VSP5000PMG6

Not Recommended For New Designs VSP5000 SLES057 – DECEMBER 2002 12-BIT 30 MSPS DUAL CHANNEL CCD SIGNAL FRONT END FOR DIGITAL COPIER FEATURES D Dual Channel CCD Signal Processing: – – – – Correlated Double Sampler (CDS) Sample Hold Mode Digital Programmable Amplifier CCD Offset Correction (OB loop) D High Performance A/D: – – – – 12-Bit Resolution INL: ±2 LSB DNL: ±0.5 LSB No Missing Codes D High-Speed Operation – Sample Rate: 30 MHz (Minimum) D 78-dB Signal-To-Noise Ratio (at 0-dB Gain) D Low Power Consumption: – Low Voltage: 3 V to 3.6 V – Low Power: 290 mW (Typ) at 3.3 V – Standby Mode: 20 mW (Typ) APPLICATIONS D Copiers D Scanners D Facsimiles DESCRIPTION The VSP5000 device is a complete application specific standard product (ASSP) for charge-coupled device (CCD) line sensor applications such as copiers, scanners, and facsimiles. The VSP5000 device provides two independent channels of processing lines and performs analog front-end processing and analog-to-digital (A/D) conversion. Each channel has a correlated double sampler (CDS)/sample hold (SH) circuit, a 14-bit analog-to-digital converter (ADC), a digital programmable gain amplifier (DPGA), and an optical black (OB) correction loop. Data output is 12 bits in length and the 2-channel A/D data is multiplexed and output. The VSP5000 is available in a 64-lead LQFP package and operates from a single 3.3-V supply. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  2002, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) VSP5000PM NRND LQFP PM 64 160 RoHS & Green SNBI Level-1-260C-UNLIM -25 to 85 VSP5000 VSP5000PMG6 NRND LQFP PM 64 160 RoHS & Green SNBI Level-1-260C-UNLIM -25 to 85 VSP5000 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of