UC1832
UC2832/3
UC3832/3
Precision Low Dropout Linear Controllers
FEATURES
DESCRIPTION
•
Precision 1% Reference
•
Over-Current Sense Threshold
Accurate to 5%
•
Programmable Duty-Ratio
Over-Current Protection
•
4.5 V to 36 V Operation
•
100mA Output Drive, Source, or
Sink
•
Under-Voltage Lockout
The UC2832 and UC3833 series of precision linear regulators include all the
control functions required in the design of very low dropout linear regulators.
Additionally, they feature an innovative duty-ratio current limiting technique
which provides peak load capability while limiting the average power dissipation of the external pass transistor during fault conditions. When the load current reaches an accurately programmed threshold, a gated-astable timer is
enabled, which switches the regulator’s pass device off and on at an externally
programmable duty-ratio. During the on-time of the pass element, the output
current is limited to a value slightly higher than the trip threshold of the duty-ratio timer. The constant-current-limit is programmable on the UCx832 to allow
higher peak current during the on-time of the pass device. With duty-ratio control, high initial load demands and short circuit protection may both be accommodated without extra heat sinking or foldback current limiting. Additionally, if
the timer pin is grounded, the duty-ratio timer is disabled, and the IC operates
in constant-voltage/constant-current regulating mode.
Additional Features of the UC2832
series:
•
Adjustable Current Limit to
Current Sense Ratio
•
Separate +VIN terminal
•
Programmable Driver Current
Limit
•
Access to VREF and E/A(+)
•
Logic-Level Disable Input
These IC’s include a 2 Volt (±1%) reference, error amplifier, UVLO, and a high
current driver that has both source and sink outputs, allowing the use of either
NPN or PNP external pass transistors. Safe operation is assured by the inclusion of under-voltage lockout (UVLO) and thermal shutdown.
The UC3833 family includes the basic functions of this design in a low-cost, 8pin mini-dip package, while the UC2832 series provides added versatility with
the availability of 14 pins. Packaging options include plastic (N suffix), or ceramic (J suffix). Specified operating temperature ranges are: commercial (0°C
to 70°C), order UC3832/3 (N or J); and industrial (–40°C to 85°C), order
UC2832/3 (N or J). Surface mount packaging is also available.
BLOCK DIAGRAMS
UDG-92040
SLUS387A - JUNE 1994 - REVISED - MAY 2003
UC1832
UC2832/3
UC3832/3
ABSOLUTE MAXIMUM RATINGS
Supply Voltage +VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V
Driver Output Current (Sink or Source) . . . . . . . . . . . . . 450mA
Driver Sink to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . 40V
TRC Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 3.2V
Other Input Voltages. . . . . . . . . . . . . . . . . . . . . . . –0.3V to +VIN
Operating Junction Temperature (note 2) . . . –55°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C
Note 1: Unless otherwise indicated, voltages are referenced to
ground and currents are positive into, negative out of, the specified terminals.
Note 2: See Unitrode Integrated Circuits databook for
information regarding thermal specifications and limitations of
packages.
CONNECTION DIAGRAMS
UC2832
UC3833
DIL-14 (Top View)
J Or N Package
DIL-8 (Top View)
J Or N Package
SOIC-16 (Top View)
DW Package
SOIC-16 (Top View)
DW Package
LCC-20 & PLCC-20
L & Q Package
(Top View)
PACKAGE PIN FUNCTION
FUNCTION
N/C
+VIN
Comp/Shutdown
E/A(+)
+2V REF
N/C
Gnd
Logic Disable
Limit
Source
N/C
E/A(-)
Sink
VADJ
N/C
Timer RC
Current Sense(-)
Current Sense(+)
LCC-20 & PLCC-20
L & Q Package
(Top View)
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15-17
18
19
20
2
PACKAGE PIN FUNCTION
FUNCTION
+VIN & C/S(+)
N/C
N/C
N/C
Comp/Shutdown
Gnd
N/C
N/C
N/C
Source
N/C
E/A(-)
N/C
N/C
Sink
Timer RC
Current Sense(+)
N/C
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18-20
UC1832
UC2832/3
UC3832/3
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, specifications hold for
TA = 0°C to 70°C for the UC3832/3, –40°C to 85°C
for the UC2832/3, +VIN = 15V, Driver sink = +VIN, C/S(+) voltage = +VIN. TA=TJ.
PARAMETER
Input Supply
Supply Current
TEST CONDITIONS
MIN
TYP
MAX
UNITS
+VIN = 6 V
6.5
10
mA
+VIN = 36 V
9.5
15
mA
Logic Disable = 2 V (UCx832 only)
3.3
mA
Reference Section
Output Voltage (Note 3)
Load Regulation (UCx832 only)
Line Regulation
TJ = 25°C, IDRIVER = 10 mA
1.98
2.00
2.02
V
over temperature, IDRIVER = 10 mA
1.96
2.00
2.04
V
IO = 0 to 10 m
+VIN = 4.5 V to 36 V, IDRIVER = 10 m
-10
Under-Voltage Lockout Threshold
-5.0
0.033
0.5
mV
mV/V
3.6
4.5
V
1.3
1.4
1.5
-5.0
-1.0
95
100
105
mV
Over Temperature
93
110
100
135
107
170
mV
mV
Logic Disable Input (UCx832 only)
Threshold Voltage
Input Bias Current
Logic Disable = 0 V
V
µA
Current Sense Section
Comparator Offset
Amplifier Offset (UCx833 only)
Amplifier Offset (UCx832 only)
VADJ = Open
110
135
170
mV
VADJ = 1 V
180
235
290
mV
VADJ = 0 V
250
305
360
mV
Input Bias Current
VCM = +VIN
65
100
135
µA
Input Offset Current (UCx832 only)
VCM = +VIN
-10
10
µA
Amplifier CMRR (UCx832 only)
Transconductance
VCM = 4.1 V to + VIN + 0.3
ICOMP = ±100 µA
VADJ Input Current (UCx832 only)
VADJ = 0V
80
dB
-10
65
-1
mS
µA
0.25
1.0
µA
-345
-270
-175
µA
Timer
Inactive Leakage Current
C/S(+) = C/S(-) = +VIN; TRC pin = 2 V
Active Pullup Current
C/S(+) = +VIN, C/S(-) = +VIN - 0.4V; TRC pin = 0 V
Duty Ratio (note 4)
ontime/period, RT = 200k, CT = 0.27µF
4.8
%
Period (notes 4,5)
ontime + offtime, RT = 200k, CT = 0.27µF
36
ms
Upper Trip Threshold (Vu)
1.8
V
Lower Trip Threshold (Vl)
Trip Threshold Ratio
0.9
2.0
V
V/V
Vu/Vl
Error Amplifier
Input Offset Voltage (UCx832 only)
VCM = VCOMP = 2 V
-8.0
Input Bias Current
VCM = VCOMP = 2 V
-4.5
Input Offset Current (UCx832 only)
VCM = VCOMP = 2 V
-1.5
AVOL
VCOMP = 1 V to 13 V
50
CMRR (UCx832 only)
VCM = 0V to +VIN - 3 V
60
80
dB
PSRR (UCx832 only)
Transconductance
VCM = 2 V, +VIN = 4.5 V to 36
ICOMP = ±10 µA
90
4.3
dB
mS
VOH
ICOMP = 0, Volts below +VIN
.95
1.3
V
VOL
ICOMP = 0
.45
0.7
V
IOH
VCOMP = 2 V
-500
-100
µA
-700
3
8.0
mV
µA
-1.1
1.5
70
µA
dB
UC1832
UC2832/3
UC3832/3
ELECTRICAL
CHARACTERISTICS (cont.) Unless otherwise stated, specifications hold for TA = 0°C to 70°C for the UC3832/3, –40°C to
85°C for the UC2832/3, +VIN = 15 V, Driver sink = +VIN, C/S(+) voltage = +VIN. TA=TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCOMP = 2 V, C/S(-) = +VIN
VCOMP = 2 V, C/S(-) = +VIN - 0.4 V
100
500
700
µA
2
6
Driver Limit & Source pins common; TJ = 25°C
200
300
400
mA
Over Temperature
100
300
450
mA
Error Amplifier (cont.)
IOL
mA
Driver
Maximum Current
Limiting Voltage (UCx832 only)
Driver Limit to Source voltage at current limit,
ISOURCE = -10 mA; TJ = 25°C (Note 6)
.72
V
Internal Current Sense Resistance
TJ = 25°C (Note 6)
2.4
Ω
Pull-Up Current at Driver Sink
Compensation/Shutdown = 0.4 V; Driver Sink = +VIN - 1V
Compensation/Shutdown = 0.4 V, +VIN = 36 V; Driver
Sink = 35 V
Pull-Down Current at Driver Source
Compensation/Shutdown = 0.4 V; Driver Source = 1 V
Saturation Voltage Sink to Source
Driver Source = 0 V; Driver Current = 100 mA
Maximum Source Voltage
Driver Sink = +VIN, Driver Current = 100 mA
Volts below + VIN
-800
-300
-100
µA
-1000
-300
-75
µA
150
300
700
µA
1.5
V
3.0
V
Source = 0 V, TA = 25°C
Compensation/Shutdown = 0 V; ISOURCE = 100 µA,
25
µA
+VIN = 3 V
1.6
V
UVLO Sink Leakage
+VIN = C/S(+) = C/S(-) = 2.5 V, Driver Sink = 15 V, Driver
Maximum Reverse Source Voltage
Thermal Shutdown
160
°C
Note 3: On the UCx833 this voltage is defined as the regulating level at the error amplifier inverting input, with the error amplifier
driving VSOURCE to 2 V.
Note 4: These parameters are first-order supply-independent, however both may vary with supply for +VIN less than about 4 V. This
supply variation will cause a slight change in the timer period and duty cycle, although a high off-time/on-time ratio will be maintained.
Note 5: With recommended RT value of 200k, TOFF ≈ RT CT * ln(Vu/Vl) ±10%.
Note 6: The internal current limiting voltage has a temperature dependence of approximately -2.0 mV/°C, or -2800 ppm/°C. The internal 2.4 Ω sense resistor has a temperature dependance of approximately +1500 ppm/°C.
APPLICATION AND OPERATION INFORMATION
NPN Pass (Local 100mA Regulator) (UCx833)
UDG-92041-1
4
APPLICATION AND OPERATION INFORMATION (cont.)
UC1832
UC2832/3
UC3832/3
PNP Pass (Low Drop-Out Regulator) (UCx833)
UDG-92042-1
NPN Pass (Medium Power, Low Drop-Out Regulator) (UCx832)
UDG-92043-1
Estimating Maximum Load Capacitance
For any power supply, the rate at which the total output
Current Sense Amplifier Offset Voltage
and
K=
capacitance can be charged depends on the maximum
100mA
output current available and on the nature of the load. For
≈1.35 for UCx833, and is variable from 1.35 to 3.05
a constant-current current-limited power supply, the outwith VADJ for the UCx832.
put will come up if the load asks for less than the maxiFor a worst-case constant-current load of value just less
mum available short-circuit limit current.
than ITH, CMAX can be estimated from:
To guarantee recovery of a duty-ratio current-limited
TON
CMAX = ((K−1)ITH) (
),
power supply from a short-circuited load condition, there
VOUT
is a maximum total output capacitance which can be
where VOUT is the nominal regulator output voltage.
charged for a given unit ON time. The design value of ON
time can be adjusted by changing the timing capacitor. For a resistive load of value RL, the value of CMAX can be
estimated from:
Nominally, TON = 0.693 x 10k x CT.
TON
1
CMAX =
•
.
Typically, the IC regulates output current to a maximum of
RL
VOUT
In [(1−
) −1]
IMAX = K x ITH, where ITH is the timer trip-point current,
K • ITH • RL
5
UC1832
UC2832/3
UC3832/3
APPLICATION AND OPERATION INFORMATION (cont.)
Current Sense Amplifier Offset Voltage vs VADJ
UCx832/33 Timer Function
UCx832/33 Current Sense Input Configuration
Load current, timing capacitor voltage, and output voltage of
the regulator under fault conditions.
6
APPLICATION AND OPERATION INFORMATION (cont.)
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX (603) 424-3460
7
UC1832
UC2832/3
UC3832/3
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9326501M2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629326501M2A
UC1832L/
883B
5962-9326501MCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9326501MC
A
UC1832J/883B
5962-9326501V2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
59629326501V2A
UC1832L
QMLV
5962-9326501VCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
5962-9326501VC
A
UC1832JQMLV
UC1832J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
UC1832J
UC1832J883B
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9326501MC
A
UC1832J/883B
UC1832L883B
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629326501M2A
UC1832L/
883B
UC2832DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-25 to 85
UC2832DW
UC2832DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-25 to 85
UC2832DW
UC2833DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2833DW
UC2833DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2833DW
UC2833DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UC2833DW
UC2833J
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
-40 to 85
UC2833N
LIFEBUY
PDIP
P
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
50
Addendum-Page 1
UC2833N
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UC3832DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3832DW
UC3832DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3832DW
UC3832N
LIFEBUY
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3832N
UC3832NG4
LIFEBUY
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3832N
UC3833DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3833DW
UC3833DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UC3833DW
UC3833J
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
0 to 70
UC3833N
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3833N
UC3833NG4
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UC3833N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2015
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1832, UC1832-SP, UC2832, UC3832, UC3833 :
• Catalog: UC3832, UC1832
• Enhanced Product: UC2832-EP
• Military: UC1832, UC1833
• Space: UC1832-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
UC2832DWTR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
UC2833DWTR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
UC3833DWTR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC2832DWTR
SOIC
DW
16
2000
367.0
367.0
38.0
UC2833DWTR
SOIC
DW
16
2000
367.0
367.0
38.0
UC3833DWTR
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
