UCC5617DWP

UCC5617 18-Line SCSI Terminator (Reverse Disconnect) FEATURES DESCRIPTION • Complies with SCSI, SCSI-2, SCSI-3, SPI and FAST-20 Standards The UCC5617 provides 18 lines of active termination for a SCSI (Small Computers Systems Interface) parallel bus. The SCSI standard recommends and Fast-20 (Ultra) requires active termination at both ends of the cable. • 2pF Channel Capacitance During Disconnect • 50mA Supply Current in Disconnect Mode • 110 Termination • SCSI Hot Plugging Compliant, 10nA Typical • +400mA Sinking Current for Active Negation • –650mA Sourcing Current for Termination • Trimmed Impedance to 5% • Thermal Shutdown • Current Limit BLOCK DIAGRAM Pin for pin compatible with the UC5609, the UCC5617 is ideal for high performance 5V SCSI systems, Termpwr 4.0-5.25V. During disconnect the supply current is only 50 A typical, which makes the IC attractive for lower powered systems. The UCC5617 is designed with a low channel capacitance of 2pF, which eliminates effects on signal integrity from disconnected terminators at interim points on the bus. The power amplifier output stage allows the UCC5617 to source full termination current and sink active negation current when all termination lines are actively negated. The UCC5617, as with all Unitrode terminators, is completely hot pluggable and appears as high impedance at the terminating channels with TRMPWR = 0V or open. Internal circuit trimming is utilized, first to trim the 110 impedance, and then most importantly, to trim the output current as close to the maximum SCSI-3 specification as possible, which maximizes noise margin in fast SCSI operation. This device is offered in low thermal resistance versions of the industry standard 28 pin wide body SOIC. Patented Circuit Design SLUS351A - APRIL 1997 - REVISED AUGUST 2002 UDG-96073 UCC5617 ABSOLUTE MAXIMUM RATINGS CONNECTION DIAGRAMS TEMPWR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Operating Junction Temperature . . . . . . . . . . –55°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C SOIC-28 (Top View) DWP Package All currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. * DWP package pin 28 serves as signal ground; pins 7, 8, 9, 20, 21, 22 serve as heatsink/ground. 2 UCC5617 ELECTRICAL CHARACTERISTICS: Unless otherwise stated these specifications apply for TA = 0°C to 70°C, TRMPWR = 4.75V, DISCNCT = 0V, TA = TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Supply Current Section TERMPWR Supply Current Power Down Mode All Termination Lines = Open 1 2 mA All Termination Lines = 0.2V DISCNCT = 0V 420 440 mA 50 100 A 110 115.5 Output Section (Termination Lines) Termination Impedance (Note 3) 104.5 Output High Voltage VTRMPWR = 4V (Note 1) 2.6 2.8 3 V Max Output Current VLINE = 0.2V, TJ = 25°C –22.1 –23.3 –24 mA VLINE = 0.2V –20.7 –23.3 –24 mA VLINE = 0.2V, TERMPWR = 4V, TJ = 25°C (Note 1) –21 –23.3 –24 mA VLINE = 0.2V, TRMPWR = 4V (Note 1) –20 –23 –24 mA –22.4 mA Output Leakage VLINE = 0.5V DISCNCT = 2.4V, TRMPWR = 0V to 5.25V, REG = 0.2V, VLINE = 5.25V 10 400 nA Output Capacitance DISCNCT = 2.4V (Note 2) 2 3.5 pF 2.6 2.8 3 V 0.4 0.8 V –650 –850 mA 400 800 mA Regulator Section Regulator Output Voltage Drop Out Voltage All Termination Lines = 0.2V Short Circuit Current VREG = 0V –475 Sinking Current Capability VREG = 3.5V 200 Thermal Shutdown 170 °C Thermal Shutdown Hysteresis 10 °C Disconnect Section Disconnect Threshold Input Current 0.8 DISCNCT = 0V 1.5 2 V –10 –30 A Note 1: Measuring each termination line while other 17 are low (0.2V). Note 2: Guaranteed by design. Not 100% tested in production. Note 3: Tested by measuring IOUT with VOUT = 0.2V and VOUT with no load, then calculating: Z = VOUT N . L. – 0 . 2V IOUT at 0 . 2V PIN DESCRIPTIONS DISCNCT: Taking this pin low causes the 18 channels to become high impedance and the chip to go into low-power mode; a high or open state allows the channels to provide normal termination. GND: Ground reference for the IC. LINE1–LINE18: 110 termination channels. REG: Output of the internal 2.8V regulator. TRMPWR: Power for the IC. 3 UCC5617 APPLICATION INFORMATION Procedure: 1) Measure VREG N.L. 2) Set VL = 0.2V 3) Measure IMAX at 0.2V 4) Impedance = VREG N .L.– 0.2V IMAX UDG-96108 Figure 1. Termline Impedance Measurement Circuit UDG-96074 4 PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) UCC5617DWP LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 UCC5617DWP UCC5617DWPG4 LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 UCC5617DWP UCC5617DWPTR LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 UCC5617DWP UCC5617DWPTRG4 LIFEBUY SOIC DW 28 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. 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