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UCC3585N

UCC3585N

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    DIP16

  • 描述:

    SWITCHING CONTROLLER

  • 数据手册
  • 价格&库存
UCC3585N 数据手册
UCC3585 Not Recommended for New Designs   SLUS304F − JULY 1999 − REVISED JANUARY 2005        FEATURES D VOUT Resistor Programmable Down to 0.9 V D 3.3-V or 5.0-V Input Supply D 1% DC Accuracy D High Efficiency Synchronous Switching D Drives P-Channel (High Side) and N-Channel DESCRIPTION The UCC3585 synchronous buck controller provides flexible high efficiency power conversion for output voltages as low as 0.9 V with ensured ±1% dc accuracy. With an input voltage range of 3.0 V to 5.5 V, it is the ideal choice for 3.3 V only, 5.0 V only, or other low voltage systems. The fixed frequency oscillator is capable of providing practical PWM operation to 500 kHz. (Low Side) MOSFETs Lossless Programmable Current Limit Logic Compatible Shutdown D D The UCC3585 drives a complementary pair of power MOSFET transistors. A P-channel on the high side, and an N-channel on the low side step down the input voltage at up to 90% efficiency. APPLICATIONS D Local Microprocessor Core Voltage Power Supplies for Desktop and Notebook Computers DSP Core or I/O Powering High-Speed GTL Bus Regulation D D A programmable two-level current limiting function is provided by sensing the voltage drop across the high side P-channel MOSFET. This circuit can be configured to provide pulseby-pulse limiting, timed shutdown after seven consecutive faults, or latch-off after fault detection, allowing maximum application flexibility. The current limit threshold can be programmed over a wide range with a single resistor. VIN C7 0.47 µ F R4 14 kΩ + C1 150 µ F 15 VIN ENABLE C2 5600 pF VIN = 3.3 V VOUT = 1.8 V IOUT = 3 A (max) UCC3585 R1 10 kΩ CLSET 1 ENB 2 COMP 4 VFB 8 PDRV 12 R2 10 kΩ Q1 SI4562DY L1 3.7 µ H VOUT ISENSE 11 C3 47 pF NDRV 14 10 SD N/C 6 3 SS N/C 9 16 CT PWRGND 13 7 ISET C4 0.47 µ F + + C8 150 µ F C9 10 µ F R5 2 kΩ C5 0.1 µ F C6 470 pF RTN GND R3 100 kΩ 5 R6 2 kΩ RTN UDG−01127    !" # $%&" !#  '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&#  &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0  !)) '!!&"&#+ Copyright  2001, Texas Instruments Incorporated www.ti.com 1   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 description (continued) The UCC3585 also includes undervoltage lockout, a logic controlled enable, and softstart functions. The UCC3585 is offered in the 16-pin surface mount and through-hole packages. absolute maximum ratings over operating free-air temperature (unless otherwise noted)†} Analog pins Minimum and maximum forced voltage (reference to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6.3 V Digital pins Minimum and maximum forced voltage (reference to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6.3 V Power driver output pins Maximum forced current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.0 A Operating junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. } Unless otherwise noted, voltages are reference to ground and currents are positive into, negative out of, the specified terminals. Pulsed is defined as a less than 10% duty cycle with a maximum duration of 500 ns. N, D and M PACKAGES (TOP VIEW) ENB COMP SS VFB GND N/C ISET CLSET 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 CT VIN NDRV PWRGND PDRV ISENSE SD N/C AVAILABLE OPTIONS PACKAGED DEVICES TA DIL (N) SOIC (D) QSOP (M) −40°C to 85°C UCC2585N UCC2585D UCC2585M 0°C to 85°C UCC3585N UCC3585D UCC3585M The M and D packages are available taped and reeled. Add an R suffix to the device type (e.g., UCC3585DR). DISSIPATION RATING TABLE PACKAGE 2 TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING N 1.1 W 11 mW/°C 610 mW 440 mW D 830 mW 8.3 mW/°C 450 mW 330 mW M 580 mW 5.8 mW/°C 320 mW 230 mW www.ti.com   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 electrical characteristics, these specifications hold for TA = 05C to 855C for the UCC3585 and TA = −405C to 855C for the UCC2585, TA = TJ, VIN = 3.3 V, VENB, VISENSE = VIN, VFB = 0.9 V, VCOMP = 1.5 V, CT = 330 pF, RISET = 100 kΩ, RCLSET = 10 kΩ, (unless otherwise noted) input supply PARAMETER TEST CONDITIONS MIN Supply current − total (active) Supply current – shutdown TYP 2.3 ENB = 0 V VIN turnon threshold (UVLO) 1.60 VIN turnon hysteresis MAX UNITS 3.5 mA µA 10 25 1.95 2.20 V 110 200 mV voltage amplifier PARAMETER Input voltage (internal reference) TEST CONDITIONS VIN = 3.0 V to 3.6 V, VIN = 3.0 V to 3.6 V, See Note 1 TA = 25°C, See Note 1 TA = 0°C to 85°C, VIN = 3.0 V to 3.6 V, See Note 1 TA = −40°C to 85°C, Open loop gain COMP = 0.5 V to 2.5 V Output voltage high ICOMP = –50 µA ICOMP = 50 µA Output voltage low MIN TYP 0.891 0.9 0.909 0.889 0.9 0.911 0.886 0.9 0.914 60 80 2.80 2.95 0.10 Output source current Output sink current MAX UNITS V dB 0.25 V –175 –300 µA 2.0 3.0 mA NOTE: 1. Measured on COMP with the error amplifier in a unity gain (voltage follower) configuration. oscillator/PWM PARAMETER Initial accuracy CT ramp peak-to-valley TEST CONDITIONS MIN MAX UNITS VIN = 3.3 V 345 420 475 kHz VIN = 5.0 V 345 425 485 kHz TA = 0°C to 85°C TA = −40°C to 85°C 1.8 2.1 2.3 1.7 2.1 2.3 2.5 2.8 CT ramp peak CT ramp valley voltage TA = 0°C to 85°C TA = −40°C to 85°C PWM maximum duty cycle COMP = 2.8 V, PWM delay to outputs COMP = 2.5 V Enable high threshold Measured on ENB, Enable low threshold Measured on ENB SS = 0 V, Softstart charge current TYP Measured on PDRV 0.4 0.40 100 % 85 See Note 3 140 ns 2.8 V 0.5 TA = 0°C to 85°C TA = −40°C to 85°C SS = 0 V, 0.3 0.27 V 9.0 13.5 16.0 9.0 13.5 19.0 µA A NOTE: 3. Enable high threshold = (VIN − 0.5). www.ti.com 3   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 electrical characteristics, these specifications hold for TA = 05C to 855C for the UCC3585 and TA = −405C to 855C for the UCC2585, TA = TJ, VIN = 3.3 V, VENB, VISENSE = VIN, VFB = 0.9 V, VCOMP = 1.5 V, CT = 330 pF, RISET = 100 kΩ, RCLSET = 10 kΩ, (unless otherwise noted) current limit PARAMETER TEST CONDITIONS Comparator offset voltage MIN TYP −25 CLSET current SD sink current MAX 0 25 10.0 11.5 14.0 11.0 12.5 15.0 VIN = 3.3 V, VIN = 5 V, TA = 0°C to 85°C TA = 0°C to 85°C VIN = 3.3 V, VIN = 5 V, TA = −40°C to 85°C TA = −40°C to 85°C 9.0 11.5 14.0 9.5 12.5 15.0 SD = 2 V, TA = 0°C to 85°C TA = −40°C to 85°C 8.5 11.0 13.5 7.5 11.0 13.5 SD = 2 V, SD source current SD = 2 V Restart threshold Measured on SD 0.7 1.1 0.40 0.55 UNITS mV µA A mA 0.70 V output driver PARAMETER TEST CONDITIONS –50 mA (source), Pullup resistance (PDRV) –50 mA (source), 50 mA (sink), Pulldown resistance (PDRV) 50 mA (sink), –50 mA (source), Pullup resistance (NDRV) –50 mA (source), 100 mA (sink), Pulldown resistance (NDRV) 50 mA (sink), MIN TYP MAX TA = 0°C to 85°C TA = −40°C to 85°C 4.5 6.0 3.5 6.0 9.0 TA = 0°C to 85°C TA = −40°C to 85°C 6.0 9.0 16.5 4.0 9.0 16.5 TA = 0°C to 85°C TA = −40°C to 85°C 4.5 6.0 9.0 3 6 9 TA = 0°C to 85°C TA = −40°C to 85°C 2.0 3.0 4.5 1.5 3.0 4.5 UNITS 9.0 Deadtime delay (PDRV high to NDRV high) See Note 2 150 215 250 Deadtime delay (NDRV low to PDRV low) See Note 2 70 125 175 Ω ns NOTE: 1. Measured on COMP with the error amplifier in a unity gain (voltage follower) configuration. NOTE: 2. 50% point of PDRV rise to NDRV rise and 50% point of NDRV fall to PDRV fall. NOTE: 3. Enable high threshold = (VIN − 0.5). pin descriptions CLSET: CLSET is used to program the pulse-by-pulse and overcurrent shutdown levels for the UCC3585. A resistor connected between CLSET and VIN sets the over-current threshold. The over-current threshold follows the following relationship: 1.25 R ISET l + CL R R CLSET DSǒonǓ COMP: Output of the voltage error amplifier. Loop compensation components are connected between COMP and VFB. 4 www.ti.com UCC3585 Not Recommended for New Designs   SLUS304F − JULY 1999 − REVISED JANUARY 2005 pin descriptions CT: A high quality ceramic capacitor connected between this pin and ground sets the PWM oscillator frequency by the following relationship: f+ ǒ7000 1 C T Ǔ The oscillator is capable of reliable operation up to 500 kHz. ENB: A logical 1 (VIN – 0.5 V) on this input will activate the output drivers. A logical zero (0.5 V) will prevent switching of the output drivers. Do not allow ENB to remain between these levels steady state. GND: Reference level for the IC. All voltages and currents are with respect to GND. ISENSE: ISENSE monitors the voltage dropped across the high side P-channel MOSFET switch while it is conducting. This information is used to detect overcurrent conditions by the current limit circuitry. ISET: A resistor is connected between ISET and ground to program a precision bias for many of the UCC3585 circuit blocks. This resistor should be 100 kΩ with a maximum tolerance of 5%. 1.25 V is provided to ISET via a buffered version of the internal bandgap voltage reference. The resulting current, 1.25 V / RISET, is mirrored directly over to CLSET to program the overcurrent threshold. NDRV: High current driver output for the low side N-channel MOSFET switch. PDRV: High current driver output for the high side P-channel MOSFET switch. PWRGND: High current return path for the MOSFET drivers. PWRGND and GND should be terminated together as close as possible to the device package . SD: This pin can configure current limit to operate in any one of three different ways. 1. A forced voltage of less than 250 mV on SD inhibits the shutdown function causing pulse by pulse limiting. 2. A capacitor from SD to GND provides a controller-converter shutdown timeout after seven consecutive overcurrent signals are received by the current limit circuitry. An internal 11-µA (typ) current sink discharges the SD capacitor to the 0.55-V (typ) restart threshold. The shutdown time is given by: t SHUT + ƪCSD ǒVIN * 0.55 VǓƫ 11 mA where CSD is the value of the capacitor from SD to GND, and VIN is the chip supply voltage (on pin 15). At this point, a softstart cycle is initiated, and a 1-mA current source (typ) quickly recharges SD to VIN. During softstart, pulse-by-pulse current limiting is enabled, and the 7-cycle counter is disabled until softstart is complete (i.e. charged to approximately VIN volts). 3. A forced voltage of greater than 1 V on SD will cause the UCC3585 to latch off after seven overcurrent signals are received. After the controller is latched off, SD must drop below 250 mV to restart the controller. SS: A low leakage capacitor connected between SS and GND will provide a softstart function for the converter. The voltage on this capacitor slowly charges on start-up via an internal 13.5 µA (typ.) current source. The output of the voltage error amplifier (COMP) tracks this voltage, thereby limiting the controller duty ratio. VFB: Inverting input to the voltage type error amplifier. The common mode input range for VFB extends from GND to 1.5 V. VIN: Supply voltage for the UCC3585. Bypass with a 0.1-µF ceramic capacitor (minimum) to supply the peak gate drive currents required to change and discharge the power MOSFET gates. See application information for details. www.ti.com 5   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 block diagram ISET CLSET 7 8 PRECISION BIAS SET CURENT LIMIT ADJ UVLO 2V VIN 15 ILIM UVLO CURRENT LIMIT 11 ISENSE DRIVER 1.25 V REF 12 PDRV ENABLE ENB 1 VIN −0.8 V ANTI SHOOT THRU PWM COMP 2 RD Q PWM VIN VFB 4 LATCH S 0.9 V Q DRIVER UVLO 14 NDRV 13.5 µA SS 3 SOFTSTART COMPLETE PRECISION BIAS NC 9 OSCILLATOR 13 PWRGND CLK OVER CURRENT COUNTER SHUTDOWN TIMER ILIM NC 6 11 µA L = NO SHUTDOWN H = LATCHED SHUTDOWN CAP = TIMED SHUTDOWN DISABLE DRIVERS 16 5 10 CT GND SD UDG−00070 APPLICATION INFORMATION ISET pin operation The ISET pin develops a precision current reference for many of the UCC3585’s internal circuit blocks. A resistor, RISET, connected from the ISET pin to ground sets the precision current value. The internal current reference is set by buffering the 1.25-V internal reference to the ISET pin, which results in a current of 1.25 V/RISET. The UCC3585 is designed for RISET = 100 kΩ with a maximum tolerance of 5%. Using a different resistor value results in changed parametric performance and possibly unpredictable operation. oscillator The oscillator frequency is programmed by a timing capacitor connected from CT to ground. The maximum recommended frequency is 500 kHz. The timing capacitor is charged and discharged by current sources derived from the ISET pin. The voltage waveform on CT is a sawtooth ramp with approximately 95% of the period spent charging the timing capacitor. Ceramic capacitors should be used, and the capacitance tolerance adds to the accuracy of the oscillator frequency. For applications that operate over a wide temperature range or where the highest accuracy is required, temperature stable ceramic capacitors such as NPO or COG dielectric should be used for the CT capacitor. The aproximate operating frequency is determined by: f+ 6 ǒ7000 1 C T Ǔ www.ti.com   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 APPLICATION INFORMATION soft-start The SS pin provides a way to prevent overshoot of the output voltage by slowly increasing the duty cycle of the PDRV output. A capacitor on SS to ground provides a controlled start-up of the supply. During start-up the COMP pin is directly clamped to the SS pin. The SS pin has an internal current source of 13.5 µA (typical) which charges the SS capacitor. Figure 1 shows the waveforms during softstart. The SS pin charges the external capacitor to VIN volts after start-up is complete. SS VIN ENB or VIN COMP V OUT V = 0.4 V + D x 2.1 0.4 V t t SS switching disabled until SS reaches switching V OUT in regulation, SS continues to charge to VIN starts, V OUT charging up 0.4 V V OUT in regulation, SS charged to VIN Figure 1. Waveforms During Softstart The softstart time is approximately: 0.4 ) t SS +C SS ƪ V OUT V IN ƫ 2.1 13.5 mA current limit operation The UCC3585 has a user configurable current limit for output overload protection. To reduce external component count and minimize losses, the P-channel MOSFET’s RDS(on) is used as a current sense element. The ISENSE pin is connected to the P-channel MOSFET drain, which is internally connected to the negative input to the current-sense comparator. The positive comparator input is connected to the CLSET pin, which has an internal current sink of 11.5 µA (typical). For highest accuracy, this current sink is derived from the ISET circuitry. A resistor from VIN to CLSET sets the current limit threshold. To eliminate errors due to PCB trace impedances, the CLSET resistor should be connected directly to the P-channel MOSFET source, and the ISENSE pin should be directly connected to the P-channel MOSFET drain. Figure 2 shows a simplified diagram of the current limit circuitry. www.ti.com 7   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 APPLICATION INFORMATION VIN RCLSET 15 12 G 8 To PWM Logic S D P−Channel MOSFET Package 11 VOUT ISENSE ENABLE 14 11.5 µA Figure 2. Current Limit Circuitry The peak current limit is calculated using the following equation: 1.25 R ISET l + CL R R CLSET DSǒonǓ When the RDS(on) of the P-channel MOSFET is used as the sense element, several issues arise. Before the current limit comparator is enabled, the P-channel MOSFET must be fully enhanced, and the drain to source voltage must be allowed to settle. The UCC3585 has an internal circuit that disables the current limit comparator, tISENSE, for a fixed time, starting at the PDRV output falling edge. It is important that no external gate resistor is used between the PDRV output and the P-channel gate. If a resistor is used, the PDRV output falls quickly, and the turnon of the P-channel MOSFET is delayed, possibly causing a false overcurrent event to be detected. Figure 3 shows the waveforms at the P-channel turnon instance and the tISENSE time interval. 8 www.ti.com UCC3585 Not Recommended for New Designs   SLUS304F − JULY 1999 − REVISED JANUARY 2005 APPLICATION INFORMATION VIN ISENSE t ISENSE VIN/2 PDRV ISENSE Comparator Enabled 0V −0.7 V time Figure 3. tISENSE Time Interval The tISENSE time interval follows the approximate relationship: t ISENSE + ǒVBE ) 12.5 mA R CLSET 12.5 mA Ǔ 3.2 pF As can be seen from the above equation, tISENSE is dependent upon two variables. First, tISENSE is longer for higher values of RCLSET. This allows more time for ISENSE to settle, which is beneficial for supplies with a higher current limit threshold. Second, tISENSE varies with the inherent temperature dependence of the VBE in the above equation. VBE can be assumed to be 0.65 V at 25°C with a temperature coefficient of −2 mV/°C. Since the tISENSE time interval decreases at high temperature, operation of the supply must be verified at the maximum ambient temperature at full output load. Another issue with using the MOSFET RDS(on) for the sense element is the minimum on time for the P-channel MOSFET. Since there is a blanking interval, tISENSE , there is a minimum time that the P-channel MOSFET stays on during any PWM period. The minimum on time occurs even with the power supply output shorted, experimentally the minimum on time is approximately 400 ns. When a converter is operated continuously into a shorted or overloaded output, this minimum on time results in a significant power dissipation and stress on both MOSFETs. www.ti.com 9   UCC3585 Not Recommended for New Designs SLUS304F − JULY 1999 − REVISED JANUARY 2005 APPLICATION INFORMATION A solution to this minimum on-time is a counter and time-out circuit. As described in the SD pin description, a capacitor on SD enables the time-out circuit. An internal digital counter is used to count the overcurrent events at the current-sense comparator output. When seven overcurrent conditions are reached, both MOSFET switches are turned off, the SS capacitor is discharged, and an 11 µA (typical) internal current sink discharges the SD capacitor. During this discharge time, both MOSFETs are held off, and the inductor current decays to zero. When the SD capacitor voltage reaches 0.55 V (typical), a softstart cycle restarts the converter. During softstart, the 7-cycle counter is disabled. However, the peak current limit comparator is enabled. When the SS voltage reaches the threshold equal to (VIN − 0.5 V), the 7-cycle counter is enabled. By sizing the SS capacitor relative to the SD capacitor, the amount of time spent switching the MOSFETs can be reduced when the output is overloaded. If the timeout mode is used, the relative capacitance values for CSS and CSD must fall into the following relationship: C SD v 20 C SS This equation also states that, if the time-out mode is used, a softstart capacitor must be used. Figure 4 shows the waveforms when the converter is operated into a short circuit. VIN V(PDRV) 0V VIN VIN−0.5 V V(SD) tSHUT V(SS) 0.55 V time Figure 4. Converter Operated Into Short Circuit 10 www.ti.com UCC3585 Not Recommended for New Designs   SLUS304F − JULY 1999 − REVISED JANUARY 2005 APPLICATION INFORMATION VIN bypass capacitor selection A ceramic capacitor must be used across VIN to GND on the UCC3585. This capacitor supplies the transient currents required to turn on and off both power MOSFETs. It is important to select a high enough capacitance value to keep the peak-to-peak ripple voltage at VIN below 100 mV. The maximum peak-to-peak ripple on VIN is somewhat arbitrary, and 100 mV is used as an estimate. Knowing the P-channel total gate charge, QP and the total gate charge for the N-channel MOSFET, QN, the minimum capacitance can be found: C VIN(min) + Q )Q P N 100 mV An estimate of QP can be found from the manufacturer’s data sheet curve for gate charge vs gate to source voltage. Since the N-channel MOSFET is switched with essentially zero volts across it, a better estimation of QN is found by multiplying the input capacitance, CISS and the VIN voltage. Because CISS is voltage dependent, it is important to use the CISS value for approximately zero volts drain to source. This gives a more accurate estimation of the N-channel gate charge. power MOSFET drivers The UCC3585 contains two high current power MOSFET drivers. The source and sink current capability of these drivers has been sized to allow operation without external gate resistors. The P-channel driver has approximately three times stronger source current than sink current. This intentionally slows down the turnon of the P-channel MOSFET, which reduces the reverse recovery snap of the N-channel MOSFET body diode. The N-channel driver has a stronger sink current than source current which aids in keeping the N-channel MOSFET off when the P-channel MOSFET is turned on. Adding a gate resistor from NDRV to the N-channel MOSFET gate makes the N-channel more sensitive to dV/dt induced turnon and should be avoided. The MOSFET drivers have lower resistance at VIN = 5 V as compared to VIN = 3.3 V. At VIN = 5 V, the drivers have approximately 60% of the resistance specified at VIN = 3.3 V. operation over wide VIN ranges It is possible to design UCC3585 based supplies to operate over both the 3.3-V and 5-V input ranges. The resulting VIN range can be as wide at 3.0 V to 5.5 V. For a successful design, several design steps must be taken. First, both MOSFETs should have RDS(on) rated at 2.7 V or 2.5 V. This assures reasonable efficiency at the lowest input voltage. Second, the current limit threshold should be set at the minimum input voltage. At the minimum input voltage, the P-channel MOSFET has maximum RDS(on). As VIN is increased to 5.5 V, the RDS(on) decreases considerably. The effect of this reduction in RDS(on) is a higher current limit. Also, note that critical parameters, such as CLSET current and oscillator frequency are specified at both 3.3 V and 5.0 V. www.ti.com 11 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) UCC3585D NRND SOIC D 16 40 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 85 UCC3585D (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
UCC3585N 价格&库存

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