UC1846-DIE
www.ti.com
SGLS409 – NOVEMBER 2012
CURRENT-MODE PWM CONTROLLER
FEATURES
1
•
•
•
•
•
Automatic Feed-Forward Compensation
Programmable Pulse-by-Pulse Current
Limiting
Automatic Symmetry Correction in Push-Pull
Configuration
Enhanced Load-Response Characteristics
Parallel Operation Capability for Modular
Power Systems
•
•
•
•
•
Differential Current-Sense Amplifier With Wide
Common-Mode Range
Double Pulse Suppression
Undervoltage Lockout
Soft-Start Capability
Shutdown Terminal
DESCRIPTION
The UC1846 control IC provides all of the necessary features to implement fixed-frequency, current-mode control
schemes, while maintaining a minimum external parts count. The superior performance of this technique can be
measured in improved line regulation, enhanced load-response characteristics, and a simpler, easier-to-design
control loop. Topological advantages include inherent pulse-by-pulse current-limiting capability, automatic
symmetry correction for push-pull converters, and the ability to parallel power modules, while maintaining equal
current sharing.
Protection circuitry includes built-in undervoltage lockout and programmable current limit, in addition to soft-start
capability. A shutdown function is also available, which can initiate either a complete shutdown with automatic
restart or latch the supply off.
Other features include fully latched operation, double pulse suppression and deadline adjust capability.
The UC1846 features low outputs in the OFF state.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
UC1846
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
UC1846VTD1
100
UC1846VTD2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
UC1846-DIE
SGLS409 – NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
AlCu2
2000 nm
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
UC1846-DIE
www.ti.com
SGLS409 – NOVEMBER 2012
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
C/S SS
1
2174.24
1661.16
2280.92
1767.84
VREF
2
2235.2
2026.92
2341.88
2133.6
C/S-
3
1996.44
2219.96
2103.12
2326.64
C/S+
4
1635.76
2219.96
1742.44
2326.64
E/A+
5
467.36
2219.96
574.04
2326.64
2326.64
E/A-
6
289.56
2219.96
396.24
COMP
7
142.24
1671.32
248.92
1778
CT
8
157.48
1270
264.16
1376.68
1046.48
RT
9
157.48
939.8
264.16
Sync
10
157.48
172.72
264.16
279.4
A Out
11
772.16
213.36
889
350.52
GND
12
1346.2
81.28
1463.04
208.28
VC
13
1341.12
472.44
1468.12
645.16
B Out
14
1920.24
213.36
2037.08
350.52
VIN
15
2255.52
320.04
2362.2
426.72
Shutdown
16
2214.88
1107.44
2321.56
1214.12
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Mar-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
UC1846VTD1
ACTIVE
0
100
RoHS & Green
Call TI
N / A for Pkg Type
-55 to 125
UC1846VTD2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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