ULN2803ADW

Product Folder Order Now Support & Community Tools & Software Technical Documents ULN2803A SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 ULN2803A Darlington Transistor Arrays 1 Features 3 Description • The ULN2803A device is a 50 V, 500 mA Darlington transistor array. The device consists of eight NPN Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of each Darlington pair is 500 mA. The Darlington pairs may be connected in parallel for higher current capability. 1 • • • 500-mA-Rated Collector Current (Single Output) High-Voltage Outputs: 50 V Output Clamp Diodes Inputs Compatible With Various Types of Logic 2 Applications • • • • • • • • • Relay Drivers Hammer Drivers Lamp Drivers Display Drivers (LED and Gas Discharge) Line Drivers Logic Buffers Stepper Motors IP Camera HVAC Valve and LED Dot Matrix Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers. The ULN2803A device has a 2.7-kΩ series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. Device Information(1) PART NUMBER ULN2803ADW PACKAGE SOIC (18) BODY SIZE (NOM) 11.55 mm × 7.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram 1 18 1B 1C 2 17 2B 2C 3 16 3B 3C 4 15 4B 4C 5 14 5B 5C 6 13 6B 6C 7 12 7B 7C 8 11 8B 8C 10 COM 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ULN2803A SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 4 5 5 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 6 Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes.......................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application ................................................. 10 10 Power Supply Recommendations ..................... 12 11 Layout................................................................... 12 11.1 Layout Guidelines ................................................. 12 11.2 Layout Example .................................................... 12 12 Device and Documentation Support ................. 13 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 13 13 13 13 13 13 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (January 2015) to Revision H Page • Deleted obsolete orderable ULN2803AN and removed all references to N package............................................................ 1 • Added Storage temperature, Tstg in Absolute Maximum Ratings ........................................................................................... 4 • Deleted VI from Recommended Operating Conditions........................................................................................................... 4 • Added Ambient temperature, TA in Recommended Operating Conditions............................................................................. 4 • Changed coil supply voltage specifications in Design Parameters ...................................................................................... 11 • Added Receiving Notification of Documentation Updates section and Community Resources section ............................. 13 Changes from Revision F (January 2014) to Revision G • Page Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 Changes from Revision E (July 2006) to Revision F Page • Updated document to new TI data sheet format - no specification changes. ........................................................................ 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 2 Submit Documentation Feedback Copyright © 1997–2017, Texas Instruments Incorporated Product Folder Links: ULN2803A ULN2803A www.ti.com SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 5 Pin Configuration and Functions DW Package 18-Pin SOIC Top View 1B 1 18 1C 2B 2 17 2C 3B 3 16 3C 4B 4 15 4C 5B 5 14 5C 6B 6 13 6C 7B 7 12 7C 8B 8 11 8C GND 9 10 COM Not to scale Pin Functions PIN NAME NO. 1B 1 2B 2 3B 3 4B 4 5B 5 6B 6 7B 7 8B 8 1C 18 2C 17 3C 16 4C 15 5C 14 6C 13 7C 12 8C 11 TYPE DESCRIPTION I Channel 1 through 8 Darlington base input O Channel 1 through 8 Darlington collector output GND 9 — Common emitter shared by all channels (typically tied to ground) COM 10 I/O Common cathode node for flyback diodes (required for inductive loads) Submit Documentation Feedback Copyright © 1997–2017, Texas Instruments Incorporated Product Folder Links: ULN2803A 3 ULN2803A SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings at 25°C free-air temperature (unless otherwise noted) (1) MIN VCE MAX UNIT 50 V Collector-emitter voltage VI Input voltage I(clamp) (2) 30 V Peak collector current 500 mA Output clamp current 500 mA –2.5 A TJ Total substrate-terminal current Junction temperature –65 150 °C Tstg Storage temperature –65 150 °C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, unless otherwise noted, are with respect to the emitter/substrate terminal GND. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) UNIT ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101 (2) V ±500 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCE Collector-emitter voltage TA Ambient temperature MIN MAX 0 50 UNIT V –40 85 °C 6.4 Thermal Information ULN2803A THERMAL METRIC (1) DW (SOIC) UNIT 18 PINS RθJA Junction-to-ambient thermal resistance 66.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.5 °C/W RθJB Junction-to-board thermal resistance 33.0 °C/W ψJT Junction-to-top characterization parameter 6.0 °C/W ψJB Junction-to-board characterization parameter 32.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 1997–2017, Texas Instruments Incorporated Product Folder Links: ULN2803A ULN2803A www.ti.com SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 6.5 Electrical Characteristics at TA = 25°C free-air temperature (unless otherwise noted) PARAMETER ULN2803A TEST CONDITIONS MIN ICEX Collector cutoff current VCE = 50 V, see Figure 3 II = 0 II(off) Off-state input current VCE = 50 V, TA = 70°C IC = 500 μA, see Figure 4 II(on) Input current VI = 3.85 V, See Figure 5 VI(on) VCE = 2 V, see Figure 6 On-state input voltage VCE(sat) Collector-emitter saturation voltage TYP MAX 50 50 65 UNIT μA μA 0.93 1.35 IC = 200 mA 2.4 IC = 250 mA 2.7 IC = 300 mA 3 II = 250 μA, see Figure 7 IC = 100 mA 0.9 1.1 II = 350 μA, see Figure 7 IC = 200 mA 1 1.3 II = 500 μA, see Figure 7 IC = 350 mA 1.3 1.6 50 mA V V IR Clamp diode reverse current VR = 50 V, see Figure 8 VF Clamp diode forward voltage IF = 350 mA see Figure 9 1.7 2 V Ci Input capacitance VI = 0, f = 1 MHz 15 25 pF TYP MAX μA 6.6 Switching Characteristics TA = 25°C PARAMETER TEST CONDITIONS MIN tPLH Propagation delay time, low- to high-level output 130 tPHL Propagation delay time, high- to low-level output VS = 50 V, CL = 15 pF, RL = 163 Ω, See Figure 10 VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, see Figure 11 UNIT ns 20 VS – 20 mV 6.7 Typical Characteristics μ μ μ μ μ μ Figure 1. Collector-Emitter Saturation Voltage vs Collector Current (One Darlington) Figure 2. Collector-Emitter Saturation Voltage vs Total Collector Current (Two Darlingtons in Parallel) Submit Documentation Feedback Copyright © 1997–2017, Texas Instruments Incorporated Product Folder Links: ULN2803A 5 ULN2803A SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 www.ti.com 7 Parameter Measurement Information Open VCE Open VCE IC II(off) ICEX Open Figure 3. ICEX Test Circuit Figure 4. II(off) Test Circuit Open Open II IC VI VI Open VCE Figure 5. II(on) Test Circuit Figure 6. VI(on) Test Circuit Open VR IC hFE = II II IR IC Open VCE Figure 7. hFE, VCE(sat) Test Circuit Figure 8. IR Test Circuit IF VF Open Figure 9. VF Test Circuit 6 Submit Documentation Feedback Copyright © 1997–2017, Texas Instruments Incorporated Product Folder Links: ULN2803A ULN2803A www.ti.com SLRS049H – FEBRUARY 1997 – REVISED FEBRUARY 2017 Parameter Measurement Information (continued) Input Open VS = 50 V RL = 163 Ω Pulse Generator (see Note A) Output CL = 15 pF (see Note B) Test Circuit