 C24 50V 470pF DNP 8 2 3 TP4 NC NC Driver A 5 NC NC GND R14 ILIM R15 1.47k 6 7 RAMP 1.47k R16 0.3 C22 50V 56pF GND Driver B DNPC19 50V 0.01uF C21 50V 2200pF R12 47.5k 0.12µF 4 R10 31.6k DNP 50V 120pF EA OUT 4.75k C18 GND R17 0.3 Q3 1 CT R8 DNP 1.00k NV DIODE R18 DNP 49.9 R7 10.0k GND T2 1 Vref CT R9 49.9k C17 GND TP3 Q2 1 10.0 GND GND INV R4 10.0k Vref GND D7 4 Vcc EA OUT 5962R8768106VYC GND TP2 2.2:1.5:1 120 uH Q1 1 10.0 Out B 16 VREF 5.1 V 9 750318061 R3 Out B 3 NV Out A 11 14 OUTA OUTB 4 GND VCC 3 GND 15 3 Vcc Switch Node1 5 Vaux ES3D-E3/57T D3 U1 DNP PGND GND Vin J3 7 8 ES3D-E3/57T D2 Vcc 2 Vin 15nF 9 10 C23 50V 56pF 750311765 GND Vref R13 2.74k TP5 GND GND TP6 INV R21 9.76k R19 2.74k C25 50V 220pF R39 DNP 0 Vaux Vin GND R20 DNP 10.0 R22 DNP 2.00k R40 DNP 2.00k D8 MURA110T3G DNPC27 0.01uF C28 0.1uF C29 1uF C30 1uF C26 50V 100uF D9 SMAZ18-13-F 18V Vcc J4 2 1 10 to 20 V TP7 TP8 GND GND GND GND Figure 35. UC1825BEVM-CVAL Schematic 02 SLUUBZ0 – March 2019 Submit Documentation Feedback UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 31 Schematics and Bill of Materials 5.2 32 www.ti.com Bill of Materials UC1825B-SP evaluation module (EVM) SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Schematics and Bill of Materials www.ti.com Table 10. Bill of Materials Designator Quantity Value Description PackageReference PartNumber Manufacturer !PCB1 1 Printed Circuit Board C1, C2 2 270uF CAP, AL, 270 uF, 100 V, +/- 20%, 0.033 ohm, TH SLHR018 Any D12.5xL30mm EKYB101ELL271MK30S Chemi-Con C3, C4, C5, C6, C7, C8, C9, C33, C34, C35, C36, C45 12 4.7uF CAP, CERM, 4.7 uF, 100 V, +/- 10%, X7S, AEC-Q200 Grade 1, 1210 1210 CGA6M3X7S2A475K200AB TDK C10 1 0.039uF CAP, CERM, 0.039 uF, 100 V, +/- 10%, X7R, 0603 0603 C0603C393K1RACTU Kemet C11 1 4700pF CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0603 0603 06031C472KAT2A AVX C12 1 330pF CAP, CERM, 330 pF, 630 V,+/- 5%, C0G/NP0, 1206 1206 GRM31A5C2J331JW01D MuRata C13, C17, C21 3 2200pF CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R, 0603 0603 C0603C222K5RACTU Kemet C14 1 0.47uF CAP, CERM, 0.47 uF, 25 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0603 0603 CGA3E3X7R1E474K080AB TDK C15 1 Cap Ceramic 0.015uF 50V X7R 10% Pad SMD 0603 0603 125°C T/R C0603C153K5RACTU Kemet C16 1 YAGEO (PHYCOMP) CC0603KRX7R9BB681 SMD Multilayer Ceramic Capacitor, 0603 [1608 Metric], 680 pF, 50 V, 10%, X7R, CC Series 0603 (1608 Metric) CC0603KRX7R9BB681 YAGEO C20 1 CAP Ceramic 0.12uF 10% X7R 0603 SMD 0603 (1608 metric) C0603C124K3RAC7867 KEMET C22, C23 2 56pF CAP, CERM, 56 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 06035A560JAT2A AVX C24 1 470pF CAP, CERM, 470 pF, 50 V, +/- 10%, X7R, 0603 0603 885012206081 Wurth Elektronik C25 1 220pF CAP, CERM, 220 pF, 50 V, +/- 10%, X7R, 0603 0603 C0603C221K5RACTU Kemet C26 1 100uF CAP, AL, 100 uF, 50 V, +/- 20%, 0.12 ohm, TH CAP, 8x11.5mm 50ZLJ100MT78X11.5 Rubycon 0603 CGA3E2X7R1H104K080AA TDK C28, C49, C52 3 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0603 C29, C30 2 1uF CAP, CERM, 1 uF, 50 V, +/- 10%, X7R, 0603 0603 UMK107AB7105KA-T Taiyo Yuden C31, C47 2 4700pF CAP, CERM, 4700 pF, 500 V, +/- 10%, X7R, 1210 1210 VJ1210Y472KXEAT5Z Vishay-Vitramon C32, C44 2 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 1210 1210 C1210C104K5RACTU Kemet 0805 08051C222KAT2A AVX C37, C43 2 2200pF CAP, CERM, 2200 pF, 100 V, +/- 10%, X7R, 0805 C38, C39, C40, C41, C42 5 220uF CAP, TA, 220 uF, 10 V, +/- 10%, 0.045 ohm, SMD 7343-43 T495X227K010ATE045 Kemet C46 1 22uF CAP, CERM, 22 uF, 16 V, +/- 20%, X7R, AECQ200 Grade 1, 1210 1210 CGA6P1X7R1C226M250AC TDK SLUUBZ0 – March 2019 Submit Documentation Feedback Alternate PartNumber Alternate Manufacturer UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 33 Schematics and Bill of Materials www.ti.com Table 10. Bill of Materials (continued) Designator Quantity Value Description PackageReference PartNumber Manufacturer C48 1 0.22uF CAP, CERM, 0.22 uF, 16 V, +/- 10%, X7R, 0603 0603 885012206048 Wurth Elektronik C51 1 100pF CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 885012006057 Wurth Elektronik C53 1 2.2uF CAP, CERM, 2.2 uF, 16 V,+/- 10%, X7R, 0603 0603 EMK107BB7225MA-T Taiyo Yuden D1, D2 2 200V Diode, Ultrafast, 200 V, 3 A, SMC SMC ES3D-E3/57T Vishay-Semiconductor D3, D4, D5, D6 4 30V Diode, Schottky, 30 V, 1 A, SMA SMA B130-13-F Diodes Inc. D7 1 75V Diode, Switching, 75 V, 0.3 A, SOD-523F SOD-523F 1N4148WT Fairchild Semiconductor D8 1 100V Diode, Ultrafast, 100 V, 2 A, SMA SMA MURA110T3G ON Semiconductor D9 1 18V Diode, Zener, 18 V, 1 W, AEC-Q101, SMA SMA SMAZ18-13-F Diodes Inc. D10, D11 2 60V Diode, Schottky, 60 V, 40 A, TH TO-247 VS-40CPQ060PBF Vishay-Semiconductor D12 1 Green LED, Green, SMD 2x1.4mm LG M67K-G1J2-24-Z OSRAM D13 1 6V Diode, Zener, 6 V, 500 mW, SOD-123 SOD-123 MMSZ5233B-7-F Diodes Inc. Screw NY PMS 440 0025 PH B&F Fastener Supply Standoff 1902C Keystone 16.26x25.4x16.26 mm 634-10ABPE Wakefield-Vette Terminal Block, 4x1, 5.08mm, TH 4x1 Terminal Block 39544-3004 Molex ED120/2DS On-Shore Technology H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon H9, H10 2 J2, J7 2 J4 1 Terminal Block, 5.08 mm, 2x1, Brass, TH 2x1 5.08 mm Terminal Block J5 1 Compact Probe Tip Circuit Board Test Points, TH, 25 per TH Scope Probe 131-5031-00 Tektronix L1 1 2.2uH Inductor, Shielded Drum Core, Mn-Zn, 2.2 uH, 28 A, 0.0015 ohm, SMD 21.8x14.5x21.5mm 7443630220 Wurth Elektronik L2 1 500nH Inductor, Shielded, Ferrite, 500 nH, 12 A, 0.0066 ohm, AEC-Q200 Grade 1, SMD 8x8x4.5 mm SRN8040TA-R50Y Bourns Q1, Q2 2 250V MOSFET, N-CH, 250 V, 25 A, DDPAK DDPAK IPB600N25N3 G Infineon Technologies Q3 1 40 V Transistor, NPN, 40 V, 0.2 A, SOT-323 SOT-323 MMBT3904WT1G ON Semiconductor R1, R2 2 100k RES, 100 k, 1%, 1 W, AEC-Q200 Grade 0, 2512 2512 CRCW2512100KFKEG Vishay-Dale R3, R5 2 10.0 RES, 10.0, 1%, 0.1 W, 0603 0603 RC0603FR-0710RL Yageo America R4, R6, R7, R33 4 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF1002V Panasonic R9 1 49.9k RES, 49.9 k, 1%, 0.1 W, 0603 0603 RC0603FR-0749K9L Yageo 0603 CRCW060331K6FKEA Vishay-Dale 0603 CRCW06034K75FKEA Vishay-Dale R10 1 31.6k RES, 31.6 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 R11 1 4.75k RES, 4.75 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 34 UC1825B-SP evaluation module (EVM) Alternate PartNumber Alternate Manufacturer None SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Schematics and Bill of Materials www.ti.com Table 10. Bill of Materials (continued) Designator Quantity Value Description PackageReference PartNumber Manufacturer R12 1 47.5k RES, 47.5 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 ERJ-3EKF4752V Panasonic R13, R19 2 2.74k RES, 2.74 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06032K74FKEA Vishay-Dale R14, R15 2 1.47k RES, 1.47 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K47FKEA Vishay-Dale R16, R17 2 0.3 RES, 0.3, 1%, 2 W, 2512 2512 CSRN2512FKR300 Stackpole Electronics Inc 0603 CRCW06039K76FKEA Vishay-Dale R21 1 9.76k RES, 9.76 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 R23, R26 2 3.00 RES, 3.00, 1%, 1 W, 2512 2512 ERJ-1TRQF3R0U Panasonic R24 1 0.5 RES, 0.5, 1%, 1 W, 2010 2010 CSRN2010FKR500 Stackpole Electronics Inc R25 1 10.0k RES, 10.0 k, 0.1%, 0.063 W, 0402 0402 MCR01MRTF1002 Rohm R28 1 49.9 RES, 49.9, 1%, 0.1 W, 0603 0603 RC0603FR-0749R9L Yageo America 0603 CRCW060340K2FKEA Vishay-Dale R29 1 40.2k RES, 40.2 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 R30 1 2.00k RES, 2.00 k, 1%, 0.1 W, 0603 0603 RC0603FR-072KL Yageo America R31 1 30.0k RES, 30.0 k, 1%, 0.1 W, 0603 0603 RC0603FR-0730KL Yageo R32 1 2.05k RES, 2.05 k, 1%, 0.1 W, 0603 0603 RC0603FR-072K05L Yageo R34, R37 2 0 RES, 0, 5%, 0.25 W, 1206 1206 RC1206JR-070RL Yageo America R35 1 17.2k RES, 17.2 k, 0.1%, 0.1 W, 0603 0603 RT0603BRD0717K2L Yageo America 0603 CRCW0603360RJNEA Vishay-Dale R36 1 360 RES, 360, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 R41, R42 2 0 RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 RMCF0603ZT0R00 Stackpole Electronics Inc T1 1 TRANSFORMER PTH_25MM0_22MM2 750318061 Wurth Electronics TP1, TP9, TP10 3 Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone TP2, TP3, TP4, TP5, TP6, TP11, TP12, TP13, TP14, TP15, TP16 11 Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone TP7, TP8, TP17, TP18 4 Test Point, Miniature, Black, TH Black Miniature Testpoint 5001 Keystone U1 1 RAD-TOLERANT CLASS V, HIGH-SPEED PWM CONTROLLER, HKT0016A (CFP-16) HKT0016A 5962R8768106VYC Texas Instruments U2 1 Isolated Feedback Generator, -55 to 125 degC, J0014A 14-pin CDIP (J) 5962-8944101VCA Texas Instruments C18 0 120pF CAP, CERM, 120 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 GRM1885C1H121JA01D MuRata C19 0 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 10%, X7R, 0603 0603 CL10B103KB8NCNC Samsung ElectroMechanics SLUUBZ0 – March 2019 Submit Documentation Feedback Alternate PartNumber Alternate Manufacturer Texas Instruments UC1825B-SP evaluation module (EVM) Copyright © 2019, Texas Instruments Incorporated 35 Schematics and Bill of Materials www.ti.com Table 10. Bill of Materials (continued) Designator Quantity Value Description PackageReference PartNumber Manufacturer C27 0 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 10%, X7R, 0603 0603 GRM188R71H103KA01D MuRata C50 0 2700pF CAP, CERM, 2700 pF, 25 V, +/- 10%, X7R, 0603 0603 GRM188R71E272KA01D MuRata FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A J1, J6 0 Banana Jack Insul Nylon Red, R/A, TH CTE_CT3151SP-2 CT3151SP-2 Cal Test Electronics J3, J8 0 Banana Jack Insul Nylon Black, R/A, TH CTE_CT3151SP-0 CT3151SP-0 Cal Test Electronics R8 0 1.00k RES, 1.00 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K00FKEA Vishay-Dale R18, R27 0 49.9 RES, 49.9, 1%, 0.1 W, 0603 0603 RC0603FR-0749R9L Yageo America R20 0 10.0 RES, 10.0, 1%, 0.25 W, 1206 1206 RC1206FR-0710RL Yageo America 2512 CRCW25122K00FKEG Vishay-Dale R22, R40 0 2.00k RES, 2.00 k, 1%, 1 W, AEC-Q200 Grade 0, 2512 R38 0 0 RES, 0, 0%, W, AEC-Q200 Grade 0, 0805 0805 PMR10EZPJ000 Rohm R39 0 0 RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 RMCF0603ZT0R00 Stackpole Electronics Inc T2 0 1.2mH Transformer, 1200 uH, SMD 8.64x9.02mm 750311765 Wurth Elektronik 36 UC1825B-SP evaluation module (EVM) Alternate PartNumber Alternate Manufacturer SLUUBZ0 – March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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UC1825BEVM-CVAL
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