UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
BUCK CURRENT/VOLTAGE FED PUSH-PULL
PWM CONTROLLERS
Check for Samples: UC2827-1, UC2827-2, UC3827-1, UC3827-2
FEATURES
1
•
•
•
•
•
•
•
•
DESCRIPTION
Ideal for Multiple Output and/or High
Voltage Output Voltage Converters
Up to 500 kHz Operation
High Voltage, High Current Floating
Driver for Buck Converter Stage
UC3827-1 Current Fed Controller has
Push-Pull Drivers with Overlapping
Conduction Periods
UC3827-2 Voltage Fed Controller has
Push-Pull Drivers with Nonoverlapping
Conduction Periods
Average Current Mode, Peak Current
Mode or Voltage Mode with Input
Voltage Feedforward Control for Buck
Power Stage
Wide Bandwidth, Low Offset,
Differential Current Sense Amplifier
Precise Short Circuit Current Control
The UC3827 family of controller devices provides an
integrated control solution for cascaded buck and
push-pull converters. These converters are known as
current fed or voltage fed push-pull converters and
are ideally suited for multiple output and/or high
voltage output applications. In both current fed and
voltage fed modes, the push-pull switches are driven
at 50% nominal duty cycles and at one half the
switching frequency of the buck stage. In the current
fed mode, the two switches are driven with a
specified over-lap period to prevent ringing and
voltage stress on the devices. In the voltage fed
mode, the two switches are driven with a specified
gap time between the switches to prevent shorting
the transformer across the energy storage capacitor
and to prohibit excessive currents flowing through the
devices.
The converter's output voltage is regulated by pulse
width modulation of the buck switch. The UC3827
contains complete protection and PWM control
functions for the buck converter. Easy control of the
floating switch is accomplished by the floating drive
circuitry. The gate drive waveform is level shifted to
support an input voltage up to 72 VDC.
BLOCK DIAGRAM
VEAOCEA+
10
12
CEAO
6
RAMP
5
Voltage Error
Amplifier
14
VEA−
16
CEA−
13
CSAO
7
CSA+
8
CSA−
9
SS
4
0.7 V
Current Error
Amplifier
PWM Comparator
+
VEA+
RD
Flying
Driver
+3 V
S
ILIM Comparator
Current Sense
Amplifier
SYNC
19
CT
18
OSC
RT
17
500 kHz
MAX
REF
15
VCC
23
GND
11
SS
INHBT
Q
1
V+
2
BUCK
3
SRC
21
PGND
24
PUSH
22
PULL
OSC
UV
Q
DELAY
T
Push/Pull
Drivers
Q
REF
&
UVLO UVLO
DELAY
20
DELAY
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2011, Texas Instruments Incorporated
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
DESCRIPTION (CONTINUED)
The UC3827 can be set up in traditional voltage mode control using input voltage feedforward technique or in
current mode control. Using current mode control prevents potential core saturation of the push-pull transformer
due to mismatches in timing and in component tolerances. With average current mode control, precise control of
the inductor current feeding the push-pull stage is possible without the noise sensitivity associated with peak
current mode control. The UC3827 average current mode loop can also be connected in parallel with the voltage
regulation loop to assist only in fault conditions.
Other valuable features of the UC3827 include bidirectional synchronization capability, user programmable
overlap time (UC3827-1), user programmable gap time (UC3827-2), a high bandwidth differential current sense
amplifier, and soft start circuitry.
ORDERING INFORMATION (1)
TA = TJ
-40°C to 85°C
0°C to 70°C
(1)
PACKAGES
PUSH-PULL TOPOLOGY
SOIC-24
PDIP-24
PLCC-28
-
Current Fed
UC2827DW-1
UC2827N-1
Voltage Fed
UC2827DW-2
UC2827N-2
-
Current Fed
UC3827DW-1
UC3827N-1
UC3827Q-1
Voltage Fed
UC3827DW-2
UC3827N-2
-
The DW and Q packages are also available taped and reeled. Add a TR suffix to the device type (i.e., UC2827DWTR-1).
THERMAL INFORMATION
THERMAL METRIC
(1)
θJA
Junction-to-ambient thermal resistance
θJCtop
Junction-to-case (top) thermal resistance (2)
(1)
(2)
UC2827-1,
UC2827-2,
UC3827-1,
UC3827-2
UC2827-1,
UC2827-2,
UC3827-1,
UC3827-2
N
J
24 PINS
24 PINS
60
70 to 80
30
28
UNITS
°C/W
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
THERMAL INFORMATION
UC2827-1,
UC2827-2,
UC3827-1,
UC3827-2
THERMAL METRIC
DW
Junction-to-ambient thermal resistance (2)
θJA
θJCtop
(1)
(2)
(3)
2
Junction-to-case (top) thermal resistance
(3)
UC2827-1,
UC2827-2,
UC3827-1,
UC3827-2
UNITS
(1)
QLCC
28 PINS
28 PINS
71 to 83
40 to 65
24
30
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Copyright © 1999–2011, Texas Instruments Incorporated
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
UC2827-1
UC2827-2
UC3827-1
UC3827-2
Supply voltage, VCC
20
CEAO, CEA+, CEA-, CSAO, CSA+, CSA-, CT, DELAY, PUSH, PULL,
RAMP, RT, SS, SYNC, VEA+, VEAO,
Input voltage range
–0.3 to 5
V+ and BUCK
90-VCC
±250
mA
±1
A
I/O continuous
±200
mA
I/O peak
±0.8
A
I/O continuous
BUCK driver
I/O peak
PUSH/PULL driver
V
90
SRC
Storage temperature
–65 to 150
Junction temperature
–55 to 150
Lead temperature (soldering, 10 sec)
(1)
UNITS
°C
300
Voltages are referenced to ground. Currents are positive into, negative out of the specified terminal. Consult Packaging section of
databook for thermal limitations and considerations of packages.
ELECTRICAL CHARACTERISTICS
Unless otherwise spsecified, VVCC = 15 V, VV+ = 14.3 V, CCT = 340 pF, RRT = 10 kΩ, RDELAY = 24.3 kΩ, VSRC = VGND = VBUCK=
VPUSH = VPULL outputs no load, TJ = TA
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
8.3
8.8
9.5
0.9
1.2
UNIT
SUPPLY
VCC UVLO, Turn-on
Hysteresis
IVCC
Supply current start
IVCC
Supply current run
1.5
V
1000
µA
32
45
mA
1
2
mA
VVCC = 8 V
IV+ buck high
0.2
V
VOLTAGE ERROR AMPLIFIER
IB
0.5
VIO
AVOL
GBW (1)
Gain bandwidth
VOL
Low-level output voltage
IVEAO = 0 µA (No load)
VOH
High-level output voltage
IVEAO = 0 µA (No load)
3
µA
10
mV
80
95
dB
1
4
MHz
2.85
0.3
0.5
V
3
3.20
V
–1
–5
µA
5
mV
CURRENT SENSE AMPLIFIER
IB
VIO
AVOL
GBW
(1)
Gain bandwidth
VOL
Low-level output voltage
ICEAO = 0 µA (No load)
VOH
High-level output voltage
ICEAO = 0 µA (No load)
CMRR
Common mode range (1)
(1)
80
110
dB
15
29
MHz
0.25
3
-0.3
0.5
3.3
V
V
2
V
Ensured by design. Not production tested.
Copyright © 1999–2011, Texas Instruments Incorporated
3
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise spsecified, VVCC = 15 V, VV+ = 14.3 V, CCT = 340 pF, RRT = 10 kΩ, RDELAY = 24.3 kΩ, VSRC = VGND = VBUCK=
VPUSH = VPULL outputs no load, TJ = TA
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
–1
–5
µA
10
mV
CURRENT ERROR AMPLIFIER
IB
VIO
AVOL
GBW (2)
Gain bandwidth
At 100 kHz, Measure Gain
VOL
ICEAO = 0 µA (No Load)
VOH
ICEAO = 0 µA (No Load)
CMRR
80
110
dB
2
4.5
MHz
0.25
3.3
Common mode range (2)
0.5
3.5
-0.3
V
V
5
V
OSCILLATOR SECTION
fOSC
Frequency
ICT(dsch)
CT discharge current
180
3.5V at CT when CT removed
220
250
5
kHz
mA
PWM COMPARATOR
DMAX
Minimum duty cycle
200 kHz
DMAX
Maximum duty cycle
200 kHz
0%
85%
91%
95%
BUCK OUTPUT STAGE
tRISE
Rise time
1 nF Load (3)
40
100
ns
tFALL
Fall tIme
1 nF, Load
30
80
ns
IBUCK = –15 mA , V+ –BUCK (4)
1.5
2.5
V
VOH
High-level output voltage
VOL
IBUCK = –150 mA, V+ –BUCK
(4)
IBUCK = 15 mA (5)
Low-level output voltage
IBUCK = 150 mA
(5)
2
2.5
V
0.2
0.4
V
0.7
1.2
V
PUSH/PULL OUTPUT STAGES
tRISE
Rise time
1 nF load
50
100
ns
tFALL
Fall tIme
1 nF load
35
100
ns
Overlap time
Nonoverlapping time
(7)
UCx827-1 1 nF loads (6)
100
250
400
ns
UCx827-2
100
250
500
ns
2
3
V
2.5
3
V
0.2
0.8
V
0.6
1.2
V
IPUSH/PULL = –10 mA, VCC – PUSH
(8)
VOH
High-level output voltage
VOL
Low-level output voltage
IPUSH/PULL = –100 mA, VCC –
PUSH (8)
IPUSH/PULL = 10 mA
(8)
IPUSH/PULL = 100 mA (8)
REFERENCE
Reference voltage
ISC
4.8
5
5.2
V
–35
–50
–65
mA
0.5V < VVCC < 20 V
5
20
mV
0 mA < IIO < 10 mA
8
20
mV
250
500
mV
–12
–25
µA
Shor-circuit current
VREF = 0V
Line regulation
Load regulation
SOFT START
VOL
Low-level output voltage saturation
ISS
Soft-start current
(2)
(3)
(4)
(5)
(6)
(7)
(8)
4
VVCC = 7 V
–5
Ensured by design. Not production tested.
Measure the rise time from when BUCK crosses 1 V until it crosses 9 V.
To force BUCK high, force VCSAO=2.5 V, VCEAO = 2.5 V, a 25-kΩ pulldown resistor from RAMP to ground, and VCT = 0.5 V.
To force BUCK low, force VCSAO = 2.5 V, VCEAO = 2.5 V, a 10-kΩ pulldown resistor from RAMP to ground, and VCT = 3.5 V.
The overlap time is measured from the point at which the rising edge of PUSH/PULL crosses 5 V until the falling edge of PULL/PUSH
crosses 5V.
The non-overlap time is measured from the point at which the falling edge of PUSH/PULL crosses 5 V until the rising edge of
PULL/PUSH crosses 5 V.
To toggle PUSH or PULL into a desired state, pulse CT from 0.5 V to 3.5 V. PUSH and PULL toggle on the rising edge of CT.
Copyright © 1999–2011, Texas Instruments Incorporated
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
CONNECTION DIAGRAMS
PLCC-28 (Q PACKAGE)
(TOP VIEW)
DIL-24 (N or J, DW PACKAGES)
(TOP VIEW)
Q PACKAGE
(TOP VIEW)
24
23
22
21
20
19
18
17
16
15
14
13
PUSH
VCC
PULL
PGND
DELAY
SYNC
CT
RT
VEA−
REF
VEA+
CEA−
SS
RAMP
CEAO
CSAO
CSA+
CSA−
VEAO
4
5
3 2 1 28 27 26
25
6
24
7
23
8
22
9
21
10
20
11
19
12 13 14 15 16 17 18
PGND
NC
NC
DELAY
SYNC
CT
RT
GND
CEA+
CEA−
VEA+
REF
NC
VEA−
1
2
3
4
5
6
7
8
9
10
11
12
V+
BUCK
SRC
SS
RAMP
CEAO
CSAO
CSA+
CSA−
VEAO
GND
CEA+
SRC
BUCK
NC
V+
PUSH
VCC
PULL
N, J OR DW PACKAGES
(TOP VIEW)
NC − No internal connection
Terminal Functions
TERMINAL
I/O
DESCRIPTION
N or
DW
Q
BUCK
2
3
O
Output of the buck PWM controller. The BUCK output is a floating driver, optimized for controlling the
gate of an N-channel MOSFET. The peak sink and source currents are 1 A. VCC undervoltage faults
disables BUCK to an off condition (low).
CEA+
12
13
I
Non-inverting input of the current error amplifier.
CEA-
13
14
I
Inverting input of the current error amplifier
CEAO
6
7
O
Output of the current error amplifier and the inverting input of the PWM comparator of the buck
converter.
CSA+
8
9
I
Noninverting input of the current sense amplifier.
CSA–
9
10
I
Inverting input of the current sense amplifier.
CSAO
7
8
O
Output of the current sense amplifier and the noninverting input of the current limit comparator. When
the signal level on this pin exceeds the 3V threshold of the current limit comparator, the buck gate drive
pulse is terminated. This feature is useful to implement cycle-by-cycle current limiting for the buck
converter.
CT
18
20
I
Provides for the timing capacitor which is connected between CT and GND. The oscillator frequency is
set by CT and a resistor RT, connected between pin RT and GND. The CT discharge current is
approximately 40 x the bias current through the resistor connected to RT. A practical maximum value for
the discharge current is 20 mA. The frequency of the oscillator is given by equation (1)
DELAY
20
22
I
A resistor to GND programs the overlap time of the PUSH and PULL outputs of the UC3827-1 and the
dead time of the PUSH and PULL outputs of the UC3827-2. The minimum value of the resistor, RDELAY,
is 18 kΩ. The delay or overlap time is given by equation (2)
GND
11
12
-
Ground reference for all sensitive setup components not related to driving the outputs. They include all
timing, voltage sense, current sense, and bypass components.
PGND
21
25
-
Ground connection for the PUSH and PULL outputs. PGND must be connected to GND at a single point
on the printed circuit board. This is imperative to prevent large, high frequency switching currents
flowing through the ground metalization inside the device.
PULL
22
26
O
Ground referenced output to drive an N-channel MOSFET. The PULL and the PUSH outputs are driving
the two switches of the push-pull converter with complementary signals at close to a 50% duty cycle.
Any undervoltage faults will disable PULL to an off condition (low).
NAME
0.77
(Hz)
RRT CCT
R
t DELAY + DELAY 10*9 (s)
200W
f OSC +
(1)
(2)
Copyright © 1999–2011, Texas Instruments Incorporated
5
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
Terminal Functions (continued)
TERMINAL
NAME
PUSH
N or
DW
Q
24
28
I/O
DESCRIPTION
O
Ground referenced output to drive an N-channel MOSFET. The PULL and the PUSH outputs are driving
the two switches of the push-pull converter with complementary signals at close to a 50% duty cycle.
Any undervoltage faults disables PUSH to an off condition (low).
RAMP
5
6
I
The RAMP voltage, after a 700 mV internal level shift, is fed to the noninverting input of the buck PWM
comparator. A resistor to VIN and a capacitor to GND provide an input voltage feedforward signal for the
buck controller in voltage mode control. In peak current mode control, the RAMP pin receives the
current signal of the buck converter. In an average current mode setup, the RAMP pin has a linearly
increasing ramp signal. This waveform may be generated either by connecting RAMP directly to CT, or
by connecting both a resistor from VCC to RAMP and a capacitor from RAMP to GND.
REF
15
16
O
The output of the +5V on board reference. Bypass this pin with a capacitor to GND. The reference is off
when the chip is in undervoltage lockout mode.o
RT
17
19
I
A resistor to GND programs the charge current of the timing capacitor connected to CT. The charge
current approximately equals that shown in equation (3). The charge current should be less than 500 µA
to keep CT's discharge peak current less than 20 mA, which is CT's maximum practical discharge value.
The discharge time, which sets the maximum duty cycle, is set internally and is influenced by the charge
current.
SRC
3
4
I
The source connection for the floating buck switch. The voltage on the SRC pin can exceed VCC but
must be lower than 90 V–VVCC. Also, during turn-off transients of the buck switch, the voltage at SRC
can go to –2V.
SS
4
5
O
5Soft-start pin requires a capacitor to GND. During soft-start the output of the voltage error amplifier is
clamped to the soft-start capacitor voltage which is slowly charged by an internal current source. In
UVLO, SS is held low.
SYNC
19
21
I
A bidirectional pin for the oscillator., used to synchronize several chips to the fastest oscillator. Its input
synchronization threshold is 1.4 V. The SYNC voltage is 3.6 V when the oscillator capacitor, CT, is
discharged. Otherwise it is 0 V. If the recommended synchronization circuit is not used, a 1 kΩ or lower
value resistor from SYNC to GND may be needed to increase the fall time of the signal at SYNC.
VCC
23
27
I
A voltage source connected to this pin supplies the power for the UC3827. It is recommended to bypass
this pin to both GND and PGND ground connections with good quality high frequency capacitors
VEA+
14
15
I
Non-inverting input of the voltage error amplifier
VEA-
16
18
I
Inverting input of the voltage error amplifier
VEAO
10
11
O
Output of the voltage error amplifier
I
Supply voltage for the buck output. The floating driver of the UC3827 uses the bootstrap technique
which requires a reservoir capacitor to store the required energy for the on time of the buck switch. A
diode must be connected from VCC to V+ to charge the reservoir capacitor. This diode must be able to
withstand VIN. The reservoir capacitor must be connected between V+ and SRC.
V+
(3)
6
1
1
I RT + 2.5 V
RRT
Copyright © 1999–2011, Texas Instruments Incorporated
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
APPLICATION INFORMATION
VREF
RT
2.5 V
–
+
RT
CT
OSCILLATOR
VREF
1.4 V
2.5 V
2.9 V
CT
S
R
SYNC
0.5 V
10 kW
VDG−99086
Figure 1. Oscillator Block With External Connections
CIRCUIT BLOCK DESCRIPTION
PWM Oscillator
The oscillator block diagram with external connections is shown in Equation 1. A resistor (RT) connected to pin
RT sets the linear charge current:
I RT + 2.5 V
RRT
(1)
The timing capacitor (CCT) is linearly charged with the charge current forcing the OSC pin to charge to a 3.4 V
threshold. After exceeding this threshold, the RS flip-flop is set driving CLKSYN high and RDEAD low which
discharges CCT. CT continues to discharge until it reaches a 0.5 V threshold and resets the RS flip-flop which
repeats the charging sequence as shown in Figure 2
As shown in Figure 3, several oscillators are synchronized to the highest free running frequency by connecting
100 pF capacitors in series with each CLKSYN pin and connecting the other side of the capacitors together
forming the CLKSYN bus. The CLKSYN bus is then pulled down to ground with a resistance of approximately
10k. Referring to Figure 1, the synchronization threshold is 1.4 V. The oscillator blanks any synchronization pulse
that occurs when OSC is below 2.5 V. This allows units, once they discharge below 2.5 V, to continue through
the current discharge and subsequent charge cycles whether or not other units on the CLKSYN bus are still
synchronizing. This requires the frequency of all free running oscillators to be within 17% of each other to assure
synchronization.
Copyright © 1999–2011, Texas Instruments Incorporated
7
UC2827-1, UC2827-2
UC3827-1, UC3827-2
SLUS365D – APRIL 1999 – REVISED APRIL 2011
www.ti.com
VAO Current
Command
Charging
Discharging
OSC
2.9 V
0.5 V
THRESHOLD
3.6 V
1.4 V
Threshold
CLKSYN
8.5 V
OUT
0V
VDG−99087
Figure 2. Oscillator and PWM Output Waveform
OSC2
OSC3
SYNC
SYNC
SYNC
100 pF
100 pF
100 pF
CLKSYN BUS
OSC1
100 pF
OSC10
SYNC
10 kW
VDG−99085
Figure 3. Oscillator Synchronization Connection Diagram
REVISION HISTORY
REVISION
8
DATE OF CHANGE
SLUS365A
8/2005
SLUS365D
4/2011
DESCRIPTION
Improved CMRR of CSA from ( 0 - 2 V) to ( -0.3 - 2 V)
Improved CMRR of CEA from ( 0 - 5 V) to ( -0.3 - 5 V)
Updated the Thermal Information Section
Copyright © 1999–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UC2827DW-1
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
UC2827DW-1
UC2827DW-1G4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
UC2827DW-1
UC2827DW-2
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
UC2827DW-2
UC2827DW-2G4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
UC2827DW-2
UC2827DWTR-1
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
UC2827DW-1
UC2827DWTR-1G4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
UC2827DW-1
UC3827DW-1
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
UC3827DW-1
UC3827DW-1G4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
UC3827DW-1
UC3827DW-2
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
UC3827DW-2
UC3827DW-2G4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
UC3827DW-2
UC3827N-1
LIFEBUY
PDIP
N
24
15
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3827N-1
UC3827N-1G4
LIFEBUY
PDIP
N
24
15
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3827N-1
UC3827N-2
LIFEBUY
PDIP
N
24
15
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3827N-2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2015
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC3827-1 :
• Military: UC1827-1
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jan-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UC2827DWTR-1
Package Package Pins
Type Drawing
SOIC
DW
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.7
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jan-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC2827DWTR-1
SOIC
DW
24
2000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
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