UCC25800AQDGNQ1

UCC25800-Q1, UCC25800B-Q1 SLUSDX3C – NOVEMBER 2020 – REVISED AUGUST 2023 UCC25800-Q1 Ultra-low EMI Transformer Driver for Isolated Bias Supplies 1 Features • • • • • • • • • • High-efficiency half-bridge transformer driver Ultra-low EMI with low interwinding capacitance Smaller and lower-cost transformer – Programmable frequency: 0.1 MHz to 1.2 MHz Wide input voltage range: 9 V to 34 V – 9 W from 34-V input – 6 W from 24-V input – 4 W from 15-V input Automatic dead-time adjustment with maximum dead-time programming External clock synchronization for low noise Robust protection features – Undervoltage lockout (UVLO) – Programmable over-current protection (OCP) – Input overvoltage protection (OVP) – Over temperature protection (TSD) – Integrated soft-start to reduce in-rush current – External disable function with fault-code output AEC-Q100 qualified for automotive applications: – Temperature grade 1: –40°C to +125°C, TA Functional Safety-Capable – Documentation available to aid functional safety system design 8-Pin DGN package with thermal pad 2 Applications • • • • • • • Automotive traction inverter & motor control Automotive on-board charger (OBC) Automotive DC/DC converter EV charging station, DC fast charging station UPS and solar inverters Industrial motors, elevators and escalators GaN, IGBT and SiC gate transformer driver bias supply 3 Description The UCC25800-Q1 ultra-low EMI transformer driver integrates the switching power stage, the control, and the protection circuits to simplify isolated bias supply designs. It allows the design to utilize a transformer with higher leakage inductance, but much smaller parasitic primary-to-secondary capacitance. This lowcapacitance transformer design enables an order of magnitude reduction in the common-mode current injection through the bias transformer. This makes the transformer driver an ideal solution for the isolated bias supply in various automotive applications to minimize the EMI noise caused by the high-speed switching devices. The soft-switching feature further reduces the EMI noise. The transformer driver has a programmable frequency range of 100 kHz to 1.2 MHz. This high switching frequency reduces the transformer size and footprint, as well as the overall cost of the bias supply. The integrated SYNC function allows the system bias supplies to synchronize with an external clock signal, further reducing the system level noise. The dead-time adjusts automatically to minimize the conduction loss and simplify the design. The programmable maximum dead-time ensures power stage design flexibility. With the integrated, low-resistance switching power stage, the transformer driver can achieve a 6-W design with 24-V input, and up to 9-W from 34-V input. With a fixed input voltage, the open-loop control also helps the output regulation to remain ±5% when the load is above 10%. The programmable overcurrent protection (OCP) allows flexibility on the power stage design to minimize the transformer size. The protection features such as adjustable OCP, input OVP, TSD and the protection from pin faults ensure robust operation. A fixed 1.5-ms soft-start period reduces the inrush current during start-up and fault recovery. The transformer driver also provides a dedicated multi-function pin for external disabling, and fault code reporting. The fault code reporting sends the fault code once the bias supply is in the protection mode. The UCC25800-Q1 transformer driver is offered in an 8-pin DGN package with the thermal pad to enhance its thermal handling capability. Device Information PACKAGE(1) PART NUMBER UCC25800-Q1 (1) HVSSOP (8) BODY SIZE (NOM) 3.00 mm × 3.00 mm For all available packages, see the orderable addendum at the end of the data sheet. VIN SYNC DIS/FLT VCC SW VOUT VREG GND OC/DT RT Simplified Application An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. UCC25800-Q1, UCC25800B-Q1 www.ti.com SLUSDX3C – NOVEMBER 2020 – REVISED AUGUST 2023 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device Comparison Table...............................................3 6 Pin Configuration and Functions...................................4 7 Specifications.................................................................. 5 7.1 Absolute Maximum Ratings........................................ 5 7.2 ESD Ratings............................................................... 5 7.3 Recommended Operating Conditions.........................5 7.4 Thermal Information....................................................6 7.5 Electrical Characteristics.............................................6 7.6 Typical Characteristics................................................ 8 8 Detailed Description......................................................10 8.1 Overview................................................................... 10 8.2 Functional Block Diagram......................................... 11 8.3 Feature Description...................................................11 8.4 Device Functional Modes..........................................24 9 Application and Implementation.................................. 26 9.1 Application Information............................................. 26 9.2 Typical Application.................................................... 26 9.3 What to Do and What Not to Do .............................. 34 10 Power Supply Recommendations..............................35 11 Layout........................................................................... 36 11.1 Layout Guidelines................................................... 36 11.2 Layout Example...................................................... 36 12 Device and Documentation Support..........................37 12.1 Documentation Support ......................................... 37 12.2 Receiving Notification of Documentation Updates..37 12.3 Support Resources................................................. 37 12.4 Trademarks............................................................. 37 12.5 Electrostatic Discharge Caution..............................37 12.6 Glossary..................................................................37 13 Mechanical, Packaging, and Orderable Information.................................................................... 38 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (November 2021) to Revision C (August 2023) Page • Initial release of UCC25800B-Q1 device............................................................................................................1 • Updated to include new device UCC25800B-Q1................................................................................................3 • Updated to include fault mode implications of new device UCC25800B-Q1.................................................... 24 Changes from Revision A (July 2021) to Revision B (November 2021) Page • Updated data sheet status from Advance Information to Production Data ........................................................1 2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: UCC25800-Q1 UCC25800B-Q1 UCC25800-Q1, UCC25800B-Q1 www.ti.com SLUSDX3C – NOVEMBER 2020 – REVISED AUGUST 2023 5 Device Comparison Table Part Number OCP1 Protection UCC25800-Q1 Enable UCC25800B-Q1 Disable Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: UCC25800-Q1 UCC25800B-Q1 3 UCC25800-Q1, UCC25800B-Q1 www.ti.com SLUSDX3C – NOVEMBER 2020 – REVISED AUGUST 2023 6 Pin Configuration and Functions SYNC 1 8 VCC DIS/FLT 2 7 SW VREG 3 6 GND OC/DT 4 5 RT Thermal pad Figure 6-1. DGN Package, 8-Pin PDSO (Top View) Table 6-1. Pin Functions PIN NAME TYPE(1) DESCRIPTION DIS/FLT 2 I/O UCC25800-Q1 disable pin (active low) and fault code output pin. GND 6 G The GND pin is the return for all the control and power signals. The layout should separate the power and control signals. OC/DT 4 I Voltage on this pin sets the maximum dead-time between the internal switching power devices. The Thevenin resistance on the pin is measured at start-up to set the OCP level. RT 5 – Switching frequency setting pin. Connect a resistor from RT pin to GND to set the converter switching frequency. The RT pin can be left open to operate the converter at the default 1.2-MHz switching frequency. SW 7 – The switch node of the integrated half-bridge. Connect this pin directly to the transformer. SYNC 1 I External clock input for frequency synchronization. The internal MOSFETs are switched synchronized with the rising edge of the SYNC signal, with half of the SYNC pin signal frequency. VCC 8 I The input for power and control of UCC25800-Q1. A good high-frequency by-pass capacitor between VCC and GND is needed to ensure high-efficiency, low-EMI design. Use the bypass capacitor layout to minimize the VCC-GND-bypass capacitor loop to reduce the stresses on internal power devices. Referring to Section 11 for layout guidelines. VREG 3 O Internal regulated reference. Put a decoupling capacitor right across VREG pin and GND with shortest distance. The VREG pin can also be used as an external supply. – Connect this pad to GND pin to provide thermal management for the device. Thermal vias are recommended if the design uses multilayer PCB. Thermal Pad (1) 4 NO. I = input, O = output, I/O = input or output, FB = feedback, G = ground, P = power Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: UCC25800-Q1 UCC25800B-Q1 UCC25800-Q1, UCC25800B-Q1 www.ti.com SLUSDX3C – NOVEMBER 2020 – REVISED AUGUST 2023 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC –0.3 40 V VREG –0.3 5.5 V RT –0.3 5.5 V DIS/FLT –0.3 5.5 V SYNC –0.3 5.5 V OC/DT –0.3 5.5 V Pin voltage –1 VCC + 1 V Current transient (100ns) –7 7 A higher of -5V or (VCC-41V) Lower of (VCC+5V) or 41V V SW Voltage transient (50ns) IQrms MOSFET RMS current TJ Junction temperature TAMB Ambient temperature Tstg Storage temperature (1) 600 mA –40 150 °C -40 125 ℃ -65 150 °C Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge VALUE UNIT ±2000 V Human body model (HBM), per AEC HBM ESD classification level 2 Q100-002(1) Charged device model (CDM), per AEC Q100-011 CDM ESD classification level C4B Corner pins (SYNC, OC/DT, RT, and VCC) ±750 V Other pins ±500 V AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VCC Supply voltage VREG VREG current CVREG VREG capacitor RRT Switching frequency set pin resistor 10 CRT Capacitor on RT DIS/FLT Disable pin OC/DT OCP/Dead Time setting pin ROC/DT Thevenin resistance COC/DT Capacitor on OC/DT SYNC External sync input voltage tSYNCmin NOM MAX UNIT 9 34 V 0 1 mA 0.1 1 µF kΩ 1000 pF 0 VREG V 1 3.9 V 22.7 kΩ 1000 pF 2.5 0 VREG V Minimum SYNC pulse width, high 150 ns Minimum SYNC pulse width, low 150 ns Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: UCC25800-Q1 UCC25800B-Q1 5 UCC25800-Q1, UCC25800B-Q1 www.ti.com SLUSDX3C – NOVEMBER 2020 – REVISED AUGUST 2023 over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT SW Half bridge output pin –0.6 VCC + 0.6 V fSW Switching frequency range 100 1200 kHz IQRMS Internal MOSFET RMS current rating 500 mA IQPeak Internal MOSFET peak current rating, steady state 1 A 7.4 Thermal Information UCC25800-Q1 THERMAL METRIC(1) DGN (HVSSOP) UNIT 8 PINS RΘJA Junction-to-ambient thermal resistance 47.9 °C/W RΘJC(top) Junction-to-case (top) thermal resistance 59.1 °C/W RΘJB Junction-to-board thermal resistance 18.4 °C/W ψJT Junction-to-top characterization parameter 1.6 °C/W ψJB Junction-to-board characterization parameter 18.4 °C/W RΘJC(bot) Junction-to-case (bottom) thermal resistance 5.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Electrical Characteristics Unless otherwise stated: VVCC = 15 V, RRT = open, CVREG = 470 nF, and -40 °C