PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9203101M2A
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
5962-9203101MEA
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
5962-9203102MEA
OBSOLETE
CDIP
J
16
Call TI
Call TI
5962-9203103Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9203103QEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
TBD
POST-PLATE N / A for Pkg Type
N / A for Pkg Type
UC1861J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1861J883B
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1863J
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
UC1863J883B
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
UC1863L
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
UC1863L883B
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
UC1864J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1864J883B
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1864L
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
UC1864L883B
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
UC1865J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1865J883B
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1867J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
Call TI
UC1867L
OBSOLETE
LCCC
FK
20
TBD
Call TI
UC2861DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2861DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2861N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2861NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2861Q
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2861QG3
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2863DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2863DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2863N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2863NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2864DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2864DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2865N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2865NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UC2866N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2866NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3861DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3861DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3861N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3861NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3862N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3862NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3863DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3863DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3863DWTR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3863DWTRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3863N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3863NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3864N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3864NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3865DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3865DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3865DWTR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3865DWTRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3865N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3865NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3865Q
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3865QG3
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3867DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UC3867DWG4
ACTIVE
SOIC
DW
16
UC3867DWTR
ACTIVE
SOIC
DW
UC3867DWTRG4
ACTIVE
SOIC
UC3867N
ACTIVE
UC3867NG4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3868N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3868NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1861, UC1863, UC1864, UC1865, UC1867, UC3861, UC3863, UC3864, UC3865, UC3867 :
• Space: UC1863-SP
NOTE: Qualified Version Definitions:
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
UC3863DWTR
SOIC
DW
16
2000
330.0
16.4
10.85
10.8
2.7
12.0
16.0
Q1
UC3865DWTR
SOIC
DW
16
2000
330.0
16.4
10.85
10.8
2.7
12.0
16.0
Q1
UC3867DWTR
SOIC
DW
16
2000
330.0
16.4
10.85
10.8
2.7
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC3863DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
UC3865DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
UC3867DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
Pack Materials-Page 2
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