VSP1900

VSP1900 SLES062 – MARCH 2003 CCD VERTICAL DRIVER FOR DIGITAL CAMERAS FEATURES D CCD Vertical Driver: – Three Field CCD Support – Two Field CCD Support D Power Supply: – – – – VDD VL VM VH 2.7 V to 5.5 V –5 V to –9 V GND 11.5V to 15.5 V D Output Drivers: – 3 Levels Driver (V-Transfer) x 5 – 2 Levels Driver (V-Transfer) x 3 – 2 Levels Driver (E-Shutter) x 1 D Drive Capability: D Input Phase: APPLICATIONS D Digital Camera D Video Camera DESCRIPTION The VSP1900 is a CCD vertical clock driver with electricshutter support. This device is composed of eight vertical transfer channels, which support both 3-field CCD and 2-field CCD operation. The VSP1900 contributes low power consumption and parts number reduction in the system. – 450 pF to 1890 pF With 60 Ω to 240 Ω – 3 State (V-Transfer) x 5 – 2 State (V-Transfer) x 3 – 2 State (E-Shutter) x 1 D Portable Operation: – Input Interface: 2.7 V to 5.5 V Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  2003, Texas Instruments Incorporated VSP1900 www.ti.com SLES062 – MARCH 2003 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PRODUCT VSP1900 PACKAGE TSSOP30 PACKAGE DESIGNATOR DBT OPERATING TEMPERATURE RANGE –25°C to 85°C PACKAGE MARKING VSP1900 ORDERING NUMBER VSP1900 TRANSPORT MEDIA Tube (60 units/tube) Tape and reel (1) For the most current specification and package information, refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNITS VDD Su ly voltage Supply voltage Input voltage, VIN Ambient temperature under bias Storage temperature, Tstg Junction temperature Package temperature (IR reflow, peak) VL VH GND –0.3 V to 7 V GND to –10 V VL + 26 V GND –0.3 V to (VDD + 0.3 V) –25°C to 85°C –55°C to 150°C 150°C 235°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS free-air temperature range unless otherwise noted MIN Supply voltage, VDD Supply voltage, VL Supply voltage, VH Input voltage, VIN 2.7 –5 11.5 GND – 0.3 to (VDD + 0.3) NOM MAX UNIT 5.5 –9 15.5 V V V V TRUTH TABLE INPUT V1N V3AN V3BN V5AN V5BN L L H H X X X X NOTE: Z = High impedance 2 CH1N CH2N CH3N CH4N CH5N L H L H X X X X X = Don’t care V1 V3A V3B V5A V5B VH VM Z VL X X X X OUTPUT V2N V4N V6N X X X X L H X X SUBN X X X X X X L H V2 V4 V6 X X X X VM VL X X SUB X X X X X X VH VL VSP1900 www.ti.com SLES062 – MARCH 2003 ELECTRICAL CHARACTERISTICS all specifications at TA = 25°C (unless otherwise noted) PARAMETER DC power consumption Switching power consumption DC CHARACTERISTICS VIH VIL IIN IH IDD IL IOL IOM1 IOM2 IOH IOSL IOSH High-level input voltage Low-level input voltage Input current VIN = GND to 5 V (without pullup / pulldown resistor) VIN = GND to 5 V (pullup / pulldown resistor) –10 –625 0 0 0.1 O erating supply current Operating su ly current V1, V2, V3A, V3B, V4, V5A, V5B, V6 = –8.1 V V1, V2, V3A, V3B, V4, V5A, V5B, V6 = –0.2 V V1, V3A, V3B, V5A, V5B = 0.2 V Output current V1, V3A, V3B, V5A, V5B = 14.55 V SUB = –8.1 V SUB = 14.55 V 5.4 –4 5 –7.2 mA 10 –5 1 0.125 0.7VDD 0.2VDD 10 625 0.2 mA V V µA VSP2267 (TG) with loading diagram TEST CONDITIONS MIN TYP 5.3 550 MAX UNIT mW mW SWITCHING CHARACTERISTICS all specifications at TA = 25°C (unless otherwise noted) PARAMETER td(PLM) td(PMH) td(PLH) td(PML) td(PHM) td(PHL) tr(TLM) tr(TMH) tr(TLH) tf(TML) tf(THM) tf(THL) Vn(CLH) Vn(CLL) Vn(CMH) Vn(CML) Vn(CHL) Out ut noise voltage Output noise voltage 2 V Fall time time VL → VM Rise time time VM → VH VL → VH VM → VL VH → VM VH → VL Propagation delay time TEST CONDITIONS MIN TYP 15 20 20 15 30 30 MAX 100 100 100 50 50 50 300 300 300 300 300 300 ns ns ns UNIT 3 VSP1900 www.ti.com SLES062 – MARCH 2003 PIN ASSIGNMENTS DBT PACKAGE (TOP VIEW) GND SUBN V2N V4N V6N DVDD V5BN CH5N CH1N V1N CH2N V3AN V5AN CH3N GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 GND GND SUB V2 V4 V6 V5B VH V1 V3A V5A V3B VL CH4N V3BN Terminal Functions TERMINAL NAME GND SUBN V2N V4N V6N DVDD V5BN CH5N CH1N V1N CH2N V3AN V5AN CH3N GND V3BN CH4N VL V3B V5A V3A V1 VH V5B V6 V4 V2 SUB GND GND 4 NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 TYPE P DI DI DI DI P DI DI DI DI DI DI DI DI P DI DI P DO DO DO DO P DO DO DO DO DO P P Ground CCD substrate clock SUB input Vertical transfer clock 2 input Vertical transfer clock 4 input Vertical transfer clock 6 input Digital power supply Vertical transfer clock 5B input Read out clock 5 input Read out clock 1 input Vertical transfer clock 1 input Read out clock 2 input Vertical transfer clock 3A input Vertical transfer clock 5A input Read out clock 3 input Ground Vertical transfer clock 3B input Read out clock 4 input Digital power supply Vertical transfer clock 3B output Vertical transfer clock 5A output Vertical transfer clock 3A output Vertical transfer clock 1 output Digital power supply Vertical transfer clock 5B output Vertical transfer clock 6 output Vertical transfer clock 4 output Vertical transfer clock 2 output CCD substrate clock SUB output Ground Ground DESCRIPTIONS VSP1900 www.ti.com SLES062 – MARCH 2003 FUNCTIONAL BLOCK DIAGRAM GND 1 30 GND SUBN 2 Level Shifter 29 GND V2N 3 Level Shifter 28 SUB V4N 4 Level Shifter 27 V2 V6N 5 Level Shifter 26 V4 DVDD 6 25 V6 V5BN 7 Level Shifter 3-State Driver 24 V5B CH5N 8 Level Shifter 23 VH CH1N 9 Level Shifter 3-State Driver 22 V1 V1N 10 Level Shifter 21 V3A CH2N 11 Level Shifter 3-State Driver 20 V5A V3AN 12 Level Shifter 19 V3B V5AN 13 Level Shifter 3-State Driver 18 VL CH3N 14 Level Shifter 17 CH4N GND 15 16 V3BN Level Shifter 3-State Driver Level Shifter 5 VSP1900 www.ti.com SLES062 – MARCH 2003 SWITCHING WAVEFORM VM VL VH VM VH VM Noise on a waveform V(CMH) V(CMH) V(CMH) V(CLH) V(CML) V(CML) V(CHL) V(CLL) 6 VSP1900 www.ti.com SLES062 – MARCH 2003 LOADING DIAGRAM R1, R2, R4, R6 Vertical clock series resistor clock series resistor R3A, R5A R3B, R5B CΦV1 Vertical clock to GND CΦV3A, CΦV3B CΦV5A, CΦV5B CΦV2, CΦV4, CΦV6 CΦV12 CΦV23A, CΦV23B Between vertical clock CΦV45A, CΦV45B CΦV3A4, CΦV3B4 CΦV5A6, CΦV5B6 CΦV61 Substrate clock to GND Vertical clock GND resistor CΦVSUB R GND 60 Ω 240 Ω 80 Ω 1280 pF 640 pF 640 pF 400 pF 510 pF 50 pF 50 pF 260 pF 260 pF 100 pF 1000 pF 18 Ω VΦ1 VΦ6 VΦ2 VΦ5B VΦ3A VΦ5A VΦ3B SUB 1000 pF VΦ4 Figure 1. VSP1900 Loading Diagram 7 VSP1900 www.ti.com SLES062 – MARCH 2003 DESCRIPTION The VSP1900 is a CCD vertical clock driver with electric shutter. The VSP1900 is composed of five 3-state and three 2-state vertical transfer channels, which support both 3 field and 2 field CCD operation. The VSP1900 contributes low power consumption and parts number reduction in the system. OPERATION Power On/Off Sequence This is the same as the CCD power up sequence, when power on, VDD powers on first VH, VM power on second, and VL powers on later. When powering off, VL powers off first, VH, VM power of second, and VDD powers off later. Vertical Transfer Signal The VSP1900 receives signals from TG (CCD timing generator). The input signal is converted into CCD operation voltage level by the level shifter. The level shifter circuits connect to a 2-state or 3-state driver, which is connected to the CCD input pin. While using a 2-field CCD, one of the 3-state drivers is used as a 2-state driver. The CH#N pin is pulled up internally, so that the VH level does not appear on the output pin. CCD Drain Bias TG SUB SUBN VSP1900 SUB CCD V# CH# V#N CH#N V# V# SUB 100 ∼ 1000 pF 1 MΩ Figure 2. FVSP1900 Circuit Application 8 VSP1900 www.ti.com SLES062 – MARCH 2003 MECHANICAL DATA DBT (R-PDSO-G**) 30 PINS SHOWN 0,27 0,17 16 PLASTIC SMALL-OUTLINE PACKAGE 0,50 30 0,08 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 15 0°– 8° 0,75 0,50 Seating Plane 1,20 MAX PINS ** DIM A MAX 20 24 28 30 38 44 50 0,15 0,05 0,10 5,10 6,60 7,90 7,90 9,80 11,10 12,60 A MIN 4.90 6,40 7,70 7,70 9,60 10,90 12,40 4073252/E 02/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-153 9 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device VSP1900DBT VSP1900DBTR (1) Status (1) ACTIVE ACTIVE Package Type SM8 SM8 Package Drawing DBT DBT Pins Package Eco Plan (2) Qty 30 30 60 2000 TBD TBD Lead/Ball Finish CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-220C-1 YEAR Level-2-220C-1 YEAR The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS019D – FEBRUARY 1996 – REVISED FEBRUARY 2002 DBT (R-PDSO-G**) 30 PINS SHOWN 0,27 0,17 16 PLASTIC SMALL-OUTLINE PACKAGE 0,50 30 0,08 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 15 0°– 8° 0,75 0,50 Seating Plane 1,20 MAX PINS ** DIM A MAX 0,15 0,05 20 24 0,10 28 30 38 44 50 5,10 6,60 7,90 7,90 9,80 11,10 12,60 A MIN 4.90 6,40 7,70 7,70 9,60 10,90 12,40 4073252/E 02/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. 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