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UCD3138064
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
UCD3138064 Highly Integrated Digital Controller for Isolated Power With 64-kB Program
Flash Memory
1 Device Overview
1.1
Features
1
• 64 kB Program Flash Derivative of UCD3138
Family
– 2-32 kB Program Flash Memory Banks
– Supports Execution From 1 Bank, While
Programming Another
– Capability to Update Firmware Without Shutting
Down the Power Supply
– Additional Communication Ports Compared to
the UCD3138 (+1 SPI, +1 I2C)
– RGC Package Pin-to-Pin Compatible with
UCD3138 (SLUSAP2B).
• Digital Control of up to 3 Independent Feedback
Loops
– Dedicated PID Based Hardware
– 2-pole/2-zero Configurable, Non-Linear Control
• Up to 16 MHz Error A/D Converter (EADC)
– Configurable Resolution (Min: 1 mV/LSB)
– Up to 8x Oversampling and Adaptive Trigger
Positioning
– Hardware Based Averaging (Up to 8x)
– 14 bit Effective DAC
• Up to 8 High Resolution Digital Pulse Width
Modulated (DPWM) Outputs
– 250 ps Pulse Width Resolution
– 4 ns Frequency and Phase Resolution
– Adjustable Phase Shift and Dead-bands
– Cycle-by-Cycle Duty Cycle Matching
– Up to 2 MHz Switching Frequency
• Configurable Trailing/Leading/Triangular
Modulation
• Configurable Feedback Control
– Voltage, Average Current and Peak Current
Mode Control
– Constant Current, Constant Power
• Configurable FM, Phase Shift Modulation and
PWM
• Fast, Automatic and Smooth Mode Switching
– Frequency Modulation and PWM
1.2
•
•
– Phase Shift Modulation and PWM
• High Efficiency and Light Load Management
– Burst Mode & Ideal Diode Emulation
– Synchronous Rectifier Soft On/Off
– Low IC Standby Power
• Primary Side Voltage Sensing
• Flux and Phase Current Balancing for Non-Peak
Current Mode Control Applications
• Current Share (Average & Master/Slave)
• Feature Rich Fault Protection Options
– 7 Analog / 4 Digital Comparators,
– Cycle-by-Cycle Current Limiting
– Programmable Blanking Time and Fault
Counting
– External Fault Inputs
• Synchronization of DPWM Waveforms Between
Multiple UCD3138064 Devices
• 14 channel, 12 bit, 267 ksps General Purpose
ADC with Integrated
– Programmable Averaging Filters
– Dual Sample and Hold
• Internal Temperature Sensor
• Fully Programmable High-Performance 31.25
MHz, 32-bit ARM7TDMI-S Processor
– 64 kB Program Flash (2-32 kB Banks)
– 2 kB Data Flash with ECC
– 4 kB Data RAM
– 8 kB Boot ROM Enables Firmware Boot-Load
• Communication Peripherals
– 1 - I2C/PMBus, 1 - I2C (master mode only)
– 2 - UARTs
– 1 - SPI
• Timer Capture with Selectable Input Pins
• Built In Watchdog: BOD and POR
• 64-pin QFN, 40-pin QFN, and 48-pin QFN
Packages
• Operating Temperature: –40°C to 125°C
• Fusion Digital Power Designer GUI Support
Applications
Power Supplies and Telecom Rectifiers
Power Factor Correction
•
Isolated DC-DC Modules
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
UCD3138064
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
1.3
www.ti.com
Description
The UCD3138064 is a digital power supply controller from Texas Instruments offering superior levels of
integration and performance in a single chip solution. The UCD3138064, in comparison to Texas
Instruments UCD3138 digital power controller (Section 3), offers 64 kB of program Flash memory (vs 32
kB in UCD3138) and additional options for communication such as SPI and a second I2C port. The
availability of 64 kB of program Flash memory in 2-32 kB banks, enables the designers to implement dual
images of firmware (e.g. one main image + one back-up image) in the device and the flexibility to execute
from either of the banks using appropriate algorithms. It also creates the unique opportunity for the
processor to load a new program and subsequently execute that program without interrupting power
delivery. This feature allows the end user to add new features to the power supply in the field while
eliminating any down-time required to load the new program.
The flexible nature of the UCD3138064 makes it suitable for a wide variety of power conversion
applications. In addition, multiple peripherals inside the device have been specifically optimized to
enhance the performance of AC/DC and isolated DC/DC applications and reduce the solution component
count in the IT and network infrastructure space. The UCD3138064 is a fully programmable solution
offering customers complete control of their application, along with ample ability to differentiate their
solution. At the same time, TI is committed to simplifying our customer’s development effort through
offering best in class development tools, including application firmware, Code Composer StudioTM
software development environment, and TI’s Fusion Power Development GUI which enables customers to
configure and monitor key system parameters.
At the core of the UCD3138064 controller are the Digital Power Peripherals (DPP). Each DPP implements
a high speed digital control loop consisting of a dedicated Error Analog to Digital Converter (EADC), a PID
based 2 pole - 2 zero digital compensator and DPWM outputs with 250ps pulse width resolution. The
device also contains a 12-bit, 267 ksps general purpose ADC with up to 14 channels, timers, interrupt
control, PMBus, I2C, SPI and UART communications ports. The device is based on a 32-bit ARM7TDMI-S
RISC microcontroller that performs real-time monitoring, configures peripherals and manages
communications. The ARM microcontroller executes its program out of programmable flash memory as
well as on chip RAM and ROM.
In addition to the DPP, specific power management peripherals have been added to enable high efficiency
across the entire operating range, high integration for increased power density, reliability, and lowest
overall system cost and high flexibility with support for the widest number of control schemes and
topologies. Such peripherals include: light load burst mode, synchronous rectification, LLC and phase
shifted full bridge mode switching, input voltage feed forward, copper trace current sense, ideal diode
emulation, constant current constant power control, synchronous rectification soft on and off, peak current
mode control, flux balancing, secondary side input voltage sensing, high resolution current sharing,
hardware configurable soft start with pre bias, as well as several other features. Topology support has
been optimized for voltage mode and peak current mode controlled phase shifted full bridge, single and
dual phase PFC, bridgeless PFC, hard switched full bridge and half bridge, and LLC half bridge and full
bridge.
Device Information (1)
PART NUMBER
UCD3138064
(1)
2
PACKAGE
BODY SIZE (NOM)
VQFN (64)
9.00 mm × 9.00 mm
VQFN (48)
7.00 mm × 7.00 mm
VQFN (40)
6.00 mm × 6.00 mm
For all available packages, see the orderable addendum at the end of the datasheet.
Device Overview
Copyright © 2013–2014, Texas Instruments Incorporated
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1.4
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Functional Block Diagram
Loop MUX
EAP0
DPWM0
PID Based
Filter 1
DPWM1
PID Based
Filter 2
DPWM2
Constant Power Constant
Current
DPWM3
Front End 0
EAN0
EAP1
Front End 1
EAN1
Front End 2
AFE
EAP2
EAN2
23-AFE
DPWM0B
DPWM1A
DPWM1B
DPWM2A
DPWM2B
DPWM3A
DPWM3B
Front End Averaging
EADC
2AFE
DPWM0A
PID Based
Filter 0
X
SYNC
Avg()
Digital Comparators
SAR/Prebias
DAC0
Ramp
A0
Input Voltage Feed Forward
Filter x
CPCC
Value
Dither
Abs()
Peak Current Mode
Control Comparator
Advanced Power Control
Mode Switching, Burst Mode, IDE,
Synchronous Rectification soft on & off
ADC_EXT
AD[13:0]
PMBUS_ALERT
ADC12 Control
Sequencing, Averaging,
Digital Compare, Dual
Sample and hold
ADC12
PMBUS_CTRL
PMBus
PMBUS_DATA
AD00
PMBUS_CLK
AD01
Internal Temperature
Sensor
AD02
AGND
Current Share
Analog, Average, Master/Slave
AD13
PWM0
Timers
4 ± 16 bit (PWM)
1 ± 24 bit
PWM1
TCAP
Oscillator
SCI_TX0
ARM7TDMI-S
32 bit, 31.25 MHz
Analog
Comparators
UART1
A
SCI_RX1
Memory
DFLASH 2 kB
RAM 4 kB
ROM 8 kB
AD03
B
C
V33D
V33DIO
VREG
DGND
D
Fault MUX &
Control
E
Cycle by Cycle
Current Limit
F
Digital
Comparators
AD13
Power and
1.8 V Voltage
Regulator
AD06
V33A
PFLASH 64 kB
EXT_INT
FAULT0
GPIO
Control
FAULT1
FAULT2
Bank 1
32 kB
Bank 2
32 kB
FAULT3
/RESET
TCK
Power On Reset
AD07
SCI_RX0
SCI_TX1
AD02
AD04
UART0
JTAG
G
TDI
TMS
Brown Out Detection
AGND
TDO
SPI_MISO
SPI_MOSI
SPI
SPI_CLK
SPI_CS
I2C_DATA
I2C
I2C_CLK
Device Overview
Copyright © 2013–2014, Texas Instruments Incorporated
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3
UCD3138064
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
www.ti.com
Table of Contents
1
2
3
Device Overview ......................................... 1
1.1
Features .............................................. 1
1.2
Applications ........................................... 1
1.3
Description ............................................ 2
1.4
Functional Block Diagram ............................ 3
Device Comparison Table ............................ 5
............................. 5
Pin Configuration and Functions ..................... 7
4.1
Pin Diagrams ......................................... 7
4.2
Pin Functions ......................................... 8
Specifications ........................................... 12
5.1
Absolute Maximum Ratings ......................... 12
5.2
Handling Ratings .................................... 12
5.3
Recommended Operating Conditions ............... 12
5.4
Thermal Information ................................. 12
5.5
Electrical Characteristics ............................ 13
5.6
Timing Characteristics .............................. 15
5.7
PMBus/SMBus/I2C Timing .......................... 16
3.2
5
6
Revision History ......................................... 4
Device Options ........................................... 5
3.1
4
5.8
Product Selection Matrix
7
8
9
Power On Reset (POR) / Brown Out Reset (BOR) . 17
...............
.............................
Detailed Description ...................................
6.1
Overview ............................................
6.2
Functional Block Diagram ...........................
6.3
Feature Description .................................
6.4
Device Functional Modes ...........................
6.5
Memory ..............................................
Applications, Implementation, and Layout........
7.1
Application Information ..............................
7.2
Typical Application ..................................
Device and Documentation Support ...............
8.1
Device Support ......................................
8.2
Documentation Support ............................
8.3
Trademarks..........................................
8.4
Electrostatic Discharge Caution .....................
8.5
Glossary .............................................
5.9
Typical Clock Gating Power Savings
5.10
Typical Characteristics
18
19
20
20
21
22
47
55
59
59
60
74
74
75
75
76
76
Mechanical, Packaging, and Orderable
Information .............................................. 76
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (February 2014) to Revision B
•
•
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................. 1
Added 40-pin RMH QFN package option (global). ............................................................................... 1
Changes from Original (March 2013) to Revision A
•
•
4
Page
Page
Finalize for release. Changed rev to A. ............................................................................................ 1
Deleted table: Summary Of Key Differences Between UCD3138x & UCD3138 ............................................. 5
Revision History
Copyright © 2013–2014, Texas Instruments Incorporated
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SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
3 Device Options
3.1
Device Comparison Table
UCD3138
RHA/RMH
UCD3138064
RMH
UCD3138
RGC
Package Offering
40 Pin QFN
(6 mm x 6
mm)
40 Pin QFN
(6 mm x 6
mm)
64 Pin QFN
(9 mm x 9
mm)
64 Pin QFN
(9 mm x 9
mm)
48 Pin QFN
(7 mm x 7
mm)
80 Pin QFP
(14 mm x 14
mm)
(Includes
leads)
80 Pin QFP
(14 mm x 14
mm)
(Includes
leads)
ARM7TDMI-S Core
Processor
31.25 MHz
31.25 MHz
31.25 MHz
31.25 MHz
31.25 MHz
31.25 MHz
31.25 MHz
High Resolution DPWM
Outputs (250ps Resolution)
8
8
8
8
8
8
8
Number of High Speed
Independent Feedback
Loops (# Regulated Output
Voltages
3
3
3
3
3
3
3
12-bit, 256kps, General
Purpose ADC Channels
7
7
14
14
9
15
15
Digital Comparators at ADC
Outputs
4
4
4
4
4
4
4
32 kB
64 kB
32 kB
64 kB
64 kB
128 kB
64 kB
FEATURE
Flash Memory (Program)
UCD3138064 UCD3138064 UCD3138128 UCD3138A64
RGC
RGZ
PFC
PFC
1
2
1
2
2
4
Only 1 bank
of 64 kB
Flash
available
Flash Memory (Data)
2 kB
2 kB
2 kB
2 kB
2 kB
2 kB
2 kB
RAM
4 kB
4 kB
4 kB
4 kB
4 kB
8 kB
8 kB
4
4
Number of Memory 32kB
Flash Memory Banks
Programmable Fault Inputs
1+2
High Speed Analog
Comparators with Cycle-byCycle Current Limiting
(1)
1+2
(1)
4
2+2
(1)
1+2
(1)
6
6
7
7
6
7
7
1 (1)
1 (1)
2
2
2
2
2
PMBus/I C
1
1
1
1
1
1
1
Additional I2C
0
0
0
1 (1)
1 (1)
1
1
(1)
(1)
UART (SCI)
2
SPI
Timers
0
0
0
1
1
4 (16 bit) and
1 (24 bit)
4 (16 bit) and
1 (24 bit)
4 (16 bit) and
1 (24 bit)
4 (16 bit) and
1 (24 bit)
4 (16 bit) and
1 (24 bit)
4 (16 bit) and
2 (24 bit)
4 (16 bit) and
2 (24 bit)
1 (1)
1 (1)
2
2
1 (1)
4
4
(1)
(1)
1+3
Timer PWM Outputs
(1)
2+2
(1)
2 + 2 (1)
Total Digital GPIOs
18
18
30
30
24
43
43
External Interrupts
0
0
1
1
0
1
1
External Crystal Clock
Support
no
no
no
no
no
Yes (pins
#61, 62)
Yes (pins
#61, 62)
EADC2 Only
All EADC
channels
EADC Only
All EADC
channels
All EADC
Channels
All EADC
Channels
All EADC
Channels
3.2
2
(1)
2
(1)
1+3
(1)
1
Timer Capture Inputs
Peak Current Mode Control
2
1
Represents an alternate pin out that is programmable via firmware.
Product Selection Matrix
FEATURE
UCD3138064 64 PIN
UCD3138064 48 PIN
UCD3138064 40 PIN
31.25 MHz
31.25 MHz
31.25 MHz
High Resolution DPWM Outputs (250ps Resolution)
8
8
8
Number of High Speed Independent Feedback Loops (#
Regulated Output Voltages)
3
3
3
12-bit, 267 ksps, General Purpose ADC Channels
14
9
7
ARM7TDMI-S Core Processor
Device Options
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UCD3138064
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
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FEATURE
UCD3138064 64 PIN
UCD3138064 48 PIN
UCD3138064 40 PIN
4
4
4
Flash Memory (Program)
64 kB
64 KB
32 KB
Flash Memory (Data)
2 kB
2 KB
2 KB
√
√
√
4 kB
4 KB
4 KB
up to 2 MHz
up to 2 MHz
up to 2 MHz
2 + 2 (1)
1 + 2 (1)
1 + 2 (1)
7 (2)
6 (2)
6
2
2
1 (1)
Digital Comparators at ADC Outputs
Flash Security
RAM
DPWM Switching Frequency
Programmable Fault Inputs
High Speed Analog Comparators with Cycle-by-Cycle
Current Limiting
UART (SCI)
1
1
√
I2C
1 (1)
1 (1)
0
SPI
(3)
(3)
PMBus
1
Timers
1
0
4 (16 bit) and 1 (24 bit)
4 (16 bit) and 1 (24 bit)
4 (16 bit) and 1 (24 bit)
2
1 (3)
1
Timer Capture Inputs
1
(3)
Watchdog
√
√
√
On Chip Oscillator
√
√
√
Power-On Reset and Brown-Out Reset
√
√
√
Sync IN and Sync OUT Functions
√
√
√
Total GPIO (includes all pins with multiplexed functions such
as, DPWM, Fault Inputs, SCI, etc.)
30
24
18
Timer PWM Outputs
1
1 (3)
External Interrupts
1
0
0
Package Offering
64 Pin QFN (9.00 mm x
9.00 mm)
48 Pin QFN (7.00 mm
x 7.00 mm)
40 Pin QFN (6.00 mm x
6.00mm)
(1)
(2)
(3)
6
This number represents an alternate pin out that is programmable via firmware. See the UCD3138064 Digital Power Peripherals
Programmer’s Manual for details.
To facilitate simple OVP and UVP connections both comparators B and C are connected to the AD03 pin.
This number represents an alternate pin out that is programmable via firmware. See the UCD3138064 Digital Power Peripherals
Programmer’s Manual for details.
Device Options
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SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
4 Pin Configuration and Functions
4.1
Pin Diagrams
AD11
AD09
AD08
AD05
AD02
AD01
AD00
V33A
AGND
EAN2
EAP2
EAN1
EAP1
EAN0
EAP0
AGND
64-Pin QFN
RGC Package
Top View
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AGND
1
48
AGND
AD13
2
47
V33D
AD12
3
46
BP18
AD10
4
45
V33DIO
AD07
5
44
DGND
AD06
6
43
FAULT3
AD04
7
42
FAULT2
AD03
8
41
TCAP
V33DIO
9
40
TMS
DGND
10
39
TDI/SCI_RX0/PMBUS_CTRL/FAULT1/SPI_MISO
/RESET
11
38
TDO/SCI_TX0/PMBUS_ALERT/FAULT0/SPI_MOSI
ADC_EXT/TCAP/SYNC/PWM0
12
37
TCK/TCAP/SYNC/PWM0
SCI_RX0
13
36
FAULT1/SPI_CLK/I2C_CLK
SCI_TX0
14
35
FAULT0/SPI_CS/I2C_DATA
PMBUS_CLK/SCI_TX0
15
34
INT_EXT
PMBUS_DATA/SCI_RX0
16
33
DGND
DPWM1B
DPWM2A
DPWM2B
DPWM3A
26
27
28
29
30
31
32
PWM1
DPWM1A
25
PWM0
DPWM0B
24
SCI_RX1/PMBUS_CTRL
23
SCI_TX1/PMBUS_ALERT
22
PMBUS_CTRL
21
PMBUS_ALERT
20
SYNC/TCAP/ADC_EXT/PWM0
19
DGND
18
DPWM3B
17
DPWM0A
QFN (64)
AD08
AD05
AD02
AD01
AD00
V33A
AGND
EAP2
EAN1
EAP1
EAN0
EAP0
48-Pin QFN
RGZ Package
Top View
48
47
46
45
44
43
42
41
40
39
38
37
AGND
1
36
AGND
AD13
2
35
AGND
AD06
3
34
BP18
AD04
4
33
V33D
AD03
5
32
DGND
DGND
6
31
FAULT2
QFN (48)
11
26
FAULT1/SPI_CLK/I2C_CLK
PMBUS_DATA/SCI_RX0
12
25
FAULT0/SPI_CS/I2C_DATA
DPWM0A
13
14
15
16
17
18
19
20
21
22
23
24
SCI_RX1/PMBUS_CTRL
TCK/TCAP/SYNC/PWM0
PMBUS_CLK/SCI_TX0
SCI_TX1/PMBUS_ALERT
27
PMBUS_CTRL
10
PMBUS_ALERT
TDO/SCI_TX0/PMBUS_ALERT/FAULT0/SPI_MOSI
SCI_TX0
DPWM3B
28
DPWM3A
9
DPWM2B
TDI/SCI_RX0/PMBUS_CTRL/FAULT1/SPI_MISO
SCI_RX0
DPWM2A
TMS
29
DPWM1B
30
8
DPWM1A
7
DPWM0B
/RESET
ADC_EXT/TCAP/SYNC/PWM0
Pin Configuration and Functions
Copyright © 2013–2014, Texas Instruments Incorporated
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UCD3138064
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
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4.2
39
38
36
34
33
32
EAP0
EAP1
EAN0
EAP2
35
EAN1
V33A
37
AGND
AD00
AD02
40
AD01
40-Pin QFN
RMH Package
Top View
31
AGND
1
30
AGND
AD13
2
29
AGND
AD06
3
28
BP18
AD04
4
27
V33D
AD03
5
26
DGND
DGND
6
25
FAULT2
/RESET
7
24
TMS
ADC_EXT_TRIG/TCAP/SYNC/PWM0
8
23
TDI/SCI_RX0/PMBUS_CTRL/FAULT1
PMBUS_CLK/SCI_TX0
9
22
TDO/SCI_TX0/PMBUS_ALERT/FAULT0
PMBUS_DATA/SCI_RX0
10
21
TCK/TCAP/SYNC/PWM0
12
13
14
15
16
17
18
19
DPWM0B
DPWM1A
DPWM1B
DPWM2A
DPWM2B
DPWM3A
DPWM3B
PMBUS_ALERT
20
PMBUS_CTRL
11
DPWM0A
QFN (40)
Pin Functions
Table 4-1. Pin Functions - 64 VQFN
PIN
ALTERNATE ASSIGNMENT
PRIMARY ASSIGNMENT
NUMBER
8
NAME
NO. 1
1
AGND
Analog ground
2
AD13
12-bit ADC, Ch 13, comparator E, I-share
3
AD12
12-bit ADC, Ch 12
4
AD10
12-bit ADC, Ch 10
5
AD07
12-bit ADC, Ch 7, Connected to comparator F and
reference to comparator G
DAC output
6
AD06
12-bit ADC, Ch 6, Connected to comparator F
DAC output
7
AD04
12-bit ADC, Ch 4, Connected to comparator D
DAC output
8
AD03
12-bit ADC, Ch 3, Connected to comparator B and C
NO. 2
NO. 3
SYNC
PWM0
NO. 4
CONFIGURABLE
AS A GPIO?
DAC output
9
V33DIO
Digital I/O 3.3V core supply
10
DGND
Digital ground
11
RESET
Device Reset Input, active low
12
ADC_EXT
ADC conversion external trigger input
13
SCI_RX0
SCI RX 0
14
SCI_TX0
SCI TX 0
15
PMBUS_CLK
PMBUS Clock (Open Drain)
SCI TX 0
Yes
16
PMBUS_DATA
PMBus data (Open Drain)
SCI RX 0
Yes
17
DPWM0A
DPWM 0A output
Yes
18
DPWM0B
DPWM 0B output
Yes
19
DPWM1A
DPWM 1A output
Yes
20
DPWM1B
DPWM 1B output
Yes
21
DPWM2A
DPWM 2A output
Yes
22
DPWM2B
DPWM 2B output
Yes
23
DPWM3A
DPWM 3A output
Yes
24
DPWM3B
DPWM 3B output
Yes
25
DGND
Digital ground
26
SYNC
DPWM Synchronize pin
27
PMBUS_ALERT
PMBus Alert (Open Drain)
TCAP
Yes
Yes
Yes
TCAP
ADC_EXT_TRIG
PWM0
Yes
Yes
Pin Configuration and Functions
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SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Table 4-1. Pin Functions - 64 VQFN (continued)
PIN
ALTERNATE ASSIGNMENT
PRIMARY ASSIGNMENT
NUMBER
(1)
NAME
NO. 1
NO. 2
NO. 3
NO. 4
CONFIGURABLE
AS A GPIO?
28
PMBUS_CTRL
PMBus Control (Open Drain)
29
SCI_TX1
SCI TX 1
PMBUS_ALERT
Yes
Yes
30
SCI_RX1
SCI RX 1
PMBUS_CTRL
Yes
31
PWM0
General purpose PWM 0
Yes
32
PWM1
General purpose PWM 1
Yes
33
DGND
Digital ground
34
INT_EXT
External Interrupt
35
FAULT0
External fault input 0
SPI_CS
I2C_DATA
36
FAULT1
External fault input 1
SPI_CLK
I2C_CLK
37
TCK (1)
JTAG TCK (for manufacturer test only)
TCAP
SYNC
PWM0
38
TDO (1)
JTAG TDO (for manufacturer test only)
SCI_TX0
PMBUS_ALERT
FAULT0
SPI_MOSI
Yes
39
TDI (1)
JTAG TDI (for manufacturer test only)
SCI_RX0
PMBUS_CTRL
FAULT1
SPI_MISO
Yes
40
TMS (1)
JTAG TMS (for manufacturer test only)
Yes
41
TCAP
Timer capture input
Yes
42
FAULT2
External fault input 2
Yes
43
FAULT3
External fault input 3
Yes
44
DGND
Digital ground
45
V33DIO
Digital I/O 3.3 V core supply
46
BP18
1.8V Bypass
47
V33D
Digital 3.3V core supply
48
AGND
Substrate analog ground
49
AGND
Analog ground
50
EAP0
Channel #0, differential analog voltage, positive input
51
EAN0
Channel #0, differential analog voltage, negative input
52
EAP1
Channel #1, differential analog voltage, positive input
53
EAN1
Channel #1, differential analog voltage, negative input
54
EAP2
Channel #2, differential analog voltage, positive input
55
EAN2
Channel #2, differential analog voltage, negative input
56
AGND
Analog ground
57
V33A
Analog 3.3 V supply
58
AD00
12-bit ADC, Ch 0, Connected to current source
59
AD01
12-bit ADC, Ch 1, Connected to current source
60
AD02
12-bit ADC, Ch 2, Connected to comparator A, I-share
61
AD05
12-bit ADC, Ch 5
62
AD08
12-bit ADC, Ch 8
63
AD09
12-bit ADC, Ch 9
64
AD11
12-bit ADC, Ch 11
Yes
Yes
Yes
Yes
Fusion Digital Power based debug tools are recommended instead of JTAG.
Table 4-2. Pin Functions - 48 VQFN
PIN
ALTERNATE ASSIGNMENT
PRIMARY ASSIGNMENT
NUMBER
NAME
NO. 1
NO. 2
NO. 3
SYNC
PWM0
NO. 4
CONFIGURABLE
AS A GPIO?
1
AGND
Analog ground
2
AD13
12-bit ADC, Ch 13, Connected to comparator E, I-share
DAC Output
3
AD06
12-bit ADC, Ch 6, Connected to comparator F
DAC Output
4
AD04
12-bit ADC, Ch 4, Connected to comparator D
DAC Output
5
AD03
12-bit ADC, Ch 3, Connected to comparator B & C
6
DGND
Digital ground
7
RESET
Device Reset Input, active low
8
ADC_EXT
ADC conversion external trigger input
9
SCI_RX0
SCI_RX0
10
SCI_TX0
SCI_TX0
11
PMBUS_CLK
PMBUS Clock (Open Drain)
SCI_TX0
Yes
12
PMBUS_DATA
PMBus data (Open Drain)
SCI_RX0
Yes
TCAP
Yes
Yes
Yes
Pin Configuration and Functions
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Table 4-2. Pin Functions - 48 VQFN (continued)
PIN
ALTERNATE ASSIGNMENT
CONFIGURABLE
AS A GPIO?
PRIMARY ASSIGNMENT
NUMBER
(1)
NAME
NO. 1
NO. 2
NO. 3
NO. 4
13
DPWM0A
DPWM 0A output
Yes
14
DPWM0B
DPWM 0B output
Yes
15
DPWM1A
DPWM 1A output
Yes
16
DPWM1B
DPWM 1B output
Yes
17
DPWM2A
DPWM 2A output
Yes
18
DPWM2B
DPWM 2B output
Yes
19
DPWM3A
DPWM 3A output
Yes
20
DPWM3B
DPWM 3B output
Yes
21
PMBUS_ALERT
PMBus Alert (Open Drain)
Yes
22
PMBUS_CTRL
PMBus Control (Open Drain)
23
SCI_TX1
SCI TX 1
PMBUS_ALERT
24
SCI_RX1
SCI RX 1
PMBUS_CTRL
25
FAULT0
External fault input 0
SPI_CS
I2C_DATA
26
FAULT1
External fault input 1
SPI_CLK
I2C_CLK
27
TCK (1)
JTAG TCK (for manufacturer test only)
TCAP
SYNC
PWM0
28
TDO (1)
JTAG TDO (for manufacturer test only)
SCI TX0
PMBUS_ALERT
FAULT0
SPI_MOSI
Yes
29
TDI (1)
JTAG TDI (for manufacturer test only)
SCI_RX0
PMBUS_CTRL
FAULT1
SPI_MISO
Yes
30
TMS (1)
JTAG TMS (for manufacturer test only)
Yes
31
FAULT2
External fault input 2
Yes
32
DGND
Digital ground
33
V33D
Digital 3.3 V core supply
34
BP18
1.8V Bypass
35
AGND
Analog ground
36
AGND
Analog ground
37
EAP0
Channel #0, differential analog voltage, positive input
38
EAN0
Channel #0, differential analog voltage, negative input
39
EAP1
Channel #1, differential analog voltage, positive input
40
EAN1
Channel #1, differential analog voltage, negative input
41
EAP2
Channel #2, differential analog voltage, positive input
42
AGND
Analog ground
43
V33A
Analog 3.3 V supply
44
AD00
12-bit ADC, Ch 0, Connected to current source
45
AD01
12-bit ADC, Ch 1, Connected to current source
46
AD02
12-bit ADC, Ch 2, Connected to comparator A, I-share
47
AD05
12-bit ADC, Ch 5
48
AD08
AD08 12-bit ADC, Ch 8
Yes
Yes
Yes
Yes
Yes
Yes
Fusion Digital Power based debug tools are recommended instead of JTAG.
Table 4-3. Pin Functions - 40 WQFN
PIN
ALTERNATE ASSIGNMENT
NO. 1
NO. 2
NO. 3
CONFIGURABLE
AS A GPIO?
TCAP
SYNC
PWM0
Yes
PRIMARY ASSIGNMENT
NUMBER
10
NAME
1
AGND
Analog ground
2
AD13
12-bit ADC, Ch 13, Connected to comparator E, I-share
3
AD06
12-bit ADC, Ch 6, Connected to comparator F
4
AD04
12-bit ADC, Ch 4, Connected to comparator D
5
AD03
12-bit ADC, Ch 3, Connected to comparator B & C
6
DGND
Digital ground
7
RESET
Device Reset Input, active low
8
ADC_EXT_TRIG
ADC conversion external trigger input
9
PMBUS_CLK
PMBUS Clock (Open Drain)
SCI_TX0
Yes
10
PMBUS_DATA
PMBUS Data (Open Drain)
SCI_RX0
Yes
11
DPWM0A
DPWM 0A output
Yes
12
DPWM0B
DPWM 0B output
Yes
13
DPWM1A
DPWM 1A output
Yes
Pin Configuration and Functions
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SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Table 4-3. Pin Functions - 40 WQFN (continued)
PIN
ALTERNATE ASSIGNMENT
PRIMARY ASSIGNMENT
NUMBER
NO. 1
NO. 2
NO. 3
CONFIGURABLE
AS A GPIO?
14
DPWM1B
DPWM 1B output
Yes
15
DPWM2A
DPWM 2A output
Yes
16
DPWM2B
DPWM 2B output
Yes
17
DPWM3A
DPWM 3A output
Yes
18
DPWM3B
DPWM 3B output
Yes
19
PMBUS_ALERT
PMBus Alert (Open Drain)
Yes
20
PMBUS_CTRL
PMBus Control (Open Drain)
21
TCK (1)
JTAG TCK (for manufacturer test only)
TCAP
SYNC
PWM0
Yes
22
TDO (1)
JTAG TDO (for manufacturer test only)
SCI TX0
PMBUS_AL
ERT
FAULT0
Yes
23
TDI (1)
JTAG TDI (for manufacturer test only)
SCI_RX0
PMBUS_CT
RL
FAULT1
Yes
24
TMS (1)
JTAG TMS (for manufacturer test only)
Yes
25
FAULT2
External fault input 2
Yes
26
DGND
Digital ground
27
V33D
Digital 3.3 V core supply
28
BP18
1.8V Bypass
29
AGND
Substrate analog ground
30
AGND
Analog ground
31
EAP0
Channel #0, differential analog voltage, positive input
32
EAN0
Channel #0, differential analog voltage, negative input
33
EAP1
Channel #1, differential analog voltage, positive input
34
EAN1
Channel #1, differential analog voltage, negative input
35
EAP2
Channel #2, differential analog voltage, positive input
(Recommended for peak current mode control)
36
AGND
Analog ground
37
V33A
Analog 3.3 V supply
38
AD00
12-bit ADC, Ch 0, Connected to current source
39
AD01
12-bit ADC, Ch 1, Connected to current source
40
AD02
12-bit ADC, Ch 2, Connected to comparator A, I-share
Corner anchor pin
(RMH only)
All four anchors should be soldered and tied to GND
Corner
NA
(1)
NAME
Yes
Fusion Digital Power based debug tools are recommended instead of JTAG.
Pin Configuration and Functions
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5 Specifications
Absolute Maximum Ratings (1)
5.1
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V33D
V33D to DGND
–0.3
3.8
V
V33DIO
V33DIO to DGND
–0.3
3.8
V
V33A
V33A to AGND
–0.3
3.8
V
BP18
BP18 to DGND
–0.3
2.5
V
|DGND – AGND|
Ground difference
0.3
V
All Pins, excluding
AGND (2)
Voltage applied to any pin
–0.3
3.8
V
TOPT
Junction Temperature
–40
125
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.3 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Referenced to DGND
5.2
Handling Ratings
MIN
MAX
UNIT
°C
TSTG
Storage temperature
–55
150
VESD (1)
Human Body Model (HBM) ESD stress voltage (2)
–2000
2000
Charge Device Model (CDM) ESD Stress voltage (3)
–500
500
(1)
(2)
(3)
V
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
5.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
V33D
Digital power
3.0
3.3
3.6
V
V33DIO
Digital I/O power
3.0
3.3
3.6
V
V33A
Analog power
3.0
3.3
3.6
V
BP18
1.8 V digital power
1.6
1.8
2.0
V
TJ
Junction temperature
–40
-
125
°C
5.4
Thermal Information
UCD3138064
THERMAL METRIC
VQFN (64)
VQFN (48)
WQFN (40)
19.9
26.9
30.8
RθJC(top) Junction-to-case (top) thermal resistance
5.7
12.5
15.7
RθJB
Junction-to-board thermal resistance
3.1
3.9
5.7
ψJT
Junction-to-top characterization parameter
0.1
0.2
0.2
ψJB
Junction-to-board characterization parameter
3.0
4.0
5.7
RθJC(bot) Junction-to-case (bottom) thermal resistance
0.3
0.5
0.9
RθJA
12
UNIT
Junction-to-ambient thermal resistance
Specifications
UNIT
°C/W
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5.5
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Electrical Characteristics
V33A = V33D = V33DIO = 3.3 V; 1μF from BP18 to DGND, TJ = –40 °C to 125 °C (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
I33A
Measured on V33A. The device is powered up
but all ADC12 and EADC sampling is disabled
I33DIO
All GPIO and communication pins are open
I33D
ROM program execution
I33D
Flash programming in ROM mode
I33
The device is in ROM mode with all DPWMs
enabled and switching at 2 MHz. The DPWMs
are all unloaded.
6.3
mA
0.35
mA
60
mA
70
mA
100
mA
ERROR ADC INPUTS EAP, EAN
EAP – AGND
EAP – EAN
Typical error range
EAP – EAN Error voltage digital
resolution
REA
Input impedance (See Figure 6-1)
IOFFSET
Input offset current (See Figure 6-1)
EADC Offset
–0.15
1.998
–0.256
1.848
AFE = 0
–256
248
mV
AFE = 3
0.8
1
1.20
mV
AFE = 2
1.7
2
2.30
mV
AFE = 1
3.55
4
4.45
mV
AFE = 0
6.90
8
9.10
AGND reference
0.5
mV
–5
5
μA
Input voltage = 0 V at AFE = 0
–2
2
LSB
Input voltage = 0 V at AFE = 1
–2.5
2.5
LSB
Input voltage = 0 V at AFE = 2
–3
-3
LSB
Input voltage = 0 V at AFE = 3
–4
4
LSB
15.62
5
MHz
Analog Front End Amplifier Bandwidth
A0
V
MΩ
Sample Rate
Gain
V
100
See Figure 6-2
MHz
1
Minimum output voltage
V/V
21
mV
EADC DAC
DAC range
0
VREF DAC reference resolution
10-bit, No dithering enabled
VREF DAC reference resolution
With 4-bit dithering enabled
INL
DNL
Does not include MSB transition
1.6
1.56
μV
97.6
–2.0
2.0
LSB
–1.0
2.1
LSB
DNL at MSB transition
–1.4
DAC reference voltage
V
mV
LSB
1.58
1.61
V
9.5
10.5
μA
0
2.5
V
2.53
V
ADC12
IBIAS
Bias current for PMBus address pins
Measurement range for voltage
monitoring
Internal ADC reference voltage
–40 to 125 °C
2.475
Change in Internal ADC reference from
25°C reference voltage
–40 to 25 °C
–0.7
25 to 125 °C
–2.1
ADC12 INL integral nonlinearity
ADC12 DNL differential nonlinearity
ADC_SAMPLING_SEL = 6 for all ADC12 data,
25 to 125 °C
2.500
mV
–7.5/+2
.9
LSB
–0.7/+3
.2
LSB
ADC Zero Scale Error
–7
7
mV
ADC Full Scale Error
–35
35
mV
Specifications
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Electrical Characteristics (continued)
V33A = V33D = V33DIO = 3.3 V; 1μF from BP18 to DGND, TJ = –40 °C to 125 °C (unless otherwise noted)
PARAMETER
TEST CONDITION
Input bias
2.5 V applied to pin
Input leakage resistance
ADC_SAMPLING_SEL= 6 or 0
MIN
TYP
MAX
200
Input Capacitance
UNIT
nA
1
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS (1) (2)
VOL
Low-level output voltage (3)
VOH
High-level output voltage
VIH
High-level input voltage
V33DIO = 3 V
VIL
Low-level input voltage
V33DIO = 3 V
IOH
Output sinking current
IOL
Output sourcing current
(3)
DGND
+ 0.25
IOH = 4 mA, V33DIO = 3 V
IOH = –4 mA, V33DIO = 3 V
V
V33DIO
– 0.6
V
2.1
V
1.1
4
–4
V
mA
mA
SYSTEM PERFORMANCE
TWD
Watchdog time out resolution
Total time is: TWD x (WDCTRL.PERIOD+1)
13.1
Processor master clock (MCLK)
tDelay
f(PCLK)
17
22.7
31.25
Digital filter delay (4)
(1 clock = 32 ns)
Retention period of flash content (data
retention and program)
TJ = 25 °C
ms
MHz
6 MCLKs
100
Internal oscillator frequency
240
Flash Read
years
250
260
1
MHz
MCLKs
ISHARE
Current share current source (See )
238
259
μA
RSHARE
Current share resistor (See )
9.75
10.3
kΩ
POWER ON RESET AND BROWN OUT (V33A pin, See Figure 5-3)
VGH
Voltage Good High
2.7
V
VGL
Voltage Good Low
2.5
V
0.8
V
2.9
V
Voltage at which IReset signal is valid (5)
Vres
Brownout
Internal signal warning of brownout conditions
TEMPERATURE SENSOR (5)
VTEMP
Voltage range of sensor
Voltage resolution
Volts/°C
Temperature resolution
Degree C per bit
Accuracy (5) (6)
–40 to 125 °C
–10
Temperature range
–40 to 125 °C
–40
ITEMP
VAMB
1.46
Current draw of sensor when active
Ambient temperature
Trimmed 25 °C reading
2.44
V
5.9
mV/ºC
0.1034
ºC/LSB
±5
10
125
ºC
ºC
30
μA
1.85
V
ANALOG COMPARATOR
DAC
Reference DAC Range
0
Reference Voltage
2.478
Bits
(1)
(2)
(3)
(4)
(5)
(6)
14
2.5
2.5
2.513
7
V
V
bits
INL (5)
–0.42
0.21
LSB
DNL (5)
0.06
0.12
LSB
DPWM outputs are low after reset. Other GPIO pins are configured as inputs after reset.
On the 40 pin package V33DIO is connected to V33D internally.
The maximum total current, IOHmax and IOLmax for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop
specified. Maximum sink current per pin = –6 mA at VOL; maximum source current per pin = 6 mA at VOH.
Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay, which
has no variation associated with it, must be accounted for when calculating the system dynamic response.
Characterized by design and not production tested.
Ambient temperature offset value should be used from the TEMPSENCTRL register to meet accuracy.
Specifications
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Electrical Characteristics (continued)
V33A = V33D = V33DIO = 3.3 V; 1μF from BP18 to DGND, TJ = –40 °C to 125 °C (unless otherwise noted)
MAX
UNIT
Offset
PARAMETER
TEST CONDITION
–5.5
19.5
mV
Reference DAC buffered output load (7)
–0.5
1
mA
Buffer offset (–0.5 mA)
Buffer offset (1.0 mA)
Output Range (–0.5 mA)
Output Range (1.0 mA)
(7)
MIN
TYP
4.6
8.3
mV
–0.05
17
mV
0.2
2.5
V
0
2.5
V
Available from reference DACs for comparators D, E, F and G.
5.6
Timing Characteristics
V33A = V33D = V33DIO = 3.3 V; 1 μF from BP18 to DGND, TJ = –40 to 125 °C (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
EADC DAC
τ
Settling Time
From 10 to 90%
250
ns
ADC single sample conversion time (1)
ADC_SAMPLING_SEL= 6 or 0
3.9
μs
ADC12
SYSTEM PERFORMANCE
tWD
Watchdog time out resolution
Total time is: tWD x (WDCTRL.PERIOD+1)
Time to disable DPWM output based on
active FAULT pin signal
High level on FAULT pin
Retention period of flash content (data
retention and program)
TJ = 25 °C
14.6
17
20.5
70
ms
ns
100
years
Program time to erase one page or block
in data flash or program flash
20
ms
Program time to write one word in data
flash or program flash
30
µs
256
ns
20
μs
1
ms
Sync-in/sync-out pulse width
Sync pin
Flash Write
POWER ON RESET AND BROWN OUT (V33D PIN, SEE Figure 5-3)
Time delay after Power is good or RESET*
relinquished
tPOR
tEXC1
The time it takes from the device to exit a IRESET goes from a low state to a high state.
reset state and begin executing program This is approximately equivalent to toggling the
flash bank 1 (32 kB). (1)
external reset pin from low to high state.
9.5
ms
tEXC2
The time it takes from the device to exit a IRESET goes from a low state to a high state.
reset state and begin executing program This is approximately equivalent to toggling the
flash bank 2 (32 kB). (1)
external reset pin from low to high state.
19
ms
tEXCT
The time it takes from the device to exit a IRESET goes from a low state to a high state.
reset state and begin executing the total This is approximately equivalent to toggling the
program flash (64 kB). (1)
external reset pin from low to high state.
19
ms
100
μs
TEMPERATURE SENSOR (1)
tON
Turn on time / settling time of sensor
ANALOG COMPARATOR
Time to disable DPWM output based on
0 V to 2.5 V step input on the analog
comparator. (1)
(1)
150
ns
Characterized by design and not production tested.
Specifications
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PMBus/SMBus/I2C Timing
5.7
The timing characteristics and timing diagram for the communications interface that supports I2C, SMBus, and
PMBus in Slave or Master mode are shown in Table 5-1, Figure 5-1, and Figure 5-2. The numbers in Table 5-1
are for 400 kHz operating frequency. However, the device supports all three speeds, standard (100 kHz), fast
(400 kHz), and fast mode plus (1 MHz).
Table 5-1. I2C/SMBus/PMBus Timing Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Typical values at TA = 25 °C and VCC = 3.3 V (unless otherwise noted)
fSMB
SMBus/PMBus operating frequency
2
Slave mode, SMBC 50% duty cycle
100
400
kHz
Slave mode, SCL 50% duty cycle
100
400
kHz
fI2C
I C operating frequency
t(BUF)
Bus free time between start and
stop (1)
1.3
µs
t(HD:STA)
Hold time after (repeated) start (1)
0.6
µs
t(SU:STA)
Repeated start setup time (1)
0.6
µs
t(SU:STO)
Stop setup time (1)
0.6
µs
t(HD:DAT)
Data hold time
0
ns
t(SU:DAT)
Data setup time
t(TIMEOUT)
Error signal/detect (2)
t(LOW)
Clock low period
Receive mode
100
1.3
(3)
t(HIGH)
Clock high period
t(LOW:SEXT)
Cumulative clock low slave extend
time (4)
tf
Clock/data fall time
Rise time tr = (VILmax – 0.15) to (VIHmin + 0.15)
tr
Clock/data rise time
Fall time tf = 0.9 VDD to (VILmax – 0.15)
Cb
(1)
(2)
(3)
(4)
(5)
ns
35
µs
0.6
Total capacitance of one bus line
ms
50
µs
25
ms
20 + 0.1
Cb (5)
300
ns
20 + 0.1
Cb (5)
300
ns
400
pF
Fast mode, 400 kHz
The device times out when any clock low exceeds t(TIMEOUT).
t(HIGH), Max, is the minimum bus idle time. SMBC = SMBD = 1 for t > 50 ms causes reset of any transaction that is in progress. This
specification is valid when the NC_SMB control bit remains in the default cleared state (CLK[0] = 0).
t(LOW:SEXT) is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
Cb (pF)
Figure 5-1. I2C/SMBus/PMBus Timing Diagram
16
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Figure 5-2. Bus Timing in Extended Mode
5.8
Power On Reset (POR) / Brown Out Reset (BOR)
V33D
3.3 V
Brown Out
VGH
VGL
Vres
t
TPOR
IReset
TPOR
t
undefined
Figure 5-3. Power On Reset (POR) / Brown Out Reset (BOR)
VGH
– This is the V33A threshold where the internal power is declared good. The UCD3138064
comes out of reset when above this threshold.
VGL
– This is the V33A threshold where the internal power is declared bad. The device goes into
reset when below this threshold.
Vres
– This is the V33A threshold where the internal reset signal is no longer valid. Below this
threshold the device is in an indeterminate state.
IReset
– This is the internal reset signal. When low, the device is held in reset. This is equivalent to
holding the reset pin on the IC low.
TPOR
– The time delay from when VGH is exceeded to when the device comes out of reset.
Brown
Out
– This is the V33A voltage threshold at which the device sets the brown out status bit. In
addition an interrupt can be triggered if enabled.
Specifications
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Typical Clock Gating Power Savings
6.00
Current Draw (mA)
5.00
4.00
3.00
2.00
1.00
0.00
DPWM
ADC12
Front-end Control
Peak Current
Mode
Timer
Filter
Constant
Power/Constant
Current
SCI
GIO
C001
Module
Figure 5-4. Clock Gating Power Savings
The power disable control register provides control bits that can enable or disable the clock to several peripherals
such as, PCM, CPCC, digital filters, front ends, DPWMs, UARTs, ADC-12 and more.
By default, all these controls are enabled. If a specific peripheral is not used the clock gate can be disabled in
order to block the propagation of the clock signal to that peripheral and therefore reduce the overall current
consumption of the device. The power savings chart displays the power savings per module. For example there
are 4 DPWM modules, therefore, if all 4 are disabled a total of ~20 mA can be saved.
18
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5.10 Typical Characteristics
(Data is taken from the UCD3138)
ADC12 Measurement Temperature Sensor Voltage
2.1
2.6
2.4
Sensor Voltage (V)
EADC LSB Size (mV)
2
1.9
1.8
1.7
1.6
−40
2.2
2.0
1.8
1.6
−20
0
20
40
60
Temperature (°C)
80
100
1.4
120
G005a
Figure 5-5. EADC LSB Size with 4X Gain (mV) vs Temperature
−60 −40 −20
20 40 60 80
Temperature (°C)
100 120 140 160
G006b
Figure 5-6. ADC12 Measurement Temperature Sensor Voltage
vs Temperature
ADC12 2.5-V Reference
8
2.515
2.510
ADC12 Temperature Sensor Measurement Error
6
2.505
ADC12 Error (LSB)
ADC12 Reference
0
2.500
2.495
2.490
4
2
0
2.485
−2
2.480
2.475
−40
−20
0
20
40
60
Temperature (°C)
80
100
−4
−40
120
G003b
Figure 5-7. ADC12 2.5-V Reference vs Temperature
−20
0
20
40
60
Temperature (°C)
80
100
120
G002b
Figure 5-8. ADC12 Temperature Sensor Measurement Error vs
Temperature
2.08
2 MHz Reference Frequency (MHz)
3σ
1σ
2.06
AVG
-1 σ
2.04
-3 σ
2.02
2
1.98
1.96
1.94
1.92
-100
-50
0
50
100
Temperature (°C)
150
200
Figure 5-9. Oscillator Frequency (2MHz Reference, Divided Down from 250MHz) vs Temperature
Specifications
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6 Detailed Description
6.1
6.1.1
Overview
ARM Processor
The ARM7TDMI-S processor is a synthesizable member of the ARM family of general purpose 32-bit
microprocessors. The ARM architecture is based on RISC (Reduced Instruction Set Computer) principles
where two instruction sets are available. The 32-bit ARM instruction set and the 16-bit Thumb instruction
set. The Thumb instructions allow for higher code density equivalent to a 16-bit microprocessor, with the
performance of the 32-bit microprocessor.
The three-staged pipelined ARM processor has fetch, decode and execute stage architecture. Major
blocks in the ARM processor include a 32-bit ALU, 32 x 8 multiplier, and a barrel shifter.
6.1.2
Memory
The UCD3138x (ARM7TDMI-S) is a Von-Neumann architecture, where a single bus provides access to all
of the memory modules. All of the memory module addresses are sequentially aligned along the same
address range.
This applies to program flash, data flash, ROM and all other peripherals. Within the UCD3138 family
architecture, there is a 1024x32-bit Boot ROM that contains the initial firmware startup routines for
PMBUS communication and non-volatile (FLASH) memory download. This boot ROM is executed after
power-up-reset checks if there is a valid FLASH program written. If a valid program is present, the ROM
code branches to the main FLASH-program execution. If there is no valid program, the device waits for a
program download through the PMBus.
The UCD3138 family also supports customization of the boot program by allowing an alternative boot
routine to be executed from program FLASH. This feature enables assignment of a unique address to
each device; therefore, enabling firmware reprogramming even when several devices are connected on
the same communication bus.
There are three separate flash memory areas present inside the device. There are 2-32 kB program flash
blocks and 1-2 kB data flash area. The 32 kB program areas are organized as 8 k x 32 bit memory blocks
and are intended to be for the firmware programs. The blocks are configured with page erase capability for
erasing blocks as small as 1 kB per page, or with a mass erase for erasing the entire 32 kB array. The
flash endurance is specified at 1000 erase/write cycles and the data retention is good for 100 years. The 2
kB data flash array is organized as a 512 x 32 bit memory (32 byte page size). The data flash is intended
for firmware data value storage and data logging. Thus, the Data flash is specified as a high endurance
memory of 20 k cycles with embedded error correction code (ECC).
For run time data storage and scratchpad memory, a 8 kB RAM is available. The RAM is organized as a 2
k x 32 bit array. The availability of 64 kB of program Flash memory in 2-32 kB banks, enables designers to
implement multiple images of firmware (e.g. one main image + one back-up image) in the device and the
flexibility to execute from either of the banks using appropriate algorithms. It also creates the unique
opportunity for the processor to load a new program and subsequently execute that program without
interrupting power delivery. This feature allows the end user to add new features to the power supply while
eliminating any down-time required to load the new program.
20
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Functional Block Diagram
Loop MUX
EAP0
DPWM0
PID Based
Filter 1
DPWM1
PID Based
Filter 2
DPWM2
Constant Power Constant
Current
DPWM3
Front End 0
EAN0
EAP1
Front End 1
EAN1
Front End 2
AFE
EAP2
EAN2
23-AFE
DPWM0B
DPWM1A
DPWM1B
DPWM2A
DPWM2B
DPWM3A
DPWM3B
Front End Averaging
EADC
2AFE
DPWM0A
PID Based
Filter 0
X
SYNC
Avg()
Digital Comparators
SAR/Prebias
DAC0
Ramp
A0
Input Voltage Feed Forward
Filter x
CPCC
Value
Dither
Abs()
Peak Current Mode
Control Comparator
Advanced Power Control
Mode Switching, Burst Mode, IDE,
Synchronous Rectification soft on & off
ADC_EXT
AD[13:0]
PMBUS_ALERT
ADC12 Control
Sequencing, Averaging,
Digital Compare, Dual
Sample and hold
ADC12
PMBUS_CTRL
PMBus
PMBUS_DATA
AD00
PMBUS_CLK
AD01
Internal Temperature
Sensor
AD02
AGND
Current Share
Analog, Average, Master/Slave
AD13
PWM0
Timers
4 ± 16 bit (PWM)
1 ± 24 bit
PWM1
TCAP
Oscillator
SCI_TX0
ARM7TDMI-S
32 bit, 31.25 MHz
Analog
Comparators
UART1
A
SCI_RX1
Memory
DFLASH 2 kB
RAM 4 kB
ROM 8 kB
AD03
B
C
V33D
V33DIO
VREG
DGND
D
Fault MUX &
Control
E
Cycle by Cycle
Current Limit
F
Digital
Comparators
AD13
Power and
1.8 V Voltage
Regulator
AD06
V33A
PFLASH 64 kB
EXT_INT
FAULT0
GPIO
Control
FAULT1
FAULT2
Bank 1
32 kB
Bank 2
32 kB
FAULT3
/RESET
TCK
Power On Reset
AD07
SCI_RX0
SCI_TX1
AD02
AD04
UART0
JTAG
G
TDI
TMS
Brown Out Detection
AGND
TDO
SPI_MISO
SPI_MOSI
SPI
SPI_CLK
SPI_CS
I2C_DATA
I2C
I2C_CLK
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Feature Description
6.3.1
System Module
The System Module contains the interface logic and configuration registers to control and configure all the
memory, peripherals and interrupt mechanisms. The blocks inside the system module are the address
decoder, memory management controller, system management unit, central interrupt unit, and clock
control unit.
6.3.1.1
Address Decoder (DEC)
The Address Decoder generates the memory selects for the FLASH, ROM and RAM arrays. The memory
map addresses are selectable through configurable register settings. These memory selects can be
configured from 1 kB to 16 MB. Power on reset uses the default addresses in the memory map for ROM
execution, which is then configured by the ROM code to the application setup. During access to the DEC
registers, a wait state is asserted to the CPU. DEC registers are only writable in the ARM privilege mode
for user mode protection.
6.3.1.2
Memory Management Controller (MMC)
The MMC manages the interface to the peripherals by controlling the interface bus for extending the read
and write accesses to each peripheral. The unit generates eight peripheral select lines with 1 kB of
address space decoding.
6.3.1.3
System Management (SYS)
The SYS unit contains the software access protection by configuring user privilege levels to memory or
peripherals modules. It contains the ability to generate fault or reset conditions on decoding of illegal
address or access conditions. A clock control setup for the processor clock (MCLK) speed, is also
available.
6.3.1.4
Central Interrupt Module (CIM)
The CIM accepts 32 interrupt requests for meeting firmware timing requirements. The ARM processor
supports two interrupt levels: FIQ and IRQ. FIQ is the highest priority interrupt. The CIM provides
hardware expansion of interrupts by use of FIQ/IRQ vector registers for providing the offset index in a
vector table. This numerical index value indicates the highest precedence channel with a pending interrupt
and is used to locate the interrupt vector address from the interrupt vector table. Interrupt channel 0 has
the lowest precedence and interrupt channel 31 has the highest precedence. To remove the interrupt
request, the firmware should clear the request as the first action in the interrupt service routine. The
request channels are maskable, allowing individual channels to be selectively disabled or enabled.
Table 6-1. Interrupt Priority Table
NAME
MODULE COMPONENT OR
REGISTER
DESCRIPTION
PRIORITY
BRN_OUT_INT
Brownout
Brownout interrupt
0 (Lowest)
EXT_INT
External Interrupts
Interrupt on external input pin
1
WDRST_INT
Watchdog Control
Interrupt from watchdog exceeded (reset)
2
WDWAKE_INT
Watchdog Control
Wake-up interrupt when watchdog equals half of set watch
time
3
SCI_ERR_INT
UART or SCI Control
UART or SCI error Interrupt. Frame, parity or overrun
4
SCI_RX_0_INT
UART or SCI Control
UART0 RX buffer has a byte
5
SCI_TX_0_INT
UART or SCI Control
UART0 TX buffer empty
6
SCI_RX_1_INT
UART or SCI Control
UART1 RX buffer has a byte
7
SCI_TX_1_INT
UART or SCI Control
UART1 TX buffer empty
8
PMBUS_INT
PMBus related interrupt
9
DIG_COMP_SPI_I2C_INT 12-bit ADC Control, SPI, I2C
Digital comparator, SPI and I2C interrupt
10
22
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Table 6-1. Interrupt Priority Table (continued)
NAME
MODULE COMPONENT OR
REGISTER
DESCRIPTION
FE0_INT
Front End 0
“Prebias complete”, “Ramp Delay Complete”, “Ramp
Complete”, “Load Step Detected”,
“Over-Voltage Detected”, “EADC saturated”
11
FE1_INT
Front End 1
“Prebias complete”, “Ramp Delay Complete”, “Ramp
Complete”, “Load Step Detected”,
“Over-Voltage Detected”, “EADC saturated”
12
FE2_INT
Front End 2
“Prebias complete”, “Ramp Delay Complete”, “Ramp
Complete”, “Load Step Detected”,
“Over-Voltage Detected”, “EADC saturated”
13
PWM3_INT
16-bit Timer PWM 3
16-bit Timer PWM3 counter overflow or compare interrupt
14
PWM2_INT
16-bit Timer PWM 2
16-bit Timer PWM2 counter Overflow or compare interrupt
15
PWM1_INT
16-bit Timer PWM 1
16-bit Timer PWM1 counter overflow or compare interrupt
16
PWM0_INT
16-bit timer PWM 0
16-bit Timer PWM0 counter overflow or compare interrupt
17
OVF24_INT
24-bit Timer Control
24-bit Timer counter overflow interrupt
18
CAPTURE_1_INT
24-bit Timer Control
24-bit Timer capture 1 interrupt
19
CAPTURE_0_INT
24-bit Timer Control
24-bit Timer capture 0 interrupt
21
COMP_0_INT
24-bit Timer Control
24-bit Timer compare 0 interrupt
22
CPCC_RTC_INT
Constant Power Constant Current
or Real Time Clock Output
Mode switched in CPCC module Flag needs to be read for
details. RTC timer output generates an interrupt.
23
ADC_CONV_INT
12-bit ADC Control
ADC end of conversion interrupt
24
FAULT_INT
Fault Mux Interrupt
Analog comparator interrupts, Over-Voltage detection,
Under-Voltage detection,
LLM load step detection
25
DPWM3
DPWM3
Same as DPWM1
26
DPWM2
DPWM2
Same as DPWM1
27
DPWM1
DPWM1
1) Every (1-256) switching cycles
2) Fault Detection
3) Mode switching
28
DPWM0
DPWM0
Same as DPWM1
29
EXT_FAULT_INT
External Faults
Fault pin interrupt
SYS_SSI_INT
System Software
System software interrupt
PRIORITY
Reserved for future use
6.3.2
20
30
31 (highest)
Peripherals
6.3.2.1
Digital Power Peripherals
At the core of the UCD3138x controller are 3 Digital Power Peripherals (DPP). Each DPP can be
configured to drive from one to eight DPWM outputs. Each DPP consists of:
• Differential input error ADC (EADC) with sophisticated controls
• Hardware accelerated digital 2-pole/2-zero PID based filter
• Digital PWM module with support for a variety of topologies
These can be connected in many different combinations, with multiple filters and DPWMs. They are
capable of supporting functions like input voltage feed forward, current mode control, and constant
current/constant power, etc.. The simplest configuration is shown in the following figure:
EAP
EAN
DPWMA
Error ADC
(Front End)
Filter
Digital
PWM
DPWMB
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6.3.2.1.1 Front End
Figure 6-1 shows the block diagram of the front end module. It consists of a differential amplifier, an
adjustable gain error amplifier, a high speed flash analog to digital converter (EADC), digital averaging
filters and a precision high resolution set point DAC reference. The programmable gain amplifier in concert
with the EADC and the adjustable digital gain on the EADC output work together to provide 9 bits of range
with 6 bits of resolution on the EADC output. The output of the Front End module is a 9 bit sign extended
result with a gain of 1 LSB / mV. Depending on the value of AFE selected, the resolution of this output
could be either 1, 2, 4 or 8 LSBs. In addition Front End 0 has the ability to automatically select the AFE
value such that the minimum resolution is maintained that still allows the voltage to fit within the range of
the measurement. The EADC control logic receives the sample request from the DPWM module for
initiating an EADC conversion. EADC control circuitry captures the EADC-9-bit-code and strobes the filter
for processing of the representative error. The set point DAC has 10 bits with an additional 4 bits of
dithering resulting in an effective resolution of 14 bits. This DAC can be driven from a variety of sources to
facilitate things like soft start, nested loops, etc. Some additional features include the ability to change the
polarity of the error measurement and an absolute value mode which automatically adds the DAC value to
the error.
It is possible to operate the controller in a peak current mode control configuration. In this mode topologies
like the phase shifted full bridge converter can be controlled to maintain transformer flux balance. The
internal DAC can be ramped at a synchronously controlled slew rate to achieve a programmable slope
compensation. This eliminates the sub-harmonic oscillation as well as improves input voltage feed-forward
performance. A0 is a unity gain buffer used to isolate the peak current mode comparator. The offset of this
buffer is specified in the Section 5.5 table.
EAP
Front End Differential
Amplifier
IOFFSET
R EA
IOFFSET
R EA
AGND
EAN
AGND
Figure 6-1. Input Stage Of EADC Module
24
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AFE_GAIN
23-AFE_GAIN
EAP0
6 bit ADC
8mV/LSB
EAN0
2AFE_GAIN
EADC
X
Averaging
Signed 9 bit result
(error) 1 mV /LSB
SAR/Prebias
Ramp
A0
Filter x
DAC0
CPCC
10 bit DAC
1.5625mV/LSB
Value
Dither
4 bit dithering gives 14 bits of effective resolution
97.65625V/LSB effective resolution
Absolute Value
Calculation
10 bit result
1.5625mV/LSB
Peak Current
Detected
Peak Current Mode
Comparator
Figure 6-2. Front End Module
6.3.2.1.2 DPWM Module
The DPWM module represents one complete DPWM channel with 2 independent outputs, A and B.
Multiple DPWM modules within the UCD3138x system can be configured to support all key power
topologies. DPWM modules can be used as independent DPWM outputs, each controlling one power
supply output voltage rail. It can also be used as a synchronized DPWM—with user selectable phase shift
between the DPWM channels to control power supply outputs with multiphase or interleaved DPWM
configurations.
The output of the filter feeds the high resolution DPWM module. The DPWM module produces the pulse
width modulated outputs for the power stage switches. The filter calculates the necessary duty ratio as a
24-bit number in Q23 fixed point format (23 bit integer with 1 sign bit). This represents a value within the
range 0.0 to 1.0. This duty ratio value is used to generate the corresponding DPWM output ON time. The
resolution of the DPWM ON time is 250 psec.
Each DPWM module can be synchronized to another module or to an external synchronization signal. An
input SYNC signal causes a DPWM ramp timer to reset. The SYNC signal outputs—from each of the four
DPWM modules—occur when the ramp timer crosses a programmed threshold. This allows the phase of
the DPWM outputs for multiple power stages to be tightly controlled.
The DPWM logic takes the output of the filter and converts it into the correct DPWM output for several
power supply topologies. It provides for programmable dead times and cycle adjustments for current
balancing between phases. It controls the triggering of the EADC. It can synchronize to other DPWMs or
to external sources. It can provide synchronization information to other DPWMs or to external recipients.
In addition, it interfaces to several fault handling circuits. Some of the control for these fault handling
circuits is in the DPWM registers. Fault handling is covered in the Fault Mux section.
Each DPWM module supports the following features:
• Dedicated 14 bit time-base with period and frequency control
• Shadow period register for end of period updates.
• Quad-event control registers (A and B, rising and falling) (Events 1-4)
– Used for on/off DPWM duty ratio updates.
• Phase control relative to other DPWM modules
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•
•
•
•
•
•
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Sample trigger placement for output voltage sensing at any point during the DPWM cycle.
Support for 2 independent edge placement DPWM outputs (same frequency or period setting)
Dead-time between DPWM A and B outputs
High Resolution PWM capability – 250 ps
Pulse cycle adjustment of up to ±8.192 µs ( 32768 × 250 ps)
Active high/ active low output polarity selection
Provides events to trigger both CPU interrupts and start of ADC12 conversions.
6.3.2.1.3 DPWM Events
Each DPWM can control the following timing events:
1. Sample Trigger Count–This register defines where the error voltage is sampled by the EADC in
relationship to the DPWM period. The programmed value set in the register should be one fourth of the
value calculated based on the DPWM clock. As the DCLK (DCLK = 62.5 MHz max) controlling the
circuitry runs at one fourth of the DPWM clock (PCLK = 250MHz max). When this sample trigger count
is equal to the DPWM Counter, it initiates a front end calculation by triggering the EADC, resulting in a
CLA calculation, and a DPWM update. Over-sampling can be set for 2, 4 or 8 times the sampling rate.
2. Phase Trigger Count–count offset for slaving another DPWM (Multi-Phase/Interleaved operation).
3. Period–low resolution switching period count. (count of PCLK cycles)
4. Event 1–count offset for rising DPWM A event. (PCLK cycles)
5. Event 2–DPWM count for falling DPWM A event that sets the duty ratio. Last 4 bits of the register are
for high resolution control. Upper 14 bits are the number of PCLK cycle counts.
6. Event 3–DPWM count for rising DPWM B event. Last 4 bits of the register are for high resolution
control. Upper 14 bits are the number of PCLK cycle counts.
7. Event 4–DPWM count for falling DPWM B event. Last 4 bits of the register are for high resolution
control. Upper 14 bits are the number of PCLK cycle counts.
8. Cycle Adjust–Constant offset for Event 2 and Event 4 adjustments.
Basic comparisons between the programmed registers and the DPWM counter can create the desired
edge placements in the DPWM. High resolution edge capability is available on Events 2, 3 and 4.
26
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Multi Mode Open Loop
Start of Period
Start of Period
Period
Period Counter
DPWM Output A
Event 1
Event 2 (High Resolution)
Cycle Adjust A (High Resolution)
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 3 (High Resolution)
Event 4 (High Resolution)
Cycle Adjust B (High Resolution)
Sample Trigger 2
Blanking B Begin
To Other
Modules
Blanking B End
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 2 + Cycle Adjust A
DPWM B Rising Edge = Event 3
DPWM B Falling Edge = Event 4 + Cycle Adjust B
Phase Trigger = Phase Trigger Register value
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B Begin,
Blanking B End
Figure 6-3. Multi Mode Open Loop
Figure 6-3 is for multi-mode, open loop. Open loop means that the DPWM is controlled entirely by its own
registers, not by the filter output. In other words, the power supply control loop is not closed.
The Sample Trigger signals are used to trigger the Front End to sample input signals. The Blanking
signals are used to blank fault measurements during noisy events, such as FET turn on and turn off.
Additional DPWM modes are described below.
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6.3.2.1.4 High Resolution DPWM
Unlike conventional PWM controllers where the frequency of the clock dictates the maximum resolution of
PWM edges, the UCD3138x DPWM can generate waveforms with resolutions as small as 250 ps. This is
16 times the resolution of the clock driving the DPWM module.
This is achieved by providing the DPWM mechanism with 16 phase shifted clock signals of 250 MHz
each.
6.3.2.1.5 Over Sampling
The DPWM module has the capability to trigger an over sampling event by initiating the EADC to sample
the error voltage. The default “00” configuration has the DPWM trigger the EADC once based on the
sample trigger register value. The over sampling register has the ability to trigger the sampling 2, 4 or 8
times per PWM period. Thus the time the over sample happens is at the divide by 2, 4, or 8 time set in the
sampling register. The “01” setting triggers 2X over sampling, the “10” setting triggers 4X over sampling,
and the “11” triggers over sampling at 8X.
6.3.2.1.6 DPWM Interrupt Generation
The DPWM has the capability to generate a CPU interrupt based on the PWM frequency programmed in
the period register. The interrupt can be scaled by a divider ratio of up to 255 for developing a slower
interrupt service execution loop. This interrupt can be fed to the ADC circuitry for providing an ADC12
trigger for sequence synchronization. Table 6-2 outlines the divide ratios that can be programmed.
6.3.2.1.7 DPWM Interrupt Scaling/Range
Table 6-2. DPWM Interrupt Divide Ratio
6.3.3
INTERRUPT
DIVIDE
SETTING
INTERRUPT
DIVIDE
COUNT
INTERRUPT
DIVIDE
COUNT (HEX)
SWITCHING PERIOD
FRAMES (assume
1MHz loop)
NUMBER OF 32
MHZ
PROCESSOR
CYCLES
1
0
00
1
32
2
1
01
2
64
3
3
03
4
128
4
7
07
8
256
5
15
0F
16
512
6
31
1F
32
1024
7
47
2F
48
1536
8
63
3F
64
2048
9
79
4F
80
2560
10
95
5F
96
3072
11
127
7F
128
4096
12
159
9F
160
5120
13
191
BF
192
6144
14
223
DF
224
7168
15
255
FF
256
8192
Automatic Mode Switching
Automatic Mode switching enables the DPWM module to switch between modes automatically, with no
firmware intervention. This is useful to increase efficiency and power range. The following paragraphs
describe phase-shifted full bridge and LLC examples.
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Phase Shifted Full Bridge Example
In phase shifted full bridge topologies, efficiency can be increased by using pulse width modulation, rather
than phase shift, at light load. This is shown below:
DPWM3A
(QB1)
DPWM3B
(QT1)
DPWM2A
(QT2)
DPWM2B
(QB2)
VTrans
DPWM1B
(QSYN1,3)
DPWM0B
(QSYN2,4)
IPRI
Figure 6-4. Phase-Shifted Full Bridge Waveforms
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L1
T1
Q7
+12V
Q6
VBUS
C1
I_pri
PRIM
CURRENT
RL
ORING
CTL
Q5
T2
VOUT
C2
D1
QT1
Lr
R2
QT2
VA
T1
QB1
Current
Sensing
QB2
D2
Vref
Vout
Duty for mode
switching
EADC0
CLA0
EADC1
CLA1
Load Current
I_pri
DPWM0B
AD02/CMP0
I_SHARE
Vout
AD 03/CMP1/CMP2
AD04/CMP3
Iout
AD05/CMP4
I_pri
AD06/CMP5
DPWM1B
DPWM2A
PCM
AD00
AD01
SYNCHRONOUS
GATE DRIVE
DPWM2B
DPWM3A
DPWM3B
ISOLATED
GATE Transformer
EADC2
temp
Vin
VA
Primary
DPWM0B
DPWM1
DPWM1B
DPWM2
DPWM2A
DPWM2B
DPWM3
DPWM3A
DPWM3B
FAULT 0
ACFAIL_IN
FAULT 1
ACFAIL_OUT
FAULT 2
FAILURE
CPCC
<
Iout
DPWM0
FAULT
CBC
AD07/CMP6
AD08
AD09
ORING_CRTL
GPIO2
ON/OFF
GPIO3
P_GOOD
WD
ARM7
PMBus
RST
OSC
UART 1
GPIO1
UART0
Memory
Figure 6-5. Secondary-Referenced Phase-Shifted Full Bridge Control With Synchronous Rectification
6.3.3.2
LLC Example
In LLC, three modes are used. At the highest frequency, a pulse width modulated mode (Multi Mode) is
used. As the frequency decreases, resonant mode is used. As the frequency gets still lower, the
synchronous MOSFET drive changes so that the on-time is fixed and does not increase. In addition, the
LLC control supports cycle-by-cycle current limiting. This protection function operates by a comparator
monitoring the maximum current during the DPWMA conduction time. Any time this current exceeds the
programmable comparator reference the pulse is immediately terminated. Due to classic instability issues
associated with half-bridge topologies it is also possible to force DPWMB to match the truncated pulse
width of DPWMA. Here are the waveforms for the LLC:
Primary
Q1T
SynFET
PWM
Mode
QSR1
fs= fr_max
LLC Mode
fr
fs> fr
fs< fr
Q1B
Tr= 1/fr
Tr= 1/fr
QSR2
I SEC (t )
Figure 6-6. LLC Waveforms
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VBUS
Q1T
ILR(t)
Transformer
LRES
QSR2
LK
NS
RLRES
Q1B
ILM(t)
LM
ISEC (t)
Driver
DPWM1B
Oring Circuitry
VOUT
NP
COUT1
NS
RF1
COUT2
AD03
EAP0
VBUS
ESR1
ESR2
RF2
QSR1
Rectifier and filter
CRES
VOUT(t)
CF
EAN0
AD04
RS
Driver
DPWM1A
CS
V CR(t)
CRES
RS1
RS2
Driver
DPWM0B
Driver
DPWM0A
ADC13
EAP1
Figure 6-7. Secondary-Referenced Half-Bridge Resonant LLC Control With Synchronous Rectification
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6.3.3.3
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Mechanism For Automatic Mode Switching
The UCD3138x allows the customer to enable up to two distinct levels of automatic mode switching.
These different modes are used to enhance light load operation, short circuit operation and soft start.
Many of the configuration parameters for the DPWM are in DPWM Control Register 1. For automatic
mode switching, some of these parameters are duplicated in the Auto Config Mid and Auto Config High
registers.
If automatic mode switching is enabled, the filter duty signal is used to select which of these three
registers is used. There are 4 registers which are used to select the points at which the mode switching
takes place. They are used as shown below.
Automatic Mode Switching
With Hysteresis
Filter Duty
Full Range
Auto Config High
High – Upper Threshold
High – Lower Threshold
Auto Config Mid
Low – Upper Threshold
Low – Lower Threshold
Control
Register 1
0
Figure 6-8. Automatic Mode Switching
As shown, the registers are used in pairs for hysteresis. The transition from Control Register 1 to Auto
Config Mid only takes place when the Filter Duty goes above the Low Upper threshold. It does not go
back to Auto Config Mid until the Low Lower Threshold is passed. This prevents oscillation between
modes if the filter duty is close to a mode switching point.
6.3.4
DPWMC, Edge Generation, Intramux
The UCD3138x has hardware for generating complex waveforms beyond the simple DPWMA and
DPWMB waveforms already discussed – DPWMC, the Edge Generation Module, and the IntraMux.
DPWMC is a signal inside the DPWM logic. It goes high at the Blanking A begin time, and low at the
Blanking A end time.
The Edge Gen module takes DPWMA and DPWMB from its own DPWM module, and the next one, and
uses them to generate edges for two outputs. For DPWM3, the DPWM0 is considered to be the next
DPWM. Each edge (rising and falling for DPWMA and DPWMB) has 8 options which can cause it.
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The options are:
0 = DPWM(n) A Rising edge
1 = DPWM(n) A Falling edge
2 = DPWM(n) B Rising edge
3 = DPWM(n) B Falling edge
4 = DPWM(n+1) A Rising edge
5 = DPWM(n+1) A Falling edge
6 = DPWM(n+1) B Rising edge
7 = DPWM(n+1) B Falling edge
Where “n" is the numerical index of the DPWM module of interest. For example n=1 refers to DPWM1.
The Edge Gen is controlled by the DPWMEDGEGEN register. It also has an enable/disable bit.
The IntraMux is controlled by the Auto Config registers. Intra Mux is short for intra multiplexer. The
IntraMux takes signals from multiple DPWMs and from the Edge Gen and combines them logically to
generate DPWMA and DPWMB signals This is useful for topologies like phase-shifted full bridge,
especially when they are controlled with automatic mode switching. Of course, it can all be disabled, and
DPWMA and DPWMB will be driven as described in the sections above. If the Intra Mux is enabled, high
resolution must be disabled, and DPWM edge resolution goes down to 4 ns.
Here is a drawing of the Edge Gen/Intra Mux:
A/B/C (N)
A/B/C (N+1)
C (N+2)
C (N+3)
INTRAMUX
PWM A
PWM B
EDGE GEN
A(N)
B(N)
A(N+1)
B(N+1)
EGEN A
EGEN B
B SELECT
A SELECT
A ON SELECT
A OFF SELECT
B ON SELECT
B OFF SELECT
Figure 6-9. Edge Generation / IntraMux
Here is a list of the IntraMux modes for DPWMA:
0 = DPWMA(n) pass through (default)
1 = Edge-gen output, DPWMA(n)
2 = DPWNC(n)
3 = DPWMB(n) (Crossover)
4 = DPWMA(n+1)
5 = DPWMB(n+1)
6 = DPWMC(n+1)
7 = DPWMC(n+2)
8 = DPWMC(n+3)
and for DPWMB:
0 = DPWMB(n) pass through (default)
1 = Edge-gen output, DPWMB(n)
2 = DPWNC(n)
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3
4
5
6
7
8
=
=
=
=
=
=
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DPWMA(n) (Crossover)
DPWMA(n+1)
DPWMB(n+1)
DPWMC(n+1)
DPWMC(n+2)
DPWMC(n+3)
The DPWM number wraps around just like the Edge Gen unit. For DPWM3 the following definitions apply:
6.3.5
DPWM(n)
DPWM3
DPWM(n+1)
DPWM0
DPWM(n+2)
DPWM1
DPWM(n+3)
DPWM2
Filter
The UCD3138x filter is a PID filter with many enhancements for power supply control. Some of its features
include:
• Traditional PID Architecture
• Programmable non-linear limits for automated modification of filter coefficients based on received
EADC error
• Multiple coefficient sets fully configurable by firmware
• Full 24-bit precision throughout filter calculations
• Programmable clamps on integrator branch and filter output
• Ability to load values into internal filter registers while system is running
• Ability to stall calculations on any of the individual filter branches
• Ability to turn off calculations on any of the individual filter branches
• Duty cycle, resonant period, or phase shift generation based on filter output.
• Flux balancing
• Voltage feed forward
Here is the first section of the Filter :
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Limit Comparator
Limit 6
Limit 5
…..
PID Filter Branch Stages
Limit 0
Kp Coef
Coefficient
select
EADC_DATA
16
Xn
24
9
24
X
P
Xn-1 Reg
Ki Coef
9
9
Optional
Selected
by
KI_ADDER_
MODE
9
9
9
+
Ki High
24
16
24
24
+
X
24
Clamp
Ki_yn reg
24
24
I
24
Ki Low
Kd alpha
9
Kd coef
16
Xn–Xn+1
-
9
24
X
Kd yn_reg
32
Round
24
9
9
24
X
24
24
24
+
Clamp
D
Figure 6-10. First Section of the Filter
The filter input, Xn, generally comes from a front end. Then there are three branches, P, I. and D. Note
that the D branch also has a pole, Kd Alpha. Clamps are provided both on the I branch and on the D
alpha pole.
The filter also supports a nonlinear mode, where up to 7 different sets of coefficients can be selected
depending on the magnitude of the error input Xn. This can be used to increase the filter gain for higher
errors to improve transient response.
Here is the output section of the filter (S0.23 means that there is 1 sign bit, 0 integer bits and 23 fractional
bits).:
24 P
24 I
24 D
Filter Yn
Clamp High
Yn Scale
+
26
S2.23
24
24
Saturate
Yn
S0.23
24
Shifter
S0.23
Clamp
Filter Yn
S0.23
Filter Yn
Clamp Low
All are S0.23
Figure 6-11. Output Section of the Filter
This section combines the P, I, and D sections, and provides for saturation, scaling, and clamping.
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There is a final section for the filter, which permits its output to be matched to the DPWM:
Filter YN
S0.23
24
KCompx
14.0
DPWMx Period 14.0
X
38
S14.23
Round to
18 bits,
Clamp to
Positive
14
14.0
PERIOD_MULT_SEL
Filter Output
Clamp High
18
14.4
Truncate
low 4 bits
14 Filter Period
Bits [17:4] 14.0
Filter YN (Duty %)
S0.23
24
KCompx
X
38
S14.23
Round to
18 bits,
Clamp to
Positive
18
Clamp
14.4
18 Filter Duty
14.4
14.0
DPWMx Period 14.0
Loop_VFF 14.0
14
Filter Output
Clamp Low
14.0
Resonant Duty 14.0
OUTPUT_MULT_SEL
Figure 6-12. Final Section for the Filter
This permits the filter output to be multiplied by a variety of correction factors to match the DPWM Period,
to provide for Voltage Feed Forward, or for other purposes. After this, there is another clamp. For resonant
mode, the filter can be used to generate both period and duty cycle.
6.3.5.1
Loop Multiplexer
The Loop Mux controls interconnections between the filters, front ends, and DPWMs. Any filter, front end,
and DPWM can be combined in a variety of configurations.
It
•
•
•
•
•
also controls the following connections:
DPWM to Front End
Front End DAC control from Filters or Constant Current/Constant Power Module
Filter Special Coefficients and Feed Forward
DPWM synchronization
Filter to DPWM
The following control modules are configured in the Loop Mux:
• Constant Power/Constant Current
• Cycle Adjustment (Current and flux balancing)
• Global Period
• Light Load (Burst Mode)
• Analog Peak Current Mode
6.3.5.2
Fault Multiplexer
In order to allow a flexible way of mapping several fault triggering sources to all the DPWMs channels, the
UCD3138x provides an extensive array of multiplexers that are united under the name Fault Mux module.
The Fault Mux Module supports the following types of mapping between all the sources of fault and all the
different fault response mechanisms inside each DPWM module.
• Many fault sources may be mapped to a single fault response mechanism. For instance an analog
comparator in charge of over voltage protection, a digital comparator in charge of over current
protection and an external digital fault pin can be all mapped to a Fault-A signal connected to a single
FAULT MODULE and shut down DPWM1-A.
• A single fault source can be mapped to many fault response mechanisms inside many DPWM
modules. For instance an analog comparator in charge of over current protection can be mapped to
DPWM-0 through DPWM-3 by way of several fault modules.
• Many fault sources can be mapped to many fault modules inside many DPWM modules.
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FAULT MUX
CBC_PWM _AB_EN
DPWM
Bit 20 in DPWMCTRL0
CYCLE BY CYCLE
ANALOG PCM
FAULT - CBC
FAULT MODULE
AB FLAG
DISABLE PWM A AND B
CBC_FAULT_EN
Bit30 in DPWMFLTCTRL
FAULT - AB
FAULT MODULE
AB FLAG
DISABLE PWM A AND B
DCOMP – 4X
EXT GPIO– 4X
ACOMP – 7X
FAULT -A
FAULT -B
FAULT MODULE
FAULT MODULE
A FLAG
B FLAG
ALL_FAULT_EN
DPWM _EN
Bit 31 in DPWMFLTCTRL
Bit 0 in DPWMCTRL0
DISABLE PWM A ONLY
DISABLE PWM B ONLY
Figure 6-13. Fault Mux Module
The Fault Mux Module provides a multitude of fault protection functions within the UCD3138x high-speed
loop (Front End Control, Filter, DPWM and Loop Mux modules). The Fault Mux Module allows highly
configurable fault generation based on digital comparators, high-speed analog comparators and external
fault pins. Each of the fault inputs to the DPWM modules can be configured to one or any combination of
the fault events provided in the Fault Mux Module.
Each one of the DPWM engines has four fault modules. The modules are called CBC fault module, AB
fault module, A fault module and B fault module.
The internal circuitry in all the four fault modules is identical, and the difference between the modules is
limited to the way the modules are attached to the DPWMs.
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FAULT FLAG
FAULT IN
DPWM EN
FAULT EN
MAX COUNT
FAULT MODULE
Figure 6-14. Fault Module
All fault modules provide immediate fault detection but only once per DPWM switching cycle. Each one of
the fault modules own a separate max_count and the fault flag will be set only if sequential cycle-by-cycle
fault count exceeds max_count.
Once the fault flag is set, DPWMs need to be disabled by DPWM_EN going low in order to clear the fault
flags. Please note, all four Fault Modules share the same DPWM_EN control, all fault flags (output of Fault
Modules) will be cleared simultaneously.
All four Fault Modules share the same global FAULT_EN as well. Therefore a specific Fault Module
cannot be enabled/ disabled separately.
FAULT - CBC
CYCLE BY CYCLE
CLIM
Figure 6-15. Cycle-By-Cycle Block
Unlike Fault Modules, only one Cycle by Cycle block is available in each DPWM module.
The Cycle by Cycle block works in conjunction with CBC Fault Module and enables DPWM reaction to
signals arriving from the Analog Peak current mode (PCM) module.
The Fault Mux Module supports the following basic functions:
• 4 digital comparators with programmable thresholds and fault generation
• Configuration for 7 high speed analog comparators with programmable thresholds and fault generation
• External GPIO detection control with programmable fault generation
• Configurable DPWM fault generation for DPWM Current Limit Fault, DPWM Over-Voltage Detection
Fault, DPWM A External Fault, DPWM B External Fault and DPWM IDE Flag
• Clock Failure Detection for High and Low Frequency Oscillator blocks
• Discontinuous Conduction Mode Detection
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DCM Detection
HFO/LFO
Fail Detect
Digital Comparator 0
Control
Front End
Control 0
Digital Comparator 1
Control
Front End
Control 1
Digital Comparator 2
Control
Front End
Control 2
Digital Comparator 3
Control
fault[2:0]
External GPIO
Detection
DPWM 0
Fault Control
DPWM 1
Fault Control
DPWM 2
Fault Control
DPWM 3
Fault Control
DPWM 0
DPWM 1
DPWM 2
DPWM 3
Analog Comparator 0
Control
Analog
Comparator 0
Analog Comparator 1
Control
Analog
Comparator 1
Analog Comparator 2
Control
Analog
Comparator 2
Analog Comparator 3
Control
Analog
Comparator 3
Analog Comparator 4
Control
Analog
Comparator 4
Analog Comparator 5
Control
Analog
Comparator 5
Analog Comparator 6
Control
Analog
Comparator 6
Analog Comparator
Automated Ramp
Figure 6-16. Fault Mux Block Diagram
6.3.6
Communication Ports
6.3.6.1
SCI (UART) Serial Communication Interface
A maximum of two independent Serial Communication Interface (SCI) or Universal Asynchronous
Receiver/Transmitter (UART) interfaces are included within the device for asynchronous start-stop serial
data communication (see the pin out sections for details). Each interface has a 24 bit pre-scaler for
supporting programmable baud rates, a programmable data word and stop bit options. Half or full duplex
operation is configurable through register bits. A loop back feature can also be setup for firmware
verification. Both SCI-TX and SCI-RX pin sets can be used as GPIO pins when the peripheral is not being
used.
6.3.6.2
PMBUS/I2C
The UCD3138x has two independent interfaces which both support PMBus and I2C in master and slave
modes. Only one of the interfaces has control of the address pin current sources as well as support for the
optional Control and Alert lines described in the PMBus specification. Other than these differences, the
interfaces are identical.
The PMBus/I2C interface is designed to minimize the processor overhead required for interface. It can
automatically detect and acknowledge addresses. It handles start and stop conditions automatically, and
can clock stretch until the processor has time to poll the PMBus status. It will automatically receive and
send up to 4 bytes at a time. It can automatically verify and generate a PEC. This means that a write byte
command can be received by the processor with only one function call. There is no need for any interrupts
at all with this PMBus/I2C interface. If it is polled every few milliseconds, it will work perfectly.
The interface also supports automatic ACK of two independent addresses. If both PMBus/I2C interfaces
are used at the same time a total of 4 independent addresses can be automatically detected.
Example: PMBus Address Decode via ADC12 Reading
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The user can allocate 2 pins of the 12-bit ADC input channels, AD_00 and AD_01, for PMBus address
decoding. At power-up the device applies IBIAS to each address detect pin and the voltage on that pin is
captured by the internal 12-bit ADC.
Vdd
AD00,
AD01
pin
On/Off Control
I BIAS
Resistor to
set PMBus
Address
To ADC Mux
Figure 6-17. PMBUS Address Detection Method
PMBus/I2C address 0x7E is a reserved address and should not be used in a system using the UCD3138x.
This address is used for manufacturing test.
6.3.6.3
SPI
The SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed
length (1 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI is
normally used for communication between the UCD3138x and external peripherals. Typical applications
include an interface to external I/O or peripheral expansion via devices such as shift registers, display
drivers, SPI EPROMs and analog-to-digital converters. The SPI allows serial communication with other
SPI devices through a 3-pin or 4-pin mode interface. The SPI typically is configured as a master for
communicating to external EEPROM.
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SCS
tCSS
tWH
tWL
tCSH
SCK
tSU
MISO
tH
VALID IN
tV
MOSI
PSCK
tWH
tWL
tSU
tH
tV
tHO
tCSS
tCSH
tHO
VALID OUT
Period SCK
SCK High Time
SCK Low Time
Data in setup
Data in hold
Ouput Valid
Ouput Data Hold
Chip Select Setup
Chip Select Hold
2 ICLK
1/2 PSCK
1/2 PSCK
2 ns (typical)
4 ns (typical)
4 ns (typical)
2 ns (typical)
1 PSCK
1 PSCK
Figure 6-18. SPI Timing Diagram
6.3.7
Real Time Clock
The UCD3138x has an internal real time clock (RTC) function that can track time in seconds, minutes,
hours and days. This function requires an external precision 10 MHz clock.
•
•
•
•
•
6.3.8
Firmware writable time/day register which tracks the total number of days.
– The day counter will be able to count 4 years worth of days.
– Years and months and leap year calculation must be calculated in firmware.
Firmware programmable frequency correction of ±200 ppm in 0.8 ppm steps
The RTC function can provide interrupts to the IRQ or FIQ at 1, 10, 30, and 60 second intervals.
The clock from the RTC driver can be driven to an external pin through an internal multiplexor
The clock for the RTC function can come from an external clock through a dedicated GPIO pin.
Timers
External to the Digital Power Peripherals there are 3 different types of timers in UCD3138x. They are the
24-bit timer, 16-bit timer and the watchdog timer
Detailed Description
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24-Bit Timer
There is one 24 bit timer which runs off the Interface Clock. It can be used to measure the time between
two events, and to generate interrupts after a specific interval. Its clock can be divided down by an 8-bit
pre-scalar to provide longer intervals. The timer has two compare registers (Data Registers). Both can be
used to generate an interrupt after a time interval. . Additionally, the timer has a shadow register (Data
Buffer register) which can be used to store CPU updates of the compare events while still using the timer.
The selected shadow register update mode happens after the compare event matches.
The two capture pins TCAP0 and TCAP1 are inputs for recording a capture event. A capture event can be
set either to rising, falling, or both edges of the capture pin signal. Upon this event, the counter value is
stored in the corresponding capture data register. Five Interrupts from the 24 bit timer can be set, which
are the counter rollover event (overflow), capture events 0 and 1, and the two comparison match events.
Each interrupt can be disabled or enabled.
6.3.8.2
16-Bit PWM Timers
There are four 16 bit counter PWM timers which run off the Interface Clock and can further be divided
down by a 8-bit pre-scaler to generate slower PWM time periods. Each timer has two compare registers
(Data Registers) for generating the PWM set/unset events. Additionally, each timer has a shadow register
(Data Buffer register) which can be used to store CPU updates of compare events while still using the
timer. The selected shadow register update mode happens after the compare event matches.
The counter reset can be configured to happen on a counter roll over, a compare equal event, or by a
software controlled register. Interrupts from the PWM timer can be set due to the counter rollover event
(overflow) or by the two comparison match events. Each comparison match and the overflow interrupts
can be disabled or enabled.
Upon an event comparison, the PWM pin can be configured to set, clear, toggle or have no action at the
output. The value of PWM pin output can be read for status or simply configured as General Purpose I/O
for reading the value of the input at the pin.
6.3.8.3
Watchdog Timer
A watchdog timer is provided on the device for ensuring proper firmware loop execution. The timer is
clocked off of a separate low speed oscillator source. If the timer is allowed to expire, a reset condition is
issued to the ARM processor. The watchdog is reset by a simple CPU write bit to the watchdog key
register by the firmware routine. On device power-up the watchdog is disabled. Yet after it is enabled, the
watchdog cannot be disabled by firmware. Only a device reset can put this bit back to the default disabled
state. A half timer flag is also provided for status monitoring of the watchdog.
6.3.9
General Purpose ADC12
The ADC12 is a 12 bit, high speed analog to digital converter, equipped with the following options:
• Typical conversion speed of 267 ksps
• Conversions can consist from 1 to 16 ADC channel conversions in any desired sequence
• Post conversion averaging capability, ranging from 4X, 8X, 16X or 32X samples
• Configurable triggering for ADC conversions from the following sources: firmware, DPWM rising edge,
ADC_EXT_TRIG pin or Analog Comparator results
• Interrupt capability to embedded processor at completion of ADC conversion
• Six digital comparators on the first 6 channels of the conversion sequence using either raw ADC data
or averaged ADC data
• Two 10 µA current sources for excitation of PMBus addressing resistors
• Dual sample and hold for accurate power measurement
• Internal temperature sensor for temperature protection and monitoring
42
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The control module (Figure 6-19) contains the control and conversion logic for auto-sequencing a series of
conversions. The sequencing is fully configurable for any combination of 16 possible ADC channels
through an analog multiplexer embedded in the ADC12 block. Once converted, the selected channel value
is stored in the result register associated with the sequence number. Input channels can be sampled in
any desired order or programmed to repeat conversions on the same channel multiple times during a
conversion sequence. Selected channel conversions are also stored in the result registers in order of
conversion, where the result 0 register is the first conversion of a 16-channel sequence and result 15
register is the last conversion of a 16-channel sequence. The number of channels converted in a
sequence can vary from 1 to 16.
Unlike EADC0 through EADC2, which are primarily designed for closing high speed compensation loops,
the ADC12 is not usually used for loop compensation purposes. The EADC converters have a
substantially faster conversion rate, thus making them more attractive for closed loop control. The ADC12
features make it best suited for monitoring and detection of currents, voltages, temperatures and faults.
Please see the Section 5.10 for the temperature variation associated with this function.
ADC12 Block
ADC12 Registers
ADC
Averaging
ADC
Channels
S/H
12-bit SAR
ADC
ADC12
Control
Digital
Comparators
ADC Channel
ADC External Trigger (from pin)
DPWM
Modules
Analog
Comparators
Figure 6-19. ADC12 Control Block Diagram
6.3.10 Miscellaneous Analog
The Miscellaneous Analog Control (MAC) Registers are a catch-all of registers that control and monitor a
wide variety of functions. These functions include device supervisory features such as Brown-Out and
power saving configuration, general purpose input/output configuration and interfacing, internal
temperature sensor control and current sharing control.
The MAC module also provides trim signals to the oscillator and AFE blocks. These controls are usually
used at the time of trimming at manufacturing; therefore this document will not cover these trim controls.
6.3.11 Brownout
Brownout function is used to determine if the device supply voltage is lower than a threshold voltage, a
condition that may be considered unsafe for proper operation of the device.
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The brownout threshold is higher than the reset threshold voltage; therefore, when the supply voltage is
lower than brownout threshold, it still does not necessarily trigger a device reset.
The brownout interrupt flag can be polled or alternatively can trigger an interrupt to service such case by
an interrupt service routine. Please see the Section 5.8.
6.3.12 Global I/O
Up to 32 pins in UCD3138x can be configured in the Global I/O register to serve as a general purpose
input or output pins (GPIO). This includes all digital input or output pins except for the RESET pin.
The pins that cannot be configured as GPIO pins are the supply pins, ground pins, ADC-12 analog input
pins, EADC analog input pins and the RESET pin. Additional digital pins not listed in this register can be
configured through their local configuration registers.
There are two ways to configure and use the digital pins as GPIO pins:
1. Through the centralized Global I/O control registers.
2. Through the distributed control registers in the specific peripheral that shares it pins with the standard
GPIO functionality.
The Global I/O registers offer full control of:
1. Configuring each pin as a GPIO.
2. Setting each pin as input or output.
3. Reading the pin’s logic state, if it is configured as an input pin.
4. Setting the logic state of the pin, if it is configured as an output pin.
5. Connecting pin/pins to high rail through internal push/pull drivers or external pull up resistors.
The Global I/O registers include Global I/O EN register, Global I/O OE Register, Global I/O Open Drain
Control Register, Global I/O Value Register and Global I/O Read Register.
The following is showing the format of Global I/O EN Register (GLBIOEN) as an example:
BIT NUMBER
31:0
Bit Name
GLOBAL_IO_EN
Access
R/W
Default
0000_0000_0000_0000_0000_0000_0000_0000
Bits 29-0: GLOBAL_IO_EN – This register enables the global control of digital I/O pins
0 = Control of IO is done by the functional block assigned to the IO (Default)
1 = Control of IO is done by Global IO registers.
44
PIN NUMBER
BIT
PIN_NAME
31
PWM2
11
30
PWM3
12
29
FAULT3
55
28
ADC_EXT_TRIG
14
27
TCK
45
26
TDO
46
25
TMS
48
24
TDI
47
23
SCI_TX1
37
22
SCI_TX0
35
21
SCI_RX1
38
20
SCI_RX0
36
19
TCAP0
49
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PIN NUMBER
BIT
PIN_NAME
18
PWM1
40
17
PWM0
39
16
TCAP1
13
15
I2C_DATA
20
14
PMBUS_CTRL
18
13
PMBUS_ALERT
17
12
EXT_INT
42
11
FAULT2
54
10
FAULT1
44
9
FAULT0
43
8
SYNC
34
7
DPWM3B
29
6
DPWM3A
28
5
DPWM2B
27
4
DPWM2A
26
3
DPWM1B
25
2
DPWM1A
24
1
DPWM0B
23
0
DPWM0A
22
UCD3138x
6.3.13 Temperature Sensor Control
Temperature sensor control register provides internal temperature sensor enabling and trimming
capabilities. The internal temperature sensor is disabled by default.
Temperature
Calibration
ADC 12
Temperature
Sensor
CH15
Figure 6-20. Internal Temp Sensor
Temperature sensor is calibrated at room temperature (25 °C) via a calibration register value.
The temperature sensor is measured using ADC12 (via Ch15). The temperature is then calculated using a
mathematical formula involving the calibration register (this effectively adds a delta to the ADC
measurement).
The temperature sensor can be enabled or disabled.
6.3.14 I/O Mux Control
I/O Mux Control register may be used in order to choose a single specific functionality that is desired to be
assigned to a physical device pin for your application. See the UCD3138x programmer's manual for
details on the available configurations.
6.3.15 Current Sharing Control
UCD3138x provides three separate modes of current sharing operation.
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•
•
•
•
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Analog bus current sharing
PWM bus current sharing
Master/Slave current sharing
AD02 has a special ESD protection mechanism that prevents the pin from pulling down the currentshare bus if power is missing from the UCD3138x
The simplified current sharing circuitry is shown in the drawing below. The digital pulse connected to SW3
transforms SW3 into a pulse-width-modulated current source. Details on the frequency and resolution of
this feature are in the digital power fusion peripherals manual.
3.3 V
ISHARE
SW3
Digital
3.3 V
3.3V
ESD
3. 2 kΩ
400 Ω
250 Ω
AD02
AD13
SW2
ESD
SW1
ESD
250 Ω
EXT CAP
R SHARE
ADC12 and
CMP
ADC12 and
CMP
Figure 6-21. Simplified Current Sharing Circuitry
FOR TEST ONLY,
ALWAYS KEEP 00
CS_MODE
EN_SW1
EN_SW2
Off or Slave Mode (3-state)
00
00 (default)
0
0
0
PWM Bus
00
01
1
0
ACTIVE
Off or Slave Mode (3-state)
00
10
0
0
0
Analog Bus or Master
00
11
0
1
0
CURRENT SHARING MODE
DPWM
The period and the duty of 8-bit PWM current source and the state of the SW1 and SW2 switches can be
controlled through the current sharing control register (CSCTRL).
6.3.16 Temperature Reference
The temperature reference register (TEMPREF) provides the ADC12 count when ADC12 measures the
internal temperature sensor (channel 15) during the factory trim and calibration.
This information can be used by different periodic temperature compensation routines implemented in the
firmware. But it should not be overwritten by firmware, otherwise this factory written value will be lost until
the device is reset.
46
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6.4
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Device Functional Modes
6.4.1
DPWM Modes Of Operation
The DPWM is a complex logic system which is highly configurable to support several different power
supply topologies. The discussion below will focus primarily on waveforms, timing and register settings,
rather than on logic design.
The DPWM is centered on a period counter, which counts up from 0 to PRD, and then is reset and starts
over again.
The DPWM logic causes transitions in many digital signals when the period counter hits the target value
for that signal.
6.4.1.1
Normal Mode
In Normal mode, the Filter output determines the pulse width on DPWM A. DPWM B fits into the rest of
the switching period, with a dead time separating it from the DPWM A on-time. It is useful for buck
topologies, among others. Here is a drawing of the Normal Mode waveforms:
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Normal Mode Closed Loop
Start of Period
Start of Period
Period
Period Counter
Filter controlled edge
DPWM Output A
Event 1
Filter Duty (High Resolution)
Cycle Adjust A (High Resolution)
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
DPWM Output B
Event 3 – Event 2 (High Res)
Event 4 (High Res)
Sample Trigger 2
Blanking B Begin
To Other
Modules
Blanking B End
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 1 + Filter Duty + Cycle Adjust A
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register or
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 1 + Filter Duty + Cycle Adjust A + (Event 3 – Event 2)
DPWM B Falling Edge = Event 4
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
Figure 6-22. Normal Mode - Closed Loop
Cycle adjust A can be used to adjust pulse widths on individual phases of a multi-phase system. This can
be used for functions like current balancing. The Adaptive Sample Triggers can be used to sample in the
middle of the on-time (for an average output), or at the end of the on-time (to minimize phase delay) The
Adaptive Sample Register provides an offset from the center of the on-time. This can compensate for
external delays, such as MOSFET and gate driver turn on times.
Blanking A-Begin and Blanking A-End can be used to blank out noise from the MOSFET turn on at the
beginning of the period (DPWMA rising edge). Blanking B could be used at the turn off time of DPWMB.
The other edges are dynamic, so blanking is more difficult.
Cycle Adjust B has no effect in Normal Mode.
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6.4.1.2
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Phase Shifting
In most modes, it is possible to synchronize multiple DPWM modules using the phase shift signal. The
phase shift signal has two possible sources. It can come from the Phase Trigger Register. This provides a
fixed value, which is useful for an application like interleaved PFC.
The phase shift value can also come from the filter output. In this case, the changes in the filter output
causes changes in the phase relationship of two DPWM modules. This is useful for phase shifted full
bridge topologies.
The following figure shows the mechanism of phase shift:
Phase Shift
DPWM0 Start of Period
DPWM0 Start of Period
Period Counter
DPWM1 Start of Period
DPWM1 Start of Period
Period Counter
Phase Trigger = Phase Trigger Register value or Filter Duty
Figure 6-23. Phase Shifting
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6.4.1.3
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DPWM Multiple Output Mode
Multi mode is used for systems where each phase has only one driver signal. It enables each DPWM
peripheral to drive two phases with the same pulse width, but with a time offset between the phases, and
with different cycle adjusts for each phase.
The Multi-Mode diagram is shown in Figure 6-24.
Multi Mode Closed Loop
Start of Period
Start of Period
Period
Period Counter
Filter controlled edge
DPWM Output A
Event 1
Filter Duty (High Resolution)
Cycle Adjust A (High Resolution)
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
Blanking A Begin
To Other
Modules
Blanking A End
DPWM Output B
Event 3 (High Resolution)
Filter Duty (High Resolution)
Cycle Adjust B (High Resolution)
Sample Trigger 2
Blanking B Begin
Blanking B End
To Other
Modules
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 1 + Filter Duty + Cycle Adjust A
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register or
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 3
DPWM B Falling Edge = Event 3 + Filter Duty + Cycle Adjust B
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B
Begin, Blanking B End
Figure 6-24. DPWM Multi-Mode Close Loop
Event 2 and Event 4 are not relevant in Multi mode.
50
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DPWMB can cross over the period boundary safely, and still have the proper pulse width, so full 100%
pulse width operation is possible. DPWMA cannot cross over the period boundary.
Since the rising edge on DPWM B is also fixed, Blanking B-Begin and Blanking B-End can be used for
blanking this rising edge.
And, of course, Cycle Adjust B is usable on DPWM B.
6.4.1.4
DPWM Resonant Mode
This mode provides a symmetrical waveform where DPWMA and DPWMB have the same pulse width. As
the switching frequency changes, the dead times between the pulses remain the same.
The equations for this mode are designed for a smooth transition from PWM mode to resonant mode, as
described in the Section 6.3.3.2. Here is a diagram of this mode:
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Resonant Symmetrical Closed Loop
Start of Period
Start of Period
Filter Period
Period Counter
Filter controlled edge
DPWM Output A
Event 1
Filter Duty – Average Dead Time
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
Blanking A Begin
To Other
Modules
Blanking A End
DPWM Output B
Event 3 - Event 2
Period Register – Event 4
Sample Trigger 2
Blanking B Begin
Blanking B End
Phase Trigger
Events which change with DPWM mode:
To Other
Modules
Dead Time 1 = Event 3 – Event 2
Dead Time 2 = Event 1 + Period Register – Event 4)
Average Dead Time = (Dead Time 1 + Dead Time 2)/2
DPWM A Rising Edge = Event 1
DPWM A Falling Edge = Event 1 + Filter Duty – Average Dead Time
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 1 + Filter Duty – Average Dead Time + (Event 3 – Event 2)
DPWM B Falling Edge = Filter Period – (Period Register – Event 4)
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B Begin,
Blanking B End
Figure 6-25. DPWM Resonant Symmetrical Mode
The Filter has two outputs, Filter Duty and Filter Period. In this case, the Filter is configured so that the
Filter Period is twice the Filter Duty. So if there were no dead times, each DPWM pin would be on for half
of the period. For dead time handling, the average of the two dead times is subtracted from the Filter Duty
for both DPWM pins. Therefore, both pins will have the same on-time, and the dead times will be fixed
regardless of the period. The only edge which is fixed relative to the start of the period is the rising edge of
DPWM A. This is the only edge for which the blanking signals can be used easily.
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6.4.2
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Triangular Mode
Triangular mode provides a stable phase shift in interleaved PFC and similar topologies. In this case, the
PWM pulse is centered in the middle of the period, rather than starting at one end or the other. In
Triangular Mode, only DPWM-B is available. Here is a diagram for Triangular Mode:
Triangular Mode Closed Loop
Start of Period
Start of Period
Period
Period Counter
DPWM Output A
Sample Trigger 1
To Other
Modules
Blanking A Begin
Blanking A End
Filter controlled edge
DPWM Output B
Cycle Adjust A (High Resolution)
Cycle Adjust B (High Resolution)
Filter Duty/2 (High Resolution)
Period/2
Sample Trigger 2
Blanking B Begin
To Other
Modules
Blanking B End
Phase Trigger
Events which change with DPWM mode:
DPWM A Rising Edge = None
DPWM A Falling Edge = None
Adaptive Sample Trigger = None
DPWM B Rising Edge = Period/2 - Filter Duty/2 + Cycle Adjust A
DPWM B Falling Edge = Period/2 + Filter Duty/2 + Cycle Adjust B
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
Figure 6-26. Triangular Mode
All edges are dynamic in triangular mode, so fixed blanking is not that useful. The adaptive sample trigger
is not needed. It is very easy to put a fixed sample trigger exactly in the center of the FET on-time,
because the center of the on-time does not move in this mode.
6.4.3
Leading Edge Mode
Leading edge mode is similar to Normal mode, reversed in time. The DPWM A falling edge is fixed, and
the rising edge moves to the left, or backwards in time, as the filter output increases. The DPWM B falling
edge stays ahead of the DPWMA rising edge by a fixed dead time. Here is a diagram of the Leading Edge
Mode:
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Leading Edge Closed Loop
Start of Period
Start of Period
Period
Period Counter
DPWM Output A
Event 1
Filter Duty (High Resolution)
Cycle Adjust A (High Resolution)
Adaptive Sample Trigger A
Adaptive Sample Trigger B
Sample Trigger 1
Blanking A Begin
To Other
Modules
Blanking A End
DPWM Output B
Event 2 - Event 3 (High Resolution)
Event 4 (High Resolution)
Sample Trigger 2
Blanking B Begin
Blanking B End
To Other
Modules
Phase Trigger
Events which change with DPWM mode:
DPWM A Falling Edge = Event 1
DPWM A Rising Edge = Event 1 - Filter Duty + Cycle Adjust A
Adaptive Sample Trigger A = Event 1 - Filter Duty + Adaptive Sample Register or
Adaptive Sample Trigger B = Event 1 - Filter Duty/2 + Adaptive Sample Register
DPWM B Rising Edge = Event 4
DPWM B Falling Edge = Event 1 - Filter Duty + Cycle Adjust A -(Event 2 – Event 3)
Phase Trigger = Phase Trigger Register value or Filter Duty
Events always set by their registers, regardless of mode:
Sample Trigger 1, Sample Trigger 2, Blanking A Begin , Blanking A End , Blanking B
Begin, Blanking B End
Figure 6-27. Leading Edge Mode
As in the Normal mode, the two edges in the middle of the period are dynamic, so the fixed blanking
intervals are mainly useful for the edges at the beginning and end of the period.
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6.5
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Memory
6.5.1
Register Maps
6.5.1.1
CPU Memory Map and Interrupts
When the device comes out of power-on-reset, the data memories are mapped to the processor as
follows:
6.5.1.1.1 Memory Map (After Reset Operation)
Address
Size (Bytes)
Module
32 X 8 k
Boot ROM
0x0004_0000 – 0x0004_7FFF
32 k
Program Flash 1
0x0004_8000 – 0x0004_FFFF
32 k
Program Flash 2
0x0006_8800 – 0x0006_8FFF
2k
Data Flash
0x0006_9000 – 0x0006_9FFF
4k
Data RAM
0x0000_0000 – 0x0003_FFFF
In 32 repeated blocks of 8 k each
6.5.1.1.2 Memory Map (Normal Operation)
Just before the boot ROM program gives control to flash program, the ROM configures the memory as
follows:
Address
Size (Bytes)
Module
0x0000_0000 – 0x0000_7FFF
32 k
Program Flash 1 (or 2)
0x0000_8000 – 0x0000_FFFF
32 k
Program Flash 2 (or 1)
0x0002_0000 – 0x0002_1FFF
8k
Boot ROM
0x0006_8800 – 0x0006_8FFF
2k
Data Flash
0x0006_9000 – 0x0006_9FFF
4k
Data RAM
6.5.1.1.3 Memory Map (System and Peripherals Blocks)
Address
Size
Module
0x0012_0000 - 0x0012_00FF
256
Loop Mux
0x0013_0000 - 0x0013_00FF
256
Fault Mux
0x0014_0000 - 0x0014_00FF
256
ADC
0x0015_0000 - 0x0015_00FF
256
DPWM 3
0x0016_0000 - 0x0016_00FF
256
Filter 2
0x0017_0000 - 0x0017_00FF
256
DPWM 2
0x0018_0000 - 0x0018_00FF
256
Front End/Ramp Interface 2
0x0019_0000 - 0x0019_00FF
256
Filter 1
0x001A_0000 - 0x001A_00FF
256
DPWM 1
0x001B_0000 – 0x001B_00FF
256
Front End/Ramp Interface 1
0x001C_0000 - 0x001C_00FF
256
Filter 0
0x001D_0000 - 0x001D_00FF
256
DPWM 0
0x001E_0000 - 0x001E_00FF
256
Front End/Ramp Interface 0
0xFFF7_EC00 - 0xFFF7_ECFF
256
UART 0
0xFFF7_ED00 - 0xFFF7_EDFF
256
UART 1
0xFFF7_F000 - 0xFFF7_F0FF
256
Miscellaneous Analog Control
0xFFF7_F600 - 0xFFF7_F6FF
256
PMBus Interface
0xFFF7_FA00 - 0xFFF7_FAFF
256
GIO
0xFFF7_FD00 - 0xFFF7_FDFF
256
Timer
0xFFFF_FD00 - 0xFFFF_FDFF
256
MMC
0xFFFF_FE00 - 0xFFFF_FEFF
256
DEC
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Address
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Size
Module
0xFFFF_FF20 - 0xFFFF_FF37
23
CIM
0xFFFF_FF40 - 0xFFFF_FF50
16
PSA
0xFFFF_FFD0 - 0xFFFF_FFEC
28
SYS
The registers and bit definitions inside the System and Peripheral blocks are detailed in the programmer’s
guide for each peripheral.
6.5.1.2
Boot ROM
The UCD3138064 incorporates a 8 kB boot ROM. This boot ROM includes support for:
• Program download through the PMBus
• Device initialization
• Examining and modifying registers and memory
• Verifying and executing program flash automatically
• Jumping to a customer defined boot program
• Checksum evaluation to facilitate program execution from either Program Flash 1 or Program Flash 2
The Boot ROM is entered automatically on device reset. It initializes the device and then performs
checksums on the program flash. If the first 2 kB of either program FLASH has a valid checksum, the
program branches to location 0 in the appropriate Program FLASH module. This permits the use of a
custom boot program. If the first checksum fails, it performs some additional checksum calculations to
determine where the valid program is located. This permits full automated program memory checking,
when there is no need for a custom boot program. The complete decision tree is located in Figure 6-28.
"Branch to Program Flash 1" means Flash 1 is at address 0x0000, and Flash 2 is at address 0x8000.
"Branch to Program Flash 2" means Flash 2 is at address 0x0000, and Flash 1 is at address 0x8000.
56
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Device Reset
Does Program Flash 1 have a
BRANCH instruction at the
beginning?
Yes
Is there a valid checksum on the
first 2 kB of Program Flash 1 or all
32 kB of Program Flash 1?
Yes
No
Does Program Flash 2 have a
BRANCH instruction at the
beginning?
No
Yes
No
Is there a valid checksum on the
first 2 kB of Program Flash 2 or all
32 kB of Program Flash 2?
Yes
BRANCH to
Program Flash 2
No
Is there a valid
checksum on all 64 kB?
Yes
BRANCH to
Program Flash 1
No
Stay in ROM
Figure 6-28. Check Sum Evaluation Flowchart
If neither checksum is valid, the Boot ROM stays in control, and accepts commands via the PMBus
interface. These functions can be used to read and write to all memory locations in the UCD3138064.
Typically they are used to download a program to Program Flash, and to command its execution.
6.5.1.3
Customer Boot Program
As described above, it is possible to generate a user boot program using 2 kB or more of the Program
Flash. This can support things which the Boot ROM does not support, including:
• Program download via UART – useful especially for applications where the UCD3138064 is isolated
from the host (e.g., PFC)
• Encrypted download – useful for code security in field updates.
• PMBus download at different addresses
6.5.1.4
Flash Management
The UCD3138064 offers a variety of features providing for easy prototyping and easy flash programming.
At the same time, high levels of security are possible for production code, even with field updates.
Standard firmware will be provided for storing multiple copies of system parameters in data flash. This
minimizes the risk of losing information if data-flash programming is interrupted.
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Synchronous Rectifier MOSFET Ramp and IDE Calculation
The UCD3138064 has built in logic for optimizing the performance of the synchronous rectifier MOSFETs.
This comes in two forms:
• Synchronous Rectifier MOSFET ramp
• Ideal Diode Emulation (IDE) calculation
When starting up a power supply, It is not uncommon for there to already be a voltage present on the
output – this is called pre-bias. It can be very difficult to calculate the ideal synchronous rectifier MOSFET
on-time for this case. If it is not calculated correctly, it may pull down the pre-bias voltage, causing the
power supply to sink current. To avoid this, the synchronous rectifier MOSFETs are not turned on until
after the power supply has ramped up to the nominal output voltage. The synchronous rectifier MOSFETs
are then turned on slowly in order to avoid an output voltage glitch. The synchronous rectifier MOSFET
ramp logic can be used to turn them on at a rate well below the bandwidth of the filter.
In discontinuous mode, the ideal on-time for the synchronous rectifier MOSFETs is a function of Vin, Vout,
and the primary side duty cycle (D). The IDE logic in the UCD3138064 takes Vin and Vout data from the
firmware and combines it with D data from the filter hardware. It uses this information to calculate the ideal
on-time for the synchronous rectifier MOSFETs.
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7 Applications, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1
Application Information
The UCD3138x has an extensive set of fully-programmable, high-performance peripherals that make it
suitable for a wide range of power supply applications. In order to make the part easier to use, TI has
prepared an extensive set of materials to demonstrate the features of the device for several key
applications. In each case the following items are available:
1. Full featured EVM hardware that demonstrates classic power supply functionality.
2. An EVM user guide that contains schematics, bill-of-materials, layout guidance and test data
showcasing the performance and features of the device and the hardware.
3. A firmware programmers manual that provides a step-by-step walk through of the code.
Table 7-1. Application Information
APPLICATION
EVM DESCRIPTION
Phase shifted full
bridge
This EVM demonstrates a PSFB DC-DC power converter with digital control using the UCD3138x device. Control is
implemented by using PCMC with slope compensation. This simplifies the hardware design by eliminating the need
for a series blocking capacitors and providing the inherent input voltage feed-forward that comes from PCMC. The
controller is located on a daughter card and requires firmware in order to operate. This firmware, along with the entire
source code, is made available through TI. A free, custom function GUI is available to help the user experiment with
the different hardware and software enabled features. The EVM accepts a DC input from 350 VDC to 400 VDC, and
outputs a nominal 12 VDC with full load output power of 360 W, or full output current of 30 A.
LLC resonant
converter
This EVM demonstrates an LLC resonant half-bridge DC-DC power converter with digital control using the
UCD3138x device. The controller is located on a daughter card and requires firmware in order to operate. This
firmware, along with the entire source code, is made available through TI. A free, custom function GUI is available to
help the user experiment with the different hardware and software enabled features. The EVM accepts a DC input
from 350 VDC to 400 VDC, and outputs a nominal 12 VDC with full load output power of 340 W, or full output current
of 29 A.
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Typical Application
This section summarizes the PSFB EVM DC-DC power converter.
L1
T1
Q7
+12V
Q6
VBUS
C1
RL
I_pri
PRIM
CURRENT
ORING
CTL
Q5
T2
VOUT
C2
D1
QT1
Lr
R2
QT2
VA
T1
QB1
Current
Sensing
QB2
D2
Vref
Vout
Duty for mode
switching
EADC0
EADC1
I_SHARE
Vout
DPWM0B
DPWM1B
DPWM2A
SYNCHRONOUS
GATE DRIVE
DPWM2B
DPWM3A
DPWM3B
ISOLATED
GATE Transformer
Iout
I_pri
temp
Vin
VA
Primary
EADC2
DPWM1
DPWM1B
DPWM2
DPWM2A
DPWM2B
CLA1
Load Current
I_pri
DPWM0B
CPCC
CLA0
<
Iout
DPWM0
PCM
DPWM3
DPWM3A
DPWM3B
AD00
AD01
AD02/CMP0
AD03/CMP1/CMP2
AD04/CMP3
AD05/CMP4
AD06/CMP5
AD07/CMP6
AD08
AD09
UART1
FAULT
UCD3138
CBC
ARM7
OSC
FAULT0
ACFAIL_IN
FAULT1
ACFAIL_OUT
FAULT2
FAILURE
GPIO1
ORING_CRTL
GPIO2
ON/OFF
GPIO3
P_GOOD
WD
PMBus
RST
UART0
Memory
Figure 7-1. Phase-Shifted Full-Bridge
60
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Design Requirements
Table 7-2. Input Characteristics
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
350
385
420
V
420
V
ALL SPECIFICATIONS at Vin=400V and 25°C AMBIENT UNLESS OTHERWISE NOTED.
Vin
Input voltage range
Normal Operating
Vinmax
Max input voltage
Continuous
Iin
Input current
Vin=350V, Full Load
Istby
Input no load current
Output current is 0A
Von
Under voltage lockout
Vhys
1.15
A
30
mA
Vin Decreasing (input voltage is detected on secondary side)
340
V
Vin Increasing
360
V
Table 7-3. Output Characteristics
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
ALL SPECIFICATIONS at Vin=400V and 25°C AMBIENT UNLESS OTHERWISE NOTED.
VO
Output voltage setpoint
No load on outputs
Regline
Line regulation
All outputs; 360 ≤ Vin ≤ 420; IO = IOmax
0.5
%
Regload
Load regulation
All outputs; 0 ≤ IO ≤ IOmax; Vin = 400 V
1
%
(1)
12
Vn
Ripple and noise
IO
Output current
5Hz to 20 MHz
η
Efficiency at phase-shift mode
Vo = 12 V, Io = 15 A
93%
η
Efficiency at PWM ZVS mode
Vo = 12 V, Io = 15 A
93%
η
Efficiency at hard switching mode
Vo = 12 V, Io = 15 A
Vadj
Output adjust range
Vtr
Transient response
overshoot/undershoot
tsettling
Transient response settling time
tstart
Output rise time
10% to 90% of Vout
50% Load Step at 1AµS, min load at 2A
At Startup
Switching frequency
Over Vin and IO ranges
Ishare
Current sharing accuracy
φ
G
mVpp
30
A
12.6
V
90%
11.4
Overshoot
(1)
100
0
fs
V
±0.36
V
100
µS
50
mS
2
%
150
kHz
50% - full load
±5
%
Loop phase margin
10% - Full load
45
degree
Loop gain margin
10% - Full load
10
dB
Ripple and noise are measured with 10µF Tantalum capacitor and 0.1µF ceramic capacitor across output.
7.2.2
Detailed Design Procedure
7.2.2.1
PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration
Overview
The hardware configuration of the UCD3138x PCMC PSFB converter contains two critical elements that
are highlighted in the subsequent sections.
• DPWM initialization - This section will highlight the key register settings and considerations necessary
for the UCD3138x to generate the correct MOSFET waveforms for this topology. This maintains the
proper phase relationship between the MOSFETs and synchronous rectifiers as well as the proper set
up required to function correctly with PCMC.
• PCMC initialization - This section will discuss the register settings and hardware considerations
necessary to modulate the DPWM pins with PCMC and internal slope compensation.
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DPWM Initialization for PSFB
The UCD3138x DPWM peripheral provides flexibility for a wide range of topologies. The PSFB
configuration utilizes the Intra-Mux and Edge Generation Modules of the DPWM. For a diagram showing
these modules, see the UCD3138x Digital Power Peripherals Manual.
Here is a schematic of the power stage of the PSFB:
L1
T1
VOUT
Q6
VBUS
I_pri
PRIM
CURRENT
Q5
T2
D1
QT1
Lr
R2
QT2
T1
QB2
SYNCHRONOUS
GATE DRIVE
DPWM2B
DPWM2A
DPWM3B
DPWM3A
ISOLATED
GATE Transformer
DPWM1B
D2
DPWM0B
QB1
Figure 7-2. Schematic – PSFB Power Stage
62
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Here is an overview of the key PSFB signals:
3 A – QB1
( DPWM1C )
3 B – QT1
( DPWM2 C)
2 A – QT 2
( EDGEGEN)
2 B – QB2
( EDGEGEN )
X1
Y3
X3
Transformer
Voltage
Y2
X2
1B–
QSYN 1 ,3
Y1
0 B–
QSYN 2,4
DPWM3 AF
DPWM3 BF
DPWM 2 AF
DPWM 2 BF
Peak Level
Current
X1 , X2 , X 3 and Y1 , Y2 , Y 3 are sets of moving edges
All other edges are fixed .
Figure 7-3. Key PSFB Signals
7.2.2.2.1 DPWM Synchronization
DPWM1 is synchronized to DPWM0, DPWM2 is synchronized to DPWM1, and DPWM3 is synchronized to
DPWM2, ½ period out of phase using these commands:
Dpwm1Regs.DPWMCTRL0.bit.MSYNC_SLAVE_EN = 1; //configured to slave
Dpwm2Regs.DPWMCTRL0.bit.MSYNC_SLAVE_EN = 1; // configured to slave
Dpwm3Regs.DPWMCTRL0.bit.MSYNC_SLAVE_EN = 1; // configured to slave
Dpwm0Regs.DPWMPHASETRIG.all = PWM_SLAVESYNC;
Dpwm1Regs.DPWMPHASETRIG.all = PWM_SLAVESYNC;
Dpwm2Regs.DPWMPHASETRIG.all = PWM_SLAVESYNC;
LoopMuxRegs.DPWMMUX.bit.DPWM1_SYNC_SEL
= 0;
LoopMuxRegs.DPWMMUX.bit.DPWM2_SYNC_SEL
= 1;
LoopMuxRegs.DPWMMUX.bit.DPWM3_SYNC_SEL
= 2;
// Slave to dpwm-0
// Slave to dpwm-1
// Slave to dpwm-2
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If the event registers on the DPWMs are the same, the two pairs of signals will be symmetrical. All code
examples are taken from the PSFB EVM code, unless otherwise stated.
7.2.2.3
Fixed Signals to Bridge
The two top signals in the above drawing have fixed timing. The DPWM1CF and DPWM2CF signals are
used for these pins. DPWMCxF refers to the signal coming out of the fault module of DPWMx, as shown
in Figure 7-4.
Figure 7-4. Fixed Signals to Bridge
64
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These signals are actually routed to pins DPWM3A and 3B using the Intra Mux with these statements:
Dpwm3Regs.DPWMCTRL0.bit.PWM_A_INTRA_MUX = 7; // Send DPWM1C
Dpwm3Regs.DPWMCTRL0.bit.PWM_B_INTRA_MUX = 8; // Send DPWM2C
Since these signals are really being used as events in the timer, the #defines are called EV5 and EV6.
Here are the statements which initialize them:
// Setup waveform for DPWM-C (re-using blanking B regs)
Dpwm2Regs.DPWMBLKBBEG.all = PWM2_EV5 + (4 *16);
Dpwm2Regs.DPWMBLKBEND.all = PWM2_EV6;
Period End
Period Start
Controlled by DPWM1 Blanking register
Blank B Begin
3 A – QB1
( DPWM1 C)
3 B – QT1
( DPWM 2 C)
Blank B End
Even 6
Even 5
Even 6
Even 5
Even 6
Blank B Begin
Blank B End
Controlled by DPWM2 Blanking register
Figure 7-5. Blank B Timing Information
The statements for DPWM1 are the same. Remember that DPWMC reuses the Blank B registers for
timing information.
7.2.2.4
Dynamic Signals to Bridge
DPWM0 and 1 are set at normal mode. PCMC triggering signal (fault) chops DPWM0A and 1A cycle by
cycle. The corresponding DPWM0B and 1B are used for synchronous rectifier MOSFET control. The
same PCMC triggering signal is applied to DPWM2 and DPWM3. Both of these are set to normal mode as
well. DPWM2 and 3 are chopped and their edges are used to generate the next two dynamic signals to
the bridge. They are generated using the Edge Generator Module in DPWM2. The Edge Generator
sources are DPWM2 and DPWM3. The edges used are:
DPWM2A
DPWM2A
DPWM2B
DPWM2B
turned on by a rising edge on DPWM2BF
turned off by a falling edge on DPWM3AF
turned on by a rising edge on DPWM3BF
turned off by a falling edge on DPWM2AF
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Period Start
Period End
3 A – QB1
( DPWM 1 C)
3 B – QT1
( DPWM 2 C)
2 A – QT 2
( EDGEGEN )
2 B – QB2
( EDGEGEN )
Y3
X3
1A
1B–
QSYN 1,3
Normal Mode
Dead time determined by events
Y2
X2
0A
0B –
QSYN 2,4
Y1
X1
DPWM 3 AF
DPWM 3 BF
DPWM 2 AF
DPWM 2 BF
Peak Level
Current
Chopping point
Chopping point
X1 , X2 , X 3 and Y 1 , Y2 , Y 3 are sets of moving edges
All other edges are fixed .
Figure 7-6. Dynamic Signals to Bridge
The Edge Generator is configured with these statements:
Dpwm2Regs.DPWMEDGEGEN.bit.A_ON_EDGE = 2;
Dpwm2Regs.DPWMEDGEGEN.bit.A_OFF_EDGE = 5;
Dpwm2Regs.DPWMEDGEGEN.bit.B_ON_EDGE = 6;
Dpwm2Regs.DPWMEDGEGEN.bit.B_OFF_EDGE = 1;
Dpwm2Regs.DPWMCTRL0.bit.PWM_A_INTRA_MUX = 1; // EDGEGEN-A out the A output
Dpwm2Regs.DPWMCTRL0.bit.PWM_B_INTRA_MUX = 1; // EDGEGEN-B out the B output
Dpwm2Regs.DPWMEDGEGEN.bit.EDGE_EN = 1;
The EDGE_EN bits are set for all 4 DPWMs. This is done to ensure that all signals have the same timing
delay through the DPWM.
The finial 6 gate signals are shown in Figure 7-7.
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Period Start
Period End
3 A – QB1
( DPWM 1 C)
3 B – QT1
( DPWM 2 C)
2 A – QT 2
( EDGEGEN )
2 B – QB2
( EDGEGEN )
Y3
X3
1B–
QSYN 1,3
Y2
X2
0B –
QSYN 2,4
Y1
X1
Peak Level
Current
Chopping point
Chopping point
Figure 7-7. Final 6 Gate Signals
Note how the falling edge of DPWM2AF aligns with the X1 edge, and how the rising edge of DPWM2BF
aligns with the X3 edge. The falling edges on DPWM2AF and DPWM3AF are caused by the peak
detection logic. This is fed through the Cycle By Cycle logic. The Cycle By Cycle logic also has a special
feature to control the rising edges of DPWM2BF (X1 and X3) and DPWM3BF (Y1 and Y3). It uses the
value of Event3 – Event2 to control the time between the edges. The same feature is used with DPWM0
and DPWM1 to control the X2 and Y2 signals. Using the other 2 DPWMs permits these signals to have a
different dead time.
The same setup can be used for voltage mode control. In this case, the Filter output sets the timing of the
falling edge on DPWMxAF.
All DPWMs are configured in Normal mode, with CBC enabled. If external slope compensation is used,
DPWM1A and DPWM1B are used to reset the external compensator at the beginning of each half cycle. If
no PCMC event occurs, the values of Events 2 and 3 determine the locations of the edges, just as in open
loop mode.
7.2.2.5
System Initialization for PCM
PCM (Peak Current Mode) is a specialized configuration for the UCD3138x which involves several
peripherals. This section describes how it works across the peripherals.
7.2.2.5.1 Use of Front Ends and Filters in PSFB
All three front ends are used in PSFB. The same signals are used in the same places for both PCMC and
voltage mode. The same hardware can be used for both control modes, with the mode determined by
which firmware is loaded into the device. FE0 and FE1 are used with their associated filters, but Filter 2 is
not used at all.
FE0 – Vout – voltage loop
FE1 – Iout – current loop
FE2 – Ipri – PCM
In PCMC mode, FE2 is used for PCMC, and the voltage loop is normally used to provide the start point for
the compensation ramp. If the CPCC firmware detects a need for constant current mode, it switches to the
current loop for the start point.
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7.2.2.5.2 Peak Current Detection
Peak current detection involves all the major modules of the DPPs, the Front End, Filter, Loop Mux, Fault
Mux and the DPWMs. A drawing of the major elements is shown in Figure 7-8.
Ipri
PCM
Comparator
Loop
Mux
Fault
Mux
DPWM
Vout
Voltage Loop
Filter
Loop
Mux
Ramp
Module
Loop
Mux
Front
End
Figure 7-8. Peak Current Detection Function
All signals without arrows flow from left to right. The voltage loop is used to select a peak current level.
This level is fed to the Ramp module to generate a compensation ramp. The compensation ramp is
compared to the primary current by the PCMC comparator in the Front End. When the ramp value is
greater than the primary current, the APCMC signal is sent to the DPWM, causing the events described in
the previous sections.
The DPWM frame start and output pin signals can be used to trigger the Ramp Module. In this case,
unlike in the case of other ramp module functions, each DPWM frame triggers the start of the ramp. The
ramp steps every 32 ns.
The Filter is configured normally, there is no real difference for PCMC. The PCM_FILTER_SEL bits in the
LoopMux.PCMCTRL register are used to select which filter is connected to the ramp module:
LoopMuxRegs.PCMCTRL.bit.PCM_FILTER_SEL =0; //select filter0
With Firmware Constant Power/Constant current, Filter 1 and Front End 1 are used as a current control
loop, with the EADCDAC set to high current. If the voltage loop value becomes higher than the current
loop value, then Filter 1 is used to control the PCM ramp start value:
LoopMuxRegs.PCMCTRL.bit.PCM_FILTER_SEL =1;
S P A C E //select filter1 for slope compensation source
In the ramp module, there are 2 bitfields in the RAMPCTRL register which must be configured. The
PCM_START_SEL must be set to a 1 to enable the Filter to be used as a ramp start source. The
RAMP_EN bit must be set, of course.
The DAC_STEP register sets the slope of the compensation ramp. The DAC value is in volts, of course,
so it is necessary to calculate the slope after the current to voltage conversion. Here is the formula for
converting from millivolts per microsecond to DACSTEP.
m = compensation slope in millivolts per microsecond
ACSTEP = 335.5 × M
In C, this can be written:
#define COMPENSATION_SLOPE 150 //compensation slope in millivolts per microsecond
#define DACSTEP_COMP_VALUE ((int) (COMPENSATION_SLOPE*335.5) )
S P A C E //value in DACSTEP for desired compensation slope
S P A C E FeCtrl0Regs.DACSTEP.all = DACSTEP_COMP_VALUE;
68
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It may also be necessary to set a ramp ending value in the RAMPDACEND register.
In addition, it is necessary to set the D2S_COMP_EN bit in the EADCCTRL register. This is for enabling
the differential to single ended comparator function. The front end diagram leaves it out for simplicity, but
the connection between the DAC and the EADC amplifier is actually differential. The PCMC comparator,
however, is single ended. So a conversion is necessary as shown in Figure 7-9.
AFE_GAIN
23-AFE_GAIN
EAP0
6 bit ADC
8mV/LSB
AFE_GAIN
EAN0
2
EADC
X
Signed 9 bit result
(error) 1 mV /LSB
Averaging
SAR/Prebias
Ramp
Filter x
DAC0
10 bit DAC
1.5625mV/LSB
Differential to
Single Ended
CPCC
Σ
Value
Dither
4 bit dithering gives 14 bits of effective resolution
97.65625μV/LSB effective resolution
Absolute Value
Calculation
10 bit result
1.5625mV/LSB
Peak Current
Detected
Peak Current Mode
Comparator
Figure 7-9. Differential to Single-Ended Comparator Function
The EADC_MODE bit in EADCCTRL should be set to a 5 for peak current mode.
The peak current detection signal next goes to the Loop Mux. The Fault Mux has only 1 APCM input, but
there are 3 front ends. So the PCM_FE_SEL bits in APCMCTRL must be used to select which front end is
used:
LoopMuxRegs.APCMCTRL.bit.PCM_FE_SEL = 2; // use FE2 for PCM */
The PCM_EN bit must also be set.
LoopMuxRegs.APCMCTRL.bit.PCM_EN = 1; // Enable PCM
Next the Fault Mux is used to enable the APCM bit to the CLIM/CBC signal to the DPWM. There are 4
DPWMxCLIM registers, one for each DPWM. The ANALOG_PCM_EN bit must be set in each one to
connect the PCM detection signal to the CLIM/CBC signal on each DPWM. For the latest configuration
information on all of these bits, consult the appropriate EVM firmware. To avoid errors, it is best to
configure your hardware design using the same DPWMs, filters, and front ends for the same functions as
the EVM.
DPWM timing is used to trigger the start of the ramp. This is selected by the FECTRLxMUX registers in
the Loop Mux. DPWMx_FRAME_SYNC_EN bits, when set, cause the ramp to be triggered at the start of
the DPWM period.
7.2.2.5.3 Peak Current Mode (PCM)
There is one peak current mode control module in the device however any front end can be configured to
use this module.
Applications, Implementation, and Layout
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Application Curves
1A-16A-1A
30A Load
Vin =385V
syncFETs off
Figure 7-11. VOUT Soft Start
Figure 7-10. Load Transient
Kp =14000
Ki =300
Kd =2000
Alpha = –2
Figure 7-12. Bode Plot
70
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7.2.4
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
Power Supply Recommendations
•
•
7.2.5
Both 3.3 VD and 3.3 VA should have a local 4.7-µF capacitor placed as close as possible to the device
pins
BP18 should have a 1-µF capacitor.
Layout
7.2.5.1
•
•
•
IC Grounding and Layout Guidelines
Two grounds are recommended: AGND (analog) and DGND (digital).
– AGND plane should be on a different layer than DGND, and right under the UCD3138064 device.
– UCD3138064 power pad should be tied to AGND plane by at least 4 vias
– AGND plane should be just large enough to connect to all required components.
– Power ground (PGND) can be independent or combined with DGND
– The power pad of the driver IC should be tied to DGND
Both 3.3VD and 3.3VA should have a local 4.7µF capacitor placed as close as possible to the device
pins
BPCAP decoupling MUST be connected as shown in the following figure. It is important that the ratio
of the 2.2-µF to 1.0-µF capacitor be 2.2:1.
V33D
2 .2 μF
BP18
1 .0 μF
DGND
•
•
•
•
•
•
•
All analog signal filter capacitors should be tied to AGND
– If the gate driver device, such as UCD27524 or UCD27511/7 driver is used, the filter capacitor for
the current sensing pin can be tied to DGND for easy layout
All digital signals, such as GPIO, PMBus and PWM are referenced to DGND.
The RESET pin capacitor (at least 0.1 µF) should be connected to either DGND or AGND locally. If the
RESET pin is unused it is recommended to tie the pin directly to 3.3V.
All filter and decoupling capacitors should be placed close to UCD3138064 as possible
– Resistor placement is less critical and can be moved a little further away
The DGND and AGND net-short resistor MUST be placed right between one UCD3138064’s DGND
pin and one AGND pin. Ground connections to the net short element should be made by a large via (or
multiple paralleled vias) for each terminal of the net-short element.
If a gate driver device such as UCC27524 or UCC27511/7 is on the control card and there is a PGND
connection, a net-short resistor should be tied to the DGND plane and PGND plane by multiple vias. In
addition the net-short element should be close to the driver IC.
Configure all unused GPIO as inputs and connect them to ground.
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Layout Example
Figure 7-13. Layout Example
72
Applications, Implementation, and Layout
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UCD3138A64/UCD3138128
Figure 7-14. Layout Example
Applications, Implementation, and Layout
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8 Device and Documentation Support
8.1
Device Support
The application firmware for the UCD3138064 is developed on Texas Instruments Code Composer Studio
(CCS) integrated development environment (v3.3 recommended).
Device programming, real time debug and monitoring/configuration of key device parameters for certain
power topologies are all available through Texas Instruments’ FUSION_DIGITAL_POWER_DESIGNER
Graphical
User
Interface
(http://www.ti.com/tool/fusion_digital_power_designer).
The
FUSION_DIGITAL_POWER_DESIGNER software application uses the PMBus protocol to communicate
with the device over a serial bus using an interface adaptor known as the USB-TO-GPIO, available as an
EVM from Texas Instruments (http://www.ti.com/tool/usb-to-gpio). PMBUS-based real-time debug
capability is available through the ‘Memory Debugger’ tool within the Device GUI module of the
FUSION_DIGITAL_POWER_DESIGNER GUI, which represents a powerful alternative over traditional
JTAG-based approaches’.
The software application can also be used to program the devices, with a version of the tool known as
FUSION_MFR_GUI optimized for manufacturing environments (http://www.ti.com/tool/fusion_mfr_gui).
The FUSION_MFR_GUI tool supports multiple devices on a board, and includes built-in logging and
reporting capabilities.
In terms of reference documentation, the following programmer’s manuals are available offering detailed
information regarding the application and usage of UCD3138064 digital controller:
1. UCD3138064 Programmer's Manual
2. UCD3138 Digital Power Peripheral Programmer's Manual Key topics covered in this manual include:
– Digital Pulse Width Modulator (DPWM)
– Modes of Operation (Normal/Multi/Phase-shift/Resonant etc)
– Automatic Mode Switching
– DPWMC, Edge Generation & Intra-Mux
– Front End
– Analog Front End
– Error ADC or EADC
– Front End DAC
– Ramp Module
– Successive Approximation Register Module
– Filter
– Filter Math
– Loop Mux
– Analog Peak Current Mode
– Constant Current/Constant Power (CCCP)
– Automatic Cycle Adjustment
– Fault Mux
– Analog Comparators
– Digital Comparators
– Fault Pin functions
– DPWM Fault Action
– Ideal Diode Emulation (IDE), DCM Detection
– Oscillator Failure Detection
– Register Map for all of the above peripherals in UCD3138064
3. UCD3138 Monitoring and Communications Programmer’s Manual Key topics covered in this manual
include:
– ADC12
– Control, Conversion, Sequencing & Averaging
– Digital Comparators
74
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– Temperature Sensor
– PMBUS Addressing
– Dual Sample & Hold
– Miscellaneous Analog Controls (Current Sharing, Brown-Out, Clock-Gating)
– PMBUS Interface
– General Purpose Input Output (GPIO)
– Timer Modules
– PMBus
– Register Map for all of the above peripherals in UCD3138064
4. UCD3138 ARM and Digital System Programmer’s Manual Key topics covered in this manual include:
– Boot ROM & Boot Flash
– BootROM Function
– Memory Read/Write Functions
– Checksum Functions
– Flash Functions
– Avoiding Program Flash Lock-Up
– ARM7 Architecture
– Modes of Operation
– Hardware/Software Interrupts
– Instruction Set
– Dual State Inter-working (Thumb 16-bit Mode/ARM 32-bit Mode)
– Memory & System Module
– Address Decoder, DEC (Memory Mapping)
– Memory Controller (MMC)
– Central Interrupt Module
– Register Map for all of the above peripherals in UCD3138064
5. FUSION_DIGITAL_POWER_DESIGNER for UCD31XX Isolated Power Applications – User Guide
In addition to the tools and documentation described above, for the most up to date information regarding
evaluation modules, reference application firmware and application notes/design tips, visit
http://www.ti.com/product/ucd3138064.
8.2
8.2.1
Documentation Support
Related Documentation
1.
2.
3.
4.
5.
6.
7.
8.
9.
8.3
UCD3138064 Programmer’s Manual (SLUUAD8)
UCD3138 Digital Power Peripherals Programmer’s Manual (SLUU995)
UCD3138 Monitoring & Communications Programmer’s Manual (SLUU996)
UCD3138 ARM and Digital System Programmer’s Manual (SLUU994)
FUSION_DIGITAL_POWER_DESIGNER for Isolated Power Applications (SLUA676)
Code Composer Studio Development Tools v3.3 – Getting Started Guide, (SPRU509H)
ARM7TDMI-S Technical Reference Manual
System Management Bus (SMBus) Specification
PMBus™ Power System Management Prototcol Specification
Trademarks
PMBus is a trademark of SMIF, Inc..
All other trademarks are the property of their respective owners.
Device and Documentation Support
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UCD3138064
SLUSB72B – MARCH 2013 – REVISED SEPTEMBER 2014
8.4
www.ti.com
Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8.5
Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
76
Mechanical, Packaging, and Orderable Information
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PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UCD3138064RGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
UCD3138064
UCD3138064RGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
UCD3138064
UCD3138064RGZR
OBSOLETE
VQFN
RGZ
48
TBD
Call TI
Call TI
-40 to 125
UCD3138064
UCD3138064RGZT
OBSOLETE
VQFN
RGZ
48
TBD
Call TI
Call TI
-40 to 125
UCD3138064
UCD3138064RMHR
ACTIVE
WQFN
RMH
40
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
3138064
UCD3138064RMHT
ACTIVE
WQFN
RMH
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
3138064
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jan-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UCD3138064RGCR
Package Package Pins
Type Drawing
VQFN
RGC
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2000
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
UCD3138064RGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
UCD3138064RMHR
WQFN
RMH
40
2000
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
UCD3138064RMHT
WQFN
RMH
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jan-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCD3138064RGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
UCD3138064RGCT
VQFN
RGC
64
250
210.0
185.0
35.0
UCD3138064RMHR
WQFN
RMH
40
2000
367.0
367.0
38.0
UCD3138064RMHT
WQFN
RMH
40
250
210.0
185.0
35.0
Pack Materials-Page 2
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