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UCD3138A64OEVM-662

UCD3138A64OEVM-662

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    EVALUATION MODULE UCD3138A64O

  • 数据手册
  • 价格&库存
UCD3138A64OEVM-662 数据手册
Using the UCD3138A64OEVM-662 User’s Guide Literature Number: SLUUB73 December 2014 Using the UCD3138A64OEVM-662 1 User Guide SLUUB73 – December 2014 Using the UCD3138A64OEVM-662 Power Management Contents Introduction ..................................................................................................................................... 4  Description ...................................................................................................................................... 4  2.1  Typical Applications .................................................................................................................. 4  2.2  Features .................................................................................................................................... 4  3  Specifications ................................................................................................................................. 5  4  Schematics ...................................................................................................................................... 6  5  Test Equipment ............................................................................................................................. 16  5.1  PC Computer .......................................................................................................................... 16  5.1.1  Operating System ....................................................................................................... 16  5.2  USB-to-GPIO Interface Adapter .............................................................................................. 16  5.2.1  USB-to-GPIO Interface Adapter (HPA172) ................................................................. 16  5.3  Oscilloscope ............................................................................................................................ 16  6  Equipment Setup .......................................................................................................................... 17  6.1  GUI (Graphical User Interface) ............................................................................................... 17  6.1.1  File for Installation ....................................................................................................... 17  6.1.2  Installation ................................................................................................................... 17  6.1.3  Launch UCD3138 Device GUI .................................................................................... 17  6.2  Hardware Setup ...................................................................................................................... 17  6.2.1  Setup Overview ........................................................................................................... 17  6.3  List of Test Points ................................................................................................................... 20  7  Test Procedure .............................................................................................................................. 21  7.1  Connection Test ...................................................................................................................... 21  7.2  ADC12 Input Setup ................................................................................................................. 22  7.3  Communication Terminal using RS232 Serial Port ................................................................. 22  7.4  Setup-A Test ........................................................................................................................... 23  7.5  Equipment Shutdown .............................................................................................................. 25  8  EVM Assembly Drawing and PCB layout ................................................................................... 25  9  Bill of Materials ............................................................................................................................. 29  Appendix A. Using Code Composer Studio v5.5 ............................................................................... 33  A.1  Importing a CCSv5 project ...................................................................................................... 33  A.2  Build/Compile a Project using Code Composer Studio v5.5 ................................................... 35  Appendix B. Setting up PuTTY ............................................................................................................ 37  Step 1 ............................................................................................................................................. 37  Step 2 ............................................................................................................................................. 37  Step 3 ............................................................................................................................................. 38  Step 4 ............................................................................................................................................. 39  Step 5 ............................................................................................................................................. 39  References ............................................................................................................................................ 40  1  2  2 SLUUB73 Figure 1.  Figure 2.  Figure 3.  Figure 4.  Figure 5.  Figure 6.  Figure 7.  Figure 8.  Figure 9.  Figure 10.  Figure 11.  Figure 12.  Figure 13.  Figure 14.  Figure 15.  Figure 16.  Figure 17.  Figure 18.  Figure 19.  Figure 20.  Figures UCD3138A64OEVM-662 Schematics (Socket) 1 of 10 .................................................... 6  UCD3138A64OEVM-662 Schematics (Headers) 2 of 10 .................................................. 7  UCD3138A64OEVM-662 Schematics (Filters) 3 of 10 ..................................................... 8  UCD3138A64OEVM-662 Schematics (Bias and LEDs) 4 of 10 ....................................... 9  UCD3138A64OEVM-662 Schematics (UART and JTAG) 5 of 10 .................................. 10  UCD3138A64OEVM-662 Schematics (PMBus) 6 of 10 .................................................. 11  UCD3138A64OEVM-662 Schematics (DPWM) 7 of 10 ................................................... 12  UCD3138A64OEVM-662 Schematics (EADC and ADC12) 8 of 10 ................................ 13  UCD3138A64OEVM-662 Schematics (Misc) 9 of 10 ...................................................... 14  UCD3138A64OEVM-662 Schematics (Hardware) 10 of 10 ............................................ 15  USB-to-GPIO Interface Adapter (HPA172) Outlook. ..................................................... 16  UCD3138A64OEVM-662 Test Connections .................................................................... 18  UCD31xx Device GUI ....................................................................................................... 18  Firmware code downloading .......................................................................................... 19  UCD3138A64OEVM-662 Top Layer Assembly Drawing (Top view) ............................. 26  UCD3138A64OEVM-662 Bottom Assembly Drawing (Bottom view) ........................... 26  UCD3138A64OEVM-662 Top Copper (Top View) .......................................................... 27  UCD3138A64OEVM-662 Internal Layer 1 (Top View) .................................................... 27  UCD3138A64OEVM-662 Internal Layer 2 (Top View) .................................................... 28  UCD3138A64OEVM-662 Bottom Copper (Top View) .................................................... 28  Table 1.  Table 2.  Table 3.  Tables UCD3138A64OEVM-662 Specifications ........................................................................... 5  The functions of each test point ..................................................................................... 20  The EVM components list according to the schematics shown in Figure 1 to 10 ..... 29  Using the UCD3138A64OEVM-662 3 SLUUB73 1 Introduction The UCD3138A64OEVM-662 EVM offers an easy to use test platform for stand-alone evaluation of UCD3138A64 digital controller optimized for isolated power applications. Featuring an 80-pin socket and a comprehensive set of test points, the EVM allows hardware and firmware engineers to manipulate signals on the different pins of the device individually and study open loop operation. The EVM also offers the flexibility to realize simple closed loop control configurations (eg. using RC circuits to filter PWM output signals and regulate a DC voltage in closed loop control). Hardware ports available to communicate with the device include PMBus and UART. The EVM accepts up to 5V DC input and an on-board 3.3V LDO can be used to bias the device. Alternately, using jumpers, the device can be biased using the PMBus communication pins. NOTE: In order to download firmware and program the UCD3138A64 device in UCD3138A64OEVM-662, a separate EVM from Texas Instruments known as the USB-TO-GPIO Adapter is required. The USB-TO-GPIO Adapter is NOT supplied with UCD3138A64OEVM-662 and must be purchased separately. The USB-TO-GPIO Adapter serves as a communication interface adaptor or a bridge between a host PC and the UCD3138A64 via a standard type-A to mini-B USB cable. The USB-TO-GPIO Adapter is listed below in the related products section. 2 Description UCD3138A64OEVM-662 is an EVM board to facilitate evaluation on UCD3138A64PFC digital power controller. This EVM provides hardware needed to evaluate UCD3138A64 80-pin device. All pins of UCD3138A64PFC are accessible through header connections, including all GPIO pins, ADC12 pins, front end pins, DPWM pins, and Fault pins, etc. Particularly, the board has terminal of PMBus, UART DB-9 RS232, and JTAG. All headers can be jumped to configure for a particular interested evaluation need. 2.1 Typical Applications    2.2 UCD3138A64 function evaluation Firmware debug Hardware design assistance Features           Test points for easy access to all pins of UCD3138A64 80-pin digital controller Socket for easy removal/replacement of the device All GPIO and ADC12 pins accessible (with on-board RC filters on each pin) Capability to adapt EVM for various evaluation targets using jumpers Hardware terminals: PMBus, UART, and Logic Analyzer Includes On-board SPI and I2C accessible EEPROMs for additional memory storage External 5.0V supply input with onboard 3.3V LDO to bias the device (option to bias device using PMBus port) LED indicators Rich test points to facilitate the IC evaluation, system design and circuit and firmware debugging Board with jumpers to make flexible configuration to adapt various evaluation target Using the UCD3138A64OEVM-662 4 SLUUB73 3 Specifications Table 1. Parameter Connector J21 J21-4 J21-3 J21-2 J21-1 Connector J26 UART Connector J27 JTAG Connector J28 UCD3138A64OEVM-662 Specifications Notes & Conditions Min Nom 3.45 5.10 3.33 Units Port to use on board 3.3V to bias external circuit External +5.0V to board External +3.3V to board Digital ground DGND 3.25 4.90 3.27 Female DB-9, RS232 Standard Standard JTAG communication connection Standard PMBus connector Port of connection to USB-to-GPIO, Jump across J56 (2&3) and J57 (2&3) to enable communication to UCD3138A64 device. For pin definition, refer to TI standard USB-to-GPIO document SLLU093 Standard Operation Environment Operating Temperature Range MECHANICAL CHARACTERSTICS Natural Convection 25 °C Dimensions Width Length Highest Component Height 4.0 6.0 0.512 in in in Firmware for Testing Filename 3.30 5.00 3.30 Max VDC VDC VDC PWR662_HelloWorld.x0 Using the UCD3138A64OEVM-662 5 SLUUB73 4 Schematics Figure 1. UCD3138A64OEVM-662 Schematics (Socket) 1 of 10 Using the UCD3138A64OEVM-662 6 SLUUB73 Figure 2. UCD3138A64OEVM-662 Schematics (Headers) 2 of 10 Using the UCD3138A64OEVM-662 7 SLUUB73 Figure 3. UCD3138A64OEVM-662 Schematics (Filters) 3 of 10 Using the UCD3138A64OEVM-662 8 SLUUB73 Figure 4. UCD3138A64OEVM-662 Schematics (Bias and LEDs) 4 of 10 Using the UCD3138A64OEVM-662 9 SLUUB73 Figure 5. UCD3138A64OEVM-662 Schematics (UART and JTAG) 5 of 10 Using the UCD3138A64OEVM-662 10 SLUUB73 Figure 6. UCD3138A64OEVM-662 Schematics (PMBus) 6 of 10 Using the UCD3138A64OEVM-662 11 SLUUB73 Figure 7. UCD3138A64OEVM-662 Schematics (DPWM) 7 of 10 Using the UCD3138A64OEVM-662 12 SLUUB73 Figure 8. UCD3138A64OEVM-662 Schematics (EADC and ADC12) 8 of 10 Using the UCD3138A64OEVM-662 13 SLUUB73 Figure 9. UCD3138A64OEVM-662 Schematics (Misc) 9 of 10 Using the UCD3138A64OEVM-662 14 SLUUB73 Figure 10. UCD3138A64OEVM-662 Schematics (Hardware) 10 of 10 Using the UCD3138A64OEVM-662 15 SLUUB73 5 Test Equipment 5.1 PC Computer 5.1.1 Operating System Microsoft Windows XP (32-bit), or Vista (32-bit), or Windows 7 (32-bit). 5.2 USB-to-GPIO Interface Adapter This adapter is to establish the communication between the control card UCC3138A64OEVM-662 and the PC computer through the PMBus and the GUI, Texas Instruments Fusion Digital Power Designer. 5.2.1 USB-to-GPIO Interface Adapter (HPA172) Accessories including: a) USB interface adapter (HPA172) b) USB cable, 5 pin B Mini Male to Type A Male. c) Ribbon cable, socket to socket, 10 pin, 2 headers, polarized. Figure 11. USB-to-GPIO Interface Adapter (HPA172) Outlook. 5.3 Oscilloscope An oscilloscope of analog or digital type is capable of 200MHz bandwidth with Tektronix P6138 or equivalent oscilloscope probe. Using the UCD3138A64OEVM-662 16 SLUUB73 6 Equipment Setup 6.1 GUI (Graphical User Interface) 6.1.1 File for Installation The GUI installation file is TI-Fusion-Digital-Power-Designer-Version-1.9.54.exe or newer version. Obtain the latest version of GUI from http://www.ti.com/tool/fusion_digital_power_designer. 6.1.2 Installation Double click and launch the .exe file to start the installation. Click Next on the subsequent dialog windows. When present, click I accept the agreement after reading it, then click Install. After the installation, click Finish to exit setup, then click Exit Program. 6.1.3 Launch UCD3138 Device GUI The GUI for UCD3138A64OEVM-662 board is launched with the following steps: Click the Windows Start → click All Programs → click Texas Instruments Fusion Digital Power Designer → click Device GUIs → click UCD3xxx and UCD9xxx Device GUI. 6.2 Hardware Setup 6.2.1 Setup Overview Figure 11 shows the connection between UCD3138A64OEVM-662 and the PC computer through USB-to-GPIO Interface Adapter. USB Adapter Connection a) Connect one end of the ribbon cable to the EVM, and connect the other end to the USB interface adapter b) Connect the Mini connector of the USB cable to the USB interface adapter, and connect the other end to the USB port of the PC computer. Using the UCD3138A64OEVM-662 17 SLUUB73 Figure 12. UCD3138A64OEVM-662 Test Connections Figure 13. UCD31xx Device GUI Using the UCD3138A64OEVM-662 18 SLUUB73 Figure 14. Firmware code downloading Using the UCD3138A64OEVM-662 19 SLUUB73 6.3 List of Test Points Table 2. The functions of each test point Test Points Name Description TP1, TP3, TP4, TP5, TP10, TP12, TP15, TP25, TP28, TP29 DGND Digital Ground (for less sensitive / noisy signals) TP2, TP9, TP11, TP20 AGND Analog Ground (for more sensitive / less noisy signals) TP6, TP8 V33D Digital 3.3VDC TP7 V33A Analog 3.3VDC TP13 UART J26-2 UART Transmitting TP14 UART J26-3 UART Receiving TP16 FLTR_DPWM0 DPWM0 Front End Connection TP17 FLTR_DPWM1 DPWM1 Front End Connection TP18 FLTR_DPWM2 DPWM2 Front End Connection TP19 FLTR_DPWM3 DPWM3 Front End Connection TP21 Q3 and Q4 Drain Ramp generator TP22 Q3 gate Ramp generator TP23 Q4 gate Ramp generator TP24 FFC_adj Feed Forward Control Adjustment J2, J3, J4, J5, J6, J7, J8, J9 Device Pins UCD3138A84 Pinout Headers J11, J12, J13, J14 Fault Connections Place jumper to choose to pull corresponding Fault pin to V33D, DGND, or neither J15 AD00 ADDR / FLTR Place jumper to choose to filter AD00, or use it to create an address, or neither J16 AD01 ADDR / FLTR Place jumper to choose to filter AD01, or use it to create an address, or neither J17, J20, J21, J22 Board Bias Power Management J18 LED D1 Place jumper to choose connection to either GPIOA, GPIOB, or neither. J19 LED D2 Place jumper to choose connection to either GPIOA, GPIOB, or neither. J23 UART RX Place jumper to use UART connector to communicate with UART Module 0, or Module 1, of the UCD3138A64 J24 Logic Analyzer Logic Analyzer connector, not populated J25 UART TX Place jumper to use UART connector to communicate with UART Module 0, or Module 1, of the UCD3138A64 J26 UART UART Connector, DB-9, Female, RS232 J27 JTAG JTAG Connector Header J28 PMBus PMBus Connector J29 PMBus CLK Enables board side Pull-up Resistor. Jump to add 1.5kΩ Pull-up resistor to PMBus Clocking line J30 PMBus CTRL Place jumper to connect PMBus Control Line J31 PMBus DATA Enables board side Pull-up Resistor. Jump to add 1.5kΩ Pull-up resistor to PMBus Data line J32 PMBus ALERT Enables board side Pull-up Resistor. Jump to add 1.5kΩ Pull-up resistor to PMBus ALERT line Using the UCD3138A64OEVM-662 20 SLUUB73 J33 DPWM0 Filter DPWM Filter. Place Jumper to choose to filter DPWM0A or DPWM0B in accordance with the schematic. J34 DPWM1 Filter DPWM Filter. Place Jumper to choose to filter DPWM1A or DPWM1B in accordance with the schematic. J35 DPWM2 Filter DPWM Filter. Place Jumper to choose to filter DPWM2A or DPWM2B in accordance with the schematic. J36 DPWM3 Filter DPWM Filter. Place Jumper to choose to filter DPWM3A or DPWM3B in accordance with the schematic. J37, J38, J39 EADC and DPWM Place Jumpers to connect chosen filtered DPWM(s) to EAP0S/EAP1S J40, J41, J43, J46 ADC12 Place Jumpers to obtain intermediate voltage on select ADC12 pins. J42 FFCS Feed Forward Control Selection J44, J45 FFC Voltage Feed Forward Test Circuit J47 Logic Connector Header Used to connect select signals to logic connector header. J48, J49, J51, J53 SPI EEPROM Place jumpers to connect SPI EEPROM to SPI MISO, MOSI, CLK, and CS pins of UCD3138A64 device. J50, J52 I2C EEPROM Place jumpers to connect I2C EEPROM to I2C CLK and DATA pins of UCD3138A64 device. J56, J57 PMBus / I2C Place jumpers to choose the PMBus connector’s connection to the UCD3138A64 device. Connect to I2C pins, or PMBus pins. S1 /RESET Push button to reset UCD3138A64. 7 Test Procedure 7.1 Connection Test 1. Connect one end of the USB cable to the PC computer and the other end to the USB interface adapter, HPA172. The LED on HPA172 should light up. 2. Connect HPA172 to PWR662 PMBus connector J28 with the ribbon cable. Jump across J22, J56(2&3), and J57(2&3). LED D3 on PWR662 should light up. 3. Launch the GUI by the steps described in 5.1.3. Wait until the window in Figure 13 is shown. 4. Click “Scan Device in ROM Mode”, then wait and check Figure 13 on its “Log” and confirm “Found ROM v1 IC v6 – UCD31xx A64 Rev 1”. If “Found ROM” not shown, Click “Device ID” then click “Command Program to jump to ROM (sendByte0xD9) and then click “Scan Device in ROM Mode” again. Using the UCD3138A64OEVM-662 21 SLUUB73 Figure 15 Using the UCD3xxx / UCD9xxx Device GUI Main Window 7.2 ADC12 Input Setup 5. 6. 7. 8. 9. Connect a voltmeter with its positive terminal to J41-1 and return terminal to TP25. Adjust R57 to make the voltage meter read 250mV +/- 0.1mV Move the voltmeter positive terminal to J43-1. Adjust R59 to make the voltmeter read 250mV +/- 0.1mV Remove J22, and move the voltmeter positive terminal to J39 pin 1, and the negative terminal to J37 pin 1. Set the voltmeter to resistance, and tune the potentiometer R54, until the resistance is 4.07kohm +/- 0.1kohm. 10. Remove the voltmeter probes, and re-connect the jumper across J22. 7.3 Communication Terminal using RS232 Serial Port 11. Set up Communication Terminal port settings as shown in Figure 16. Then save this setup as “Test_UCD3138A64OEVM-662”. The detail how to set up UART terminal communication is addressed in Appendix B. 12. Connect RS232 Serial Port (UART) with DB9 male to PWR662 J26 and DB9 female to PC. Jump across J23(2&3) and J25(2&3). 13. Launch saved terminal. Using the UCD3138A64OEVM-662 22 SLUUB73 Figure 16 Terminal Communication Settings Figure 17: Download the Firmware 7.4 Setup-A Test 14. Place jumpers on the following Headers:  J18(1&2) and J19(1&2)  J27(11&13)  J11(1&2), J12(1&2), J13(1&2), and J14(1&2). Using the UCD3138A64OEVM-662 23 SLUUB73 15. 16. 17. 18. 19.  J16(1&2), J46(2&3), J43(1&2)(3&4)(5&6)(7&8)(9&10)(11&12)(13&14), J41(13&14)  J48, J49, J51, and J53  J50  J38(1&2)(3&4)(5&6)(7&8), J37, J39, J33(2&3), J34(2&3), J35(2&3), and J36(2&3) Using clip wires, short PWM0,1,2,3, TCAP0, TCAP1, INT_EXT, SYNC, and ADC_EXT_TRIG to V33D. That is, J6pins1,2,3,4, J9pins4,9,10, and J7pins2,9 must all be shorted together and connected to TP6. On the GUI shown in Figure 15, click Firmware Download, then a new window should come up as in Figure 17. On this new window, a) Check “Download data flash”, “DO NOT write program checksum”, and “Block 0 (32kB)” as shown in Figure 17 b) Click “Select file” and find “PWR662_Test.x0”. Click “Download”. c) When asked, “Do you want to continue with the firmware download?”, click “Yes” to continue. After finishing the program download, the PWR662 board starts self-test automatically. The test status is reported by the Hyper Terminal, shown in Figure 18. With Setup-A, Tests A1-A8 should pass. Check LED D1 and D2. Both should light up. Click “Close” to close the Firmware Download window shown in Figure 17. Using the UCD3138A64OEVM-662 24 SLUUB73 Figure 18: Setup-A Test Result 7.5 Equipment Shutdown a. Exit the GUI and UART b. Disconnect the cables. 8 EVM Assembly Drawing and PCB layout The following figures (Figure 17 through Figure 22) show the design of the UCD3138A64OEVM-662 printed circuit board. PCB dimensions: L x W = 6.0 x 4.0 in, PCB material: FR4 or compatible, four layers and 1oz copper on each layer. Using the UCD3138A64OEVM-662 25 SLUUB73 Figure 15. UCD3138A64OEVM-662 Top Layer Assembly Drawing (Top view) Figure 16. UCD3138A64OEVM-662 Bottom Assembly Drawing (Bottom view) Using the UCD3138A64OEVM-662 26 SLUUB73 Figure 17. UCD3138A64OEVM-662 Top Copper (Top View) Figure 18. UCD3138A64OEVM-662 Internal Layer 1 (Top View) Using the UCD3138A64OEVM-662 27 SLUUB73 Figure 19. UCD3138A64OEVM-662 Internal Layer 2 (Top View) Figure 20. UCD3138A64OEVM-662 Bottom Copper (Top View) Using the UCD3138A64OEVM-662 28 SLUUB73 9 Bill of Materials Table 3. The EVM components list according to the schematics shown in Figure 1 to 10 RefDes Q TY !PCB 1 C3 1 0.1uF CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0603 C5, C7, C11, C13, C16, C36, C37 7 1000p F C6, C8, C12, C14 4 C9 Value Description Size Part Number MFR PWR662 Any 0603 C0603C104K4RACTU Kemet CAP, CERM, 1000pF, 50V, +/-5%, C0G/NP0, 0603 0603 C0603C102J5GAC Kemet 4.7uF CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603 0603 GRM188R61C475KAAJ MuRata 1 0.1uF CAP, CERM, 0.1uF, 25V, +/-10%, X5R, 0603 0603 GRM188R61E104KA01D MuRata C15, C39, C42, C49 4 1uF CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603 0603 GRM188R71C105KA12D MuRata C17 1 0.1uF CAP, CERM, 0.1uF, 25V, +/-10%, X7R, 0603 0603 GRM188R71E104KA01D MuRata C18, C19, C20, C22, C23, C24, C26, C27, C28, C30, C31, C32, C33, C34, C35 15 1000p F CAP, CERM, 1000pF, 50V, +/-10%, X7R, 0603 0603 GRM188R71H102KA01D MuRata C21, C25, C29 3 100pF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0603 0603 GRM1885C1H101JA01D MuRata C38, C40, C41 3 10uF CAP, TA, 10uF, 10V, +/-20%, 3.4 ohm, SMD 3216-18 293D106X0010A2TE3 Vishay-Sprague C43, C44, C45, C46, C47, C56, C57, C58, C59, C60, C61 11 0.1uF CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0603 0603 GRM188R71C104KA01D MuRata C48, C50, C52, C53, C54, C55 6 1000p F CAP, CERM, 1000pF, 50V, +/-10%, X7R, 0603 0603 C0603C102K5RACTU Kemet D1 1 Orang e LED, Orange, SMD 1.6x0.8x0.8 mm LTST-C190KFKT Lite-On LTST-C190CKT Lite-On Printed Circuit Board D2 1 Red LED, Red, SMD Red LED, 1.6x0.8x0.8 mm D3 1 Green LED, Green, SMD 1.6x0.8x0.8 mm LTST-C190GKT Lite-On D4, D5 2 5.1V Diode, Zener, 5.1V, 300mW, SOT-23 SOT-23 AZ23C5V1-7-F Diodes Inc. H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone J2, J3, J4, J5, J6, J7, J8, J9 8 Header, TH, 100mil, 10x1, Gold plated, 230 mil above insulator 10x1 Header TSW-110-07-G-S Samtec Using the UCD3138A64OEVM-662 29 SLUUB73 J11, J12, J13, J14, J15, J16, J18, J19, J20, J23, J25, J33, J34, J35, J36, J44, J46, J56, J57 PEC03SAAN Sullins Connector Solutions Header, 100mil, 2x1, Tin plated, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions 1 TERMINAL BLOCK 5.08MM VERT 4POS, TH TERM_BLK, 4pos, 5.08mm ED120/4DS On-Shore Technology 1 CONN DB9 FEMALE R/A SOLDER TH D-SUB 9 PIN 182-009-213R171 NorComp 3 Header, 100mil, 7x2, Tin plated, TH Header, 7x2, 100mil, Tin PEC07DAAN Sullins Connector Solutions 1 Header (shrouded), 100mil, 5x2, HighTemperature, Gold, TH 5x2 Shrouded header N2510-6002-RB 3M PEC04DAAN Sullins Connector Solutions Header, 100mil, 3x1, Tin plated, TH Header, 3 PIN, 100mil, Tin 17 J21 J26 J17, J22, J29, J30, J31, J32, J37, J39, J40, J42, J45, J48, J49, J50, J51, J52, J53 J27, J41, J43 J28 19 J38 1 Header, 100mil, 4x2, Tin plated, TH Header, 4x2, 100mil, Tin J47 1 Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator 4x1 Header TSW-104-07-G-S Samtec NT1 1 Single point connection between nets. Q1, Q2 2 0.2V Transistor, NPN, 40V, 0.2A, SOT-23 SOT-23 MMBT3904 Fairchild Semiconductor Q3, Q4 2 60V MOSFET, N-CH, 60V, 0.17A, SOT-23 SOT-23 2N7002-7-F Diodes Inc. R1, R58, R64 3 1.0k RES, 1.0k ohm, 5%, 0.1W, 0603 0603 CRCW06031K00JNEA Vishay-Dale R2, R3 2 4.7k RES, 4.7k ohm, 5%, 0.1W, 0603 0603 CRCW06034K70JNEA Vishay-Dale R4, R5, R6, R7, R32, R33, R37, R38, R39, R40, R41, R42, R55, R56, R61, R62, R63 17 10.0k RES, 10.0k ohm, 1%, 0.1W, 0603 0603 CRCW060310K0FKEA Vishay-Dale R8, R9, R10, R12, R13, R14, R16, R17, R18, R20, R21, R22, R23, R24, R25 15 100 RES, 100 ohm, 1%, 0.1W, 0603 0603 CRCW0603100RFKEA Vishay-Dale R11, R15, R19 3 1.00k RES, 1.00k ohm, 1%, 0.1W, 0603 0603 CRCW06031K00FKEA Vishay-Dale R26 1 44.2k RES, 44.2k ohm, 1%, 0.1W, 0603 0603 CRCW060344K2FKEA Vishay-Dale R27 1 22.6k RES, 22.6k ohm, 1%, 0.1W, 0603 0603 CRCW060322K6FKEA Vishay-Dale R28, R29 2 100 RES, 100 ohm, 1%, 0.125W, 0805 0805 CRCW0805100RFKEA Vishay-Dale R30, R31 2 4.70k RES, 4.70k ohm, 1%, 0.1W, 0603 0603 RC0603FR-074K7L Yageo America R34 1 0 RES, 0 ohm, 5%, 0.333W, 0805 0805 CRCW08050000Z0EAHP Vishay-Dale Using the UCD3138A64OEVM-662 30 SLUUB73 R35 1 200 RES, 200 ohm, 5%, 0.1W, 0603 0603 CRCW0603200RJNEA Vishay-Dale R36 1 0 RES, 0 ohm, 5%, 0.1W, 0603 0603 CRCW06030000Z0EA Vishay-Dale R43, R47, R49 3 1.5k RES, 1.5k ohm, 5%, 0.1W, 0603 0603 CRCW06031K50JNEA Vishay-Dale R44, R45, R46, R48 4 33 RES, 33 ohm, 5%, 0.1W, 0603 0603 CRCW060333R0JNEA Vishay-Dale R50, R51, R52, R53 4 2.00k RES, 2.00k ohm, 1%, 0.1W, 0603 0603 CRCW06032K00FKEA Vishay-Dale R54, R57, R59, R60 4 20k ohm TRIMMER, 20K, 0.5W, TH 9.5x10x4.8 mm 3296Y-1-203LF Bourns Switch, Tactile, SPST-NO, 1VA, 32V, SMT Switch, 6.3x5.36x6. 6 mm, SMT KT11P2JM34LFS C&K Components Shunt, 100mil, Flash Gold, Black Closed Top 100mil Shunt SPC02SYAN Sullins Connector Solutions Test Point, Multipurpose, Black, TH Black Multipurpos e Testpoint 5011 Keystone 5128 Keystone S1 SH-J1, SH-J2, SHJ3, SH-J4, SH-J5, SH-J6, SH-J7, SHJ8, SH-J9, SH-J10, SH-J11 TP1, TP5, TP15 1 11 3 1x2 Black TP2 1 Grey Test Point, Multipurpose, Grey, TH Grey Multipurpos e Testpoint TP3, TP4, TP9, TP10, TP11, TP12, TP20, TP25, TP28, TP29 10 Triple Terminal, Turret, TH, Triple Keystone15 98-2 1598-2 Keystone Test Point, Multipurpose, Red, TH Red Multipurpos e Testpoint 5010 Keystone Test Point, Multipurpose, Orange, TH Orange Multipurpos e Testpoint 5013 Keystone Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone Test Point, Miniature, Yellow, TH Yellow Miniature Testpoint 5004 Keystone TP6, TP8 TP7 TP13, TP16, TP17, TP18, TP19, TP21, TP22, TP23, TP24 2 Red 1 Orang e 9 White TP14 1 U1 1 IC, EEPROM, 2MBIT, 1MHZ, 8SOIC SOIC-8 M24M02-DRMN6TP STMicroelectron ics 1 2-Mbit DataFlash (with Extra 64Kbits), 1.65V Minimum SPI Serial Flash Memory, SOIC-8 SOIC-8 AT45DB021E-SSHN-B Adesto Technologies U3 1 LOW-POWER 150-mA LOWDROPOUT LINEAR REGULATOR, DBV0005A DBV0005A TPS76333DBV Texas Instruments U4 1 3-V to 5.5-V Single-Channel RS-232 Compatible Line Driver / Receiver, 0 DB0016A SN75C3221DBR Texas Instruments U2 Yellow Using the UCD3138A64OEVM-662 31 SLUUB73 to 70 degC, 16-Pin SSOP (DB), Green (RoHS & no Sb/Br) U5, U6, U7 3 Low-Noise, Low Quiescent Current, Precision Operational Amplifier e-trim Series, DBV0005A U8 1 UCD3138A64PFC, PFC0080 PFC0080A UCD3138A64PFC Texas Instruments XU1 1 Socket, QFN-80, 0.5mm pitch, TH 29X16.5X29 mm IC357-0804-074P-2 Yamaichi Electronics C1, C2 0 10pF CAP, CERM, 10pF, 50V, +/-5%, C0G/NP0, 0603 0603 C0603C100J5GACTU Kemet C4 0 2.2uF CAP, CERM, 2.2uF, 10V, +/-10%, X7R, 0603 0603 GRM188R71A225KE15D MuRata C51 0 1uF CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603 0603 GRM188R71C105KA12D MuRata FID1, FID2, FID3, FID4, FID5, FID6 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A J24 0 CONN RECEPT 38POS .025 VERT SMD 1000x250x2 72 mil 2-5767004-2 TE Connectivity Y1 0 Crystal, 10.000MHz, 10pF, SMD 5x0.9x3.2m m 7B-10.000MEEQ-T TXC Corporation DBV0005A OPA376AIDBV Texas Instruments Using the UCD3138A64OEVM-662 32 Appendix A. Using Code Composer Studio v5.5 In this appendix, the basic steps of how to use Code Composer Studio v5.5 to compile firmware for UCD3138 family of devices is described. A design flow is described while detailed steps for firmware code creation, and firmware debugging along with hardware are obviously beyond the scope of this user’s guide and this appendix. A.1 Importing a CCSv5 project Upon running CCSv5.5 for the first time, the Workspace Launcher window will appear as shown in Figure A1: CCSv5.5 Workspace Launcher. It is left to the user do decide whether or not to use a workspace, where it is located, and/or to check the box that says Use this as the default and do not ask again. For this guide, a workspace will not be used, so click OK. Figure A1: CCSv5.5 Workspace Launcher When the main window opens, click Project in the top navigation menu, then choose Import Existing CCS Eclipse Project as shown in window as shown in Figure A2: Import Existing CCS Eclipse Project. Figure A2: Import Existing CCS Eclipse Project This will open the window shown in Figure A3: Importing a CCSv5.5 project. Under Selectsearch directory, click Browse, navigate to the target project, and click OK. For this example, the project is called Training_CCSv5.5 and is located in a folder called Training_CCS5v5. Check the box next to the discovered project, and do not check Copy projects into workspace, or Automatically import referenced projects. Click Finish. Figure A3: Importing a CCSv5.5 project The project should be imported into CCSv5.5 and should be shown in the Project Explorer as shown in Figure A4: Project Explorer. At this point, files in the project can be edited as required. Figure A4: Project Explorer A.2 Build/Compile a Project using Code Composer Studio v5.5 For the UCD3138 family of devices, compiling a project produces an Intel-hex (.x0) firmware file that can be downloaded to, and run on the UCD3138 or related target device using the UCD3XXX / UCD9XXX Device GUI (part of the Fusion Design Online software from TI). After finished editing the project files, Right-Click on the project in the Project explorer, and choose Build Project. Note: If this is the first time building a UCD3138 or related project, and Cygwin is also installed on the PC that is performing the compilation, the instructions in Section 3.3 of the Application Note entitled “Converting UCD3138 Firmware Project from Code Composer Studio Version 3.3 to 5.2” must be followed. Mainly, the C:\CYGWIN or other similarly named directory must be renamed temporarily during this first build. This will allow the new ARM library to be built properly. After this first build, the CYGWIN directory can be rolled back to its original name, and future builds can compile successfully. Builds may take up to a minute to compile, or longer for a first time build. Figure A5: Successful Build of UCD3138 Related Source Code shows the state of a successful build: Figure A5: Successful Build of UCD3138 Related Source Code When the build has finished, the .x0 file should be created and will be placed in the project directory’s debug folder. The filename that prefaces the .x0 will be the name of the project that was built (i.e. a project named Training_CCS5v5 will create Training_CCS5v5.x0 as its firmware file). However, it must be noted that the project name must have no spaces, otherwise the .x0 file will not be generated. This .x0 file can be and run on the UCD3138 target device using the UCD3XXX / UCD9XXX Device GUI. Appendix B. Setting up PuTTY PuTTY is an open source Telnet and SSH terminal software that can be downloaded from www.putty.org. Download and run the putty.exe installation file. Follow the installation prompts making sure to allow the program to install to the default directory. Step 1 In Windows, launch from its installed directory using the start menu (StartProgramsPuTTYPuTTY) Figure B1: Starting Putty Step 2 On the main Session category, click the Serial radio button. Figure B2 Step 2 Step 3 Under the Connection category, click Serial as highlighted in the figure from Step 2. Configure the information as shown in the image below. However, instead of COM1, use the serial line in which the Device Under Test (DUT) is connected on the PC. Baud = 9600, Data bits = 8, Stop bits = 1, Parity = None, and Flow Control = XON/XOFF. Figure B3 Step 3 Step 4 Click back to the main Session category, and enter in a save name for this configuration such as PWR662_Test as shown below. Click Save. This will save the session configuration so that upon closing and re-opening PuTTY, just click on the saved session name, and choose Load. Figure B4 Step 4 Step 5 Click Open to open the serial terminal session with the DUT. References 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. UCD3138A64 Data Manual (SLUSBZ8) UCD3138 Monitoring and Communications Programmer’s Manual (SLUU996) UCD3138 Digital Power Peripherals Programmer’s Manual (SLUU995) UCD3138 ARM and Digital System Programmer’s Manual (SLUU994) Fusion Digital Power Designer GUI for Isolated Power Applications User Guide (for UCD3138, UCD3138064, UCD3138A64 applications) (SLUA676) Code Composer Studio v5 Wiki, Texas Instruments, http://processors.wiki.ti.com/index.php/Category:Code_Composer_Studio_v5 Converting UCD3138 Firmware Project from Code Composer Studio Version 3.3 to 5.2 (SLUA679) UCD3138A64 Programmer’s Manual (SLUUB54) UCD3138 Datasheet, SLUSAP2, 2012 UCD3138CC64EVM-030 Evaluation Module and User’s Guide, SLUU886, 2012 EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMER For Feasibility Evaluation Only, in Laboratory/Development Environments. The EVM is not a complete product. It is intended solely for use for preliminary feasibility evaluation in laboratory / development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical / mechanical components, systems and subsystems. It should not be used as all or part of a production unit. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. 2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. 3. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL, CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. Certain Instructions. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User’s Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output ranges are maintained at nominal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be indentified using the EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, “Claims”) arising out of or in connection with any use of the EVM that is not in accordance with the terms of this agreement. This obligation shall apply whether Claims arise under the law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate TI components for possible use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. 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