UC3836NG4

UC1835 UC1836 UC2835 UC2836 UC3835 UC3836 High Efficiency Regulator Controller FEATURES DESCRIPTION • Complete Control for a High Current, Low Dropout, Linear Regulator • Fixed 5V or Adjustable Output Voltage • Accurate 2.5A Current Limiting with Foldback • Internal Current Sense Resistor The UC1835/6 families of linear controllers are optimized for the design of low cost, low dropout, linear regulators. Using an external pass element, dropout voltages of less than 0.5V are readily obtained. These devices contain a high gain error amplifier, a 250mA output driver, and a precision reference. In addition, current sense with foldback provides for a 2.5A peak output current dropping to less than 0.5A at short circuit. • Remote Sense for Improved Load Regulation • External Shutdown • Under-Voltage Lockout and Reverse Voltage Protection • Thermal Shutdown Protection • 8 Pin Mini-Dip Package (Surface Mount also Available) BLOCK DIAGRAM Note: Pin numbers refer to 8-Pin DIL Package 8/94 These devices are available in fixed, 5V, (UC1835), or adjustable, (UC1836), versions. In the fixed 5 volt version, the only external parts required are an external pass element, an output capacitor, and a compensation capacitor. On the adjustable version the output voltage can be set anywhere from 2.5V to 35V with two external resistors. Additional features of these devices include under-voltage lockout for predictable start-up, thermal shutdown and short circuit current limiting to protect the driver device. On the fixed voltage version, a reverse voltage comparator minimizes reverse load current in the event of a negative input to output differential. UC1835 UC1836 UC2835 UC2836 UC3835 UC3836 ABSOLUTE MAXIMUM RATINGS (Note 1) Input Supply Voltage (+VIN) . . . . . . . . . . . . . . . . –1.0V to + 40V Driver Output Current (Sink or Source) . . . . . . . . . . . . . 600mA Driver Source to Sink Voltage . . . . . . . . . . . . . . . . . . . . . + 40V Maximum Current Through Sense Resistor. . . . . . . . . . . . . . 4A VOUT Sense Input Voltage . . . . . . . . . . . . . . . . . . –.3V to + 40V Power Dissipation at TA = 25°C (Note 2) . . . . . . . . . . . 1000mW Power Dissipation at TC = 25°C (Note 2) . . . . . . . . . . . 2000mW Operating Junction Temperature . . . . . . . . . . . -55°C to +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C Note 1: Voltages are referenced to ground, (Pin 3). Currents are positive into, negative out of, the specified terminals. Consult Packaging Section of Databook for thermal considerations and limitations of packages. CONNECTION DIAGRAMS DIL-8, SOIC-8 (TOP VIEW) N or J Package, D Package PLCC-20, LCC-20 (TOP VIEW) Q, L Packages PACKAGE PIN FUNCTION FUNCTION PIN N/C +VIN +VIN N/C Compensation/ Shutdown N/C Ground N/C N/C Driver Source N/C VOUT Sense N/C N/C Driver Sink N/C Current Limit (-) N/C Sense Resistor Out Sense Resistor Out SOIC-16 (TOP VIEW) DW Package 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, specifications hold for TA = 0°C to + 70°C for the UC3835/6, –25°C to + 85°C for the UC2835/6, and –55°C to +125°C for the UC1835/6, +VIN = 6V, Driver Source= 0V, Driver Sink = 5V, TA = TJ. PARAMETER Input Supply Supply Current TEST CONDITIONS +VIN = 6V +VIN = 40V +VIN Low to High, VOUT Sense = 0V UVLO Threshold Threshold Hysteresis Reverse Current +VIN = -1.0V, Driver Sink Open Regulating Voltage and Error Amplifier (UC1835 Family Only) Driver Current = 10mA, TJ = 25°C Regulating Level at VOUT Sense (VREG) Over Temperature Line Regulation +VIN = 5.2V + 35V Load Regulation Driver Current = 0 to 250mA VOUT Sense = 5.0V Bias Current at VOUT Sense Error Amp Transconductance ±100µA at Compensation/Shutdown Pin Maximum Compensation Output Current Sink or Source, Driver Source Open 2 MIN. TYP. MAX. UNITS 3.9 2.75 3.75 4.4 0.1 6.0 4.0 6.0 4.9 0.35 20 mA mA V V mA 5.0 5.06 5.1 40 25 210 2.0 260 V V mV mV µA mS µA 4.94 4.9 75 0.8 90 15 6.0 125 1.3 200 UC1835 UC1836 UC2835 UC2836 UC3835 UC3836 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, specifications hold for TA = 0°C to + 70°C for the UC3835/6, –25°C to + 85°C for the UC2835/6, and –55°C to +125°C for the UC1835/6, +VIN = 6V, Driver Source= 0V, Driver Sink = 5V, TA = TJ. PARAMETER TEST CONDITIONS MIN. TYP. Regulating Voltage and Error Amplifier (UC1836 Family Only) Driver Current = 10mA, TJ = 25°C 2.47 2.5 Regulating Level at VOUT Sense (VREG) Over Temperature 2.45 6.0 Line Regulation +VIN = 5.2V to 35V Load Regulation Driver Current = 0 to 250mA 3.0 VOUT Sense =2.5V -1.0 -0.2 Bias Current at VOUT Sense Error Amp Transconductance ±100µA at Compensation/Shutdown Pin 0.8 1.3 Maximum Compensation Output Current Sink or Source, Driver Source Open 90 200 Driver Maximum Current 250 500 Saturation Voltage Driver Current = 250mA, Driver Sink 2.0 Pull-Up Current at Driver Sink Compensation/Shutdown=0.45V 140 250 Driver Sink Leakage In UVLO In Reverse Voltage (UC1835 Family Only) Thermal Shutdown 165 Foldback Current Limit 2.2 2.5 Current Limit Levels at Sense Resistor Out VOUT Sense = (0.99) VREG VOUT Sense = (0.5) VREG 1.3 1.5 0.25 0.4 VOUT Sense = 0V 12 24 Current Limit Amp Tansconductance ±100µA at Compensation/Shutdown, VOUT Sense = (0.9) VREG Limiting Voltage at Current Limit (-) VOUT Sense = (0.9) VREG 80 100 (Note 2) Volts Below +VIN, TJ = 25°C Sense Resistor Value (Note 3) VOUT Sense = (0.9) VREG, 40 IOUT = IA, TJ = 25°C Note 2: This voltage has a positive temperature coefficient of approximately 3500ppm/°C. Note 3: This resistance has a positive temperature coefficient of approximately 3500ppm/°C. The total resistance from Pin 1 to Pin 8 will include an additional 60 to 100mΩ of package resistance. MAX. UNITS 2.53 2.55 20 15 2.0 260 2.8 300 10 10 mA V µA µA µA °C 2.8 1.7 0.55 42 A A A mS 140 mV APPLICATION AND OPERATION INFORMATION UC 1835 − Typical configurations for a 2A, Low Dropout 5V Regulator UC1836 − Typical Configuration for a 2A, Low Dropout Adjustable Regulator Note 4: Suggested Pass devices are TIP 32B. (Dropout Voltage ≤0.75V) or, D45H, (Dropout Voltage ≤0.5V), or equivalents. 3 V V mV mV µA mS µA mΩ UC1835 UC1836 UC2835 UC2836 UC3835 UC3836 APPLICATION AND OPERATION INFORMATION (cont.) UC1835/6 Foldback Current Limiting UC3835/36 TYPICAL APPLICATIONS Low Current Application Typical Output Current vs VIN and VOUT using the UC3836 internal drive transistor of the UC3836 internal drive transistor for PDISS = 0.5W (approx.) High Current Application Parallel Pass Transistors using drive transistor Q2 to increase Q1 base drive and reduce UC3836 power dissipation can be added for high current or high power dissipation applications EQUATIONS: R1 = 0.100 V/IOUT (MAX) R2 = (VOUT - 2.5V/1mA) R3 = ((VIN - VBE - VSAT)*BETA(min))/IOUT (max) UNITRODE INTEGRATED CIRCUITS 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. (603) 424-2410 • FAX 603-424-3460 4 PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty 5962-9065002PA ACTIVE CDIP JG 8 1 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) TBD A42 N / A for Pkg Type -55 to 125 Device Marking (4/5) 9065002PA UC1836 UC1835J OBSOLETE CDIP JG 8 TBD Call TI Call TI -55 to 125 UC1835J883B OBSOLETE CDIP JG 8 TBD Call TI Call TI -55 to 125 UC1835L883B OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC1836J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 UC1836J UC1836J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9065002PA UC1836 UC1836L OBSOLETE TO/SOT L 20 TBD Call TI Call TI -55 to 125 UC1836L883B OBSOLETE TO/SOT L 20 TBD Call TI Call TI -55 to 125 UC2835D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 UC2835D UC2835J OBSOLETE CDIP JG 8 TBD Call TI Call TI -25 to 85 UC2835N LIFEBUY PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -25 to 85 UC2835N UC2836D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 UC2836D UC2836DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 UC2836D UC2836DW OBSOLETE SOIC DW 16 TBD Call TI Call TI -25 to 85 UC3835N NRND PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3835N UC3836D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3836D UC3836DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3836D UC3836DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3836D UC3836N NRND PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3836N UC3836NG4 NRND PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3836N Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2016 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF UC1835, UC1836, UC3835, UC3836 : • Catalog: UC3835, UC3836 • Military: UC1835, UC1836 Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2016 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device UC3836DTR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC3836DTR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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