UCC3810TD1

UCC3810-DIE www.ti.com SLUSBM2 – JUNE 2013 DUAL CHANNEL SYNCHRONIZED CURRENT-MODE PWM Check for Samples: UCC3810-DIE FEATURES 1 • • • • • • • • Single Oscillator Synchronizes Two PWMs Startup Supply Current Operating Supply Current Internal Soft-Start Full-Cycle Fault Restart Internal Leading-Edge Blanking of the Current Sense Signal 75-ns Typical Response from Current Sense to Output 1.5% Tolerance Voltage Reference DESCRIPTION The UCC3810-DIE is a high-speed BiCMOS controller integrating two synchronized pulse width modulators for use in off-line and dc-to-dc power supplies. The UCC3810-DIE provides perfect synchronization between two PWMs by using the same oscillator. The oscillator’s sawtooth waveform can be used for slope compensation if required. Using a toggle flip-flop to alternate between modulators, the UCC3810-DIE ensures that one PWM does not slave, interfere, or otherwise affect the other PWM. This toggle flip- flop also ensures that each PWM is limited to 50% maximum duty cycle, insuring adequate off-time to reset magnetic elements. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE UCC3810 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY UCC3810TD1 100 UCC3810TD2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated UCC3810-DIE SLUSBM2 – JUNE 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating ALCU(0.5%) 1200 nm Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: UCC3810-DIE UCC3810-DIE www.ti.com SLUSBM2 – JUNE 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX SYNC 1 1719.58 172.72 1821.18 274.32 CT 2 1963.42 205.74 2065.02 307.34 RT 3 2202.18 205.74 2303.78 307.34 FB1 4 2232.66 581.66 2334.26 683.26 COMP1 5 2204.72 1252.22 2306.32 1353.82 CS1 6 2240.28 1663.7 2341.88 1765.3 OUT1 7 1938.02 2255.52 2039.62 2357.12 GND 8 1719.58 2326.64 1821.18 2428.24 GND 9 1206.5 2217.42 1308.1 2319.02 PWRGND 10 596.9 2217.42 698.5 2319.02 OUT2 11 421.64 2280.92 523.24 2382.52 CS2 12 172.72 2169.16 274.32 2270.76 COMP2 13 172.72 1310.64 274.32 1412.24 FB2 14 144.78 805.18 246.38 906.78 ENABLE2 15 152.4 513.08 254 614.68 302.26 REF 16 287.02 200.66 388.62 VCC 17 508 167.64 609.6 269.24 VCC 18 741.68 942.34 843.28 1043.94 N/C 19 668.02 182.88 762 276.86 N/C 20 840.74 182.88 934.72 276.86 N/C 21 1016 182.88 1109.98 276.86 N/C 22 1188.72 182.88 1282.7 276.86 N/C 23 1361.44 182.88 1455.42 276.86 N/C 24 1534.16 182.88 1628.14 276.86 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: UCC3810-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) UCC3810TD1 ACTIVE 0 100 RoHS & Green Call TI N / A for Pkg Type 25 to 25 UCC3810TD2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 25 to 25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of