UC1705
UC2705, UC3705
www.ti.com
SLUS370D – JULY 1995 – REVISED MARCH 2012
HIGH SPEED POWER DRIVER
Check for Samples: UC1705, UC2705, UC3705
FEATURES
1
•
•
•
•
•
1.5 A Source/Sink Drive
100 nsec Delay
40 nsec Rise Fall into 1000 pF
Inverting and Non-Inverting Inputs
Low Cross-Conduction Current Spike
•
•
•
•
Low Quiescent Current
5 V to 40 V Operation
Thermal Shutdown Protection
Minidip and Power Packages
DESCRIPTION
The UC1705 family of power drivers is made with a high sppeed Schottky process to interface between low-level
control functions and high-power switching devices - particularly power MOSFETs. These devices are also an
optimum choise for capacitive line drivers where up to 1.5 A may be switched in either direction. With both
inverting and non-inverting inputs available, logic signals of either polarity may be accepted, or one input can be
used to gate or strobe the other.
Supply voltages for both VS and VC can independently range from 5 V to 40 V. For additional application details,
see the UC1707/3707 data sheet (SLUS177).
The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55°C to 125°C operation. The UC3705 is
specified for a temperature range of 0°C to 70°C and is available in either a plastic minidip or a 5-pin, power
TO-220 package.
TRUTH TABLE (1) (2)
(1)
(2)
INV
N.I
OUT
H
H
L
L
H
H
H
L
L
L
L
L
OUT = INV and N.I.
OUT = INV and N.i.
BLOCK DIAGRAM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2012, Texas Instruments Incorporated
UC1705
UC2705, UC3705
SLUS370D – JULY 1995 – REVISED MARCH 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
DIL-8 MINIDIP, SOIC-8
(TOP VIEW)
N, JG OR D PACKAGE
xxx
VS
1
8 N.I. IN
VC 2
7 INV. IN
N/C 3
OUT 4
6
5-PIN TO-220
(TOP VIEW)
T PACKAGE
xxx
5
4
3
2
1
N.I. IN
INV. IN
GND
OUT
VC + VS
LOGIC
GND
5 PWR
GND
N/C
5
17
PWR GND
N/C
6
16
OUT
N/C
7
15
VC
N/C
8
14
9 10 11 12 13
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N/C
N/C
N/C
N/C
1 20 19
18
N/C
4
VS
N/C
N/C
2
N/C
2
LOGIC GND
INV. IN
3
N/C
N.I. IN
LCCC-20
(TOP VIEW)
FK PACKAGE
xxx
Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
UC1705
UC2705, UC3705
www.ti.com
SLUS370D – JULY 1995 – REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
UNIT
N-Pkg
JG-Pkg
T-Pkg
Supply Voltage (VIN)
40
40
40
Collector Supply Voltage, VC
40
40
40
Steady-State
±500
±500
±1
A
Peak Transient
±1.5
±1
±2
A
µJ
V
Output current (source or sink)
Capacitive Discharge Energy
Digital Inputs
(2)
Power Dissipation at TA = 25°C
(1)
Power Dissipation at TA (Lead/Case) = 25°C
(1)
Operating Temperature Range
Storage temperaturee
(1)
(2)
20
15
50
5.5
5.5
5.5
V
1
1
3
W
3
2
25
W
0 to 70
–55 to 125
0 to 70
°C
–65 to 150
–65 to 150
–65 to 150
°C
All currents are positive into, negative out of the specified terminal.
Digital Drive can exceed 5.5 V if the input current is limited to 10 mA
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, these specifications apply for TA = –55°C to +125°C for the UC1705, –25°C to +85°C for the
UC2707, and 0°C to +70°C for the UC3705; VIN = VC = 20 V. TA = TJ.
PARAMETER
TYP
MAX
VS = 40 V, outputs high, T package
TEST CONDITIONS
MIN
6
8
UNIT
mA
VS
Supply current
VC = 40 V, outputs low, T package
6
12
mA
VC
Supply current (N, JG Only)
VC = 40 V, outputs low
2
4
mA
VC
Leakage current (N, JG Only)
VS = 0, VC = 30 V
0.05
0.1
mA
0.8
V
Digital input low level
Digital input high level
2.2
VI = 0
–0.6
–1
mA
Input leakage
VI = 5 V
0.05
0.1
mA
IO = –50 mA
VC – VO Output high saturation
VO
V
Input current
Output low saturation
2
IO = –500 mA
2.5
IO = –50 mA
0.4
IO = –500 mA
2.5
Thermal shutdown
155
Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
Submit Documentation Feedback
V
V
°C
3
UC1705
UC2705, UC3705
SLUS370D – JULY 1995 – REVISED MARCH 2012
www.ti.com
TYPICAL SWITCHING CHARACTERISTICS
VIN = VC = 20 V, TA = 25°C. Delays measured to 10% output change.
PARAMETER
TEST CONDITIONS
OUTPUT CL =
From Inv. Input to Output
UNIT
open
1
2.2
nF
Rise time delay
60
60
60
ns
10% to 90% rise
20
40
60
ns
Fall time delay
60
60
60
ns
90% to 10% fall
25
40
50
ns
Rise time delay
90
90
90
ns
10% to 90% rise
20
40
60
ns
Fall time delay
60
60
60
ns
90% to 10% fall
25
40
50
ns
From N.I. Input to Output
VC cross-conduction current spike duration Output rise
Output fall
4
Submit Documentation Feedback
25
ns
0
ns
Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
UC1705
UC2705, UC3705
www.ti.com
SLUS370D – JULY 1995 – REVISED MARCH 2012
APPLICATION INFORMATION
D1, D2: UC3611 Schottky Diodes
Figure 1. Power MOSFET Drive Circuit
D1, D2: UC3611 Schottky Diodes
Figure 3. Transformer Coupled MOSFET DRIVE
Circuit
D1
D2
D1, D2: UC3611 Schottky Diodes
Figure 2. Power MOSFET Drive Circuit Using
Negative Bias Voltage and Level Shifting to
Ground Referenced PWMs
D1
D2
Figure 4. Charge Pump Circuit
Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
Submit Documentation Feedback
5
UC1705
UC2705, UC3705
SLUS370D – JULY 1995 – REVISED MARCH 2012
www.ti.com
REVISION HISTORY
Changes from Revision C (December, 2011) to Revision D
•
6
Page
Deleted SN54BCT373 from title for FK package image ....................................................................................................... 2
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Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
5962-9579801M2A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
59629579801M2A
UC1705L/
883B
5962-9579801MPA
ACTIVE
CDIP
JG
8
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
9579801MPA
UC1705
Samples
5962-9579801VPA
ACTIVE
CDIP
JG
8
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
9579801VPA
UC1705
Samples
UC1705J
ACTIVE
CDIP
JG
8
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
UC1705J
Samples
UC1705J883B
ACTIVE
CDIP
JG
8
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
9579801MPA
UC1705
Samples
UC1705L883B
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
59629579801M2A
UC1705L/
883B
UC2705D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2705D
Samples
UC2705DG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2705D
Samples
UC2705N
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
UC2705N
Samples
UC3705D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3705D
Samples
UC3705DTR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3705D
Samples
UC3705J
ACTIVE
CDIP
JG
8
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
0 to 70
UC3705J
Samples
UC3705N
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
0 to 70
UC3705N
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2022
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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